Vehicle-mounted three-dimensional imaging millimeter wave radar

Abstract

The utility model provides a vehicle-mounted three-dimensional imaging millimeter wave radar, which comprises a first heat dissipation substrate, a second heat dissipation substrate, a heat dissipation piece, an antenna cover, a radio frequency PCB, a bottom shell and a processing PCB, the first heat dissipation substrate and the second heat dissipation substrate are arranged at an interval, the heat dissipation piece is arranged between the first heat dissipation substrate and the second heat dissipation substrate, and the antenna cover is arranged between the first heat dissipation substrate and the second heat dissipation substrate. The radio frequency PCB is connected with the first heat dissipation substrate, the processing PCB is connected with the second heat dissipation substrate, when the radio frequency PCB and the processing PCB work, generated heat is conducted to the first heat dissipation substrate and the second heat dissipation substrate respectively, and the heat is conducted to the environment where the vehicle-mounted three-dimensional imaging millimeter wave radar is located through the first heat dissipation substrate and the second heat dissipation substrate. Meanwhile, the heat dissipation piece is arranged between the first heat dissipation substrate and the second heat dissipation substrate, so that the heat dissipation effect of the first heat dissipation substrate and the second heat dissipation substrate is further improved, and the working stability of the vehicle-mounted three-dimensional imaging millimeter wave radar is improved.

Description

Technical Field

[0001] This utility model belongs to the field of vehicle-mounted radar technology, and more specifically, it relates to a vehicle-mounted stereo imaging millimeter-wave radar. Background Technology

[0002] Automotive millimeter-wave radar is a widely used sensor technology in intelligent driving and vehicle safety systems. Stereo imaging automotive millimeter-wave radar, due to its large data processing volume, requires two PCBs inside the radar: one for the radio frequency antenna and the other for data processing. Both PCBs are located within a housing. Because multiple electronic components are mounted on each PCB, they generate significant heat during radar operation. However, existing automotive millimeter-wave radars have poor heat dissipation, failing to effectively dissipate the heat generated by the electronic components on the PCBs. This causes the overall temperature of the automotive millimeter-wave radar to rise rapidly, affecting the stability of its operation. Utility Model Content

[0003] The purpose of this utility model embodiment is to provide a vehicle-mounted stereo imaging millimeter-wave radar to solve the technical problem that the heat dissipation effect of existing vehicle-mounted stereo imaging millimeter-wave radars still needs to be improved.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: to provide a vehicle-mounted stereo imaging millimeter-wave radar, comprising:

[0005] A first heat dissipation substrate and a second heat dissipation substrate are disposed at an interval;

[0006] The heat sink has one end connected to the first heat sink substrate and the other end connected to the second heat sink substrate.

[0007] An RF PCB board is connected to the side of the first heat sink substrate that is away from the second heat sink substrate;

[0008] The antenna cover is connected to the side of the first heat dissipation substrate away from the second heat dissipation substrate, and the radio frequency PCB board is located between the antenna cover and the first heat dissipation substrate.

[0009] The PCB board is connected to the side of the second heat sink substrate away from the first heat sink substrate;

[0010] The bottom shell is connected to the side of the second heat dissipation substrate opposite to the first heat dissipation substrate, and the processing PCB board is located between the bottom shell and the second heat dissipation substrate.

[0011] Optionally, the number of heat sinks is multiple, and the multiple heat sinks are evenly spaced along the first direction to form a heat sink group;

[0012] In the plurality of heat sinks, a first heat dissipation channel extending in a second direction is formed between any two adjacent heat sinks;

[0013] Wherein, the first direction and the second direction are perpendicular to each other.

[0014] Optionally, the number of heat sink assemblies is multiple, and the multiple heat sink assemblies are evenly spaced along the second direction;

[0015] In the plurality of heat dissipation component groups, a second heat dissipation channel extending along the first direction is formed between any two adjacent heat dissipation component groups.

[0016] Optionally, the first heat dissipation substrate is provided with a first thermally conductive protrusion;

[0017] A first thermally conductive adhesive is provided on the side of the first thermally conductive protrusion away from the first heat dissipation substrate, and the end of the first thermally conductive adhesive away from the first thermally conductive protrusion is connected to the radio frequency PCB board.

[0018] There are multiple first thermally conductive protrusions and multiple first thermally conductive adhesives, with each first thermally conductive protrusion corresponding to one of the multiple first thermally conductive adhesives, and each first thermally conductive adhesive is connected to the corresponding first thermally conductive protrusion.

