Wafer sweeping mechanism with wiring spring and wafer detection device

Abstract

The utility model provides a wafer sweeping mechanism with a wiring spring and a wafer detection device, the wafer sweeping mechanism comprises a support arm fixing plate, a first support arm, a first sensor, a first wiring spring and a first wiring, the first support arm is arranged on the support arm fixing plate, the first support arm can move relative to the support arm fixing plate, the first sensor is arranged on the first support arm, and the first wiring spring is arranged on the first sensor. One end of the first wiring spring is connected with the first support arm, the other end of the first wiring spring is connected with the support arm fixing plate, one end of the first wiring is electrically connected to the first sensor, a part of the first wiring is connected with the first wiring spring, and the other end of the first wiring is connected with the support arm fixing plate. One part of the first wiring is connected to the first wiring spring, so that the first wiring is prevented from falling down, and the risk that other mechanisms are scratched in a narrow space is avoided, the first wiring of the first sensor is regular and reasonable, the first wiring is restrained, and meanwhile the service life of the first wiring is prolonged.

Description

Technical Field

[0001] This application relates to the technical field of wafer inspection, specifically to a wafer scanning mechanism with wiring springs and a wafer inspection device. Background Technology

[0002] In the wafer manufacturing process, wafers are usually completed using different equipment at different process stages. The transfer of wafers between different equipment is usually accomplished using wafer cassettes. However, due to various reasons, the wafer cassettes are usually not full. Therefore, a wafer scanning mechanism is needed to confirm the presence of wafers in the cassettes, so as to help the equipment accurately remove wafers from each layer of the cassette.

[0003] The scanning mechanism is usually equipped with other structures such as forks for picking up and placing the tablets to complete the picking and placing operation after accurate detection. Due to the limited space of the material box and the height of the material box, the space left for the scanning mechanism is relatively small, which requires the design of the mechanism to be more compact and stable.

[0004] Typically, wafer scanning mechanisms use sensors to determine the presence or absence of wafers. However, when accommodating wafers of different sizes, the sensor position needs to be adjusted to avoid contact with the wafer or the sidewall of the wafer tray. But the constant opening and closing motion can damage the fiber optic cabling connected to the sensor, leading to sensor instability. If sufficient bending radius is provided for the fiber optic cabling, it will sag, posing a risk of scratching other mechanisms in confined spaces. Therefore, providing a wafer scanning mechanism with neat and reasonable sensor cabling becomes a technical problem that needs to be solved. Utility Model Content

[0005] This application provides a wafer scanning mechanism and wafer inspection device with wiring springs that can neatly and reasonably arrange sensor wiring.

[0006] In a first aspect, the scanning mechanism with a wiring spring provided in the embodiments of this application includes:

[0007] Outrigger mounting plate;

[0008] A first arm is mounted on the arm fixing plate and is movable relative to the arm fixing plate.

[0009] The first sensor is mounted on the first arm;

[0010] A first wiring spring, one end of which is connected to the first support arm, and the other end of which is connected to the support arm fixing plate;

[0011] The first wiring has one end electrically connected to the first sensor, a portion of the first wiring connected to the first wiring spring, and the other end of the first wiring connected to the support arm fixing plate.

[0012] This application provides a scanning mechanism with a wiring spring, including a support arm fixing plate, a first support arm, a first sensor, a first wiring spring, and a first wiring. The first support arm is mounted on the support arm fixing plate and is movable relative to the support arm fixing plate. The first sensor is mounted on the first support arm. One end of the first wiring spring is connected to the first support arm, and the other end of the first wiring spring is connected to the support arm fixing plate. One end of the first wiring is electrically connected to the first sensor, a portion of the first wiring is connected to the first wiring spring, and the other end of the first wiring is connected to the support arm fixing plate. By setting the first wiring spring, a portion of the first wiring is connected to the first wiring spring to prevent the first wiring from falling and risking scratching other mechanisms in a confined space. The first wiring of the first sensor is neatly organized, which constrains the first wiring and extends its service life.

[0013] In one optional embodiment, the first wiring spring includes a first fixing part, a first long arm, a second long arm, and a second fixing part connected in sequence. The first fixing part is fixed to the first support arm, the first long arm and the second long arm are bent and connected, and the second fixing part is fixed to the support arm fixing plate.

[0014] In one optional implementation, the angle between the first long arm and the second long arm is 120°-140°.

[0015] In one optional embodiment, the first wiring spring further includes a helical portion, one end of which is connected to one end of the first long arm, and the other end of which is connected to one end of the second long arm.

[0016] In one alternative implementation, a first portion of the first wiring is connected to the first long arm; and / or, a second portion of the first wiring is connected to the connection between the first long arm and the second long arm; and / or, a third portion of the first wiring is connected to the second long arm.

[0017] In one optional embodiment, the scanning mechanism further includes at least one connector, which connects the first wire to the first wire spring; or, the first wire spring is provided with at least one connecting portion, through which the first wire passes.

[0018] In one optional embodiment, the scanning mechanism further includes a second arm, which is disposed on the arm fixing plate and is disposed opposite to the first arm. The second arm is provided with a signal reflector for reflecting the signal emitted by the first sensor.

[0019] In one optional embodiment, the scanning mechanism further includes a second arm, a second sensor, a second wiring and a second wiring spring. The second arm is disposed on the arm fixing plate and is opposite to the first arm. The second sensor is disposed on the second arm. One end of the second wiring spring is connected to the second arm, and the other end of the second wiring spring is connected to the arm fixing plate. One end of the second wiring is electrically connected to the second sensor, a portion of the second wiring is connected to the second wiring spring, and the other end of the second wiring is connected to the arm fixing plate.

