Wafer transmission mechanism of built-in valve plate structure and thin film deposition equipment of wafer transmission mechanism
By incorporating the valve plate into the wafer transfer mechanism, the valve plate is integrated into the transfer cavity, solving the problem of insufficient valve body strength between the transfer module and the process module. This enables efficient repair and maintenance, and reduces costs.
Patent Information
- Application Number
- CN202520678993.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-04-10
AI Technical Summary
In existing semiconductor process equipment, the transmission module and the process module are connected by an independent valve box and valve body, which results in low valve body strength. During maintenance, the entire unit needs to be disassembled and reassembled after the machine is stopped, which affects processing efficiency and increases maintenance costs.
It adopts an internal valve plate structure, with the valve plate built into the transmission cavity and the driver located at the bottom. Maintenance is assisted through the cover plate hole, requiring only partial disassembly and assembly, thus reducing maintenance costs.
It improves the strength and stability of the valve body, simplifies the maintenance process, reduces maintenance costs, and increases production efficiency.
Smart Images
Figure CN223839778U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of thin film deposition equipment technology, and in particular to a wafer transport mechanism with a built-in valve plate structure and its thin film deposition equipment. Background Technology
[0002] In semiconductor process equipment, to improve efficiency, a single transport module typically connects to multiple process modules. Wafers are transferred from the transport module to the process modules, and the transport module and process modules are connected by a valve box / valve body. This valve box / valve body serves two purposes: firstly, it isolates the harsh environment within the process modules from the external environment, and secondly, it maintains a vacuum environment within the transport module. Current equipment generally uses independent valve box / valve body structures to connect the transport module and the process modules. However, the valve box / valve body structure has low strength, and in case of failure, it requires shutdown and complete repair of the valve box / valve body. This approach impacts processing efficiency and increases maintenance costs. Utility Model Content
[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a wafer transport mechanism with a built-in valve plate structure and its thin film deposition equipment to solve the technical problem of the cavity bottom dropping caused by the use of independent valve box valve body docking between the existing transport module and process module.
[0004] To achieve the above objectives, the present invention adopts the following technical solution:
[0005] In a first aspect, embodiments of this utility model provide a wafer transfer mechanism with a built-in valve plate structure, comprising: a transfer cavity and a gate valve; the transfer cavity has a storage cavity for caching wafers, and the transfer cavity is provided with a transfer port, the transfer port being connected to the storage cavity; the gate valve comprises: a driver and a valve plate controlled by the extension and retraction movement of the driver; the driver is connected to the transfer cavity, and the valve plate passes through the transfer cavity and abuts against the inner side of the transfer port, such that the driver can drive the valve plate to open or close the transfer port.
[0006] The transmission port is located on the side wall of the transmission cavity, and the valve plate is controlled by the driver to extend and retract in a direction parallel to the side wall.
[0007] The bottom of the transmission cavity is provided with a perforation, the valve plate passes through the perforation, and the outer side of the valve plate abuts against the inner side of the transmission port.
[0008] The driver is connected to the bottom of the transmission cavity, and the driving end of the driver is connected to the valve plate.
[0009] The top of the transmission cavity is provided with a cover plate hole, and a maintenance cover plate is provided at the cover plate hole, which is located directly above the valve plate.
[0010] The transmission port is further provided with a connector, which has a through hole, and the valve plate abuts against the inner side of the through hole.
[0011] The connector has sealing rings on both the inner and outer sides of the through hole.
[0012] The outer side of the transmission cavity is also provided with at least two positioning guides, which are used to position and guide the external process cavity.
[0013] The positioning guide is provided with a positioning hole and a guide surface is provided on the surface of the positioning guide.
[0014] Secondly, this utility model embodiment also provides a thin film deposition apparatus, which includes a wafer transport mechanism with a built-in valve plate structure as described in any of the above embodiments.
[0015] This utility model discloses a wafer transfer mechanism with an internal valve plate structure. By embedding the valve plate inside the transfer cavity, the strength of the valve body is improved. The driver is set at the bottom of the transfer cavity for easy disassembly and maintenance. A cover plate hole is provided on the transfer cavity above the valve plate to assist in maintenance. During maintenance, there is no need to disassemble the whole assembly. Only the connector and sealing ring need to be removed from the inside of the transfer cavity, which greatly reduces maintenance costs and improves production efficiency.
[0016] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description
[0017] Figure 1 and Figure 2 These are schematic diagrams of the wafer transport mechanism with a built-in valve plate structure according to different perspectives of an embodiment of this utility model.
[0018] Figure 3 and Figure 4 These are exploded views from different perspectives of the wafer transport mechanism with a built-in valve plate structure according to an embodiment of this utility model.
[0019] Figure 5 This is a side view of the wafer transport mechanism with a built-in valve plate structure according to an embodiment of the present invention.
[0020] Figure 6 for Figure 5The sectional view shown is along line AA.
[0021] Figure 7 for Figure 6 The diagram shows a magnified view of part A.
