Wafer aging test device

Abstract

A wafer aging test device relates to the technical field of wafer test equipment and comprises a wafer aging test fixture and a wafer aging test bench, and the wafer aging test fixture comprises a fixture probe board card assembly, a fixture chuck assembly and a heating sucker assembly. The clamp probe board card assembly comprises a board card supporting plate, a board card adapter plate, a probe fixing plate and a bolt assembly, the clamp chuck assembly comprises a chuck base, and the heating suction cup assembly sequentially comprises a heating suction cup, a heating suction cup gasket, a heating piece and a heating piece supporting plate from top to bottom. The wafer aging test bench comprises a test driving plate module, a lifting module, a translation module and a bearing bench, the test driving plate module comprises a driving plate bottom plate, a driving plate assembly and a driving switching probe plate, and the bearing bench comprises a clamp carrier plate and a clamp base plate. The device is small in size and small in occupied space, in addition, the structure of the device is designed in a modularized mode, operation of testers is facilitated, testing efficiency is improved, and large-batch testing is achieved.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing equipment technology, and in particular to a wafer aging test device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon crystal ingot forms a silicon wafer. After processes such as photolithography and etching, the wafer needs to undergo testing, one of which is aging testing.

[0003] The existing wafer aging test equipment has the following problems: 1. The equipment is large in size and occupies a lot of space; 2. The equipment structure is complex, making it inconvenient for testers to operate, resulting in low testing efficiency and making it unsuitable for large-scale testing; 3. The equipment has low reliability and is prone to damaging wafer devices during the aging test. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a wafer aging test device. The device is small in size, which reduces the space occupied. In addition, the modular design of the device structure facilitates operation by testers, improves test efficiency, and enables large-scale testing.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A wafer aging test apparatus includes a wafer aging test fixture and a wafer aging test stage. The wafer aging test fixture includes a fixture probe board assembly, a fixture chuck assembly, and a heated suction cup assembly.

[0007] The fixture probe board assembly includes a board tray, a board adapter plate fixed to the top surface of the board tray, a probe fixing plate fixed to the bottom surface of the board adapter plate, and a number of bolt assemblies. The board tray has a central circular hole, and the probe fixing plate is located within this hole and has a gate / element probe area on it. The gate / element probe area has an array of gate / element probes, and common probes are located on its sides. The top surface of the board adapter plate has an adapter area with an array of adapter contacts. The probe distribution on the probe fixing plate corresponds to the wafer. During aging testing, the probes abut against the wafer, and the test signal is transmitted outward through the probes and the adapter contacts in the adapter area.

[0008] The clamp chuck assembly includes a chuck base with a cavity on the top surface and an inflation connector, an air extraction connector seat, and an inner wire adapter plate on the side. The inflation connector communicates with the cavity. The chuck base has an air extraction channel A, the outer end of which communicates with the air extraction connector seat, and the inner end which is located in the middle of the bottom of the cavity and has an insulating sealing pad. The cavity contains an inner wire that is connected to the inner wire adapter plate.

[0009] The heating suction cup assembly, from top to bottom, includes a heating suction cup, a heating suction cup pad, a heating plate, and a heating plate support. The heating suction cup has a number of suction channels B extending from the center outwards. The top surface has a number of suction holes communicating with the suction channels B. The bottom surface has a suction connector A communicating with the suction channels B. The suction connector A passes through the heating suction cup pad, the heating plate, and the heating plate support and abuts against an insulating sealing gasket. The insulating sealing gasket has sealing rings on its upper and lower surfaces. A common electrode conductive post is located on the side of the top surface of the heating suction cup. This common electrode conductive post corresponds to the common electrode probe of the probe fixing plate. The gate / element probe is mated to the wafer surface, forming an aging test circuit.

[0010] The heating suction cup is made of tungsten-copper alloy, which has good thermal conductivity. The heating suction cup gasket is a ceramic sheet, which has good thermal conductivity and insulation properties. The heating element is a mica heating element, which provides uniform heating per unit area. The central perforation facilitates uniform heating throughout the entire structure. The heating element support plate has heat insulation and reinforcement functions. The layered structure of the heating suction cup assembly can effectively reduce heat loss.

[0011] The heating chuck is secured to the cavity of the chuck base by a number of fixing bolts on its outer periphery. The bottom surface of the board adapter plate abuts against the top surface of the chuck base and is fixed by bolt assemblies. Before the aging test, the clamp probe board assembly is removed, and the wafer to be tested is placed on the heating chuck. Air is drawn out through the suction device, creating a negative pressure in suction channels A, B, and the suction port, firmly adhering the wafer to the heating chuck. During the aging test, the board adapter plate and the chuck base form a sealed cavity. Inert gas is supplied to the cavity through the gas inlet connector, protecting the wafer and providing thermal insulation to stabilize its temperature. The inner wiring adapter plate and inner wiring are used to transmit the current and signals required for the heating element of the heating chuck assembly.