[0020] In one optional embodiment, the scanning mechanism further includes a scanning drive, a scanning slide rail, a scanning guide plate, and a follower. The scanning drive and the scanning slide rail are mounted on the support arm fixing plate. The scanning guide plate has a groove, the extension direction of which intersects the driving direction of the scanning drive and the extension direction of the scanning slide rail. The follower is mounted on the first support arm and slidably connected to the groove wall. When the scanning drive drives the scanning guide plate to move, the scanning guide plate drives the first support arm to move along the scanning slide rail via the follower.

[0021] Secondly, the present application provides a wafer inspection device with a scanning mechanism, including the scanning mechanism described in the first aspect. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below.

[0023] Figure 1 This is a schematic diagram of the structure of a scanning mechanism provided in an embodiment of this application. Figure 1 ;

[0024] Figure 2 This is a schematic diagram of the structure of a scanning mechanism provided in an embodiment of this application. Figure 2 ;

[0025] Figure 3 This is a schematic diagram of the structure of a scanning mechanism provided in an embodiment of this application. Figure 3 ;

[0026] Figure 4 This is a top view of a scanning mechanism provided in an embodiment of this application. Figure 1 ;

[0027] Figure 5 This is a schematic diagram of the structure of a scanning mechanism provided in an embodiment of this application. Figure 4 ;

[0028] Figure 6 This is a partial structural diagram of a scanning mechanism provided in an embodiment of this application. Figure 1 ;

[0029] Figure 7 This is a partial structural diagram of a scanning mechanism provided in an embodiment of this application. Figure 2 ;

[0030] Figure 8 This is a top view of a scanning mechanism provided in an embodiment of this application. Figure 2 ;

[0031] Figure 9 This is a schematic diagram of the structure of a scanning mechanism and a moving mechanism provided in an embodiment of this application. Figure 1 ;

[0032] Figure 10 This is a schematic diagram of the structure of a scanning mechanism and a moving mechanism provided in an embodiment of this application. Figure 2 .

[0033] Explanation of icon numbers:

[0034] Sweeping plate mechanism 100; support arm fixing plate 10; first support arm 21; first sensor 31; first main fixing plate 11; first support fixing plate 12; second support fixing plate 13; first sweeping plate slide rail 41; first slider 51; first main support arm 211; first sub-support arm 212; first central axis L1; second support arm 22; second sweeping plate slide rail 42; second slider 52; second main support arm 221; second sub-support arm 222; second sensor 32; first wiring 61; first wiring spring 71; first fixing part 711; first long arm 712; second long arm 714; second fixing part 715; screw Rotating part 713; Connector 81; Second wiring 62; Second wiring spring 72; Sweeping plate drive 91; Sweeping plate slide rail 40; Sweeping plate guide plate 92; Follower 93; First limit block 941; Second limit block 942; Third limit block 943; First slide groove 921; Second slide groove 922; First follower 931; Second follower 932; Mounting plate 330; Moving mechanism 340; Drive structure 341; Moving slide rail 342; Moving slider 343; First buffer 344; Second buffer 345; First detector 346; Second detector 347; Sensing plate 348. Detailed Implementation

[0035] The technical solution of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the embodiments described in this application are only a part of the embodiments, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without creative effort are within the protection scope of this application.

[0036] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment to other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0037] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a particular order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, an assembly or device comprising one or more components is not limited to the one or more components listed, but may optionally also include one or more components not listed but inherent to the exemplified product, or one or more components that it should have based on the described function.

[0038] In wafer inspection equipment, the material bin is used to store and place wafers for their organization. A robotic arm typically picks up and places wafers from the material bin and transfers them to the inspection platform for testing. Before transferring the wafers, a scanning mechanism equipped with sensors senses the wafer's placement within the material bin. However, when accommodating wafers of different sizes, the sensor's position needs to be moved accordingly. Therefore, the sensor wiring is generally designed with a certain margin to ensure that the wiring is not stretched during sensor movement. However, if sufficient bending radius is allowed for the fiber optic wiring, the fiber optic cable may sag, posing a risk of scratching other mechanisms in confined spaces.

[0039] Please see Figure 1 This application provides a scanning mechanism 100 with a wiring spring.

[0040] The scanning mechanism 100 includes a support arm fixing plate 10, a first support arm 21, and a first sensor 31.

[0041] The outrigger fixing plate 10 includes a first main fixing plate 11, a first branch fixing plate 12, and a second branch fixing plate 13 that are interconnected as a whole.

[0042] The first main fixing plate 11 extends along a first direction (e.g., longitudinally), the first branch fixing plate 12 extends from one end of the first main fixing plate 11 along a first inclined direction, and the second branch fixing plate 13 extends from one end of the first main fixing plate 11 along a second inclined direction. In other words, the arm fixing plate 10 is approximately Y-shaped.

[0043] The first support arm 21 is mounted on the support arm fixing plate 10. The first support arm 21 is movable relative to the support arm fixing plate 10.

[0044] For details, please refer to Figure 3 The scanning mechanism 100 also includes a first scanning slide rail 41 and a first slider 51. The first scanning slide rail 41 is disposed on the first support plate 12 and extends along or approximately along the first inclined direction. The first slider 51 is embedded in the first scanning slide rail 41 and is slidably connected to the first scanning slide rail 41.