[0019] Optionally, the first heat dissipation substrate is provided with a first mounting groove, the radio frequency PCB board is mounted in the opening of the first mounting groove, and a plurality of the first thermally conductive protrusions are disposed on the bottom wall of the first mounting groove.

[0020] Optionally, the second heat dissipation substrate is provided with a second thermally conductive protrusion;

[0021] A second thermally conductive adhesive is provided on the side of the second thermally conductive protrusion away from the second heat dissipation substrate, and the end of the second thermally conductive adhesive away from the second thermally conductive protrusion is connected to the processing PCB board.

[0022] There are multiple second thermally conductive protrusions and multiple second thermally conductive adhesives, with each second thermally conductive protrusion corresponding to one of the multiple second thermally conductive adhesives, and each second thermally conductive adhesive is connected to the corresponding second thermally conductive protrusion.

[0023] Optionally, the second heat dissipation substrate is provided with a second mounting groove, the processing PCB board is mounted in the opening of the second mounting groove, and a plurality of the second heat-conducting protrusions are provided on the bottom wall of the second mounting groove.

[0024] Optionally, a third thermally conductive protrusion is provided inside the bottom shell, and a third thermally conductive adhesive is provided between the third thermally conductive protrusion and the processing PCB board. One end of the third thermally conductive adhesive is connected to the third thermally conductive protrusion, and the other end is connected to the processing PCB board.

[0025] Optionally, a plurality of heat dissipation ribs are protruding on the outer wall of the bottom shell, and the plurality of heat dissipation ribs are spaced apart along the circumference of the bottom shell.

[0026] Optionally, a first sealing ring is provided between the antenna cover and the heat dissipation substrate;

[0027] A second sealing ring is provided between the bottom shell and the heat dissipation substrate.

[0028] The beneficial effects of the vehicle-mounted stereo imaging millimeter-wave radar provided by this utility model are as follows: Compared with the prior art, the vehicle-mounted stereo imaging millimeter-wave radar provided by this utility model includes a first heat dissipation substrate, a second heat dissipation substrate, a heat sink, an antenna cover, an RF PCB board, a bottom shell, and a processing PCB board. The first and second heat dissipation substrates are spaced apart, and the heat sink is disposed between the first and second heat dissipation substrates. The RF PCB board is connected to the first heat dissipation substrate, and the processing PCB board is connected to the second heat dissipation substrate. When the RF PCB board and the processing PCB board are working, the heat generated is conducted to the first and second heat dissipation substrates respectively, and then conducted to the environment where the vehicle-mounted stereo imaging millimeter-wave radar is located. Simultaneously, by spaced apart the first and second heat dissipation substrates and placing the heat sink between them, the contact area between the first and second heat dissipation substrates and the environment is increased, thereby improving the heat dissipation effect of the first and second heat dissipation substrates and enhancing the stability of the vehicle-mounted stereo imaging millimeter-wave radar. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is an exploded structural diagram of a vehicle-mounted stereo imaging millimeter-wave radar provided in an embodiment of this application;

[0031] Figure 2 This is a schematic diagram of the structure of the first heat dissipation substrate and the second heat dissipation substrate provided in the embodiments of this application;

[0032] Figure 3This is a schematic diagram of the structure of the heat sink provided in the embodiment of this application.

[0033] The following are the labeling elements in the figure:

[0034] 10. First heat dissipation substrate; 11. First mounting groove; 12. First thermally conductive protrusion; 13. First thermally conductive adhesive; 14. First slot; 20. Second heat dissipation substrate; 21. Second thermally conductive adhesive; 30. Heat sink; 30a. Heat sink assembly; 31. First heat dissipation channel; 32. Second heat dissipation channel; 40. RF PCB board; 41. First screw; 50. Antenna cover; 51. Second screw; 60. Bottom shell; 61. Third thermally conductive protrusion; 62. Third thermally conductive adhesive; 63. Heat dissipation ribs; 70. Processing PCB board; 71. Third screw; 80. First sealing ring; 90. Second sealing ring. Detailed Implementation

[0035] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0036] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0037] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] Please see Figures 1 to 3 The vehicle-mounted stereo imaging millimeter-wave radar provided in the embodiments of this utility model will now be described.

[0040] A vehicle-mounted stereo imaging millimeter-wave radar includes a first heat dissipation substrate 10 and a second heat dissipation substrate 20, a heat sink 30, an RF PCB board 40, an antenna cover 50, a bottom shell 60, and a processing PCB board 70.

