Negative pressure generating device and semiconductor processing system
By designing a negative pressure generating device in the semiconductor processing system, and utilizing the special angle settings of the main pipe and branch pipes and the dust collection mechanism, the problem of vacuum pump jamming was solved, thus achieving vacuum pump protection and improving production efficiency.
Patent Information
- Application Number
- CN202520477144.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-03-18
AI Technical Summary
In existing semiconductor processing technologies, vacuum pumps are prone to jamming due to the accumulation of large particles, resulting in low production efficiency and shortened service life.
Design a negative pressure generating device, including a main pipe, branch pipes, a first dust collection mechanism and a negative pressure pump. The main pipe is vertically arranged, the first dust collection mechanism is located at the bottom, the branch pipes are spaced apart from the main pipe, and the negative pressure pump is connected to the main pipe through the branch pipes. The angle between the branch pipes and the main pipes is greater than 0 degrees, so that large particles can fall directly into the dust collection mechanism by gravity and avoid entering the negative pressure pump.
It effectively prevents large particles from entering the negative pressure pump, extends the service life of the vacuum pump, and reduces system maintenance costs and manpower consumption.
Smart Images
Figure CN223839282U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a negative pressure generating device and a semiconductor processing system. Background Technology
[0002] In semiconductor processing systems, the processing equipment typically needs to be in a vacuum state. Generally, a vacuum pump is used to connect the processing equipment through vacuum pipes, bringing the equipment to the desired process environment.
[0003] In existing technology, the vacuum pump is connected to the processing equipment via a straight vacuum pipe. However, byproducts generated during the process accumulate in the vacuum pipe. Over time, these byproducts accumulate inside the vacuum pipe, and a large number of large particles directly enter the vacuum pump, causing it to jam.
[0004] In summary, existing technologies have a problem where vacuum pumps are prone to jamming in semiconductor processing. Summary of the Invention
[0005] The purpose of this application is to provide a negative pressure generating device and a semiconductor processing system to solve the problem that vacuum pumps are prone to jamming in existing semiconductor processing technologies.
[0006] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:
[0007] On one hand, this application provides a negative pressure generating device, which includes a main pipe, a branch pipe, a first dust collection mechanism, and a negative pressure pump. The main pipe is vertically arranged, and the first dust collection mechanism is located at the bottom of the main pipe and is detachably connected to the main pipe. The top of the main pipe is used to communicate with processing equipment.
[0008] One end of the branch pipe is connected to the main pipe, and the other end is connected to the negative pressure pump; the branch pipe and the first dust collection mechanism are spaced apart, and the angle between the branch pipe and the main pipe is greater than 0 degrees, so that the projection of the other end of the branch pipe and the main pipe on the horizontal plane do not overlap.
[0009] Optionally, the branch pipeline includes a first pipeline and a second pipeline, one end of the first pipeline is connected to the main pipeline, the other end of the first pipeline is connected to the second pipeline, and the other end of the second pipeline is connected to the negative pressure pump, wherein the second pipeline is vertically arranged; wherein,
[0010] The first pipe is set at an acute angle to the main pipe.
[0011] Optionally, the angle between the first pipe and the main pipe is less than 60°.
[0012] Optionally, the branch pipeline includes a first pipeline and a second pipeline, one end of the first pipeline is connected to the main pipeline, the other end of the first pipeline is connected to the second pipeline, and the other end of the second pipeline is connected to the negative pressure pump, wherein the second pipeline is vertically arranged; wherein,
[0013] The first pipe is set at a right angle to the main pipe.
[0014] Optionally, the branch pipeline includes a first pipeline and a second pipeline, one end of the first pipeline is connected to the main pipeline, the other end of the first pipeline is connected to the second pipeline, and the other end of the second pipeline is connected to the negative pressure pump, wherein the second pipeline is vertically arranged; wherein,
[0015] The first pipe is set at an obtuse angle to the main pipe.
[0016] Optionally, the branch pipeline includes a first pipeline and a second pipeline, one end of the first pipeline is connected to the main pipeline, the other end of the first pipeline is connected to the second pipeline, and the other end of the second pipeline is connected to the negative pressure pump, wherein the second pipeline is vertically arranged; wherein,
[0017] The first pipe is configured as a V-shaped pipe or a U-shaped pipe with the opening facing upwards.
[0018] Optionally, the negative pressure generating device further includes a second dust collection mechanism, which is detachably connected to the bottom of the V-shaped pipe or U-shaped pipe.
