Silicon wafer surface liquid drying device

Abstract

The utility model is suitable for the technical field of silicon wafer drying, and provides a silicon wafer surface liquid drying device, which comprises a U-shaped frame and two belt conveying assemblies penetrating through the inside of the U-shaped frame, and is characterized in that the two belt conveying assemblies are respectively positioned on one side and the other side of an inner cavity of the U-shaped frame; a connecting plate is fixedly connected to the bottom of the belt conveying assembly, a containing frame is fixedly connected to the lower surface of the connecting plate, heating lamp tubes are detachably arranged at the front end and the rear end of the two side faces of the inner wall of the U-shaped frame, and a plurality of mounting holes are formed in the top of the U-shaped frame. According to the silicon wafer surface liquid drying device, through the arrangement of the four heating lamp tubes, drying can be conducted for a certain time when a flower basket waits, liquid carried by silicon wafers is reduced, and therefore clamping groove marks, fragments and the failure rate caused by liquid carrying are reduced, and after the liquid carrying condition is reduced, the silicon wafers can be kept parallel relatively; and the failure rate and the fragment rate during automatic sheet feeding and discharging are reduced.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer drying technology, and in particular relates to a device for drying silicon wafers with liquid on the surface. Background Technology

[0002] Solar energy is a renewable and clean energy source. In order to realize the utilization of solar photovoltaic energy, solar cells have been developed. They are mainly based on semiconductor materials. The principle of photoelectric materials absorbing light energy and then converting it into photoelectrons is to ultimately convert light energy into electrical energy.

[0003] In the existing technology, the presence of slot marks on silicon wafers accounts for a large proportion of the overall production process of solar cells. This reduces the quality of the finished cells, increases the defect rate in the solar cell production process, and consequently increases the production cost of the solar cell industry. Utility Model Content

[0004] This invention provides a liquid drying device for silicon wafers, aiming to solve the problem that in the existing technology, the proportion of silicon wafers with groove marks is relatively large in the entire production process of solar cells, which will reduce the quality of the finished cells.

[0005] The technical solution of this utility model is:

[0006] This utility model provides a silicon wafer surface liquid drying device, including a frame and two belt conveyor assemblies that penetrate the interior of the frame. The two belt conveyor assemblies are respectively located on one side and the other side of the inner cavity of the frame. A connecting plate is fixedly connected to the top of the belt conveyor assembly, and a placement rack is fixedly connected to the upper surface of the connecting plate.

[0007] Heating lamps are detachably installed on the front and rear ends of both sides of the inner wall of the frame. Several mounting holes are opened at the bottom of the frame. Temperature controllers are fixedly connected to the front ends of both sides of the inner wall of the frame. Multiple temperature controllers correspond one-to-one with multiple heating lamps and are electrically connected.

[0008] Preferably, it also includes a main controller, wherein the heating lamp is electrically connected to the corresponding temperature controller via a first wiring connection, and the temperature controller is electrically connected to the main controller via a second wiring connection.

[0009] Preferably, a limiting plate is fixedly connected to the lower part between the two sides inside the frame, and multiple second wirings pass through the limiting plate and are electrically connected to the main controller.

[0010] Preferably, the inner wall of the frame is provided with a plurality of disassembly structures, each of which corresponds one-to-one with a plurality of heating lamps. Each disassembly structure includes two fixing boxes and two snap-fit ​​seats. The two fixing boxes are respectively fixedly connected to the inner wall of the frame, and the two snap-fit ​​seats are respectively fixedly connected to the top of the front and rear sides of the heating lamps. The inner cavity of the fixing box is provided with a sliding plate that slides horizontally. The inner side of the sliding plate is fixedly connected with a snap-fit ​​rod whose inner end extends to the outside of the fixing box. The snap-fit ​​rod is adapted to the snap-fit ​​seat.

[0011] Preferably, a spring is laterally fixed between the inner side of the sliding plate and the inner end of the inner wall of the fixed box, and a connecting rod is fixedly connected to the top of the sliding plate, with the top end of the connecting rod extending movably to the outside of the fixed box.

[0012] Preferably, the inner wall of the fixing box is provided with a sliding groove for the sliding plate to slide.

[0013] Preferably, the top of the fixing box has a horizontally openable opening, and the top end of the connecting rod extends movably through the inside of the openable opening to the outside of the fixing box.

[0014] Preferably, the spring is movably sleeved on the outside of the locking rod.

[0015] Preferably, the frame is U-shaped and has several mounting holes at the bottom.

[0016] Preferably, the heating lamp is a far-infrared quartz heating tube.

[0017] The beneficial effects of this utility model are:

[0018] This utility model discloses a silicon wafer surface liquid drying device. Equipped with four heating lamps, it can dry the wafers for a certain period while they are waiting in the wafer basket, reducing liquid residue on the wafers. This reduces the likelihood of wafer jamming, breakage, and failures caused by liquid residue. By reducing liquid residue, the wafers can maintain relative parallelism, lowering the failure and breakage rates during automated wafer feeding and unloading. This further reduces the number of wafers falling off the EF suction cup, lowers the breakage rate in the Lp process, improves the production qualification rate, enhances the quality of finished products, and reduces industrial production costs. Furthermore, the device features several mounting holes, allowing for the disassembly of the U-shaped frame for easy maintenance and repair.

