Cutting and separating structure for packaging TF card chip

Abstract

The utility model discloses a cutting and separating structure for packaging a TF card chip, which relates to the field of wafer cutting and comprises a base, an XY-axis displacement platform is arranged at the top end of the base, and a mounting frame is arranged at the top end of the XY-axis displacement platform; a wafer tray connecting groove is formed in the top end of the mounting rack, a wafer tray is arranged in the wafer tray connecting groove, and an auxiliary pop-up assembly is arranged between the wafer tray and the top end of the mounting rack; a laser cutting head is arranged on the side, close to the XY-axis displacement platform, of the vertical frame. According to the utility model, before the TF card chip is packaged, the wafer of the TF card chip can be cut and separated, the stability and the consistency of the position of the wafer can be guaranteed during each processing, and the cutting and separating precision of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer dicing, and more specifically, to a dicing and separation structure for TF card chip packaging. Background Technology

[0002] TF (Trans Flash, a type of small flash memory card) cards are commonly used in modern electronic products, such as mobile phones, cameras, and other portable devices. With technological advancements and increasing market demand, the demand for TF cards continues to rise. Among the manufacturing processes of TF cards, the packaging of the TF card chip is a crucial step. Before packaging the TF card chip, the wafer needs to be diced and separated to obtain bare dies, which are then used to complete the chip packaging.

[0003] Because TF card chips are small, laser cutting technology is often used when cutting and separating wafers. Among existing wafer laser cutting technologies, for example, Chinese patent 201921024300.8 discloses a silicon wafer laser cutting device, which adjusts the spacing of the clamping plates during the rotation of the lead screw to clamp and fix the wafer body, and then uses a laser cutting head to cut the wafer body. However, this silicon wafer laser cutting device still has the following shortcomings: the adjustment method of the clamping plates may lead to inconsistent stability of the wafer each time it is fixed, and the positional accuracy of the wafer cannot be guaranteed, which will affect the processing accuracy.

[0004] There are currently no effective solutions to the problems in the relevant technologies. Utility Model Content

[0005] In view of the problems in the related technologies, this utility model proposes a cutting and separating structure for TF card chip packaging to overcome the above-mentioned technical problems existing in the existing related technologies.

[0006] Therefore, the specific technical solution adopted by this utility model is as follows:

[0007] A cutting and separating structure for TF card chip packaging includes a base, an XY-axis displacement platform at the top of the base, and a mounting bracket at the top of the XY-axis displacement platform; a wafer tray connection groove at the top of the mounting bracket, a wafer tray inside the wafer tray connection groove, and an auxiliary ejection component between the wafer tray and the top of the mounting bracket; a stand at one end of the base, and a laser cutting head on the side of the stand near the XY-axis displacement platform.

[0008] Furthermore, to ensure precise positioning of the wafer tray, the wafer tray connection groove includes a tray groove disposed at the top of the mounting bracket, one end of the tray groove is provided with a first positioning groove, and the other end of the tray groove is provided with a second positioning groove; the wafer tray includes a tray body disposed in the tray groove, and the two ends of the tray body are respectively provided with a first positioning block and a second positioning block that cooperate with the first positioning groove and the second positioning groove; the length of the first positioning block is greater than the length of the second positioning block.

[0009] Furthermore, in order to achieve rapid adsorption and release of the wafer tray, an electromagnet is installed in the middle of the tray groove, and a magnetic plate is installed at the bottom of the tray body.

[0010] Furthermore, in order to easily lift the wafer tray, the auxiliary ejection assembly includes a spring cavity located at the top of the mounting bracket, with a compression spring inside the spring cavity. A handle is provided on the side wall of the wafer tray, and a push rod is provided at the bottom end of the handle. The bottom end of the push rod extends into the spring cavity and contacts the top end of the compression spring.

[0011] The beneficial effects of this utility model are as follows:

[0012] (1) This utility model can cut and separate the wafer of the TF card chip before the TF card chip is packaged, and the stability and consistency of the wafer position can be guaranteed each time it is processed, thus improving the accuracy of wafer cutting and separation.

[0013] (2) By using the wafer tray connecting groove and the wafer tray in conjunction, the precise positioning of the wafer tray in the tray groove is ensured. This maintains the stability of the wafer position during the dicing process, avoids positional deviation, and improves dicing accuracy. The design of the first positioning block being longer than the second positioning block provides a directional installation method, preventing misalignment and asymmetry of the wafer tray during installation and ensuring consistency of wafer tray installation each time. The wafer tray is firmly fixed in the tray groove by magnetic force, and the rapid adsorption and release of the wafer tray is achieved by controlling the on and off current of the electromagnet, facilitating wafer tray replacement and improving operational efficiency.

[0014] (3) By setting an auxiliary ejection component, the safe ejection function of the wafer tray is realized, so that the operator can easily lift the wafer tray. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a cutting and separating structure for TF card chip packaging according to an embodiment of the present utility model;

[0017] Figure 2 This is a schematic diagram showing the connection between the wafer tray connecting groove and the wafer tray in a TF card chip packaging cutting and separating structure according to an embodiment of the present utility model;

[0018] Figure 3 This is a three-dimensional unfolded view of the wafer tray in a TF card chip packaging cutting and separating structure according to an embodiment of the present utility model;

[0019] Figure 4 This is a schematic diagram of the wafer tray in a TF card chip packaging cutting and separating structure according to an embodiment of the present utility model;

[0020] Figure 5 This is a schematic diagram of the wafer tray from another angle in a TF card chip packaging cutting and separating structure according to an embodiment of the present invention.