[0019] Optionally, the branch pipeline includes a first pipeline and a second pipeline, one end of the first pipeline is connected to the main pipeline, the other end of the first pipeline is connected to the second pipeline, and the other end of the second pipeline is connected to the negative pressure pump, wherein the second pipeline is vertically arranged; wherein,
[0020] The first pipe is configured as a V-shaped pipe or a U-shaped pipe with the opening facing downwards.
[0021] Optionally, the negative pressure generating device further includes a filter screen, which is disposed at the connection between the main pipe and the branch pipe.
[0022] On the other hand, this application also provides a semiconductor processing system, which includes processing equipment and the aforementioned negative pressure generating device, wherein the processing equipment and the negative pressure generating device are connected by a main pipe.
[0023] Compared with the prior art, this application has the following advantages:
[0024] This application provides a negative pressure generating device and a semiconductor processing system. The negative pressure generating device includes a main pipe, branch pipes, a first dust collection mechanism, and a negative pressure pump. The main pipe is vertically arranged, and the first dust collection mechanism is located at the bottom of the main pipe and detachably connected to it. The upper part of the main pipe is used to communicate with processing equipment. One end of the branch pipe is connected to the main pipe, and the other end is connected to the negative pressure pump. The branch pipe and the first dust collection mechanism are spaced apart, and the angle between the branch pipe and the main pipe is greater than 0 degrees, so that the projection of the other end of the branch pipe and the main pipe on the horizontal plane does not overlap. Because the negative pressure pump is connected to the main pipe through the branch pipe, and the first dust collection mechanism is located at the bottom of the main pipe, when large particles are generated, they will fall directly into the first dust collection mechanism due to gravity, preventing large particles from entering the negative pressure pump and achieving the effect of protecting the negative pressure pump and preventing it from jamming.
[0025] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This is a schematic diagram of the first structure of the negative pressure generating device provided in the embodiments of this application.
[0028] Figure 2 This is a schematic diagram of a second structure of the negative pressure generating device provided in the embodiments of this application.
[0029] Figure 3 This is a schematic diagram of a third structure of the negative pressure generating device provided in the embodiments of this application.
[0030] Figure 4 This is a schematic diagram of a fourth structure of the negative pressure generating device provided in the embodiments of this application.
[0031] Figure 5 This is a fifth structural schematic diagram of the negative pressure generating device provided in the embodiments of this application.
[0032] Figure 6 This is a sixth structural schematic diagram of the negative pressure generating device provided in the embodiments of this application.
[0033] In the picture:
[0034] 110 - Main pipeline; 120 - Branch pipeline; 121 - First pipeline; 122 - Second pipeline; 130 - First dust collection mechanism; 140 - Negative pressure pump; 150 - Filter screen; 160 - Second dust collection mechanism. Detailed Implementation
[0035] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0036] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0037] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0038] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.
[0039] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0040] As described in the background section, in current semiconductor processing systems, the vacuum pump is typically connected to the processing equipment via a straight vacuum pipe. This can lead to large particles forming in the vacuum pipe and easily entering the vacuum pump, causing it to seize up. This necessitates manual repair, which incurs labor costs, reduces production efficiency, and shortens the lifespan of the vacuum pump.
[0041] In view of this, in order to solve the above problems, this application provides a negative pressure generating device. By setting different pipes and dust collection mechanisms, even if large particles are generated in the vacuum pipe, the large particles will not directly enter the vacuum pump, thus achieving the effect of protecting the vacuum pump.
[0042] The negative pressure generating device provided in this application is described below by way of example:
[0043] As an optional implementation, please refer to Figure 1 The negative pressure generating device includes a main pipe 110, a branch pipe 120, a first dust collection mechanism 130, and a negative pressure pump 140. The main pipe 110 is vertically arranged, and the first dust collection mechanism 130 is located at the bottom of the main pipe 110 and is detachably connected to the main pipe 110. The upper part of the main pipe 110 is used to communicate with processing equipment. One end of the branch pipe 120 is connected to the main pipe 110, and the other end is connected to the negative pressure pump 140. The branch pipe 120 and the first dust collection mechanism 130 are spaced apart, and the angle between the branch pipe 120 and the main pipe 110 is greater than 0 degrees, so that the projection of the other end of the branch pipe 120 and the main pipe 110 on the horizontal plane does not overlap.
[0044] The negative pressure pump 140 provided in this application is used to generate negative pressure, so that the processing equipment is in a vacuum state. Based on this, the processing equipment described in this application can be used to process semiconductor devices.