[0022] Figure 8 This is a schematic diagram of the insert valve portion of the wafer transfer mechanism with a built-in valve plate structure according to an embodiment of the present invention.
[0023] Explanation of reference numerals in the attached figures:
[0024] The wafer transfer mechanism 100 with built-in valve plate structure includes a transfer cavity 1, a gate valve 2, an actuator 21, a drive end 211, a valve plate 22, an elastic sealing part 23, a transfer port 13, a through hole 14, a maintenance cover plate 3, a connector 4, a through hole 41, a sealing ring 5, a sealing ring 6, a positioning guide 7, a positioning hole 7, a cavity body 11, a cover 12, a storage cavity 111, and a cover hole 121. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0031] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0032] In semiconductor process equipment, to improve efficiency, a single transport module typically connects to multiple process modules. Wafers are transferred from the transport module to the process modules, and a valve box / body connects the transport module and the process modules. This valve box / body isolates the harsh environment within the process modules from the external environment and maintains a vacuum environment within the transport module. Existing equipment generally uses independent valve box / body structures to connect the transport module and the process modules. However, these valve box / body structures are not very strong, and malfunctions require downtime and complete repair of the valve box / body, impacting processing efficiency and increasing maintenance costs. Therefore, based on these requirements, this embodiment provides a wafer transport mechanism 100 with a built-in valve plate structure.
[0033] Please see Figures 1 to 8This embodiment discloses a wafer transfer mechanism 100 with a built-in valve plate structure, which includes: a transfer cavity 1 and a gate valve 2; the transfer cavity 1 has a storage cavity 111 for caching wafers, and the transfer cavity 111 is provided with a transfer port 13, which is connected to the storage cavity 111; the gate valve 2 includes: a driver 21 and a valve plate 22 controlled by the extension and retraction of the driver 21; the driver 21 is connected to the transfer cavity 1, and the valve plate 22 passes through the transfer cavity 1 and abuts against the inner side 131 of the transfer port 13, so that the driver 21 can drive the valve plate 22 to open or close the transfer port 13.
[0034] In existing technology, the transmission cavity 1 and the process module are connected by an independent valve box and valve body. That is, the transmission port 13 of the transmission cavity 1 and the interface of the process module are respectively connected to the valve box of the valve body. The valve plate moves relative to the valve box to open or close the passage between the two. Because this method requires extremely high internal sealing and is in a vacuum state, the valve box and valve plate are affected by pressure, resulting in insufficient strength.
[0035] In this embodiment, the valve plate 22 is built into the transmission cavity 1, and the inner surface 131 of the transmission cavity 1 provides support for the valve plate 22, which greatly improves its strength and stability compared to the valve box. That is, the partial structure of the transmission cavity 1 replaces the traditional valve box function, and the valve plate 22 is built into the transmission cavity 1, which is called an internal structure.
[0036] Please refer to it again. Figure 1 and Figure 2 The transmission cavity 1 is provided with multiple transmission ports 13. The following description only takes the structure of one of the transmission ports 13 as an example. The structures of the other transmission ports 13 are the same and will not be described in detail in this article.
[0037] The transmission port 13 is disposed on the side wall 112 of the transmission cavity 1, and the valve plate 22 is controlled by the driver 21 to extend and retract in a direction parallel to the side wall 112. That is, the driver 21 drives the valve plate 22 to extend and retract in a direction parallel to the side wall 112, and the plate surface of the valve plate 22 is in contact with the inner surface 131 of the transmission port 13, thereby realizing the opening or closing of the transmission port 13.
[0038] Please refer to it again. Figure 4 The bottom of the transmission cavity 1 is also provided with a perforation 14, the valve plate 22 is inserted through the perforation 14, and the outer side of the valve plate 22 abuts against the inner side 131 of the transmission port 13. The wafer passes horizontally through the transmission port 13, while the valve plate 22 moves up and down in the vertical direction to open or close the transmission port 13.
[0039] like Figure 2As shown, the driver 21 is connected to the bottom of the transmission cavity 1, and the driving end 211 of the driver 21 is connected to the valve plate 22. The driver 21 can be electric or pneumatic, such as a motor or cylinder.
[0040] The transmission cavity 1 includes a cavity body 11 and a cover 12 connected to the cavity body 11. The cover 12 and the cavity body 11 are sealed together to form the storage cavity 111.
[0041] The top of the transmission cavity 1 is provided with a cover hole 121, and a maintenance cover 3 is provided at the cover hole 121. The cover hole 121 is located directly above the valve plate 22. Specifically, the cover hole 121 is formed on the cover body 12, and the number of cover holes 121 corresponds to the corresponding transmission port 13.
[0042] In this embodiment, a connector 4 is also provided inside the transmission port 13. The connector 4 has a through hole 41 and is assembled from the inside of the transmission cavity 1 onto the transmission port 13. The valve plate 22 abuts against the inner side of the through hole 41. Since the transmission cavity 1 is relatively large, wear or failure is likely to occur at the connection between the transmission port 13 and other components. Adding the connector 4 to connect with other components can reduce damage to the transmission cavity 1 itself, requiring only the replacement or repair of other small components.