[0012] Preferably, the wafer aging test bench includes a test driver board module, a lifting module, a translation module, and a support platform. The test driver board module includes a driver board base plate, a driver board assembly fixed to the top surface of the driver board base plate, and a driver adapter probe board fixed to the bottom surface of the driver board assembly. The driver board base plate has a circular hole in the center, and the driver adapter probe board is located within the circular hole and has probes arranged in an array on it. The driver board assembly includes a driver board and a relay board module thereon. The probes of the driver adapter probe board correspond to the adapter contact points on the top surface of the adapter board; during aging testing, the two contact each other to transmit test signals.

[0013] The lifting module includes a test platform base plate and lifting cylinder assemblies on both sides. The movable end of each lifting cylinder assembly has a lifting mounting plate, and the two sides of the drive plate base plate are fixed to the lifting mounting plate. The lifting cylinder assembly includes a lifting cylinder and guide column structures on both sides. The lifting module is used to test the rising and falling of the drive plate module. During falling, the probes of the drive adapter probe plate abut against the transfer contact points on the top surface of the adapter plate, thus performing the aging test.

[0014] The translation module includes a translation base plate and a translation cylinder assembly at its bottom. The inner end of the translation base plate is fixed to the middle of the test platform base plate, forming a T-shape. The support platform includes a fixture carrier plate and a fixture pad plate fixed to its top surface. The bottom surface of the fixture carrier plate is fixed to the movable end of the translation cylinder assembly. The fixture carrier plate on the front side of the fixture pad plate is provided with several front fixture blocks, and the fixture carrier plate on the rear side is provided with several rear fixture blocks. The wafer aging test fixture is placed on the fixture pad plate of the support platform. The front and rear fixture blocks are located on the outer periphery of the chuck base, limiting their horizontal movement. The translation cylinder assembly can drive the support platform and the wafer aging test fixture on it to move horizontally inward or outward.

[0015] Preferably, a certain number of board tray support columns are provided on the bottom of the outer periphery of the board tray, and the lower end of the board tray support columns extends beyond the lower end face of the chuck base, so that when the fixture probe board assembly or wafer aging test fixture is placed on other objects, only the bottom surface of the board tray support columns contacts the surface of the object, and the other structures are suspended.

[0016] Preferably, the bottom circular hole of the board tray is provided with clamping hooks on both sides for use with the clamping structure of the wafer loading and unloading equipment.

[0017] Preferably, the plate holder has wing plates on both sides, and the wing plates have strip-shaped holes A. The structure of the wing plates on both sides is designed to cooperate with the robotic arm of the loading and unloading equipment as well as for manual handling.

[0018] Preferably, the wing plate is provided with positioning grooves at the front and rear to cooperate with the limiting and positioning structure of the wafer loading and unloading equipment.

[0019] Preferably, the front end of the clamp carrier plate is provided with a strip-shaped hole B, which facilitates manual gripping.

[0020] Preferably, a plate fixing plate is fixed in the middle of the top surface of the plate adapter plate. The bolt assembly includes a positioning bolt sleeve and a positioning bolt inside. The positioning bolt sleeve is fixed to the outer periphery of the top surface of the plate fixing plate. A bolt bearing is provided on the top of the positioning bolt. A compression spring A is provided between the positioning bolt and the positioning bolt sleeve. The lower end of the compression spring A abuts against the plate fixing plate, and the upper end abuts against the bolt bearing (outer ring). A bolt inner sleeve is provided in the hole of the plate adapter plate and the plate fixing plate through which the positioning bolt passes. The top surface of the outer periphery of the chuck base is provided with corresponding screw holes / nuts. The connection and separation of the clamp probe plate assembly and the clamp chuck assembly can be realized by tightening the bolt. When connecting and fixing, tighten the positioning bolt downwards. Under the positioning and guiding action of the positioning bolt sleeve, bolt bearing, bolt inner sleeve and other structures, the positioning bolt can be accurately screwed into the screw hole / nut. At this time, the compression spring A is in a compressed state. When separation is required, loosen the positioning bolt. The positioning bolt disengages from the screw hole / nut and will return to the top of the positioning bolt sleeve under the action of the compression spring A, maintaining a vertical state and not shaking.

[0021] Preferably, the top surface of the board tray is provided with an avoidance groove A corresponding to the transfer area of ​​the board adapter plate, and the bottom surface of the board fixing plate is provided with an avoidance groove B corresponding to the probe fixing plate, so as to avoid interference.

[0022] Preferably, the transition area is distributed in a ring around the outer periphery of the board transition plate, and the corresponding drive transition probe plate is distributed in a ring.

[0023] Preferably, the bottom surface of the probe fixing plate is embedded with several board vision recognition components, and the top surface of the outer periphery of the chuck base is embedded with several loading and unloading vision recognition components. These vision recognition components, in conjunction with the automatic loading and unloading equipment, enable precise positioning of the wafer when placed in the center of the top surface of the heating chuck assembly, and precise positioning between the board adapter plate and the chuck base during the installation of the fixture probe board assembly and the fixture chuck assembly.