[0045] Understandably, since the negative pressure pump 140 is connected to the main pipe 110 via the branch pipe 120, and the other end of the branch pipe 120 does not overlap with the projection of the main pipe 110 on the horizontal plane, the negative pressure pump 140 is no longer located directly below the main pipe 110. Simultaneously, since the first dust collection mechanism 130 is located at the bottom of the main pipe 110, the structure provided in this application allows the first dust collection mechanism 130 to be connected to the processing equipment via a straight pipe (main pipe 110), while the negative pressure pump 140 is no longer connected to the processing equipment solely via a straight pipe. Based on this, even if large particles are generated within the main pipe 110, these particles will fall directly into the first dust collection mechanism 130 due to gravity, preventing large particles from falling into the vacuum pump, avoiding vacuum pump jamming, and extending the service life of the vacuum pump.
[0046] Meanwhile, since the first dust collection mechanism 130 is detachably connected to the main pipe 110, after a period of use, the first dust collection mechanism 130 can be directly removed and the accumulated material inside can be cleaned, making cleaning relatively convenient and reducing system maintenance costs and labor costs.
[0047] It should be noted that the first dust collection mechanism 130 can be configured as a dust collection box, which can be threaded to the bottom of the main pipe 110. When the dust collection box is directly connected to the main pipe 110, it is necessary to ensure that the connection between the two is sealed so that a negative pressure state is maintained inside the main pipe 110. Of course, the dust collection box can not only hold large particles, but also dust and other impurities.
[0048] In one implementation of this application, the branch pipe 120 includes a first pipe 121 and a second pipe 122. One end of the first pipe 121 is connected to the main pipe 110, and the other end of the first pipe 121 is connected to the second pipe 122. The other end of the second pipe 122 is connected to the negative pressure pump 140, and the second pipe 122 is vertically arranged. The first pipe 121 and the main pipe 110 are arranged at an acute angle. Figure 1 In the diagram, A represents the angle between the first pipe 121 and the main pipe 110.
[0049] In this application, the first pipe 121 and the second pipe 122 can be integrally formed or connected in a detachable manner, but the airtightness of the two in the connected state must be guaranteed. Understandably, the second pipe 122 is arranged parallel to the main pipe 110.
[0050] When the first pipe 121 and the main pipe 110 are set at an acute angle, the angle between the first pipe 121 and the main pipe 110 is less than 60°. With this setting, the airflow inside the pipe is less obstructed, so the negative pressure generation effect is better.
[0051] As a second implementation of this application, please refer to Figure 2 The first pipe 121 is set at a right angle to the main pipe 110. This arrangement can more effectively prevent large particles from entering the branch pipe 120, and thus more effectively prevent large particles from entering the negative pressure pump 140.
[0052] As a third implementation method for the application, please refer to Figure 3 The first pipe 121 and the main pipe 110 are set at an obtuse angle. This arrangement can further prevent large particles from entering the branch pipe 120, and thus more effectively prevent large particles from entering the negative pressure pump 140.
[0053] In addition, to more effectively prevent large particulate matter from entering branch pipe 120, please refer to... Figure 4The negative pressure generating device also includes a filter screen 150, which is disposed at the connection between the main pipe 110 and the branch pipe 120. For example, the filter screen 150 is provided with small holes, which can allow the internal air to circulate, but can block the passage of large particulate matter, thereby effectively preventing large particulate matter from entering the branch pipe 120.
[0054] Furthermore, when the first pipe 121 and the main pipe 110 are set at an obtuse angle, the filter screen 150 can also be set at the connection between the first pipe 121 and the second pipe 122.
[0055] This application does not limit the structure of the first pipe 121. For example, the first pipe 121 can be a straight structure or an arc structure.
[0056] To further prevent large particulate matter from entering the negative pressure pump 140, please refer to... Figure 5 The first pipe 121 is configured as an upward-opening V-shaped or U-shaped pipe. Based on this, even if large particles enter the first pipe 121, they will accumulate at the bottom of the V-shaped or U-shaped pipe. Furthermore, the negative pressure generating device also includes a second dust collection mechanism 160, which is detachably connected to the bottom of the V-shaped or U-shaped pipe. This configuration allows for the removal of large particles from the branch pipe 120, even if they enter the branch pipe, in addition to the first dust collection mechanism 130. Of course, when the second dust collection mechanism 160 is connected to the bottom of the V-shaped or U-shaped pipe, a sealed connection is required between them.