[0021] In the picture:

[0022] 1. Base; 2. XY axis displacement platform; 3. Mounting bracket; 4. Wafer tray connecting groove; 401. Tray groove; 402. First positioning groove; 403. Second positioning groove; 404. Electromagnet; 5. Wafer tray; 501. Tray body; 502. First positioning block; 503. Second positioning block; 504. Magnetic plate; 6. Auxiliary ejection assembly; 601. Spring cavity; 602. Compression spring; 603. Handle; 604. Top rod; 7. Stand; 8. Laser cutting head; 9. Positioning protrusion. Detailed Implementation

[0023] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0024] According to an embodiment of the present invention, a cutting and separating structure for TF card chip packaging is provided.

[0025] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, such as... Figure 1-5As shown, the TF card chip packaging cutting and separation structure according to an embodiment of the present invention includes a base 1, an XY axis displacement platform 2 is provided at the top of the base 1, a mounting frame 3 is provided at the top of the XY axis displacement platform 2, and the mounting frame 3 is fixed to the XY axis displacement platform 2 by bolts; a wafer tray connecting groove 4 is provided at the top of the mounting frame 3, a wafer tray 5 is provided inside the wafer tray connecting groove 4, and an auxiliary ejection component 6 is provided between the wafer tray 5 and the top of the mounting frame 3; a stand 7 is provided at one end of the base 1, and a laser cutting head 8 is provided on the side of the stand 7 near the XY axis displacement platform 2.

[0026] The XY-axis displacement platform 2 can move in two mutually perpendicular directions (X-axis and Y-axis). Each axis of the XY-axis displacement platform 2 has an independent drive system, which achieves planar movement by driving a lead screw or belt mechanism via a motor. The control system (such as a PLC or motion controller) precisely controls the rotation of the motor according to the required motion path. This allows the wafer above it to move along a preset path within the plane, and in conjunction with the laser cutting head 8, completes the wafer cutting.

[0027] When in use, the laser cutting head 8 generates a high-energy laser beam through a laser. This beam is focused onto a very small point by optical components (such as lenses and mirrors), generating intense heat on the wafer. The focused laser beam rapidly heats and melts, vaporizes, or ablates the wafer material on its surface. The laser cutting head 8 is typically also equipped with a gas nozzle to assist in removing slag and cooling the cut. Laser cutting technology can achieve micron-level precision, making it ideal for components requiring high-precision processing, such as TF card chips. Laser cutting can easily achieve complex shapes and intricate patterns, meeting the special processing needs of small electronic components such as TF cards.

[0028] With the help of the above solution, this utility model can cut and separate the wafer of TF card chip before TF card chip packaging, and the stability and consistency of the wafer position can be guaranteed in each processing, thus improving the accuracy of wafer cutting and separation.

[0029] In one embodiment, the wafer tray connection groove 4 includes a tray groove 401 disposed at the top of the mounting bracket 3. One end of the tray groove 401 is provided with a first positioning groove 402, and the other end of the tray groove 401 is provided with a second positioning groove 403. The wafer tray 5 includes a tray body 501 disposed in the tray groove 401. The two ends of the tray body 501 are respectively provided with a first positioning block 502 and a second positioning block 503 that cooperate with the first positioning groove 402 and the second positioning groove 403. The length of the first positioning block 502 is greater than the length of the second positioning block 503, thereby ensuring the precise positioning of the wafer tray 5 in the tray groove 401. This can keep the wafer position stable during the cutting process, avoid positional deviation, and improve cutting accuracy. By designing that the length of the first positioning block 502 is greater than that of the second positioning block 503, a directional installation method is provided to prevent the wafer tray 5 from being misaligned and asymmetrical during the installation process, and to ensure the consistency of the wafer tray 5 in each installation.

[0030] In one embodiment, for the aforementioned tray groove 401, an electromagnet 404 is provided in the middle of the tray groove 401, and a magnetic plate 504 is provided at the bottom of the tray body 501. Thus, the wafer tray 5 is firmly fixed in the tray groove 401 by magnetic force. Furthermore, by controlling the on and off current of the electromagnet 404, the wafer tray 5 can be quickly adsorbed and released, facilitating the replacement of the wafer tray 5 and improving operational efficiency.

[0031] The working principle of the wafer tray connecting groove 4 and wafer tray 5 is as follows: the length of the first positioning block 502 is greater than the length of the second positioning block 503. This design ensures that the wafer tray 5 can only be inserted into the tray groove 401 in one correct orientation. The electromagnet 404 and the magnetic plate 504 are magnetically connected, which simplifies the loading and unloading operation of the wafer tray 5. In addition, the tray body 501 is also provided with a positioning protrusion 9, which cooperates with the groove on the wafer of the TF card chip to position the wafer.