[0024] Preferably, the fixture pad has a raised fixture limiting strip in the middle, and the bottom surface of the chuck base has a corresponding fixture limiting groove, which limits the rotation of the chuck base, i.e., the wafer aging test fixture, in the circumferential direction.

[0025] Preferably, the chuck base has an O-ring on its outer periphery top surface. After installation, the O-ring abuts against the card adapter plate to achieve a sealing effect.

[0026] Preferably, a chuck heat insulation sheet is provided at the bottom of the cavity, and an annular heat insulation sheet can also be provided on the side wall of the cavity to play the role of heat insulation and temperature stabilization.

[0027] Preferably, the heating suction cup has an insulating block embedded around its outer periphery corresponding to the fixing bolt. The fixing bolt passes through the insulating block, and a heating suction cup support column is fitted at its lower end. The insulating block and the support column are poor conductors of heat, and the support column suspends the heating suction cup assembly, thus providing a heat insulation effect.

[0028] Preferably, the heating suction cup has a certain number of sensor channels on its outer periphery, extending towards the center. Thermocouple sensors are installed within these channels, equidistantly distributed (e.g., three sensors), for collecting the temperature of the heating suction cup. The thermocouple sensors are installed by drilling and potting inside the heating suction cup to improve the accuracy of temperature acquisition. The signal is transmitted outward through an internal wire and an internal wire adapter plate.

[0029] Preferably, the heating suction cup has an opening on its outer periphery that communicates with the air extraction channel B, and a plug is provided in the opening for processing the air extraction channel B. After processing, the plug is installed for sealing.

[0030] Preferably, the drive board assembly has a through hole in the middle to dissipate heat and prevent heat accumulation. Additionally, several heat dissipation holes may be formed on the bottom plate of the drive board.

[0031] Preferably, the top surface of the outer periphery of the drive plate bottom plate is provided with a reinforcing plate, which has the function of improving structural strength and protecting the drive plate assembly.

[0032] Preferably, the test bench base plate is equipped with a station protection air circuit control component and a temperature control component. The station protection air circuit control component includes a mounting plate and an air switch, pressure transmitter, power supply, etc., and the temperature control component includes a mounting plate and a control board, power supply, etc.

[0033] Preferably, the top surface of the translation base plate is provided with two linear slide rails, and the linear slide rails are provided with linear sliders that are fixed to the bottom surface of the clamping plate.

[0034] Preferably, the top surface of the rear end of the translation base plate is provided with a buffer limiting component, which includes a limiting pin and hydraulic buffers on both sides, for limiting and buffering the translation module to drive the carrier platform to move inward.

[0035] Preferably, the top surface of the rear end of the translation base plate is provided with a clamping adapter assembly. The clamping adapter assembly includes a clamping adapter mounting plate fixed to the translation base plate. The clamping adapter mounting plate is provided with an inflation valve corresponding to the inflation connector, an air extraction connector B corresponding to the air extraction connector seat, and a probe plate module corresponding to the inner line adapter plate. Inert gas can be delivered into the cavity through the channel formed by the connection between the inflation connector and the inflation valve. A negative pressure can be created by evacuating air through the channel formed by the connection between the air extraction connector seat and the air extraction connector B to adsorb the wafer. Power and signals can be transmitted through the channel formed by the connection between the inner line adapter plate and the probe plate module.

[0036] Preferably, there are two inflation valves and two inflation connectors. One structural distribution of the clamp adapter assembly is as follows: the suction connector B is located in the middle of the probe plate module, and the inflation valves are located on both sides of the probe plate module. The structural distribution of the inflation connectors, suction connector seats, and inner wire adapter plate corresponds accordingly. During operation, one inflation valve supplies inert gas into the cavity, and the gas in the cavity is discharged through the other inflation valve. After the cavity is filled with inert gas, one channel is closed, and the other channel is used for pressure maintenance.

[0037] Preferably, the inflation valve includes a guide limiting connector fixed to the clamp adapter mounting plate and a movable inflation connector passing through the guide limiting connector. The movable inflation connector has several pin holes on its outer periphery at the front end, with guide positioning pins inside each hole. The inner end of the guide positioning pin connects to the guide limiting connector, and a compression spring B is sleeved on the guide positioning pin between the guide limiting connector and the front end of the movable inflation connector. The movable inflation connector of the inflation valve can move within a certain range, avoiding hard contact between the inflation valve and the inflation connector, and ensuring a seal under the action of the compression spring B.

[0038] Preferably, the device also includes a housing and a support within it. Multiple wafer aging test stands are mounted in an array on the support, and the number of wafer aging test fixtures is greater than or equal to the number of wafer aging test stands. When the wafer aging test stands are operating, wafers to be tested can be loaded into other wafer aging test fixtures and replaced promptly after testing, improving testing efficiency.