[0045] Please see Figure 1 and Figure 4 The first support arm 21 is mounted on the first slider 51. The first support arm 21 includes a first main support arm 211 and a first sub-support arm 212. The first main support arm 211 and the first sub-support arm 212 are interconnected as a single unit and bent together. The first main support arm 211 is mounted on the slider. The extension direction of the first main support arm 211 is the same as the extension direction of the first sweeping plate slide rail 41. The extension direction of the first sub-support arm 212 is approximately along a first direction (e.g., longitudinal). It can be seen that the first support arm 21 is slidably connected to the first sweeping plate slide rail 41 via the first slider 51. Taking the central axis between the first fixing plate 12 and the second fixing plate 13 as the first central axis L1, and using the first central axis L1 as a reference line, as the first slider 51 gradually moves away from the first central axis L1, the first main support arm 211 gradually moves away from the first central axis L1 along the first inclined direction, and the first sub-support arm 212 gradually moves away from the first central axis L1 along the second direction (e.g., transverse).

[0046] The first sensor 31 is disposed on the first support arm 21. Optionally, the first sensor 31 is disposed at the end of the first sub-support arm 212 away from the first main support arm 211. The first sensor 31 is used to detect whether a wafer is present in the material box.

[0047] Further optional information can be found in [link to relevant documentation]. Figure 1 and Figure 2 The scanning mechanism 100 also includes a second support arm 22. The second support arm 22 is mounted on the support arm fixing plate 10. The second support arm 22 is movable relative to the support arm fixing plate 10. The second support arm 22 is disposed opposite to the first support arm 21.

[0048] For details, please refer to Figure 2 and Figure 3The scanning mechanism 100 also includes a second scanning slide rail 42 and a second slider 52. The second scanning slide rail 42 is disposed on the second support plate 13 and extends along or approximately along the second inclined direction. The second slider 52 is embedded in the second scanning slide rail 42 and is slidably connected to the second scanning slide rail 42.

[0049] Please see Figure 1 and Figure 2 The second support arm 22 is mounted on the second slider 52. The second support arm 22 includes a second main support arm 221 and a second sub-support arm 222. The second main support arm 221 and the second sub-support arm 222 are interconnected as a single unit and bent together. The second main support arm 221 is mounted on the second slider 52. The extension direction of the second main support arm 221 is the same as the extension direction of the second sweeping plate slide rail 42. The extension direction of the second sub-support arm 222 is approximately along a first direction (e.g., longitudinal). It can be seen that the second support arm 22 is slidably connected to the second sweeping plate slide rail 42 via the second slider 52. Taking the central axis between the first support plate 12 and the second support plate 13 as the first central axis L1, and using the first central axis L1 as a reference line, as the second slider 52 gradually moves away from the first central axis L1, the second main support arm 221 gradually moves away from the first central axis L1 along a second inclined direction, and the second sub-support arm 222 gradually moves away from the first central axis L1 along a second direction (e.g., transverse).

[0050] Optionally, the first fixing plate 12 and the second fixing plate 13 are symmetrically arranged about the first central axis L1. The first sweeping plate slide rail 41 and the second sweeping plate slide rail 42 are symmetrically arranged about the first central axis L1. The first support arm 21 and the second support arm 22 are symmetrically arranged about the first central axis L1.

[0051] When the first arm 21 and the second arm 22 simultaneously move away from the first central axis L1, the distance between the first arm 21 and the second arm 22 along the second direction (e.g., laterally) increases, which facilitates the scanning mechanism 100 in scanning large-sized wafers. When the first arm 21 and the second arm 22 simultaneously move closer to the first central axis L1, the distance between the first arm 21 and the second arm 22 along the second direction (e.g., laterally) decreases, which facilitates the scanning mechanism 100 in scanning small-sized wafers. This allows the scanning mechanism 100 to be compatible with scanning wafers of different sizes.

[0052] In one optional embodiment, the first sensor 31 includes a signal transmitter and a signal receiver. A signal reflector is provided on the second support arm 22. The signal reflector is located at the end of the second sub-support arm 222 away from the second main support arm 221. The signal transmitter of the first sensor 31 transmits a detection signal toward the signal reflector, and the signal reflector reflects the detection signal transmitted by the first sensor 31. The signal receiver of the first sensor 31 receives the reflected signal from the signal reflector.

[0053] When the wafer at the scanning position of the scanning mechanism 100 is empty, the first sensor 31 emits a detection signal and receives the detection signal reflected by the signal reflector. After the above process, the first sensor 31 sends the received detection signal result to the controller, which can then determine that the wafer at the scanning position of the current scanning mechanism 100 is empty.

[0054] When a wafer is present at the scanning position of the wafer scanning mechanism 100, the detection signal emitted by the first sensor 31 is blocked by the wafer. Thus, the first sensor 31 cannot receive the detection signal reflected by the signal reflector. After the above process, the first sensor 31 sends the received detection signal result to the controller, which can then determine whether a wafer is present at the current scanning position of the wafer scanning mechanism 100.

[0055] Optionally, the first sensor 31 may include, but is not limited to, an optical fiber sensor.

[0056] In another alternative implementation, please refer to Figure 1 and Figure 2 The scanning mechanism 100 also includes a second sensor 32, which is disposed on the second support arm 22. Optionally, the second sensor 32 is disposed at the end of the second sub-support arm 222 away from the second main support arm 221. One of the first sensor 31 and the second sensor 32 is a signal transmitter, and the other is a signal receiver.

[0057] Taking the first sensor 31 as a signal transmitter and the second sensor 32 as a signal receiver as an example.