[0019] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0020] The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings, in which like reference numerals generally represent like parts.

[0021] Figure 1 This is a schematic diagram of the three-dimensional device of this utility model;

[0022] Figure 2 This is a schematic diagram of the device for fixing the box and heating lamp tube in this utility model;

[0023] Figure 3 This is a schematic diagram of the device consisting of a fixed box and a sliding plate in this utility model.

[0024] In the diagram: 1. U-shaped frame; 2. Heating lamp tube; 3. Temperature controller; 4. First wiring; 5. Limiting plate; 6. Second wiring; 7. Main controller; 8. Belt conveyor assembly; 9. Connecting plate; 10. Placement rack; 11. Fixing box; 12. Sliding plate; 13. Connecting rod; 14. Movable opening; 15. Snap-fit ​​rod; 16. Spring; 17. Snap-fit ​​seat; 18. Mounting hole. Detailed Implementation

[0025] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. Although preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0026] Please see Figure 1-3 This utility model provides a technical solution: a silicon wafer surface liquid drying device, including a U-shaped frame 1 and two belt conveyor assemblies 8 that penetrate the interior of the U-shaped frame 1. The two belt conveyor assemblies 8 are located on one side and the other side of the inner cavity of the U-shaped frame 1, respectively. A connecting plate 9 is fixedly connected to the top of the belt conveyor assembly 8, and a placement rack 10 is fixedly connected to the upper surface of the connecting plate 9.

[0027] Heating lamps 2 are detachably installed on the front and rear ends of both sides of the inner wall of the U-shaped frame 1. Several mounting holes 18 are opened at the bottom of the U-shaped frame 1. Temperature controllers 3 are fixedly connected to the front ends of both sides of the inner wall of the U-shaped frame 1. Multiple temperature controllers 3 correspond one-to-one with multiple heating lamps 2 and are electrically connected.

[0028] While waiting in the flower basket, the silicon wafers can be dried for a certain period of time using the four heating lamps 2, which reduces liquid residue on the wafers and thus reduces the number of slot marks, fragments, and failures caused by liquid residue.

[0029] Reducing liquid carryover can maintain relative parallelism between silicon wafers, lowering the failure rate and breakage rate during automated wafer feeding and unloading, thereby reducing the number of wafers falling off the EF chuck, reducing the breakage rate in the Lp process, improving the production qualification rate, improving the quality of finished products, and reducing industrial production costs.

[0030] Multiple mounting holes 18 allow the U-shaped frame 1 to be installed on the Lpcvd for timely drying before feeding, and also allow the U-shaped frame 1 to be disassembled later, facilitating the maintenance and repair of the device.

[0031] Furthermore, it also includes a main controller 7, with the heating lamp 2 electrically connected to the corresponding temperature controller 3 via the first wiring 4, and the temperature controller 3 electrically connected to the main controller 7 via the second wiring 6.

[0032] Furthermore, a limiting plate 5 is fixedly connected to the lower part between the two sides inside the U-shaped frame 1, and multiple second wiring terminals 6 pass through the limiting plate 5 and are electrically connected to the main controller 7.

[0033] Two wires, a live wire and a neutral wire, are led out from the machine and connected to the main controller 7. Four sets of second wires 6 are connected in parallel through the circuit breaker. Each set of second wires 6 passes through its own temperature controller 3, and then leads out from the temperature controller 3 using the first wire 4 to connect to the corresponding heating lamp 2, forming a circuit. The limit plate 5 can prevent the second wires 6 from falling and affecting the use.

[0034] Furthermore, the inner wall of the U-shaped frame 1 is provided with several disassembly structures, each of which corresponds to a number of heating lamps 2. The disassembly structure includes two fixing boxes 11 and two snap-fit ​​seats 17, with the two fixing boxes 11 respectively fixedly connected to the inner wall of the U-shaped frame 1.

[0035] Two snap-fit ​​seats 17 are fixedly connected to the top of the front and rear sides of the heating lamp tube 2, respectively. The inner cavity of the fixing box 11 is provided with a sliding plate 12 that slides in the horizontal direction. The inner side of the sliding plate 12 is fixedly connected with a snap-fit ​​rod 15 that extends from the inner end to the outside of the fixing box 11. The snap-fit ​​rod 15 is adapted to the snap-fit ​​seat 17.

[0036] A spring 16 is horizontally fixed between the inner side of the sliding plate 12 and the inner end of the inner wall of the fixed box 11. A connecting rod 13 is fixedly connected to the top of the sliding plate 12, and the top end of the connecting rod 13 extends movably to the outside of the fixed box 11.

