Heat dissipation device for server

Abstract

The utility model provides a heat dissipation device for a server, which relates to the technical field of server heat dissipation and comprises a condensation part, an evaporation part, a steam conveying pipe and a liquid conveying pipe. Wherein the evaporation part is installed on the heating unit and provided with a first cavity for containing a phase change working medium, and the phase change working medium is used for absorbing heat of the heating unit to be vaporized. The condensation part comprises a first shell and a heat conduction plate, a containing space is formed in the first shell, the heat conduction plate is installed in the first shell and divides the containing space into a second cavity and a third cavity, the third cavity communicates with the refrigeration unit and is filled with a cooling working medium, and a plurality of first heat conduction protrusions are formed on the two sides of the heat conduction plate. The steam conveying pipe and the liquid conveying pipe allow the phase change working medium to move back and forth between the first cavity and the second cavity, the contact area is increased through the first heat conduction protrusions, the vaporized phase change working medium is promoted to form turbulent flow, the heat transfer efficiency is improved, and the technical problem that an existing heat dissipation device cannot meet the heat dissipation requirement of a central processing unit running for a long time with high power consumption is solved.

Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, and in particular to a heat dissipation device for servers. Background Technology

[0002] A server is a high-performance computer and a core node in a network environment, responsible for storing, processing, and distributing massive amounts of data and critical services. With the rapid development of cloud computing, big data, artificial intelligence, and the Internet of Things (IoT), modern data centers place higher demands on the processing power, computing density, and reliability of servers. The form factor of servers has also evolved from early tower servers to space-saving rack servers, higher-density blade servers, and even rack-mount servers customized for hyperscale data centers. The performance of their core hardware components, including central processing units (CPUs), graphics processing units (GPUs), memory, and storage devices, has continuously increased, but so has the power consumption. This transforms servers from mere independent units performing computing tasks into complex information processing systems, whose stability, energy efficiency, and manageability directly determine the effectiveness of the entire information infrastructure.

[0003] Server cooling systems are critical subsystems that ensure the stable operation of internal electronic components within safe temperature ranges. Server cooling technology has evolved from forced air convection to the use of heat pipes and vapor chambers to enhance heat transfer for high-performance CPUs (Central Processing Units), and finally to liquid cooling. Liquid cooling, with its heat capacity thousands of times greater than air, can more efficiently dissipate high heat loads. Furthermore, cooling systems not only need excellent heat dissipation capabilities but also must consider noise and energy consumption control.

[0004] In related technologies, the peak power consumption of the central processing unit is about to exceed 550W, and the heat flux density will reach at least 230W / cm² while the chip size remains almost unchanged. 2 Traditional air-cooled heat dissipation, due to the low thermal conductivity of air, has a heat flow bottleneck of approximately 150 W / cm². 2Forcibly increasing heat exchange performance would result in a bulky and complex device, requiring solutions for noise and dust accumulation. While water cooling can generally meet cooling needs, its maintenance costs are high, and replacing the CPU or upgrading is cumbersome and has low reusability. Furthermore, there are precedents for using gravity heat pipes in conjunction with air cooling. Although this utilizes the phase change of the working fluid and its transport within the gravity heat pipe to provide redundancy for server cooling—for example, during low-power operation of the CPU, a small portion of the working fluid evaporates and condenses back quickly, ensuring sufficient liquid working fluid reserves; and during near-peak power operation, the accumulated liquid working fluid rapidly evaporates to cool the server, while the evaporated gaseous working fluid continuously condenses back to replenish it—the limitations of air cooling mean that prolonged high-power operation can lead to insufficient condensation backflow to compensate for the evaporation rate. Therefore, providing a cooling device with high-efficiency circulating cooling and long-term stable operation is a pressing technical problem that needs to be solved. Utility Model Content

[0005] This invention provides a heat dissipation device for servers, which at least solves the problem that heat dissipation devices in related technologies cannot meet the heat dissipation requirements of central processing units that operate at high power consumption for extended periods.