[0039] The advantages of this utility model are: 1. The equipment is small in size, which reduces the space occupied; 2. The modular design of the equipment structure facilitates operation by testers, improves testing efficiency, and enables large-scale testing; 3. It improves the reliability of the equipment and ensures the protection of wafer devices during the aging test. Attached Figure Description

[0040] Figure 1 This is a perspective view of the present utility model;

[0041] Figure 2 This is a side view of the present invention;

[0042] Figure 3 This is a top view of the present invention;

[0043] Figure 4 This utility model provides a three-dimensional wafer aging test fixture. Figure 1 ;

[0044] Figure 5 This utility model provides a three-dimensional wafer aging test fixture. Figure 2 ;

[0045] Figure 6 This is a rear view of the wafer aging test fixture of this utility model;

[0046] Figure 7 for Figure 6 Sectional view along the middle AA direction;

[0047] Figure 8 This is a perspective view of the clamp probe board assembly in this utility model;

[0048] Figure 9 This is an exploded view of the clamp probe board assembly in this utility model;

[0049] Figure 10 This is a top view of the clamp probe board assembly in this utility model;

[0050] Figure 11 for Figure 10 Sectional view along the BB direction;

[0051] Figure 12 This is a perspective view of the clamp chuck assembly in this utility model;

[0052] Figure 13 This is a top view of the clamp chuck assembly in this utility model;

[0053] Figure 14 for Figure 13 A cross-sectional view along the CC direction;

[0054] Figure 15 The three-dimensional heating suction cup assembly in this utility model Figure 1 ;

[0055] Figure 16 The three-dimensional heating suction cup assembly in this utility model Figure 2 ;

[0056] Figure 17 This is an exploded view of the heating suction cup assembly in this utility model;

[0057] Figure 18 This is a top view of the heating suction cup assembly in this utility model;

[0058] Figure 19 for Figure 18 Sectional view along the DD direction;

[0059] Figure 20 for Figure 19 A sectional view along the EE direction;

[0060] Figure 21 This is a side view of the heating suction cup in this utility model;

[0061] Figure 22 for Figure 21 Sectional view along the FF direction;

[0062] Figure 23 This utility model provides a three-dimensional view of the test drive board module. Figure 1 ;

[0063] Figure 24 This utility model provides a three-dimensional view of the test drive board module. Figure 2 ;

[0064] Figure 25 This is a perspective view of the lifting module in this utility model;

[0065] Figure 26 This is a front view of the lifting module in this utility model;

[0066] Figure 27 The three-dimensional translation module in this utility model Figure 1 ;

[0067] Figure 28 The three-dimensional translation module in this utility model Figure 2 ;

[0068] Figure 29 This is a side view of the translation module in this utility model;

[0069] Figure 30 This is a perspective view of the clamp adapter assembly in this utility model;

[0070] Figure 31 This is a front view of the clamp adapter assembly in this utility model;

[0071] Figure 32 for Figure 31 A cross-sectional view along the GG direction.

[0072] Explanation of key component symbols in the diagram:

[0073] 100. Wafer aging test fixture;

[0074] 110. Fixture probe board assembly; 111. Board support plate; 111.1. Board support plate support column; 111.2. Clamping hook; 111.3. Wing plate; 111.4. Strip hole A; 111.5. Positioning groove; 111.6. Clearance groove A; 112. Board adapter plate; 112.1. Adapter area; 113. Probe fixing plate; 113.1. Gate / electrode probe area; 113.2. Common probe; 113.3. Board vision recognition assembly; 114. Bolt assembly; 114.1. Positioning bolt sleeve; 114.2. Positioning bolt; 114.3. Bolt bearing; 114.4. Compression spring A; 115. Board fixing plate; 115.1. Clearance groove B;

[0075] 120. Clamp chuck assembly; 121. Chuck base; 121.1. Cavity; 121.2. Air extraction channel A; 121.3. Loading / unloading vision recognition assembly; 121.4. Clamp limiting groove; 122. Inflation connector; 123. Air extraction connector seat; 124. Inner wire adapter plate; 125. Insulating sealing gasket; 126. Inner wire; 127. O-ring; 128. Chuck heat insulation sheet;

[0076] 130. Heated suction cup assembly; 131. Heated suction cup; 131.1. Suction channel B; 131.2. Suction hole; 131.3. Common conductive post; 131.4. Sensor channel; 131.5. Plug; 132. Heated suction cup gasket; 133. Heating element; 134. Heating element support plate; 135. Suction connector A; 136. Fixing bolt; 137. Heated suction cup insulating block; 138. Heated suction cup support column; 139. Thermocouple sensor;

[0077] 200. Wafer aging test station;

[0078] 210. Test driver board module; 211. Driver board base plate; 212. Driver board assembly; 213. Driver adapter probe board; 214. Through hole; 215. Reinforcing plate;

[0079] 220. Lifting module; 221. Test bench base plate; 222. Lifting cylinder assembly; 223. Lifting mounting plate; 224. Workstation protection air circuit control assembly; 225. Temperature control assembly;

[0080] 230. Translation module; 231. Translation base plate; 232. Translation cylinder assembly; 233. Linear slide rail; 234. Linear slider; 235. Buffer limit assembly; 235.1. Limit pin; 235.2. Hydraulic damper;