[0041] The first heat dissipation substrate 10 and the second heat dissipation substrate 20 are arranged in parallel and spaced apart. One end of the heat dissipation component 30 is connected to the first heat dissipation substrate 10 and the other end is connected to the second heat dissipation substrate 20 to increase the contact area between the first heat dissipation substrate 10 and the second heat dissipation substrate 20 and the environment, thereby improving the heat dissipation effect of the first heat dissipation substrate 10 and the second heat dissipation substrate 20.

[0042] The RF PCB board 40 is connected to the side of the first heat sink 10 away from the second heat sink 20 by a first screw 41. The first heat sink 10 is provided with a first mounting groove 11, and the RF PCB board 40 is connected to the opening of the first mounting groove 11. The first heat sink 10 is used to dissipate heat from the RF PCB board 40, and at the same time, the first heat sink 10 is also used to electrically shield the RF PCB board 40.

[0043] The antenna cover 50 is connected to the side of the first heat dissipation substrate 10 away from the second heat dissipation substrate 20 by the second screw 51, and the radio frequency PCB board 40 is located between the antenna cover 50 and the first heat dissipation substrate 10.

[0044] The processing PCB board 70 is connected to the side of the second heat sink 20 away from the first heat sink 10 by a third screw 71. The second heat sink 20 is provided with a second mounting groove, and the processing PCB board 70 is connected to the opening of the second mounting groove. The second heat sink 20 is used to dissipate heat from the processing PCB board 70, and at the same time, the second heat sink 20 is also used to electrically shield the processing PCB board 70.

[0045] The bottom shell 60 is connected to the side of the second heat dissipation substrate 20 away from the first heat dissipation substrate 10. The second screw 51 passes through the first heat dissipation substrate 10 and the second substrate and is threadedly connected to the bottom shell 60. The processing PCB board 70 is located between the bottom shell 60 and the second heat dissipation substrate 20.

[0046] Compared with the prior art, the vehicle-mounted stereo imaging millimeter-wave radar provided by this utility model includes a first heat dissipation substrate 10, a second heat dissipation substrate 20, a heat sink 30, an antenna cover 50, an RF PCB board 40, a bottom shell 60, and a processing PCB board 70. The first heat dissipation substrate 10 and the second heat dissipation substrate 20 are spaced apart, the heat sink 30 is disposed between the first heat dissipation substrate 10 and the second heat dissipation substrate 20, the RF PCB board 40 is connected to the first heat dissipation substrate 10, and the processing PCB board 70 is connected to the second heat dissipation substrate 20. The heat generated when the RF PCB board 40 and the processing PCB board 70 are working... The heat is conducted to the first heat dissipation substrate 10 and the second heat dissipation substrate 20 respectively, and the first heat dissipation substrate 10 and the second heat dissipation substrate 20 conduct heat to the environment where the vehicle-mounted stereo imaging millimeter-wave radar is located. At the same time, by setting the first heat dissipation substrate 10 and the second heat dissipation substrate 20 apart and setting the heat dissipation component 30 between the first heat dissipation substrate 10 and the second heat dissipation substrate 20, the contact area between the first heat dissipation substrate 10 and the second heat dissipation substrate 20 and the environment is increased, thereby improving the heat dissipation effect of the first heat dissipation substrate 10 and the second heat dissipation substrate 20, so as to improve the stability of the vehicle-mounted stereo imaging millimeter-wave radar.

[0047] In this invention, there are multiple heat sinks 30, which are evenly spaced along a first direction to form a heat sink group 30a. The first direction is the width direction of the first heat sink substrate 10 and the second heat sink substrate 20. Among the multiple heat sinks 30, a first heat dissipation channel 31 extending along a second direction is formed between any two adjacent heat sinks 30. The second direction is the length direction of the first heat sink substrate 10 and the second heat sink substrate 20. The first direction and the second direction are perpendicular to each other.

[0048] There are multiple heat sink assemblies 30a, which are evenly spaced along a second direction. Among the multiple heat sink assemblies 30a, a second heat dissipation channel 32 extending along a first direction is formed between any two adjacent heat sink assemblies 30a.

[0049] By providing a first heat dissipation channel 31 and a second heat dissipation channel 32 between the first heat dissipation substrate 10 and the second heat dissipation substrate 20, the contact area between the first heat dissipation substrate 10 and the second heat dissipation substrate 20 and the outside world is increased, and the heat dissipation component 30 is also able to conduct heat to the outside world.