[0006] This utility model provides a heat dissipation device for a server, comprising: an evaporation section, installed on a heating unit and having a first chamber for containing a phase change working fluid, the phase change working fluid being suitable for absorbing heat from the heating unit and vaporizing; a condensation section, comprising: a first shell with an internally formed receiving space; and a heat-conducting plate, installed in the first shell and dividing the receiving space into a second chamber and a third chamber, the third chamber being connected to a cooling unit and filled with a cooling working fluid, the heat-conducting plate having multiple first heat-conducting protrusions formed on both sides; a vapor supply pipe for the vaporized phase change working fluid to flow to the second chamber for heat exchange and condensation with the cooling working fluid through the first heat-conducting protrusions; and a liquid supply pipe for the condensed phase change working fluid to flow back to the first chamber.

[0007] This invention utilizes the phase change cycle of the phase change working fluid to transfer heat from the heating unit to the cooling unit, achieving continuous cooling of the heating unit. This significantly reduces the risk of leakage, and the device can be removed or installed as a whole for convenient operation. By using a heat-conducting plate and a first heat-conducting protrusion as the heat transfer medium, the contact area is significantly increased, and the flow field of the gaseous phase change working fluid in the second chamber can be adjusted, effectively improving the efficiency of exothermic condensation. This results in a significantly increased condensation reflux rate of the gaseous phase change working fluid, meeting the heat dissipation requirements for long-term, high heat flux density applications. Attached Figure Description

[0008] To more clearly illustrate the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A three-dimensional structural diagram of a heat dissipation device for a server provided in an embodiment of this utility model;

[0010] Figure 2 A plan view of a heat dissipation device for a server provided in an embodiment of this utility model;

[0011] Figure 3 A cross-sectional perspective view of a heat dissipation device for a server provided in an embodiment of this utility model;

[0012] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;

[0013] Figure 5 Three-dimensional structural diagrams of two embodiments of the cross clamp for a server heat dissipation device provided in this utility model embodiment;

[0014] Figure 6 A partial exploded view of a heat dissipation device for a server provided in an embodiment of this utility model;

[0015] Figure 7 A partial perspective view of a heat dissipation device for a server provided in an embodiment of the present invention shows an infusion pipe, a steam infusion pipe, and a first housing;

[0016] Figure 8 A cross-sectional perspective view of the evaporator section of a heat dissipation device for a server provided in an embodiment of this utility model.

[0017] In the accompanying drawings, the meanings of the reference numerals are as follows:

[0018] 1. Condensation section;

[0019] 11. Heat-conducting plate;

[0020] 111. First thermally conductive protrusion;

[0021] 12. Second chamber;

[0022] 13. Third chamber;

[0023] 14. First shell;

[0024] 141. The first opening;

[0025] 2. Evaporation section;

[0026] 21. First chamber;

[0027] 22. Second shell;

[0028] 23. Second thermally conductive protrusion;

[0029] 3. Steam transmission pipeline;

[0030] 31. Steam nozzle;

[0031] 32. Cross-shaped clamp;

[0032] 4. Infusion tubing;

[0033] 41. The second opening;

[0034] 5. Heating unit;

[0035] 6. Refrigeration unit. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. The terms "installed," "connected," and "joined" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similar situations is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] Figure 1 This is a perspective structural diagram of a heat dissipation device for a server provided in an embodiment of the present invention. Figure 2 This is a plan view of a heat dissipation device for a server provided in an embodiment of the present invention. Figure 3 This is a cross-sectional perspective view of a heat dissipation device for a server provided in an embodiment of the present invention. Figure 4 for Figure 3 A magnified view of a portion of point A in the middle.

[0040] An embodiment of this utility model provides a heat dissipation device for a server, such as... Figures 1 to 4As shown, the system includes a condenser section 1, an evaporator section 2, a vapor delivery pipe 3, and a liquid delivery pipe 4. The evaporator section 2 is installed in the heating unit 5 and has a first chamber 21 for containing a phase change working fluid, which is suitable for absorbing heat from the heating unit 5 and vaporizing. The condenser section 1 includes a first housing 14 and a heat-conducting plate 11. The first housing 14 forms an internal receiving space, and the heat-conducting plate 11 is installed inside the first housing 14, dividing the receiving space into a second chamber 12 and a third chamber 13. The third chamber 13 is connected to the refrigeration unit 6 and filled with a cooling working fluid. Multiple first heat-conducting protrusions 111 are formed on both sides of the heat-conducting plate 11. The vapor delivery pipe 3 supplies the vaporized phase change working fluid to flow to the first chamber 21 for heat exchange and condensation with the cooling working fluid through the first heat-conducting protrusions 111. The liquid delivery pipe 4 supplies the condensed phase change working fluid to flow back to the first chamber 21.