[0081] 240. Support platform; 241. Fixture carrier plate; 241.1. Strip hole B; 242. Fixture pad; 243. Fixture front stop; 244. Fixture rear stop; 245. Fixture limit strip;

[0082] 250. Fixture adapter assembly; 251. Fixture adapter mounting plate; 252. Inflation valve; 252.1. Guide limit joint; 252.2. Movable inflation joint; 252.3. Guide positioning pin; 252.4. Compression spring B; 253. Air extraction joint B; 254. Probe plate module. Detailed Implementation

[0083] To more clearly illustrate this utility model, the following description, in conjunction with the accompanying drawings, will provide further details.

[0084] Example 1: As Figure 1-3 As shown, a wafer aging test apparatus includes a wafer aging test fixture 100 and a wafer aging test stage 200.

[0085] Combination Figure 4-7 As shown, the wafer aging test fixture 100 includes a fixture probe board assembly 110, a fixture chuck assembly 120, and a heating suction cup assembly 130.

[0086] Combination Figure 8-11 As shown, the clamp probe board assembly 110 includes a board support plate 111, a board adapter plate 112 fixed to the top surface of the board support plate 111, a probe fixing plate 113 fixed to the bottom surface of the board adapter plate 112, and a certain number of bolt assemblies 114. The board support plate 111 has a circular hole in the middle. The probe fixing plate 113 is located in the circular hole and has a gate / element probe area 113.1 on it. The gate / element probe area 113.1 has gate / element probes arranged in an array. Common probes 113.2 are provided on the side of the gate / element probe area 113.1. The top surface of the board adapter plate 112 has an adapter area 112.1, and the adapter area 112.1 has adapter contact points arranged in an array.

[0087] Combination Figure 12-14 As shown, the clamp chuck assembly 120 includes a chuck base 121. The top surface of the chuck base 121 has a cavity 121.1, and the side has an inflation connector 122, an air extraction connector seat 123, and an inner wire adapter plate 124. The inflation connector 122 communicates with the cavity 121.1. The chuck base 121 has an air extraction channel A121.2. The outer end of the air extraction channel A121.2 communicates with the air extraction connector seat 123, and the inner end is located in the middle of the bottom of the cavity 121.1 and is provided with an insulating sealing gasket 125. The cavity 121.1 contains an inner wire 126 that is connected to the inner wire adapter plate 124.

[0088] Combination Figure 15-22As shown, the heating suction cup assembly 130 includes, from top to bottom, a heating suction cup 131, a heating suction cup pad 132, a heating plate 133, and a heating plate support plate 134. The heating suction cup 131 has a certain number of suction channels B131.1 extending from the center to the surrounding area. The top surface has a certain number of suction holes 131.2 communicating with the suction channels B131.1. The bottom surface has a suction connector A135 communicating with the suction channels B131.1. The suction connector A135 passes through the heating suction cup pad 132, the heating plate 133, and the heating plate support plate 134 and abuts against the insulating sealing gasket 125. The side of the top surface of the heating suction cup 131 has a common electrode conductive post 131.3.

[0089] The heating suction cup 131 is provided with a certain number of fixing bolts 136 on its outer periphery and is fixed in the cavity 121.1 of the chuck base 121 by the fixing bolts 136. The bottom surface of the plate adapter plate 112 abuts against the top surface of the outer periphery of the chuck base 121 and is fixed by bolt assembly 114.

[0090] Combination Figure 1-3 As shown, the wafer aging test bench 200 includes a test drive board module 210, a lifting module 220, a translation module 230, and a support platform 240.

[0091] Combination Figure 23-24 As shown, the test drive board module 210 includes a drive board base plate 211, a drive board assembly 212 fixed on the top surface of the drive board base plate 211, and a drive adapter probe plate 213 fixed on the bottom surface of the drive board assembly 212. The drive board base plate 211 has a circular hole in the middle, and the drive adapter probe plate 213 is located in the circular hole and has probes arranged in an array on it.

[0092] Combination Figure 25-26 As shown, the lifting module 220 includes a test bench base plate 221 and lifting cylinder assemblies 222 on both sides. The movable end of the lifting cylinder assembly 222 is provided with a lifting mounting plate 223, and the two sides of the drive plate base plate 211 are fixed to the lifting mounting plate 223.

[0093] Combination Figure 27-29 As shown, the translation module 230 includes a translation base plate 231 and a translation cylinder assembly 232 at its bottom. The inner end of the translation base plate 231 is fixed to the middle of the test platform base plate 221.

[0094] Combination Figure 27-29 As shown, the support platform 240 includes a clamping carrier plate 241 and a clamping pad 242 fixed on its top surface. The bottom surface of the clamping carrier plate 241 is fixed to the movable end of the translation cylinder assembly 232. A plurality of clamping front blocks 243 are provided on the clamping carrier plate 241 on the front side of the clamping pad 242, and a plurality of clamping rear blocks 244 are provided on the clamping carrier plate 241 on the rear side.