[0050] In this invention, the bottom wall of the first mounting groove 11 on the first heat dissipation substrate 10 is provided with a first thermally conductive protrusion 12. A first thermally conductive adhesive 13 is provided on the side of the first thermally conductive protrusion 12 away from the first heat dissipation substrate 10, and the end of the first thermally conductive adhesive 13 away from the first thermally conductive protrusion 12 is connected to the radio frequency PCB board 40. There are multiple first thermally conductive protrusions 12 and multiple first thermally conductive adhesives 13, with each first thermally conductive adhesive 13 connected to its corresponding first thermally conductive protrusion 12.

[0051] During operation, some of the heat generated by the RF PCB board 40 is conducted to the first thermally conductive adhesive 13, then from the first thermally conductive adhesive 13 to the first thermally conductive protrusion 12, and finally from the first thermally conductive protrusion 12 to the first heat dissipation substrate 10. The first heat dissipation substrate 10 transfers the heat to the heat sink 30, which dissipates the heat to the environment of the vehicle-mounted stereo imaging millimeter-wave radar through the first heat dissipation channel 31 and the second heat dissipation channel 32. By setting multiple first thermally conductive protrusions 12 and first thermally conductive adhesive 13, the thermal conductivity between the RF PCB board 40 and the first heat dissipation substrate 10 is improved, thereby enhancing the heat dissipation effect of the RF PCB board 40.

[0052] In this invention, a second thermally conductive protrusion is provided on the bottom wall of the second mounting groove on the second heat dissipation substrate 20. A second thermally conductive adhesive 21 is provided on the side of the second thermally conductive protrusion away from the second heat dissipation substrate 20, and the end of the second thermally conductive adhesive 21 away from the second thermally conductive protrusion is connected to the processing PCB board 70. There are multiple second thermally conductive protrusions and multiple thermally conductive adhesives 21, and each second thermally conductive adhesive 21 is connected to its corresponding second thermally conductive protrusion.

[0053] During operation, some of the heat generated by the PCB board 70 is conducted to the second thermally conductive adhesive 21, then to the second thermally conductive protrusion, and finally to the second heat dissipation substrate 20. The second heat dissipation substrate 20 then transfers the heat to the heat sink 30, which dissipates the heat to the environment of the vehicle-mounted stereo imaging millimeter-wave radar through the first heat dissipation channel 31 and the second heat dissipation channel 32. By providing multiple second thermally conductive protrusions and second thermally conductive adhesives 21, the thermal conductivity between the PCB board 70 and the second heat dissipation substrate 20 is improved, thereby enhancing the heat dissipation effect of the PCB board 70.

[0054] In this utility model, a third thermally conductive protrusion 61 is provided inside the bottom shell 60, and a third thermally conductive adhesive 62 is provided between the third thermally conductive protrusion 61 and the processing PCB board 70. One end of the third thermally conductive adhesive 62 is connected to the third thermally conductive protrusion 61, and the other end is connected to the processing PCB board 70.

[0055] By providing a third thermally conductive protrusion 61 and a third thermally conductive adhesive 62 between the bottom shell 60 and the processing PCB board 70, some of the heat generated by the processing PCB board 70 during operation is conducted to the third thermally conductive adhesive 62, then to the third thermally conductive protrusion 61, and finally to the bottom shell 60. The bottom shell 60 dissipates the heat to the environment where the vehicle-mounted stereo imaging millimeter-wave radar is located, thereby further improving the heat dissipation efficiency of the processing PCB board 70.

[0056] In one embodiment of the present invention, a plurality of heat dissipation ribs 63 are protruding on the outer wall of the bottom shell 60. The plurality of heat dissipation ribs 63 are arranged at intervals along the circumference of the bottom shell 60, thereby increasing the contact area between the bottom shell 60 and the environment in which the vehicle-mounted stereo imaging millimeter-wave radar is located, thereby improving the heat dissipation efficiency of the bottom shell 60.

[0057] In one embodiment of the present invention, a first sealing ring 80 is provided between the radome 50 and the heat dissipation substrate, and a second sealing ring 90 is provided between the bottom shell 60 and the heat dissipation substrate.

[0058] A first slot 14 is formed on the first sidewall of the heat dissipation substrate, and a second slot is formed on the second sidewall of the heat dissipation substrate. A first sealing ring 80 is installed in the first slot 14, and a second sealing ring 90 is installed in the second slot. The first sealing ring 80 is used to seal the connection between the antenna cover 50 and the heat dissipation substrate, and the first sealing ring 80 is used to seal the connection between the bottom shell 60 and the heat dissipation substrate.