[0041] In this embodiment, good heat conduction can be achieved between the evaporation section 2 and the heating unit 5. The liquid phase change working fluid is stored in the first chamber 21 of the evaporation section 2. The phase change working fluid gradually vaporizes by absorbing heat from the heating unit 5 through the evaporation section 2 and flows to the condensation section 1 through the steam pipe 3. Specifically, the first shell 14 and the heat-conducting plate 11 define two non-communicating second chambers 12 and third chambers 13. The third chamber 13 is continuously supplied with cooling working fluid by the refrigeration unit 6. The first heat-conducting protrusion 111 is in contact with both the cooling working fluid and the vaporized phase change working fluid. The vaporized phase change working fluid enters the second chamber 12, gradually condenses by releasing heat to the cooling working fluid through impact with the heat-conducting plate 11 and the first heat-conducting protrusion 111, and flows back to the condensation section 1 through the liquid pipe 4. This increases the contact area during condensation, improves the heat transfer coefficient, and effectively enhances the exothermic condensation efficiency. This allows for the continuous return of heat from the absorbing heating unit 5, increasing the condensation reflux rate. Even when the heating unit 5 is nearing its peak power consumption, with high heat flux density and rapid evaporation of the liquid phase change working fluid, it can still be replenished in a timely manner. Furthermore, the device has a low structural complexity, occupies little space, and is easy to install and arrange.

[0042] According to an embodiment of the present invention, in a server, the heating unit 5 includes, but is not limited to, a CPU (central processing unit) or a GPU (graphics processing unit), and the evaporation part 2 is preferably installed on the heating unit 5 by press-fitting.

[0043] In some preferred embodiments, such as Figure 4 As shown, the first heat-conducting protrusions 111 are symmetrically arranged on both sides of the heat-conducting plate 11 and are distributed in an array.

[0044] According to an embodiment of this utility model, a plurality of positioning holes are provided on the heat-conducting plate 11 in an array, and the first heat-conducting protrusion 111 is disposed through the positioning holes and fixed to the heat-conducting plate 11 by welding. At this time, a part of the first heat-conducting protrusion 111 is located in the third chamber 13 and immersed in the cooling working medium, and the other part is located in the second chamber 12.

[0045] In some preferred embodiments, the surface of the first thermally conductive protrusion 111 is plated with a pure tin layer with a thickness of approximately 0.1 mm to 0.2 mm to enhance liquid spreading ability.

[0046] In some other embodiments, the first heat-conducting protrusion 111 may be asymmetrically arranged on both sides of the heat-conducting plate 11 to reduce uneven heat exchange and heat accumulation.

[0047] In this embodiment, the heat-conducting plate 11 and the first heat-conducting protrusion 111 are preferably made by integral casting.

[0048] In some alternative embodiments, the cooling unit 6 in the server includes, but is not limited to, a CDU (coolant distribution unit) which is capable of pumping coolant into the third chamber 13 and recovering coolant from the third chamber 13, so that the coolant is continuously circulated and absorbs the heat of the vaporized phase change fluid.

[0049] For example, the phase change working fluid includes, but is not limited to, pure water, ammonia or acetone, and the cooling working fluid includes, but is not limited to, pure water, dielectric coolant or ethylene glycol solution.

[0050] In one exemplary embodiment, such as Figures 1 to 3 As shown, the liquid delivery pipe 4 is sleeved outside the steam delivery pipe 3, and the inner wall of the liquid delivery pipe 4 and / or the outer wall of the steam delivery pipe 3 form a spiral channel extending along the flow direction of the phase change working fluid, so as to assist the condensed phase change working fluid to flow back to the first chamber 21 through capillary action.