[0058] When the wafer at the scanning position of the scanning mechanism 100 is empty, the first sensor 31 emits a detection signal, and the second sensor 32 receives the detection signal from the first sensor 31. After the above process, the second sensor 32 sends the received detection signal result to the controller, and the controller can determine that the wafer at the scanning position of the current scanning mechanism 100 is empty.

[0059] When a wafer is present at the scanning position of the wafer scanning mechanism 100, the detection signal emitted by the first sensor 31 is blocked by the wafer. As a result, the second sensor 32 cannot receive the detection signal from the first sensor 31. After the above process, the second sensor 32 sends the received detection signal result to the controller, which can then determine whether a wafer is present at the current scanning position of the wafer scanning mechanism 100.

[0060] Optionally, the first sensor 31 and the second sensor 32 may be, but are not limited to, through-beam fiber optic sensors.

[0061] In this embodiment, please refer to Figure 5The scanning mechanism 100 includes a first wiring 61 and a first wiring spring 71.

[0062] Please see Figure 5 One end of the first wiring 61 is electrically connected to the first sensor 31. Optionally, one end of the first wiring 61 is electrically connected to the first sensor 31, and the first wiring 61 extends out of the first support arm 21 via the outside of the first sub-support arm 212, and extends along the outside of the bend connection between the first sub-support arm 212 and the first main support arm 211 to the outside of the first main support arm 211.

[0063] Please refer to Figure 5 The bending angle at the bend connection between the first sub-arm 212 and the first main arm 211 is an obtuse angle. Therefore, the bending radius of the first wiring 61 when it bends at this point is relatively large, thereby avoiding or reducing the bending damage of the first wiring 61.

[0064] Please refer to Figure 5 One end of the first wiring spring 71 is connected to the first support arm 21, and the other end of the first wiring spring 71 is connected to the support arm fixing plate 10. Specifically, one end of the first wiring spring 71 is fixedly mounted to the outer side of the first main support arm 211, and the other end of the first wiring spring 71 is fixedly mounted to the side wall of the first main fixing plate 11 facing the side where the first support arm 21 is located. For ease of explanation, in this application, the side wall of the first main fixing plate 11 facing the side where the first support arm 21 is located is defined as the first side wall.

[0065] Please see Figure 5 A portion of the first wiring 61 is connected to the first wiring spring 71. The other end of the first wiring 61 is connected to the support arm fixing plate 10 and extends along the first side wall of the first main fixing plate 11. More specifically, the other end of the first wiring 61 is electrically connected to a wiring box at the end of the first main fixing plate 11 away from the first support fixing plate 12.

[0066] The first wiring spring 71 is used to guide the direction of the first wiring 61 and to lift a portion of the first wiring 61 to prevent the excess portion of the first wiring 61 from falling down, which would pose a risk of scratching other mechanisms in a confined space.

[0067] This application provides a scanning mechanism 100 with a wiring spring, including a support arm fixing plate 10, a first support arm 21, a first sensor 31, a first wiring spring 71, and a first wiring 61. The first support arm 21 is mounted on the support arm fixing plate 10 and is movable relative to the support arm fixing plate 10. The first sensor 31 is mounted on the first support arm 21. One end of the first wiring spring 71 is connected to the first support arm 21, and the other end of the first wiring spring 71 is connected to the support arm fixing plate 10. One end of the first wiring 61 is electrically connected to the first sensor 31, a portion of the first wiring 61 is connected to the first wiring spring 71, and the other end of the first wiring 61 is connected to the support arm fixing plate 10. By setting the first wiring spring 71, a portion of the first wiring 61 is connected to the first wiring spring 71 to prevent the first wiring 61 from falling and risking scratching other mechanisms in a confined space. The first wiring 61 of the first sensor 31 is neatly organized to achieve constraint on the first wiring 61 and extend the service life of the first wiring 61.

[0068] This application does not specifically limit the extension direction of the first wiring spring 71. Optionally, the first wiring spring 71 may extend in a straight line, curve, bend, or other manner.

[0069] The structure of the first wiring spring 71 will be illustrated below with reference to the accompanying drawings.

[0070] Optional, please refer to Figure 6 The first wiring spring 71 includes a first fixing part 711, a first long arm 712, a second long arm 714, and a second fixing part 715 connected in sequence. Optionally, the first fixing part 711, the first long arm 712, the second long arm 714, and the second fixing part 715 are interconnected as a single unit. Optionally, the first fixing part 711, the first long arm 712, the second long arm 714, and the second fixing part 715 are formed by bending a single metal wire. Thus, the first wiring spring 71 has the characteristics of simple structure, light weight, and low cost.

[0071] The first fixing part 711 is fixed to the first support arm 21. Specifically, the first fixing part 711 is generally annular to facilitate fixing to the outer wall of the first main support arm 211 by screws or the like. Of course, in other embodiments, the fixing method between the first fixing part 711 and the first main support arm 211 includes, but is not limited to, welding, snap-fit ​​connection, or hook connection.

[0072] Optionally, the first long arm 712 and the second long arm 714 are bent and connected. The bending angle formed between the extending direction of the first long arm 712 and the outer wall of the first main support arm 211 is an obtuse angle. This results in a larger bending radius for the first wiring 61 along the outer wall of the first main support arm 211 to the first long arm 712, avoiding or reducing bending damage. The first wiring 61 also extends along the first long arm 712.

