Semiconductor refrigeration assembly with long service life

Abstract

The utility model relates to the technical field of semiconductor refrigeration, and provides a long-life semiconductor refrigeration assembly, which comprises a refrigeration element layer positioned at the central part, and the refrigeration element layer is a rectangular array formed by electrically connecting a plurality of N-type and P-type refrigeration elements through flow deflectors; and at least one group of two adjacent columns of refrigeration elements in the rectangular array formed by the N-type refrigeration elements and the P-type refrigeration elements are electrically connected through a parallel circuit. According to the technical scheme, when a certain refrigeration element is damaged and fails, the whole circuit can be kept closed, the service life of a current semiconductor refrigeration product is prolonged, and the maintenance cost of an enterprise is reduced.

Description

Technical Field

[0001] This utility model relates to a semiconductor cooling component, and more particularly to a semiconductor cooling component that can extend its service life. Background Technology

[0002] like Figure 1 , Figure 2 As shown, existing semiconductor cooling components are analyzed using a layered structure: they have a central N / P type cooling element layer, in which the cooling elements are arranged in series in an NPNP configuration, forming a rectangular array; above and below the cooling element layer are conductive layer and ceramic plate layer arranged sequentially, thus constituting a complete semiconductor cooling component. This type of cooling component has a fatal flaw: because the N / P cooling elements are connected in series, the failure of any one element causes the entire circuit to break, resulting in the failure of the entire cooling component and rendering the cooling product unusable. Utility Model Content

[0003] In order to solve the above-mentioned problems in the prior art, this utility model provides a semiconductor cooling component that can extend its service life.

[0004] A high-lifespan semiconductor cooling component includes a cooling element layer located at the center, wherein the cooling element layer is composed of a rectangular array of several N-type and P-type cooling elements electrically connected by a current guide plate; at least one pair of adjacent columns of cooling elements in the rectangular array composed of several N-type and P-type cooling elements are electrically connected by a parallel circuit.

[0005] By implementing the above technical solutions, even if a certain cooling component fails, the entire circuit can still remain open, extending the service life of current semiconductor cooling products and reducing enterprise maintenance costs.

[0006] In a more preferred embodiment based on the above scheme, the cooling element layer consists of an even-numbered rectangular array of N-type and P-type cooling elements, and two adjacent columns of cooling elements form a parallel circuit unit, with each of the parallel circuit units connected in series.

[0007] Furthermore, the guide vane is made of copper. The guide vane is welded to the cooling element at high temperature.

[0008] Furthermore, the cooling element is one or more of the following: bismuth telluride element, antimony telluride element, bismuth selenide element, antimony selenide element, tin selenide element, and lead selenide element. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the layered structure of an existing cooling component;

[0010] Figure 2 This is a schematic diagram of the electrical connection structure of an existing cooling element;

[0011] Figure 3 This is a schematic diagram of the electrical connection structure of the cooling element of this utility model.

[0012] In the diagram: 1. Ceramic plate layer; 2. Flow guide layer; 3. Cooling element layer. Detailed Implementation

[0013] like Figure 1 , Figure 2 As shown, the high-lifespan semiconductor cooling component provided by this invention has the same layered structure as the prior art, namely, a cooling element layer 3 located at the center, and a flow guide layer 2 and a ceramic plate layer 1 arranged sequentially in both vertical directions around the cooling element layer 3. The cooling element layer 3 contains a plurality of N-type and P-type cooling elements, which are connected in series in an NPN or PNP configuration by copper flow guides on the flow guide layer 2. These N-type and P-type cooling elements are typically arranged in a rectangular array on the cooling element layer 3.

[0014] like Figure 2 , Figure 3 As shown, the circuit design structure of the cooling elements on the cooling element layer 3 in this invention differs from that in the prior art. Instead, the N-type and P-type cooling elements arranged in a rectangular array on the cooling element layer 3 are arranged in columns, and at least two adjacent columns of N-type and P-type cooling elements are designed as parallel circuits. In this way, even if one of the cooling elements in the parallel circuit fails, the entire circuit can still remain open, extending the service life of current semiconductor cooling products and reducing enterprise maintenance costs.

[0015] In this invention, the cooling elements are typically arranged in an even number of horizontal / vertical sequences on the cooling element layer 3. For example, a 126-group NP semiconductor cooling assembly is used.

[0016] The power supply has two fewer sets of NP cooling elements at its positive and negative terminals to facilitate wiring. The remaining cooling elements are arranged in a 16x16 grid. Using the positive and negative terminals as a reference, these cooling elements are divided into 16 vertical sequences. Two adjacent vertical sequences are designed as a parallel circuit unit, resulting in a total of eight parallel circuit units. These parallel circuit units are then connected in series to form a series-parallel hybrid cooling assembly. This way, if a single cooling element in the parallel circuit fails, it will not affect the circuitry of the entire cooling assembly. If a large number of cooling elements fail, the entire cooling assembly can be replaced, extending its lifespan and reducing maintenance costs for the company.

[0017] The current-conducting plate in this invention should be made of materials including but not limited to those with high electrical conductivity, such as copper current-conducting plates, which can be welded to the cooling element at high temperature. The cooling element can be one of the following: bismuth telluride element, antimony telluride element, bismuth selenide element, antimony selenide element, tin selenide element, lead selenide element, or a combination of several of the above elements.

Claims

1. A high-lifespan semiconductor cooling assembly, comprising a cooling element layer located at the center, wherein the cooling element layer is composed of a plurality of N-type and P-type cooling elements electrically connected by current-conducting plates to form a rectangular array; characterized in that: In the rectangular array consisting of several N-type and P-type cooling elements, at least one pair of adjacent rows of cooling elements are electrically connected by a parallel circuit.

2. The high-lifetime semiconductor cooling component as described in claim 1, characterized in that: The cooling element layer consists of an even-numbered rectangular array of N-type and P-type cooling elements, with adjacent columns of cooling elements forming a parallel circuit unit, and each of the parallel circuit units being connected in series.

3. The high-lifetime semiconductor cooling component as described in claim 1 or 2, characterized in that: The guide vane is made of copper.

4. The high-lifespan semiconductor cooling component as described in claim 3, characterized in that: The flow guide plate is welded to the cooling element at high temperature.

5. The high-lifespan semiconductor cooling component as described in claim 1 or 2, characterized in that: The cooling element is one or more of the following: bismuth telluride element, antimony telluride element, bismuth selenide element, antimony selenide element, tin selenide element, and lead selenide element.

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