[0059] The above are merely preferred embodiments of the utility model and are not intended to limit the utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the utility model should be included within the protection scope of the utility model.

Claims

1. A vehicle-mounted stereo imaging millimeter-wave radar, characterized in that, include: A first heat dissipation substrate (10) and a second heat dissipation substrate (20) are provided at intervals; The heat sink (30) is connected at one end to the first heat sink substrate (10) and at the other end to the second heat sink substrate (20); The radio frequency PCB board (40) is connected to the side of the first heat sink substrate (10) away from the second heat sink substrate (20); The antenna cover (50) is connected to the side of the first heat dissipation substrate (10) away from the second heat dissipation substrate (20), and the radio frequency PCB board (40) is located between the antenna cover (50) and the first heat dissipation substrate (10). The PCB board (70) is connected to the side of the second heat sink substrate (20) away from the first heat sink substrate (10); The bottom shell (60) is connected to the side of the second heat dissipation substrate (20) away from the first heat dissipation substrate (10), and the processing PCB board (70) is located between the bottom shell (60) and the second heat dissipation substrate (20).

2. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 1, characterized in that, The number of heat sinks (30) is multiple, and the multiple heat sinks (30) are evenly spaced along the first direction to form a group of heat sinks (30); Among the plurality of heat sinks (30), a first heat dissipation channel (31) extending in the second direction is formed between any two adjacent heat sinks (30); Wherein, the first direction and the second direction are perpendicular to each other.

3. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 2, characterized in that, The number of heat sink (30) groups is multiple, and the multiple heat sink (30) groups are evenly spaced along the second direction; In any two adjacent heat sink groups (30), a second heat dissipation channel (32) extending along the first direction is formed.

4. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 1 or 3, characterized in that, The first heat dissipation substrate (10) is provided with a first thermally conductive protrusion (12); A first thermally conductive adhesive (13) is provided on the side of the first thermally conductive protrusion (12) away from the first heat dissipation substrate (10), and the end of the first thermally conductive adhesive (13) away from the first thermally conductive protrusion (12) is connected to the radio frequency PCB board (40). There are multiple first thermally conductive protrusions (12) and multiple first thermally conductive adhesives (13). Each of the multiple first thermally conductive protrusions (12) corresponds to a single first thermally conductive adhesive (13), and each first thermally conductive adhesive (13) is connected to the corresponding first thermally conductive protrusion.

5. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 4, characterized in that, The first heat dissipation substrate (10) is provided with a first mounting groove (11), the radio frequency PCB board (40) is installed in the opening of the first mounting groove (11), and a plurality of the first heat-conducting protrusions (12) are all disposed on the bottom wall of the first mounting groove (11).

6. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 5, characterized in that, The second heat dissipation substrate (20) is provided with a second thermally conductive protrusion; A second thermally conductive adhesive (21) is provided on the side of the second thermally conductive protrusion away from the second heat dissipation substrate (20), and the end of the second thermally conductive adhesive (21) away from the second thermally conductive protrusion is connected to the processing PCB board (70). There are multiple second thermally conductive protrusions and multiple second thermally conductive adhesives. Each of the multiple second thermally conductive protrusions corresponds to a multiple of the second thermally conductive adhesives (21), and each of the second thermally conductive adhesives (21) is connected to the corresponding second thermally conductive protrusion.

7. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 6, characterized in that, The second heat dissipation substrate (20) is provided with a second mounting groove, the processing PCB board (70) is mounted in the opening of the second mounting groove, and a plurality of the second heat-conducting protrusions are provided on the bottom wall of the second mounting groove.

8. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 1, characterized in that, The bottom shell (60) has a third thermally conductive protrusion (61) protruding inside. A third thermally conductive adhesive (62) is provided between the third thermally conductive protrusion (61) and the processing PCB board (70). One end of the third thermally conductive adhesive (62) is connected to the third thermally conductive protrusion (61), and the other end is connected to the processing PCB board (70).

9. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 8, characterized in that, The outer wall of the bottom shell (60) is provided with a plurality of heat dissipation ribs (63), which are spaced apart along the circumference of the bottom shell (60).

10. The vehicle-mounted stereo imaging millimeter-wave radar as described in claim 1, characterized in that, A first sealing ring (80) is provided between the radome (50) and the heat dissipation substrate; a second sealing ring (90) is provided between the bottom shell (60) and the heat dissipation substrate.

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