[0051] In this implementation, the nested arrangement of the liquid inlet pipe 4 and the steam inlet pipe 3 effectively saves space, allowing for the arrangement of more sets of liquid inlet pipe 4-steam inlet pipe 3 sleeve structures. The nested liquid inlet pipe 4 and steam inlet pipe 3 define a roughly annular flow channel for the flow of the condensed phase change working fluid. Furthermore, the spiral channel forms a continuous network of microchannels. When the condensed liquid phase change working fluid enters this spiral channel, significant capillary force is generated due to the surface tension of the liquid, thereby driving the condensed liquid phase change working fluid to overcome flow viscous resistance and flow towards the evaporation section 2. Moreover, the spiral channel makes the flow of the condensed liquid phase change working fluid smoother, reduces the generation of flow resistance, and has little impact on the strength of the steam inlet pipe 3 or the liquid inlet pipe 4. Compared to the traditional dual-pipe system, it saves space and is easy to arrange multiple sets (nested steam pipe 3 and liquid pipe 4 form one set); compared to the simple single-pipe system, it can avoid interference between liquid and gaseous phase change working fluids during their phase-to-phase movement and minimize heat exchange between them.

[0052] In some preferred embodiments, the steam pipe 3 is made of heat-insulating material to prevent the heat of the vaporized phase change working fluid from leaking to the condensed phase change working fluid. Furthermore, spiral channels are formed on the outer wall of the liquid pipe 4 to prevent heat leakage caused by an increased contact area between the condensed phase change working fluid and the steam pipe 3.

[0053] In some alternative embodiments, the steam pipe 3 and the liquid pipe 4 are preferably cylindrical pipes, which facilitates the fabrication of the spiral channel and the flow of the condensed liquid phase change working fluid. Square pipes can also be used, which have higher structural stability and avoid damage caused by external impacts.

[0054] According to an embodiment of this utility model, the steam pipe 3 is a copper pipe with an inner diameter of 3-5 mm. The inner wall of the copper pipe is electrolytically polished, and the roughness Ra is ≤0.8 micrometers, which reduces the resistance encountered by the vaporized phase change working fluid during flow.

[0055] In some other embodiments, a gap is left between the inner wall of the infusion pipe 4 and the steam pipe 3, so that the condensed phase change working fluid can flow along the spiral channel and the annular axial channel at the same time, in order to avoid the spiral channel from being accidentally blocked and causing the condensed phase change working fluid to be unable to flow back normally. The gap is preferably 1-1.5 mm.

[0056] Figure 5 The three-dimensional structural diagrams show two embodiments of the cross clamp for a server heat dissipation device provided in this utility model.

[0057] According to an embodiment of this utility model, when there is a gap between the infusion tube 4 and the steam infusion tube 3, the gap between the infusion tube 4 and the steam infusion tube 3 is achieved by setting as follows: Figure 5 The annular cross clamp 32 shown provides support. The cross clamp 32 is fitted onto the outer wall of the steam pipe 3 and abuts against the inner wall of the liquid pipe 4 to ensure structural stability. Figure 5 (a) shows a cross clamp 32 suitable for tubing. Figure 5 (b) shows the cross clamp 32 for fitting a round pipe.

[0058] In some optional embodiments, the spiral channel has a groove depth of 0.1-0.3 mm (the groove depth is the depth of the indentation on the inner wall of the infusion tube 4), a spiral angle of 10°-20°, preferably 15°, and a groove density of 40-60 grooves / cm (i.e., 40-60 grooves are formed per centimeter along the extension direction of the infusion tube 4).

[0059] According to embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the height of the condenser section 1 is higher than the height of the evaporator section 2.

[0060] In such an implementation, such as Figure 1 and Figure 2 As shown, with the evaporation section 2 as the reference horizontal plane, the condensation section 1 is positioned higher than the evaporation section 2. The steam pipe 3 and the liquid pipe 4 are both segmented, with one segment extending horizontally and the other vertically. The vaporized phase change working fluid generated in the evaporation section 2 rises along the steam pipe 3 under the influence of pressure difference, while the condensed phase change working fluid generated in the condensation section 1 flows back to the evaporation section 2 under the combined drive of gravity and capillary force. This thermosiphon effect, based on density and height differences, effectively enhances the circulation rate and volume of the phase change working fluid, improving the heat transfer capacity of the heat dissipation device. It avoids the permeability decay problem present in traditional sintered capillary cores, providing a basis for extending the length of the steam pipe 3 and the liquid pipe 4.