[0095] Example 2: Combination Figure 8 and Figure 10-11 As shown, based on Embodiment 1, a certain number of plate support columns 111.1 are provided on the bottom of the outer periphery of the plate support plate 111, and clamping hooks 111.2 are provided on both sides of the bottom round hole.

[0096] The plate card holder 111 has wing plates 111.3 on both sides, and the wing plates 111.3 have strip holes A111.4 and positioning grooves 111.5 at the front and rear.

[0097] Combination Figure 27-28 As shown, the front end of the fixture carrier plate 241 is provided with a strip-shaped hole B241.1.

[0098] Example 3: Combination Figure 4 , Figure 7 , Figure 9-11 As shown, based on Embodiment 1 or Embodiment 2, a board fixing plate 115 is fixed in the middle of the top surface of the board adapter plate 112, and the bolt assembly 114 includes a positioning bolt sleeve 114.1 and a positioning bolt 114.2 inside it. The positioning bolt sleeve 114.1 is fixed to the outer periphery of the top surface of the board fixing plate 115, and a bolt bearing 114.3 is provided on the top of the positioning bolt 114.2. A compression spring A114.4 is provided between the positioning bolt 114.2 and the positioning bolt sleeve 114.1.

[0099] The top surface of the board tray 111 is provided with a clearance groove A111.6 corresponding to the transfer area 112.1 of the board adapter plate 112, and the bottom surface of the board fixing plate 115 is provided with a clearance groove B115.1 corresponding to the probe fixing plate 113.

[0100] The transition area 112.1 is arranged in a ring around the outer periphery of the board transition plate 112, and the corresponding drive transition probe plate 213 is also arranged in a ring. Figure 24 .

[0101] Example 4: Combination Figure 8 , Figure 12-13 As shown, based on Embodiment 1, Embodiment 2 or Embodiment 3, the bottom surface of the probe fixing plate 113 is embedded with a plurality of board visual recognition components 113.3, and the top surface of the outer periphery of the chuck base 121 is embedded with a plurality of loading and unloading visual recognition components 121.3.

[0102] Example 5: Combination Figure 8 , Figure 14 , Figure 27 and Figure 29As shown, based on Embodiment 1, Embodiment 2, Embodiment 3 or Embodiment 4, the clamping pad 242 is provided with a protruding clamping limit strip 245 in the middle, and the bottom surface of the chuck base 121 is provided with a corresponding clamping limit groove 121.4.

[0103] Example 6: Combination Figure 12-14 As shown, based on the above embodiment, the chuck base 121 has an O-ring 127 on its outer top surface and a chuck heat insulation sheet 128 at the bottom of the cavity 121.1.

[0104] Example 7: Combination Figure 12-16 , Figure 18 , Figure 20-22 As shown, based on the above embodiment, the heating suction cup 131 has a heating suction cup insulating block 137 embedded on its outer periphery, corresponding to the fixing bolt 136. The fixing bolt 136 passes through the heating suction cup insulating block 137, and a heating suction cup support column 138 is sleeved at its lower end.

[0105] Example 8: Combination Figure 21-22 As shown, based on the above embodiment, the heating suction cup 131 is provided with a certain number of sensor channels 131.4 on its outer periphery, and thermocouple sensors 139 are provided in the sensor channels 131.4.

[0106] Combination Figures 19-20 As shown, the heating suction cup 131 has an opening on its outer periphery that communicates with the air extraction channel B131.1, and a plug 131.5 is provided inside the opening.

[0107] Example 9: Combination Figure 23-24 As shown, based on the above embodiment, the drive plate assembly 212 has a through hole 214 in the middle, and the drive plate bottom plate 211 has a reinforcing plate 215 on the top surface of its outer periphery.

[0108] Example 10: Combining Figure 25 As shown, based on the above embodiment, the test bench base plate 221 is provided with a workstation protection air circuit control component 224 and a temperature control component 225.

[0109] Example 11: Combination Figure 27-29 As shown, based on the above embodiment, the top surface of the translation base plate 231 is provided with two linear slide rails 233, and the linear slide rails 233 are provided with linear sliders 234 that are fixed to the bottom surface of the clamp carrier plate 241.

[0110] The rear top surface of the translation base plate 231 is provided with a buffer limiting component 235, which includes a limiting pin 235.1 and hydraulic buffers 235.2 on both sides.

[0111] Example 12: Combination Figure 27 , Figure 29-32 As shown, based on the above embodiment, the top surface of the rear end of the translation base plate 231 is provided with a clamping adapter assembly 250. The clamping adapter assembly 250 includes a clamping adapter mounting plate 251 fixed to the translation base plate 231. The clamping adapter mounting plate 251 is provided with an inflation valve 252 corresponding to the inflation connector 122, an air extraction connector B253 corresponding to the air extraction connector seat 123, and a probe plate module 254 corresponding to the inner line adapter plate 124.