[0073] The angle between the first long arm 712 and the second long arm 714 is an obtuse angle. Optionally, the angle between the first long arm 712 and the second long arm 714 is 120°-140°. The first wiring 61 also extends along the first long arm 712 and the second long arm 714. This embodiment, by designing the angle between the first long arm 712 and the second long arm 714 to be 120°-140°, ensures that the bending angle of the first wiring 61 along the first long arm 712 to the second long arm 714 is relatively large, resulting in a large bending radius and a good bending radius, thus avoiding or reducing bending damage. Furthermore, the bending shape of the first long arm 712 and the second long arm 714 provides a deformable elastic space when the first support arm 21 moves along the first sweeping slide rail 41 relative to the support arm fixing plate 10, without causing excessive bending resistance.

[0074] Specifically, during the movement of the first arm 21 along the first sweeping slide rail 41 relative to the arm fixing plate 10, the angle between the first long arm 712 and the second long arm 714 changes, and the first wiring spring 71 deforms to support the first long arm 712 connected to the first arm 21 so that it can move with the first arm 21.

[0075] The second fixing part 715 is fixed to the support arm fixing plate 10. Specifically, the second fixing part 715 is generally annular to facilitate fixing to the first side wall of the first main fixing plate 11 by screws or the like. Of course, in other embodiments, the fixing method between the second fixing part 715 and the first side wall of the first main fixing plate 11 includes, but is not limited to, welding, snap-fit ​​connection, or connection by hooks.

[0076] After the first wiring 61 completes its course along the second long arm 714, it extends along the first side wall of the first main fixing plate 11.

[0077] Furthermore, the angle between the second long arm 714 and the first side wall of the first main fixing plate 11 is an obtuse angle, so that the bending radius of the first wiring 61 along the second long arm 714 to the first side wall of the first main fixing plate 11 is larger, thereby avoiding or reducing bending damage.

[0078] Alternatively, the first fixing part 711, the first long arm 712, the second long arm 714, and the second fixing part 715 may be formed by bending a metal wire or a metal rod.

[0079] Optional, please refer to Figure 6 The first wiring spring 71 also includes a helical portion 713. One end of the helical portion 713 is connected to one end of the first long arm 712, and the other end of the helical portion 713 is connected to one end of the second long arm 714. That is, the helical portion 713 is connected between the first long arm 712 and the second long arm 714.

[0080] Alternatively, the first fixing part 711, the first long arm 712, the spiral part 713, the second long arm 714, and the second fixing part 715 may be formed by bending a metal wire or a metal rod.

[0081] Optionally, the spiral axis of the spiral part 713 can be set in the vertical direction, which is also the thickness direction of the support arm fixing plate 10.

[0082] The first long arm 712, the helical part 713, and the second long arm 714 form a torsion spring structure.

[0083] As the first arm 21 moves away from the first central axis L1, one end of the first long arm 712 moves away from the second long arm 714, the angle between the first long arm 712 and the second long arm 714 increases, and the spiral part 713 deforms (or recovers its deformation).

[0084] As the first arm 21 approaches the first central axis L1, one end of the first long arm 712 moves closer to the second long arm 714, the angle between the first long arm 712 and the second long arm 714 decreases, and the spiral part 713 recovers its deformation (or undergoes deformation).

[0085] This application does not specify the installation position of the first fixing part 711 on the first support arm 21.

[0086] In a first optional embodiment, when the first wiring spring 71 is in its natural state (undeformed state), the first fixing part 711 is fixed at the position where the first support arm 21 is located on the first sweeping slide rail 41 closest to the first central axis L1. As the first support arm 21 moves away from the first central axis L1, the first wiring spring 71 is stretched and deformed.

[0087] In a second alternative embodiment, when the first wiring spring 71 is in its natural state (undeformed state), the first fixing part 711 is fixed at the position where the first support arm 21 is located on the first sweeping slide rail 41 furthest from the first central axis L1. As the first support arm 21 approaches the first central axis L1, the first wiring spring 71 is compressed and deformed.

[0088] In a third alternative embodiment, when the first wiring spring 71 is in its natural state (undeformed state), the first fixing part 711 is fixed at the position where the first support arm 21 is located in the middle position on the first sweeping slide rail 41. As the first support arm 21 moves closer to / away from the first central axis L1, the first wiring spring 71 is compressed / stretched.

[0089] This application does not specify the connection position between the first wiring 61 and the first wiring spring 71.

[0090] Optionally, a first portion of the first wiring 61 is connected to the first long arm 712; and / or, a second portion of the first wiring 61 is connected to the connection between the first long arm 712 and the second long arm 714; and / or, a third portion of the first wiring 61 is connected to the second long arm 714.

[0091] In other words, please see Figure 6 and Figure 7 At least one of the following—the first long arm 712 of the first wiring spring 71, the bent connection between the first long arm 712 and the second long arm 714, and the second long arm 714—connects the first wiring 61 to guide the first wiring 61 along the layout of the first wiring spring 71. This avoids damage to the first wiring 61 due to excessive bending and also prevents the first wiring 61 from sagging excessively during the movement of the first support arm 21, thus avoiding the risk of it scraping other mechanisms in a confined space.

[0092] Further optionally, when the bent connection between the first long arm 712 and the second long arm 714 is a spiral portion 713, the spiral portion 713 is connected to a portion of the first wiring 61.

[0093] For example, a first portion of the first wiring 61 is connected to the first long arm 712; a second portion of the first wiring 61 is connected to the connection between the first long arm 712 and the second long arm 714; and a third portion of the first wiring 61 is connected to the second long arm 714, thereby increasing the connection between the first wiring 61 and the first wiring spring 71, and thus increasing the support point of the first wiring spring 71 for the first wiring 61, reducing the amount of sag of the first wiring 61.

[0094] The connection between the first wiring 61 and the first wiring spring 71 includes, but is not limited to, the following implementation methods.