[0057] In another implementation, please refer to Figure 6 The first pipe 121 can also be configured as a V-shaped or U-shaped pipe with the opening facing downwards. This configuration can more effectively prevent large particles from entering the negative pressure pump 140.
[0058] In summary, this application provides a negative pressure generating device and a semiconductor processing system. The negative pressure generating device includes a main pipe, branch pipes, a first dust collection mechanism, and a negative pressure pump. The main pipe is vertically arranged, and the first dust collection mechanism is located at the bottom of the main pipe and is detachably connected to the main pipe. The upper part of the main pipe is used to communicate with processing equipment. One end of the branch pipe is connected to the main pipe, and the other end is connected to the negative pressure pump. The branch pipe and the first dust collection mechanism are spaced apart, and the angle between the branch pipe and the main pipe is greater than 0 degrees, so that the projection of the other end of the branch pipe and the main pipe on the horizontal plane does not overlap. Because the negative pressure pump is connected to the main pipe through the branch pipe, and the first dust collection mechanism is located at the bottom of the main pipe, when large particles are generated, they will fall directly into the first dust collection mechanism due to gravity, preventing large particles from entering the negative pressure pump and achieving the effect of protecting the negative pressure pump and preventing it from jamming.
[0059] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
[0060] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A negative pressure generating device, characterized in that, The negative pressure generating device includes a main pipe, branch pipes, a first dust collection mechanism, and a negative pressure pump. The main pipe is vertically arranged, and the first dust collection mechanism is located at the bottom of the main pipe and is detachably connected to the main pipe. The top of the main pipe is used to communicate with processing equipment. One end of the branch pipe is connected to the main pipe, and the other end is connected to the negative pressure pump; the branch pipe and the first dust collection mechanism are spaced apart, and the angle between the branch pipe and the main pipe is greater than 0 degrees, so that the projection of the other end of the branch pipe and the main pipe on the horizontal plane do not overlap.
2. The negative pressure generating device as described in claim 1, characterized in that, The branch pipeline includes a first pipeline and a second pipeline. One end of the first pipeline is connected to the main pipeline, and the other end of the first pipeline is connected to the second pipeline. The other end of the second pipeline is connected to the negative pressure pump, and the second pipeline is vertically arranged. The first pipe is set at an acute angle to the main pipe.
3. The negative pressure generating device as described in claim 2, characterized in that, The angle between the first pipe and the main pipe is less than 60°.
4. The negative pressure generating device as described in claim 1, characterized in that, The branch pipeline includes a first pipeline and a second pipeline. One end of the first pipeline is connected to the main pipeline, and the other end of the first pipeline is connected to the second pipeline. The other end of the second pipeline is connected to the negative pressure pump, and the second pipeline is vertically arranged. The first pipe is set at a right angle to the main pipe.
5. The negative pressure generating device as described in claim 1, characterized in that, The branch pipeline includes a first pipeline and a second pipeline. One end of the first pipeline is connected to the main pipeline, and the other end of the first pipeline is connected to the second pipeline. The other end of the second pipeline is connected to the negative pressure pump, and the second pipeline is vertically arranged. The first pipe is set at an obtuse angle to the main pipe.
6. The negative pressure generating device as described in claim 1, characterized in that, The branch pipeline includes a first pipeline and a second pipeline. One end of the first pipeline is connected to the main pipeline, and the other end of the first pipeline is connected to the second pipeline. The other end of the second pipeline is connected to the negative pressure pump, and the second pipeline is vertically arranged. The first pipe is configured as a V-shaped pipe or a U-shaped pipe with the opening facing upwards.
7. The negative pressure generating device as described in claim 6, characterized in that, The negative pressure generating device also includes a second dust collection mechanism, which is detachably connected to the bottom of the V-shaped pipe or U-shaped pipe.
8. The negative pressure generating device as described in claim 1, characterized in that, The branch pipeline includes a first pipeline and a second pipeline. One end of the first pipeline is connected to the main pipeline, and the other end of the first pipeline is connected to the second pipeline. The other end of the second pipeline is connected to the negative pressure pump, and the second pipeline is vertically arranged. The first pipe is configured as a V-shaped pipe or a U-shaped pipe with the opening facing downwards.
9. The negative pressure generating device as described in claim 1, characterized in that, The negative pressure generating device also includes a filter screen, which is disposed at the connection between the main pipeline and the branch pipeline.
10. A semiconductor processing system, characterized in that, The semiconductor processing system includes processing equipment and a negative pressure generating device as described in any one of claims 1 to 9, wherein the processing equipment is connected to the main pipeline of the negative pressure generating device.