[0112] Example 13: Combination Figure 12-13 , Figure 30-32 As shown, based on Embodiment Twelve, the number of the inflation valve 252 and the inflation connector 122 are two each. The inflation valve 252 includes a guide limiting connector 252.1 fixed on the clamp adapter mounting plate 251 and a movable inflation connector 252.2 passing through the guide limiting connector 252.1. The outer periphery of the front end of the movable inflation connector 252.2 is provided with several pin holes, and a guide positioning pin 252.3 is provided in the pin holes. The inner end of the guide positioning pin 252.3 is connected to the guide limiting connector 252.1. A compression spring B252.4 is sleeved on the guide positioning pin 252.3 between the guide limiting connector 252.1 and the front end of the movable inflation connector 252.2.

[0113] Example 14: Based on the above examples, the testing device of this utility model further includes a housing and a support inside it. The number of wafer aging test stands 200 is multiple and they are arranged in an array on the support. The number of wafer aging test fixtures 100 is greater than or equal to the number of wafer aging test stands 200.

[0114] The above description is only a specific embodiment of the present utility model, but the structural features of the present utility model are not limited thereto. The present utility model can be used in similar products. Any changes or modifications made by those skilled in the art within the scope of the present utility model are covered by the patent scope of the present utility model.

Claims

1. A wafer aging test apparatus, characterized in that: Includes a wafer aging test fixture (100) and a wafer aging test station (200). The wafer aging test fixture (100) includes a fixture probe board assembly (110), a fixture chuck assembly (120), and a heated suction cup assembly (130). The clamp probe board assembly (110) includes a board support plate (111), a board adapter plate (112) fixed on the top surface of the board support plate (111), a probe fixing plate (113) fixed on the bottom surface of the board adapter plate (112), and a certain number of bolt assemblies (114). The board support plate (111) has a circular hole in the middle. The probe fixing plate (113) is located in the circular hole and has a gate / element probe area (113.1) on it. The gate / element probe area (113.1) has gate / element probes arranged in an array. The gate / element probe area (113.1) has a common probe (113.2) on the side. The top surface of the board adapter plate (112) has an adapter area (112.1) and the adapter area (112.1) has adapter contact points arranged in an array. The plate card holder (111) has wing plates (111.3) on both sides, and a strip hole A (111.4) on the wing plate (111.3). The wing plate (111.3) has positioning grooves (111.5) at the front and rear. The plate card adapter plate (112) has a plate card fixing plate (115) fixed in the middle of its top surface. The bolt assembly (114) includes a positioning bolt sleeve (114.1) and a positioning bolt (114.2) inside it. The positioning bolt sleeve (114.1) is fixed to the outer periphery of the top surface of the plate card fixing plate (115). The top of the positioning bolt (114.2) is provided with a bolt bearing (114.3). A compression spring A (114.4) is provided between the positioning bolt (114.2) and the positioning bolt sleeve (114.1). The clamp chuck assembly (120) includes a chuck base (121), the top surface of the chuck base (121) is provided with a cavity (121.1), and the side is provided with an inflation connector (122), an air extraction connector seat (123) and an inner wire adapter plate (124). The inflation connector (122) is connected to the cavity (121.1). The chuck base (121) is provided with an air extraction channel A (121.2). The outer end of the air extraction channel A (121.2) is connected to the air extraction connector seat (123), and the inner end is located in the middle of the bottom of the cavity (121.1) and is provided with an insulating sealing pad (125). The cavity (121.1) is provided with an inner wire (126) connected to the inner wire adapter plate (124). The heating suction cup assembly (130) includes, from top to bottom, a heating suction cup (131), a heating suction cup pad (132), a heating plate (133), and a heating plate support plate (134). The heating suction cup (131) has a certain number of suction channels B (131.1) extending from the center to the surrounding area. The top surface has a certain number of suction holes (131.2) communicating with the suction channels B (131.1). The bottom surface has a suction connector A (135) communicating with the suction channels B (131.1). The suction connector A (135) passes through the heating suction cup pad (132), the heating plate (133), and the heating plate support plate (134) and abuts against the insulating sealing pad (125). The heating suction cup (131) has a common electrode conductive post (131.3) on the side of the top surface. The heating suction cup (131) is provided with a certain number of fixing bolts (136) on its outer periphery and is fixed in the cavity (121.1) of the chuck base (121) by the fixing bolts (136). The bottom surface of the plate adapter plate (112) abuts against the top surface of the outer periphery of the chuck base (121) and is fixed by bolt assembly (114). The wafer aging test bench (200) includes a test drive board module (210), a lifting module (220), a translation module (230), and a support platform (240). The test drive board module (210) includes a drive board base plate (211), a drive board assembly (212) fixed on the top surface of the drive board base plate (211), and a drive adapter probe plate (213) fixed on the bottom surface of the drive board assembly (212). The drive board base plate (211) has a circular hole in the middle, and the drive adapter probe plate (213) is located in the circular hole and has probes arranged in an array on it. The lifting module (220) includes a test bench base plate (221) and lifting cylinder assemblies (222) on both sides. The lifting cylinder assembly (222) has a lifting mounting plate (223) at its movable end. The two sides of the drive plate base plate (211) are fixed to the lifting mounting plate (223). The translation module (230) includes a translation base plate (231) and a translation cylinder assembly (232) at its bottom. The inner end of the translation base plate (231) is fixed to the middle of the test bench base plate (221). The support platform (240) includes a clamping carrier plate (241) and a clamping pad plate (242) fixed on its top surface. The bottom surface of the clamping carrier plate (241) is fixed to the movable end of the translation cylinder assembly (232). The clamping carrier plate (241) on the front side of the clamping pad plate (242) is provided with a number of clamping front stops (243), and the clamping carrier plate (241) on the rear side is provided with a number of clamping rear stops (244). The front end of the clamping carrier plate (241) is provided with a strip hole B (241.1).