[0037] In this embodiment, the elastic force of the spring 16 pulls the sliding plate 12 to move, so that the locking rod 15 is embedded in the inside of the locking seat 17, which can fix the heating lamp tube 2 for use. When the heating lamp tube 2 needs to be disassembled, the connecting rod 13 is pulled to move the sliding plate 12. After the spring 16 is deformed, the locking rod 15 can be pulled out of the inside of the locking seat 17, thereby enabling the heating lamp tube 2 to be disassembled, which facilitates the inspection and maintenance of the heating lamp tube 2.

[0038] Furthermore, the top of the fixed box 11 has a horizontally openable opening 14, through which the top of the connecting rod 13 extends to the outside of the fixed box 11, and the spring 16 is movably sleeved on the outside of the snap-fit ​​rod 15.

[0039] In this embodiment, the spring 16 is sleeved on the outside of the snap-fit ​​rod 15, which can prevent the spring 16 from shifting significantly during deformation and extend the service life of the spring 16.

[0040] The working principle and usage process of this utility model: After the utility model is installed, while waiting in the flower basket, the four first wiring terminals 4 can be dried for a certain period of time, reducing the amount of liquid on the silicon wafers. This reduces the number of slot marks, fragments, and failures caused by liquid on the wafers. After reducing the amount of liquid on the wafers, the silicon wafers can be kept relatively parallel, reducing the failure rate and fragmentation rate during automated wafer feeding and unloading. This reduces the number of wafer drops from the EF suction cup, reduces the fragmentation rate in the Lp process, improves the production qualification rate, improves the quality of finished products, and reduces industrial production costs. Furthermore, the U-shaped frame 1 can be disassembled later through the provided mounting holes 18, facilitating the maintenance and repair of the device later.

[0041] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A silicon wafer surface liquid drying device, comprising a frame (1) and two belt conveyor assemblies (8) penetrating the interior of the frame (1), characterized in that: The two belt conveyor assemblies (8) are located on one side and the other side of the inner cavity of the frame (1), respectively. A connecting plate (9) is fixedly connected to the top of the belt conveyor assembly (8), and a placement rack (10) is fixedly connected to the upper surface of the connecting plate (9). Heating lamps (2) are detachably installed on the front and rear ends of both sides of the inner wall of the frame (1). Several mounting holes (18) are opened at the bottom of the frame (1). Temperature controllers (3) are fixedly connected to the front ends of both sides of the inner wall of the frame (1). Multiple temperature controllers (3) correspond one-to-one with multiple heating lamps (2) and are electrically connected.

2. The silicon wafer surface liquid drying device according to claim 1, characterized in that: It also includes a main controller (7), wherein the heating lamp (2) is electrically connected to the corresponding temperature controller (3) via a first wiring (4), and the temperature controller (3) is electrically connected to the main controller (7) via a second wiring (6).

3. The silicon wafer surface liquid drying device according to claim 2, characterized in that: A limiting plate (5) is fixedly connected between the two sides inside the frame (1), and multiple second wirings (6) pass through the limiting plate (5) and are electrically connected to the main controller (7).

4. The silicon wafer surface liquid drying device according to claim 1, characterized in that: The inner wall of the frame (1) is provided with several disassembly structures, and each of the disassembly structures corresponds to one of the heating lamps (2). Each disassembly structure includes two fixing boxes (11) and two snap-fit ​​seats (17). The two fixing boxes (11) are respectively fixedly connected to the inner wall of the frame (1), and the two snap-fit ​​seats (17) are respectively fixedly connected to the top of the front and rear sides of the heating lamps (2). The inner cavity of the fixing box (11) is provided with a sliding plate (12) that slides in the horizontal direction. The inner side of the sliding plate (12) is fixedly connected with a snap-fit ​​rod (15) whose inner end is pulled out to the outside of the fixing box (11). The snap-fit ​​rod (15) is adapted to the snap-fit ​​seat (17).

5. The silicon wafer surface liquid drying device according to claim 4, characterized in that: A spring (16) is horizontally fixed between the inner side of the sliding plate (12) and the inner end of the inner wall of the fixed box (11). A connecting rod (13) is fixedly connected to the top of the sliding plate (12), and the top end of the connecting rod (13) extends movably to the outside of the fixed box (11).

6. The silicon wafer surface liquid drying device according to claim 4, characterized in that: The inner wall of the fixed box (11) is provided with a sliding groove for the sliding plate (12) to slide.

7. The silicon wafer surface liquid drying device according to claim 5, characterized in that: The top of the fixed box (11) has a horizontally openable opening (14), and the top of the connecting rod (13) extends movably through the inside of the openable opening (14) to the outside of the fixed box (11).

8. A silicon wafer surface liquid drying device according to claim 5, characterized in that: The spring (16) is movably sleeved on the outside of the snap-fit ​​rod (15).

9. The silicon wafer surface liquid drying device according to claim 1, characterized in that: The frame (1) is U-shaped and has several mounting holes at the bottom.

10. A silicon wafer surface liquid drying device according to claim 1, characterized in that: The heating lamp tube (2) is a far-infrared quartz heating tube.

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