[0061] In some optional embodiments, the steam pipe 3 and the liquid pipe 4 can also be designed as multi-segment pipes. Taking the steam pipe 3 as an example, the portion that connects to the condenser section 1 and the evaporator section 2 extends horizontally, and the intermediate transition portion forms an acute angle with the horizontal plane. The liquid pipe 4 is sleeved on the outside of the steam pipe 3, and its segmentation method is roughly the same as that of the steam pipe 3, which will not be described in detail here.

[0062] In some optional embodiments, the angle between the inclined transition portion and the horizontal plane is preferably 5°-30°.

[0063] In some preferred embodiments, the height difference between the condenser section 1 and the evaporator section 2 ranges from 80 mm to 150 mm, preferably 120 mm.

[0064] According to a further embodiment of the present invention, the gravity head generated by the height difference between the condenser section 1 and the evaporator section 2 is P, the capillary head generated by the spiral channel is ΔP, and P / (P+ΔP)≥65%.

[0065] In this implementation, the gravity head P generated by the height difference is stable and almost attenuates. Driven by both gravity and capillary force, the gravity head P becomes dominant through a collaborative design, while the capillary head ΔP serves as an auxiliary and redundant force. This ensures the transmission capacity of the infusion tube 4 and overcomes the transmission distance limitation inherent in simple capillary drive. Furthermore, since the gravity head P is dominant, the capillary structure (such as the spiral channel in the above embodiment) can be optimized more effectively in terms of flow resistance, process, and cost, without needing to focus on increasing the driving force of the capillary structure.

[0066] More specifically, the gravity head P is calculated using the formula P=ρgh, where ρ is the density of the phase change working fluid (in its liquid state after condensation), g is the gravitational acceleration, and h is the height difference between the condensation section 1 and the evaporation section 2.

[0067] In some optional embodiments, the calculation of the capillary head ΔP can be determined according to different capillary structures. Taking the spiral channel in the above embodiment as an example, it can be calculated by the formula ΔP=(2σcosθ) / r, where σ is the surface tension of the phase change working fluid (generally obtained through experimental measurement), θ is the contact angle between the phase change working fluid and the spiral channel, and r is the effective capillary radius of the spiral channel, which can be approximately equal to the channel opening width or channel radius.

[0068] It should be noted that the above calculation method for capillary head ΔP is only used as an example. Those skilled in the art can calculate the capillary head generated by commonly used capillary structures, such as pipes, spiral grooves, or porous coatings with a small inner diameter that can directly generate capillary action. The purpose of the embodiments of this utility model is to ensure the proportion of gravity head P through collaborative design and calculation.

[0069] Figure 6 This is a partial exploded view of a heat dissipation device for a server provided in an embodiment of the present invention. Figure 7 This is a partial perspective view of a heat dissipation device for a server provided in an embodiment of the present invention, showing an infusion pipe, a steam infusion pipe, and a first housing.

[0070] In one exemplary embodiment, such as Figure 6 and Figure 7 As shown, the steam pipe 3 has multiple steam nozzles 31 facing the second chamber 12.

[0071] In this implementation, multiple steam nozzles 31 form an ejector structure at the end of the steam pipe 3 that connects to the second chamber 12. The vaporized phase change working fluid is injected into the second chamber 12 through the steam nozzles 31, avoiding local flow dead zones and uneven heat transfer that might occur if the fluid is concentrated at a single point from the pipe opening. This allows the vaporized phase change working fluid to make full and uniform contact with the entire lower surface of the heat-conducting plate 11 and the multiple first heat-conducting protrusions 111, improving the utilization rate and efficiency of the condensation heat exchange area. Furthermore, the vaporized phase change working fluid ejected from the steam nozzles 31 generates strong turbulence and disturbance within the second chamber 12, effectively disrupting the stagnant liquid film boundary layer formed on the heat exchange surface during condensation. This significantly reduces the liquid film thermal resistance through jet impact, thereby enhancing the heat transfer coefficient between the steam and the condensation wall, accelerating the condensation rate, and improving the heat transport capacity of the entire phase change cycle.