[0095] For the first alternative implementation, please refer to Figure 6 and Figure 7 The scanning mechanism 100 further includes at least one connector 81. The at least one connector 81 connects the first wiring 61 to the first wiring spring 71.

[0096] Optionally, the number of connectors 81 may be one or more.

[0097] For example, there may be multiple connectors 81. For instance, the multiple connectors 81 may include a first connector, a second connector, and a third connector. Specifically, the first connector connects a first portion of the first wiring 61 to the first long arm 712; the second connector connects a second portion of the first wiring 61 to the connection point (e.g., the spiral portion 713) between the first long arm 712 and the second long arm 714; and the third connector connects a third portion of the first wiring 61 to the second long arm 714.

[0098] This application does not impose specific limitations on the structure of the connector 81. Optionally, the connector 81 may include, but is not limited to, a buckle, a strap, or a cable tie.

[0099] For example, please see Figure 6 and Figure 7 The connector 81 is a cable tie. Multiple cable ties are used to connect the first part of the first wiring 61 to the first long arm 712, the second part of the first wiring 61 to the connection between the first long arm 712 and the second long arm 714 (e.g., the spiral part 713), and the third part of the first wiring 61 to the second long arm 714. This improves the reliability of the connection between the first wiring 61 and the first wiring spring 71. On the other hand, the cable ties can directly connect the first wiring 61 to the first wiring spring 71 after both ends of the first wiring 61 are connected, without affecting the assembly of the first wiring 61, making disassembly and assembly convenient.

[0100] In a second alternative embodiment, the first wiring spring 71 is provided with at least one connecting portion (not shown). The first wiring 61 passes through the at least one connecting portion.

[0101] Optionally, the connecting part is a portion welded to the first wiring spring 71, or a portion integrally formed with the first wiring spring 71, or a portion formed by bending the first wiring spring 71.

[0102] For example, the connecting portion is ring-shaped or approximately ring-shaped with an opening. The central axis of the connecting portion is close to the extending direction of the first wiring 61. In this way, the first wiring 61 can be inserted into the connecting portion, which can both support the first wiring spring 71 for the first wiring 61 and not affect the free movement of the first wiring 61.

[0103] For example, the first fixing part 711, the first long arm 712, the spiral part 713, the second long arm 714, and the second fixing part 715 are formed by bending a metal wire. The first fixing part 711 of the first wiring spring 71 can be fixed to the first support arm 21 by locking screws, and the second fixing part 715 of the first wiring spring 71 can be fixed to the first side wall of the first main fixing plate 11 by locking screws.

[0104] The first cabling, 61, is for fiber optic cabling.

[0105] The optical fiber trace leading from the first sensor 31 is guided along the first long arm 712, through the spiral part 713, and then along the second long arm 714 to the first side wall of the first main fixing plate 11 in a different layer. Specifically, the first wiring 61 is tied together with the first long arm 712, the spiral part 713, and the second long arm 714 by cable ties, thereby achieving a fixed trajectory bend for the first wiring 61.

[0106] For example, the spiral portion 713 has 4 spiral turns (not limited to this number). The more spiral turns the spiral portion 713 has, the greater its weight, and the larger the spring wire diameter needs to be designed to support the weight of the spring itself.

[0107] For example, the helix diameter of the helix 713 is 6-12 mm (not limited to this value). The larger the diameter of the helix 713, the smaller the bending force required, but the greater the weight.

[0108] For example, the wire diameter of the first wiring spring 71 is 0.4-0.6mm (not limited to this value). The larger the wire diameter of the first wiring spring 71, the greater the spring force. The greater the spring force, the greater the resistance to the movement of the first support arm 21, which is not conducive to the movement of the first support arm 21.

[0109] For example, the bending radius of the first fixing part 711 is 1.5-2.5mm (not limited to this value), and the bending radius of the second fixing part 715 is 1.5-2.5mm (not limited to this value), which allows the use of smaller screws to fix the first wiring spring 71.

[0110] The above describes the first wiring 61 and the first wiring spring 71 provided on the first side wall of the first main fixing plate 11 and the first support arm 21. This can be applied to embodiments where the first sensor 31 is a signal receiver and a signal transmitter, and the second support arm 22 includes a signal reflector.

[0111] Optional, please refer to Figure 8The scanning mechanism 100 further includes the aforementioned second arm 22, the aforementioned second sensor 32, the second wiring 62, and the second wiring spring 72. As mentioned above, the second arm 22 is mounted on the arm fixing plate 10. The second arm 22 is disposed opposite to the first arm 21. The second sensor 32 is mounted on the second arm 22.

[0112] Please see Figure 8 One end of the second wiring spring 72 is connected to the second support arm 22, and the other end of the second wiring spring 72 is connected to the support arm fixing plate 10. Specifically, one end of the second wiring spring 72 is fixedly mounted on the outer side of the second main support arm 221, and the other end of the second wiring spring 72 is fixedly mounted on the side wall of the first main fixing plate 11 facing the side where the second support arm 22 is located. For ease of explanation, in this application, the side wall of the first main fixing plate 11 facing the side where the second support arm 22 is located is defined as the second side wall.

[0113] Please see Figure 8 A portion of the second wiring 62 is connected to the second wiring spring 72. The other end of the second wiring 62 is connected to the support arm fixing plate 10 and extends along the second side wall of the first main fixing plate 11. More specifically, the other end of the second wiring 62 is electrically connected to a wiring box at the end of the first main fixing plate 11 away from the second support fixing plate 13.