[0032] In one embodiment, the auxiliary ejection assembly 6 includes a spring cavity 601 disposed at the top of the mounting bracket 3, a compression spring 602 disposed inside the spring cavity 601, a handle 603 disposed on the side wall of the wafer tray 5, a push rod 604 disposed at the bottom end of the handle 603, the bottom end of the push rod 604 extending into the spring cavity 601 and contacting the top end of the compression spring 602, thereby realizing the safe ejection function of the wafer tray 5, so that the operator can easily lift the wafer tray 5.

[0033] The working principle of the auxiliary ejection component 6 is as follows: when the wafer tray 5 is placed in position, the compression spring is in a compressed state, accumulating elastic force. When it is necessary to remove the wafer tray 5, the magnetism of the electromagnet 404 disappears, which facilitates the lifting of the wafer tray 5.

[0034] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.

[0035] In practical applications, the base 1 serves as a foundation, providing a stable support structure. The XY-axis displacement platform 2 is used to achieve precise positioning and movement of the wafer tray 5. It moves in the XY plane through programmable control to adjust the cutting position. The wafer tray connecting groove 4 is located at the top of the mounting bracket 3 to accommodate and fix the wafer tray 5. The first positioning groove 402 and the second positioning groove 403 ensure the precise positioning of the wafer tray 5 and prevent the wafer tray 5 from moving during the cutting process. When the electromagnet 404 is energized, it generates magnetic force, attracting the magnetic plate 504 at the bottom of the wafer tray 5 to ensure that the wafer tray 5 is fixed. When it is necessary to replace the wafer tray 5, the wafer tray 5 is released by de-energizing the electromagnet 404. The spring cavity 601 and the compression spring 602 are used to provide the ejection force of the tray. The operator lifts the wafer tray 5 using the handle 603.

[0036] When the laser cutting head 8 is in use, it precisely cuts the wafer of the TF card chip in the wafer tray 5 by controlling the position and intensity of the laser beam. The precise movement of the XY axis displacement platform supports the adjustment of the cutting path.

[0037] In summary, this invention enables the TF card chip wafer to be cut and separated before TF card chip packaging, ensuring the stability and consistency of the wafer position during each processing, thus improving the precision of wafer cutting and separation. The cooperation between the wafer tray connecting groove 4 and the wafer tray 5 ensures the precise positioning of the wafer tray 5 in the tray groove 401, maintaining wafer position stability during cutting, preventing positional shifts, and improving cutting accuracy. The design of the first positioning block 502 being longer than the second positioning block 503 provides a directional installation method, preventing misalignment and asymmetry of the wafer tray 5 during installation, ensuring consistency in each installation. Magnetic force firmly fixes the wafer tray 5 in the tray groove 401, and controlling the on / off current of the electromagnet 404 enables rapid adsorption and release of the wafer tray 5, facilitating replacement and improving operational efficiency. The auxiliary ejection component 6 provides a safe ejection function for the wafer tray 5, allowing operators to easily lift it.

[0038] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0039] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cutting and separating structure for TF card chip packaging, comprising a base (1), characterized in that, The base (1) is provided with an XY axis displacement platform (2) at its top, and the XY axis displacement platform (2) is provided with a mounting bracket (3) at its top. The top of the mounting bracket (3) is provided with a wafer tray connection groove (4), and a wafer tray (5) is provided inside the wafer tray connection groove (4). An auxiliary ejection component (6) is provided between the wafer tray (5) and the top of the mounting bracket (3). A support frame (7) is provided at one end of the base (1), and a laser cutting head (8) is provided on the side of the support frame (7) near the XY axis displacement platform (2).

2. The cutting and separating structure for TF card chip packaging according to claim 1, characterized in that, The wafer tray connection groove (4) includes a tray groove (401) disposed at the top of the mounting frame (3), one end of the tray groove (401) is provided with a first positioning groove (402), and the other end of the tray groove (401) is provided with a second positioning groove (403).

3. The cutting and separating structure for TF card chip packaging according to claim 2, characterized in that, The wafer tray (5) includes a tray body (501) disposed in the tray groove (401), and the two ends of the tray body (501) are respectively provided with a first positioning block (502) and a second positioning block (503) that cooperate with the first positioning groove (402) and the second positioning groove (403).

4. The cutting and separating structure for TF card chip packaging according to claim 3, characterized in that, An electromagnet (404) is provided in the middle of the tray groove (401), and a magnetic plate (504) is provided at the bottom of the tray body (501).

5. The cutting and separating structure for TF card chip packaging according to claim 3, characterized in that, The length of the first positioning block (502) is greater than the length of the second positioning block (503).

6. The cutting and separating structure for TF card chip packaging according to claim 1, characterized in that, The auxiliary ejection assembly (6) includes a spring cavity (601) disposed at the top of the mounting bracket (3), a compression spring (602) disposed inside the spring cavity (601), a handle (603) disposed on the side wall of the wafer tray (5), a push rod (604) disposed at the bottom end of the handle (603), and the bottom end of the push rod (604) extends into the spring cavity (601) and contacts the top end of the compression spring (602).

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