[0072] In some preferred embodiments, a plurality of steam nozzles 31 are evenly spaced along the extension direction of the steam pipe 3, and are directly machined on the steam pipe 3 using processes such as drilling or laser processing, thus saving manufacturing costs. For example, the diameter of the steam nozzles 31 is preferably 0.8 mm.

[0073] According to embodiments of the present invention, such as Figure 6 and Figure 7 As shown, a first opening 141 is formed at the bottom of the first housing 14, and a second opening 41 is formed in the infusion tube 4, which communicates with the first opening 141. After the vaporized phase change working fluid is ejected from the steam nozzle 31, it enters the second chamber 12 through the second opening 41 and the first opening 141.

[0074] In this embodiment, the first opening 141 and the second opening 41 are aligned vertically to form a channel for the vaporized phase change working fluid to enter the second chamber 12, and the size of the first opening 141 and the second opening 41 is sufficient to cover multiple steam nozzles 31. More specifically, see... Figure 7 As shown, the end face of the second opening 41 of the infusion tube 4 is at the same height as the steam nozzle 31 of the steam infusion tube 3, and is close to the bottom surface of the first housing 14 and roughly aligned with the first opening 141 to facilitate welding or sealing.

[0075] In one exemplary embodiment, such as Figure 4 and Figure 6 As shown, the first heat-conducting protrusion 111 extends in a direction perpendicular to the heat-conducting plate 11, and has a circular cross-section.

[0076] In this implementation, based on a circular cross-section, the shape of the first thermally conductive protrusion 111 includes, but is not limited to, a cylinder, a cone, or a spindle shape. For the same volume or the same amount of material, the three-dimensional structure formed by the circular cross-section can provide a larger heat exchange area. Furthermore, the arc-shaped surface facilitates the rapid sliding of the condensing phase change working fluid under gravity, preventing liquid film thickening or stagnation at the corners.

[0077] In some preferred embodiments, the first thermally conductive protrusion 111 is a cylinder with a diameter of 1 mm and a height of 3.5 mm, and the spacing between adjacent first thermally conductive protrusions 111 is 3 mm.

[0078] Figure 8 A cross-sectional perspective view of the evaporator section of a heat dissipation device for a server provided in an embodiment of this utility model.

[0079] In one exemplary embodiment, such as Figure 1 , Figure 3 and Figure 8 As shown, the evaporation section 2 includes a second housing 22, which is in thermal contact with the heating unit 5 and defines a first chamber 21. A plurality of second heat-conducting protrusions 23 are arranged in an array on the inner bottom wall of the second housing 22.

[0080] In this embodiment, the bottom surface of the second housing 22 forms thermal contact with the heating unit 5 through a heat-conducting medium, thereby introducing and transferring the heat from the heating unit 5 to the second heat-conducting protrusion 23. The second heat-conducting protrusion 23 is immersed in the phase change working fluid to significantly increase the contact area, improve the heat transfer efficiency, and promote the heat absorption and vaporization (or evaporation) of the phase change working fluid.

[0081] In some alternative embodiments, an opening is formed at the top of the second housing 22, and the ends of the vapor pipe 3 and the liquid pipe 4 near the second housing 22 are provided with connection ports that are roughly aligned with the opening, so as to form channels for the flow of vaporized phase change working fluid and condensed phase change working fluid.

[0082] In some alternative embodiments, the second housing 22 is mounted to the motherboard or server body by spring screws with a preload of 80-100N to ensure good thermal contact with the CPU or GPU.

[0083] According to embodiments of the present invention, such as Figure 8 As shown, the second heat-conducting protrusion 23 extends in a direction parallel to the inner bottom wall and has a triangular cross-section.

[0084] In this embodiment, taking a square shell as an example, the second thermally conductive protrusions 23 extend along the length of the square shell and are arranged in multiples at intervals along the width of the square shell. Furthermore, multiple second thermally conductive protrusions 23 are also arranged at intervals along the length to form an array. The array of parallel-extending second thermally conductive protrusions 23 constitutes a microchannel network, and the triangular cross-section design enhances the convective heat transfer between the phase change working fluid and the surfaces of the second thermally conductive protrusions 23, thereby improving heat transfer efficiency.

