Parallel operation copper bar and system of electronic load

Abstract

The utility model discloses a parallel operation copper bar and system of an electronic load, and the parallel operation copper bar comprises a positive electrode copper bar which is used for connecting the positive electrode power input end of the electronic load; the cathode copper bar is used for connecting a cathode power input end of the electronic load, and the cathode copper bar and the anode copper bar are oppositely arranged at an interval; the insulating plate is arranged between the positive electrode copper bar and the negative electrode copper bar, and the positive electrode copper bar and the negative electrode copper bar are tightly attached to one side face of the insulating plate respectively. According to the invention, the amplitude of current overshoot oscillation can be reduced, and the reliability and safety of the parallel operation system of the electronic load are improved.

Description

Technical Field

[0001] This application relates to the field of electronic loads, and in particular to a parallel copper busbar and system for electronic loads. Background Technology

[0002] Electronic loads are specialized instruments used to test power supply performance. Currently, server power supplies often have power ratings of tens of kilowatts and current ratings of several thousand amperes. Therefore, multiple electronic loads need to be connected in parallel to form a high-power electronic load parallel system to meet the testing requirements of high-power power supplies.

[0003] In related technologies, the power input terminals of high-power electronic load parallel systems are connected in parallel via copper busbars. The positive and negative copper busbars are separated to avoid short circuits. Due to the significant self-inductance effect of the copper busbars and the inductive reactance of the wires used to connect the tested object, an inductive effect is generated, which hinders current changes. At the same time, it forms an LC resonance effect with the internal capacitor of the equipment, causing the load current to overshoot and oscillate when the current rises instantaneously.

[0004] In summary, among the related technologies, the parallel system of electronic loads has low reliability and safety because the copper busbar has a significant self-inductance effect and is prone to current overshoot and oscillation when under high dynamic and high current load. Utility Model Content

[0005] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a parallel copper busbar and system for electronic loads, which can reduce the amplitude of current overshoot oscillation and improve the reliability and safety of the parallel electronic load system.

[0006] The parallel copper busbar of the electronic load according to the first aspect embodiment of this application includes:

[0007] A positive copper busbar is used to connect to the positive power input terminal of the electronic load;

[0008] The negative copper busbar is used to connect to the negative power input terminal of the electronic load, and the negative copper busbar is arranged at a distance from the positive copper busbar.

[0009] An insulating plate is disposed between the positive copper busbar and the negative copper busbar, with the positive and negative copper busbars respectively in close contact with one side of the insulating plate.

[0010] According to some embodiments of this application, the thickness of the insulating plate is less than or equal to 2 mm.

[0011] In this embodiment, a thickness of [thickness value missing] is used.

[0012] According to some embodiments of this application, the thickness of the insulating plate is 1.5 mm.

[0013] According to some embodiments of this application, the insulating board is an epoxy resin board.

[0014] According to some embodiments of this application, a plurality of positive terminals are evenly distributed from one end to the other on the positive copper busbar, and the positive terminals are used to connect to the positive power input terminal of the electronic load through wires; a plurality of negative terminals are evenly distributed from one end to the other on the negative copper busbar, and the negative terminals are used to connect to the negative power input terminal of the electronic load through wires.

[0015] An electronic load parallel system according to a second aspect embodiment of this application includes at least two electronic loads, the at least two electronic loads being connected in parallel via the aforementioned electronic load parallel busbar.

[0016] According to some embodiments of this application, at least two electronic loads are arranged in a stacked structure.

[0017] The parallel copper busbar and system of the electronic load according to the embodiments of this application have at least the following beneficial effects:

[0018] In this embodiment, the positive and negative copper busbars are respectively attached tightly to one side of the insulating plate, which shortens the distance between them. When a rapidly changing current passes through the positive and negative copper busbars, self-induction occurs, generating magnetic fields of equal magnitude and opposite direction. Since the positive and negative copper busbars are almost touching, the magnetic fields cancel each other out, reducing the inductance effect and effectively decreasing the inductance of the copper busbars. This also weakens the LC resonance effect formed with the internal capacitance of the electronic load. This application can reduce the amplitude of current overshoot oscillation and improve the reliability and safety of the parallel electronic load system.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 This is a schematic diagram of the parallel copper busbar of the electronic load in an embodiment of this application;

[0022] Figure 2 This is a perspective view of the parallel copper busbar of the electronic load in the embodiments of this application;

[0023] Figure 3 for Figure 2 A magnified view of a portion of the image;

[0024] Figure 4 This is a schematic diagram of the parallel system of electronic loads in the embodiments of this application.