[0114] Please see Figure 8 The second wiring spring 72 is used to guide the direction of the second wiring 62 and to lift a portion of the second wiring 62 to prevent the excess portion of the second wiring 62 from falling down, which would pose a risk of scratching other mechanisms in a confined space.

[0115] The structure of the second wiring spring 72 can refer to the structure of the first wiring spring 71. The way the first wiring spring 71 supports the first wiring 61 can refer to the way the first wiring spring 71 supports the first wiring 61.

[0116] Optional, please refer to Figure 1 and Figure 2 The scanning mechanism 100 further includes a scanning drive 91, a scanning slide rail 40, a scanning guide plate 92, and a follower 93. The scanning drive 91 and the scanning slide rail 40 are mounted on the support arm fixing plate 10.

[0117] The scanning drive 91 includes, but is not limited to, a cylinder, a motor, etc. In this embodiment, the scanning drive 91 is a cylinder.

[0118] The scanning drive 91 is disposed on the aforementioned first main fixing plate 11. The scanning drive 91 is disposed along a first direction (e.g., longitudinal direction).

[0119] Please see Figure 1 and Figure 2 The scanning slide rail 40 includes the aforementioned first scanning slide rail 41 and the aforementioned second scanning slide rail 42.

[0120] The first arm 21 is slidably connected to the first scanning plate slide rail 41 via the first slider 51. The second arm 22 is slidably connected to the second scanning plate slide rail 42 via the second slider 52.

[0121] Further, please refer to Figure 2 and Figure 3 The scanning mechanism 100 further includes a first limiting block 941, a second limiting block 942, and a third limiting block 943. The first limiting block 941 is located between the first scanning slide rail 41 and the second scanning slide rail 42. The first limiting block 941 is used to limit the sliding of the first slider 51 and the second slider 52.

[0122] The second limiting block 942 is located on the first sweeping slide rail 41 at one end away from the first limiting block 941. The second limiting block 942 is used to limit the sliding of the first slider 51.

[0123] The third limiting block 943 is located on the second sweeping slide rail 42 at one end away from the first limiting block 941. The third limiting block 943 is used to limit the sliding of the second slider 52.

[0124] The scanning drive unit 91 is connected to the scanning guide plate 92.

[0125] The sweeping plate guide plate 92 is provided with a sliding groove. The extending direction of the sliding groove intersects with the driving direction of the sweeping plate drive member 91. The extending direction of the sliding groove intersects with the extending direction of the sweeping plate slide rail 40.

[0126] Further, please refer to Figure 2 and Figure 3 The guide plate 92 has a first groove 921 and a second groove 922. The first groove 921 extends in an inclined direction relative to both the second direction (e.g., transverse) and the first direction (e.g., longitudinal). The second groove 922 extends in an inclined direction relative to both the second direction (e.g., transverse) and the first direction (e.g., longitudinal).

[0127] For example, the first groove 921 extends in a direction gradually moving away from the first central axis L1 and gradually moving away from the first sub-support arm 212. The second groove 922 extends in a direction gradually moving away from the first central axis L1 and gradually moving away from the second sub-support arm 222.

[0128] Alternatively, the first slide groove 921 and the second slide groove 922 are arranged symmetrically.

[0129] The follower 93 is mounted on the first support arm 21 and is slidably connected to the groove wall of the slide.

[0130] Please see Figure 1 The follower 93 includes a first follower 931 and a second follower 932.

[0131] A portion of the first follower 931 is fixedly connected to one end of the first main support arm 211 away from the first sub-support arm 212 and the first slider 51. The other portion of the first follower 931 is located in the first slide groove 921 and is slidably connected to the groove wall of the first slide groove 921.

[0132] A portion of the second follower 932 is fixedly connected to one end of the second main support arm 221 away from the second sub-support arm 222 and the second slider 52. The other portion of the second follower 932 is located in the second slide groove 922 and is slidably connected to the groove wall of the second slide groove 922.

[0133] When the sweeping plate drive 91 drives the sweeping plate guide plate 92 to move, the sweeping plate guide plate 92 drives the first support arm 21 to move along the sweeping plate slide rail 40 via the follower 93.

[0134] Specifically, the wafer scanning drive 91 pushes the wafer scanning guide plate 92 to move along a first direction (e.g., longitudinal direction). The wafer scanning guide plate 92 drives the first support arm 21 to move along the first wafer scanning slide rail 41 via the first follower 931. At the same time, the wafer scanning guide plate 92 drives the second support arm 22 to move along the second wafer scanning slide rail 42 via the second follower 932. The distance between the first support arm 21 and the second support arm 22 in a second direction (e.g., lateral direction) increases to detect larger wafers.

[0135] Since the first wiring 61 has a certain margin when it is routed, the margin of the first wiring 61 moves towards the first support arm 21 as it moves away from the first support arm 21.

[0136] The wafer scanning drive 91 pulls back the wafer scanning guide plate 92 to move along a first direction (e.g., longitudinal direction). The wafer scanning guide plate 92 drives the first support arm 21 to move along the first wafer scanning slide rail 41 via the first follower 931. At the same time, the wafer scanning guide plate 92 drives the second support arm 22 to move along the second wafer scanning slide rail 42 via the second follower 932. The distance between the first support arm 21 and the second support arm 22 in a second direction (e.g., lateral direction) decreases to detect smaller wafers.

[0137] As the first arm 21 approaches, the first wiring 61 generates some slack. Due to the setting of the first wiring spring 71, the slack part of the first wiring 61 will not fall down, but will be relatively far away from the first arm 21, etc., supported by the first wiring spring 71, thus avoiding the risk of scratching other mechanisms in a narrow space.