[0043] like Figure 7 As shown, a sealing ring 5 is provided on the outer surface of the through hole 41 on the connector 4. When the transmission cavity 1 is connected to the external process cavity, a sealing ring 6 is also provided on the outer mating surface of the transmission port 13 of the transmission cavity 1. The sealing ring 5 and the sealing ring 6 form a double-layer seal. During long-term operation, when the inner sealing ring 5 is corroded or aged, the outer sealing ring 6 can still achieve a compliant sealing environment. In addition, when the sealing performance of the inner sealing ring 5 is insufficient due to corrosion and aging, the internal pressure of the transmission cavity can be detected by the pressure detection unit. If the pressure is abnormal, the connector 4 can be removed from the inside of the transmission cavity 1, that is, removed to the side of the valve plate 22, and the sealing ring 5 can be quickly replaced. In the existing design of the connection between the transmission module and the process module, if the sealing ring 5 is damaged, the two need to be disassembled as a whole, and the internal vacuum and process gas need to be cleaned and treated again, which is time-consuming and labor-intensive for replacement and maintenance.
[0044] The valve plate 22 is provided with an elastic sealing part 23 on the surface that is in contact with the inner side of the through hole 41 of the connector 4, so that when the valve plate 22 completely blocks the through hole 41, a seal is formed with its surface.
[0045] Please refer to it again. Figure 1In order to enable the transmission cavity 1 to quickly and accurately dock with other process modules, the outer surface 112 of the transmission cavity 1 is also provided with at least two positioning guides 7, which are used to position and guide the external process cavities (not shown in the figure).
[0046] The positioning guide 7 is provided with a positioning hole 71 and a guide surface is provided on the surface of the positioning guide 7 to guide the docking end of the process module to be smoothly aligned. The positioning hole 71 is used to achieve precise alignment with the positioning column and other structures of the process module.
[0047] This utility model embodiment also provides a thin film deposition apparatus, which includes a wafer transport mechanism 100 with a built-in valve plate structure as described in any of the above embodiments.
[0048] The wafer transfer mechanism with an embedded valve plate structure in this embodiment improves the strength of the valve body by embedding the valve plate inside the transfer cavity. The driver is set at the bottom of the transfer cavity for easy disassembly and maintenance. A cover plate hole is provided on the transfer cavity above the valve plate to assist in maintenance. During maintenance, the entire object is disassembled and only partial maintenance is required, which greatly reduces maintenance costs and improves production efficiency.
[0049] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.
Claims
1. A wafer transport mechanism with a built-in valve plate structure, characterized in that, include: Transmission chamber and slide gate valve; The transmission cavity has a storage cavity for a cache wafer. The transmission cavity is provided with a transmission port, which is connected to the storage cavity. The slide valve includes a driver and a valve plate controlled by the extension and retraction of the driver. The driver is connected to the transmission cavity. The valve plate passes through the transmission cavity and abuts against the inner side of the transmission port, so that the driver can drive the valve plate to open or close the transmission port.
2. The wafer transport mechanism with an embedded valve plate structure according to claim 1, characterized in that, The transmission port is located on the side wall of the transmission cavity, and the valve plate is controlled by the driver to extend and retract in a direction parallel to the side wall.
3. The wafer transport mechanism with an embedded valve plate structure according to claim 2, characterized in that, The bottom of the transmission cavity is also provided with a perforation, the valve plate passes through the perforation, and the outer side of the valve plate abuts against the inner side of the transmission port.
4. The wafer transport mechanism with an embedded valve plate structure according to claim 3, characterized in that, The driver is connected to the bottom of the transmission cavity, and the driving end of the driver is connected to the valve plate.
5. The wafer transport mechanism with an embedded valve plate structure according to any one of claims 1 to 4, characterized in that, The top of the transmission cavity is also provided with a cover plate hole, and a maintenance cover plate is provided at the cover plate hole, which is located directly above the valve plate.
6. The wafer transport mechanism with an embedded valve plate structure according to claim 5, characterized in that, The transmission port is also provided with a connector, which has a through hole. The valve plate abuts against the inner side of the through hole, and the connector is assembled from inside the transmission cavity to the transmission port.
7. The wafer transport mechanism with a built-in valve plate structure according to claim 6, characterized in that, Both the outer surface of the connector and the outer surface of the transmission port are provided with sealing rings.
8. The wafer transport mechanism with a built-in valve plate structure according to claim 7, characterized in that, The outer side of the transmission cavity is also provided with at least two positioning guides, which are used to position and guide the external process cavity.
9. The wafer transport mechanism with an embedded valve plate structure according to claim 8, characterized in that, The positioning guide is provided with a positioning hole, and the surface of the positioning guide is provided with a guide surface.
10. A thin film deposition apparatus, characterized in that, The thin film deposition apparatus includes a wafer transport mechanism with a built-in valve plate structure as described in any one of claims 1 to 9.