[0025] Icon labels:

[0026] Positive copper busbar 100, negative copper busbar 200, insulating plate 300, positive terminal 110, negative terminal 210, electronic load 400. Detailed Implementation

[0027] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0028] In the description of this application, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] In the description of this application, "multiple" refers to two or more. The use of "first" and "second" is for the purpose of distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or the order in which the technical features are indicated.

[0030] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0031] refer to Figures 1 to 3 As shown, a parallel copper busbar for an electronic load includes:

[0032] Positive copper busbar 100 is used to connect to the positive power input terminal of the electronic load;

[0033] The negative copper busbar 200 is used to connect the negative power input terminal of the electronic load. The negative copper busbar 200 and the positive copper busbar 100 are arranged at intervals relative to each other.

[0034] An insulating plate 300 is disposed between the positive copper busbar 100 and the negative copper busbar 200, with the positive copper busbar 100 and the negative copper busbar 200 respectively in close contact with one side of the insulating plate 300.

[0035] In this embodiment, the positive copper busbar 100 and the negative copper busbar 200 are respectively attached to one side of the insulating plate 300, which shortens the distance between them. When a rapidly changing current passes through the positive copper busbar 100 and the negative copper busbar 200, they generate self-inductance, producing magnetic fields of equal magnitude and opposite direction. Since the positive copper busbar 100 and the negative copper busbar 200 are almost in close contact, the magnetic fields cancel each other out, the inductance effect is weakened, and the inductance of the copper busbars is effectively reduced, thus weakening the LC resonance effect formed with the internal capacitance of the electronic load. This application can reduce the amplitude of current overshoot oscillation and improve the reliability and safety of the parallel system of electronic loads.

[0036] It should be noted that when multiple electronic loads are connected in parallel to form a parallel system, two copper busbars are usually set up. The positive power input terminal of each electronic load is connected to the positive copper busbar, and the negative power input terminal is connected to the negative copper busbar. In order to enhance the insulation effect, the distance between the positive and negative copper busbars is increased. Therefore, the copper busbar self-inductance effect is obvious, and the current is prone to overshoot and oscillation when under high dynamic and high current load.

[0037] This application uses an insulating plate 300 between the positive copper busbar 100 and the negative copper busbar 200, placing the positive and negative copper busbars 100 and 200 in close contact with one side of the insulating plate 300, making them nearly touching. However, due to the presence of the insulating plate 300, good insulation is still achieved. Furthermore, because the positive and negative copper busbars 100 and 200 are nearly touching, the magnetic fields generated by the current flowing through the positive and negative copper busbars 100 cancel each other out, reducing the inductance effect. Therefore, the inductance of the copper busbars can be effectively reduced, weakening the LC resonance effect formed with the internal capacitance of the electronic load. This reduces the amplitude of current overshoot oscillation and improves the reliability and safety of the parallel electronic load system. It is suitable for high-current, high-speed dynamic load conditions.

[0038] It should be noted that the power input terminals of the electronic load are connected to the positive copper busbar 100 and the negative copper busbar 200 respectively via wires. The wires can be directly soldered to the positive and negative copper busbars 100, or independent terminals can be provided on the copper busbars for connection to the wires. The insulating board 300 can be made of epoxy resin, phenolic resin, polyimide, or other insulating materials.

[0039] In some implementations, the thickness of the insulating plate 300 is less than or equal to 2 mm.

[0040] In this embodiment, an insulating plate 300 with a thickness of 2 mm or less is used, which can enhance the effect of mutual cancellation of magnetic fields and further improve the reliability and safety of the parallel system of electronic loads.