[0138] Please see Figure 9 and Figure 10 This application also provides a wafer inspection apparatus having a scanning mechanism 100. The wafer inspection apparatus includes the scanning mechanism 100 as described in any of the foregoing embodiments. The wafer inspection apparatus is used to detect the presence of wafers in a material box.

[0139] Further, please refer to Figure 9 and Figure 10 The wafer inspection device further includes a mounting plate 330 and a moving mechanism 340 disposed on the mounting plate 330. The moving mechanism 340 is connected to the wafer scanning mechanism 100 and is used to drive the wafer scanning mechanism 100 to move along a first direction (e.g., longitudinal direction). Optionally, the moving mechanism 340 includes a drive structure 341, a moving slide rail 342, and a moving slider 343.

[0140] The drive structure 341 includes, but is not limited to, a cylinder, a motor, etc. In this embodiment, the drive structure 341 is a cylinder.

[0141] The sliding rail 342 is set along a first direction (e.g., longitudinal direction).

[0142] The movable slider 343 is slidably connected to the movable slide rail 342. The support arm fixing plate 10 is fixed to the movable slider 343. The drive structure 341 is connected to the movable slider 343 to drive the movable slider 343 to slide along the movable slide rail 342 in a first direction (e.g., longitudinal direction) to drive the scanning mechanism 100 to move in the first direction (e.g., longitudinal direction).

[0143] Please see Figure 9 and Figure 10 The moving mechanism 340 also includes a first buffer 344 and a second buffer 345 located at both ends of the moving slide rail 342, for limiting and buffering the movement of the moving slider 343 along the moving slide rail 342.

[0144] Please see Figure 9 and Figure 10The moving mechanism 340 also includes a first detector 346 and a second detector 347 located on the mounting plate 330. The moving mechanism 340 also includes a sensing plate 348, which is fixed to the moving slider 343. When the moving slider 343 moves to one end of the moving slide rail 342, it abuts against the first buffer 344. The sensing plate 348 is located in the detection area of ​​the first detector 346, which feeds back the detection result to the controller so that the controller can obtain the current position of the moving slider 343 (scanning mechanism 100). When the moving slider 343 moves to the other end of the moving slide rail 342, it abuts against the second buffer 345. The sensing plate 348 is located in the detection area of ​​the second detector 347, which feeds back the detection result to the controller so that the controller can obtain the current position of the moving slider 343 (scanning mechanism 100).

[0145] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application, and such improvements and refinements are also considered to be within the protection scope of this application.

Claims

1. A scanning mechanism with a wiring spring, characterized in that, include: Outrigger mounting plate; A first arm is mounted on the arm fixing plate and is movable relative to the arm fixing plate. The first sensor is mounted on the first arm; A first wiring spring, one end of which is connected to the first support arm, and the other end of which is connected to the support arm fixing plate; and The first wiring has one end electrically connected to the first sensor, a portion of the first wiring connected to the first wiring spring, and the other end of the first wiring connected to the support arm fixing plate.

2. The scanning mechanism as described in claim 1, characterized in that, The first wiring spring includes a first fixing part, a first long arm, a second long arm, and a second fixing part connected in sequence. The first fixing part is fixed to the first support arm, the first long arm and the second long arm are bent and connected, and the second fixing part is fixed to the support arm fixing plate.

3. The scanning mechanism as described in claim 2, characterized in that, The angle between the first long arm and the second long arm is 120°-140°.

4. The scanning mechanism as described in claim 2, characterized in that, The first wiring spring further includes a helical portion, one end of which is connected to one end of the first long arm, and the other end of which is connected to one end of the second long arm.

5. The scanning mechanism as described in claim 2, characterized in that, A first portion of the first wiring is connected to the first long arm; and / or, a second portion of the first wiring is connected to the junction between the first long arm and the second long arm; and / or, a third portion of the first wiring is connected to the second long arm.

6. The scanning mechanism as described in claim 2, characterized in that, The scanning mechanism further includes at least one connector, which connects the first wire to the first wire spring; or, the first wire spring is provided with at least one connecting part, through which the first wire passes.

7. The scanning mechanism as described in claim 1, characterized in that, The scanning mechanism further includes a second arm, which is mounted on the arm fixing plate and is positioned opposite to the first arm. The second arm is equipped with a signal reflector, which is used to reflect the signal emitted by the first sensor.

8. The scanning mechanism as described in claim 1, characterized in that, The scanning mechanism further includes a second arm, a second sensor, a second wiring and a second wiring spring. The second arm is mounted on the arm fixing plate and is positioned opposite to the first arm. The second sensor is mounted on the second arm. One end of the second wiring spring is connected to the second arm, and the other end of the second wiring spring is connected to the arm fixing plate. One end of the second wiring is electrically connected to the second sensor, a portion of the second wiring is connected to the second wiring spring, and the other end of the second wiring is connected to the arm fixing plate.

9. The scanning mechanism as described in claim 1, characterized in that, The scanning mechanism further includes a scanning drive, a scanning slide rail, a scanning guide plate, and a follower. The scanning drive and the scanning slide rail are mounted on the support arm fixing plate. The scanning guide plate has a groove, the extension direction of which intersects the driving direction of the scanning drive and the extension direction of the scanning slide rail. The follower is mounted on the first support arm and slidably connected to the groove wall. When the scanning drive drives the scanning guide plate to move, the scanning guide plate drives the first support arm to move along the scanning slide rail via the follower.

10. A wafer inspection device with a scanning mechanism, characterized in that, Includes the scanning mechanism as described in any one of claims 1 to 9.

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