2. The wafer aging test apparatus according to claim 1, characterized in that: The bottom of the outer periphery of the plate card tray (111) is provided with a certain number of plate card tray support columns (111.1), and the bottom round hole is provided with clamping hooks (111.2) on both sides. The top surface of the board tray (111) is provided with a clearance groove A (111.6) corresponding to the transfer area (112.1) of the board adapter plate (112), and the bottom surface of the board fixing plate (115) is provided with a clearance groove B (115.1) corresponding to the probe fixing plate (113). The transition area (112.1) is distributed in a ring around the outer periphery of the board transition plate (112), and the corresponding drive transition probe plate (213) is distributed in a ring.

3. The wafer aging test apparatus according to claim 1, characterized in that: The bottom surface of the probe fixing plate (113) is embedded with several board card visual recognition components (113.3), and the top surface of the outer periphery of the chuck base (121) is embedded with several loading and unloading visual recognition components (121.3). The chuck base (121) has an O-ring (127) on its outer top surface and a chuck heat insulation sheet (128) at the bottom of the cavity (121.1). The heating suction cup (131) has an insulating block (137) embedded on its outer periphery that corresponds to the fixing bolt (136). The fixing bolt (136) passes through the insulating block (137) and is fitted with a heating suction cup support column (138) at its lower end.

4. The wafer aging test apparatus according to claim 1, characterized in that: The heating suction cup (131) has a certain number of sensor channels (131.4) on its outer periphery. Thermocouple sensors (139) are installed in the sensor channels (131.4). The heating suction cup (131) has an opening on its outer periphery that communicates with the air extraction channel B (131.1). A plug (131.5) is installed in the opening.

5. The wafer aging test apparatus according to claim 1, characterized in that: The clamp pad (242) has a raised clamp limiting strip (245) in the middle, and the bottom surface of the chuck base (121) has a corresponding clamp limiting groove (121.4).

6. The wafer aging test apparatus according to claim 1, characterized in that: The drive plate assembly (212) has a through hole (214) in the middle, and the drive plate bottom plate (211) has a reinforcing plate (215) on the top surface of its outer periphery. The test bench base plate (221) is equipped with a workstation protection gas path control component (224) and a temperature control component (225).

7. The wafer aging test apparatus according to claim 1, characterized in that: The top surface of the translation base plate (231) is provided with two linear slide rails (233), and the linear slide rails (233) are provided with linear sliders (234) that are fixed to the bottom surface of the clamp carrier plate (241). The rear end top surface of the translation base plate (231) is provided with a buffer limiting component (235), which includes a limiting pin (235.1) and hydraulic buffers (235.2) on both sides.

8. The wafer aging test apparatus according to claim 1, characterized in that: The top rear end of the translation base plate (231) is provided with a clamp adapter assembly (250). The clamp adapter assembly (250) includes a clamp adapter mounting plate (251) fixed to the translation base plate (231). The clamp adapter mounting plate (251) is provided with an inflation valve (252) corresponding to the inflation connector (122), an air extraction connector B (253) corresponding to the air extraction connector seat (123), and a probe plate module (254) corresponding to the inner line adapter plate (124).

9. A wafer aging test apparatus according to claim 8, characterized in that: The number of the inflation valve (252) and the inflation connector (122) are two. The inflation valve (252) includes a guide limit connector (252.1) fixed on the clamp adapter mounting plate (251) and a movable inflation connector (252.2) passing through the guide limit connector (252.1). The outer periphery of the front end of the movable inflation connector (252.2) is provided with several pin holes, and a guide positioning pin (252.3) is provided in the pin holes. The inner end of the guide positioning pin (252.3) is connected to the guide limit connector (252.1). The guide positioning pin (252.3) between the guide limit connector (252.1) and the front end of the movable inflation connector (252.2) is covered with a compression spring B (252.4).

10. A wafer aging test apparatus according to any one of claims 1-9, characterized in that: It also includes a housing and a support inside it, and the number of wafer aging test stands (200) is multiple and arranged in an array on the support. The number of wafer aging test fixtures (100) is greater than or equal to the number of wafer aging test stands (200).

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