[0041] In some embodiments, the thickness of the insulating plate 300 is 1.5 mm.

[0042] In this embodiment, an insulating plate 300 with a thickness of 1.5 mm is used, which can enhance the effect of mutual cancellation of magnetic fields and further improve the reliability and safety of the parallel system of electronic loads.

[0043] It should be noted that the insulation effect of the insulating board 300 is positively correlated with its thickness, but too thick a board will weaken the effect of magnetic field cancellation. After testing, it was found that using an insulating board 300 with a thickness of 1.5mm in the parallel system of electronic loads can achieve both good insulation effect and ensure the effect of magnetic field cancellation, thus achieving a balance between the two.

[0044] In some embodiments, the insulating board 300 is an epoxy resin board.

[0045] In this embodiment, epoxy resin board is used as insulation board 300, which has the advantages of high strength, good heat resistance, low water absorption, and excellent mechanical and electrical properties.

[0046] In some embodiments, a plurality of positive terminals 110 are evenly distributed from one end to the other on the positive copper busbar 100, and the positive terminals 110 are used to connect to the positive power input terminal of the electronic load through a conductor; a plurality of negative terminals 210 are evenly distributed from one end to the other on the negative copper busbar 200, and the negative terminals 210 are used to connect to the negative power input terminal of the electronic load through a conductor.

[0047] In this embodiment, a plurality of positive terminals 110 are arranged at intervals on the positive copper busbar 100, and a plurality of negative terminals 210 are arranged at intervals on the negative copper busbar 200. This facilitates the connection of electronic loads to the copper busbars and makes it easier to add or disconnect electronic loads in the parallel system.

[0048] Specifically, multiple evenly spaced positive terminals 110 are sequentially arranged from front to back on the positive copper busbar 100, and the positive conductor of the electronic load is fixed to the positive terminals 110 by bolts. Similarly, multiple evenly spaced negative terminals 210 are sequentially arranged from front to back on the negative copper busbar 200, and the negative conductor of the electronic load is fixed to the negative terminals 210 by bolts. By providing terminals on the copper busbars, electronic loads can be easily connected.

[0049] refer to Figure 4 As shown, this application also relates to an electronic load parallel system, including at least two electronic loads, which are connected in parallel via the above-mentioned electronic load parallel busbar.

[0050] In some implementations, at least two electronic loads are arranged in a stacked structure.

[0051] In this embodiment, multiple electronic loads adopt a stacked structure, which can save the space occupied by the parallel system.

[0052] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A parallel copper busbar for an electronic load, characterized in that, include: A positive copper busbar (100) is used to connect to the positive power input terminal of the electronic load; A negative copper busbar (200) is used to connect to the negative power input terminal of the electronic load. The negative copper busbar (200) and the positive copper busbar (100) are arranged at intervals relative to each other. An insulating plate (300) is disposed between the positive copper busbar (100) and the negative copper busbar (200), with the positive copper busbar (100) and the negative copper busbar (200) respectively in close contact with one side of the insulating plate (300).

2. The parallel copper busbar of the electronic load according to claim 1, characterized in that, The thickness of the insulating plate (300) is less than or equal to 2 mm.

3. The parallel copper busbar of the electronic load according to claim 2, characterized in that, The thickness of the insulating board (300) is 1.5 mm.

4. The parallel copper busbar of the electronic load according to claim 1, characterized in that, The insulating board (300) is an epoxy resin board.

5. The parallel copper busbar of the electronic load according to claim 1, characterized in that, The positive copper busbar (100) has a plurality of positive terminals (110) evenly distributed from one end to the other, and the positive terminals (110) are used to connect to the positive power input terminal of the electronic load through wires; the negative copper busbar (200) has a plurality of negative terminals (210) evenly distributed from one end to the other, and the negative terminals (210) are used to connect to the negative power input terminal of the electronic load through wires.

6. An electronic load parallel system, characterized in that, It includes at least two electronic loads, and the at least two electronic loads are connected in parallel via a parallel copper busbar of the electronic loads as described in any one of claims 1 to 5.

7. The electronic load parallel system according to claim 6, characterized in that, At least two electronic loads are stacked.

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