[0085] In some preferred embodiments, the plurality of second heat-conducting protrusions 23 arranged along the width direction are arranged in a row, and adjacent rows of second heat-conducting protrusions 23 are staggered by a predetermined distance along the width direction to increase the complexity of the distribution of the second heat-conducting protrusions 23 and avoid uneven heat transfer.

[0086] In some alternative embodiments, the second housing 22 is made of oxygen-free copper at least at its bottom, with a thickness of 5 mm, and the bottom is in thermal contact with the server's CPU or GPU via thermal grease. The second thermally conductive protrusion 23 has a triangular cross-section with a side length of 0.3 mm, an extension length of 1 mm, and a spacing of 0.15 mm between adjacent second thermally conductive protrusions 23.

[0087] According to a further embodiment of the present invention, the surface of the second thermally conductive protrusion 23 is coated with a porous material coating, which is suitable for increasing the contact area between the second thermally conductive protrusion 23 and the phase change working fluid.

[0088] In this implementation, the porous material contains a pore network structure and has a large specific surface area, which can significantly improve the heat exchange efficiency with the phase change working fluid. Furthermore, the porous material also has a certain capillary effect, enabling it to promptly pump the phase change working fluid to areas where vaporization (evaporation) is more intense.

[0089] In some preferred embodiments, the porous material coating is a sintered Al2O3 nanoporous coating with a thickness of 50±5 micrometers, a porosity of 60%-70%, and an average pore size of 0.5-1 micrometer. Al2O3 has good thermal conductivity, is an inert ceramic material, and does not react with commonly used phase change media (such as water and alcohols), ensuring that it will not experience performance degradation under long-term high-temperature environments and has high reliability. It also exhibits hydrophilicity, which is beneficial for heat exchange.

[0090] In some other embodiments, the condenser section 1 employs a double-stage seal, with an inner seal being a PTFE conical sealing ring and an outer seal being a fluororubber O-ring. The leakage detection circuit is integrated near the sealing surface. Specifically, the first housing 14 is made of PTFE and, in conjunction with a rubber gasket, two copper wires of the leakage detection circuit are embedded parallel to each other between the rubber gasket and the first housing 14. In the absence of leakage, the sealing surface is dry and insulated, and the resistance detected by the circuit approaches infinity. Upon leakage, the phase change working fluid or cooling working fluid permeates to the sealing surface, causing a decrease in resistance. When the detected resistance decreases by more than 5 ohms, a leakage is detected, and an audible and visual alarm signal is issued.

[0091] The above provides a detailed description of the article retrieval device provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core idea of ​​this utility model. It should be noted that those skilled in the art can make several improvements and modifications to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A heat dissipation device for a server, characterized in that, include: An evaporation section is installed on the heating unit and has a first chamber for containing a phase change working fluid, the phase change working fluid being suitable for absorbing heat from the heating unit and vaporizing. The condenser section includes: The first shell, with an internal cavity for receptacle; and A heat-conducting plate is installed inside the first housing and divides the accommodating space into a second chamber and a third chamber. The third chamber is connected to the refrigeration unit and filled with a cooling working fluid. Multiple first heat-conducting protrusions are formed on both sides of the heat-conducting plate. A steam pipe supplies the vaporized phase change working fluid to the second chamber for heat exchange and condensation with the cooling working fluid via the first thermally conductive protrusion; and An infusion tube is provided for the condensed phase change working fluid to flow back to the first chamber.

2. The heat dissipation device for a server according to claim 1, characterized in that, The infusion tube is sleeved outside the steam infusion tube, and the inner wall of the infusion tube and / or the outer wall of the steam infusion tube are formed with spiral channels extending along the flow direction of the phase change working fluid, so as to assist the condensed phase change working fluid to flow back to the first chamber through capillary action.

3. The heat dissipation device for a server according to claim 2, characterized in that, The height of the condenser section is higher than the height of the evaporator section.

4. The heat dissipation device for a server according to claim 3, characterized in that, The gravity head generated by the height difference between the condensation section and the evaporation section is P, and the capillary head generated by the spiral channel is ΔP, and P / (P+ΔP)≥65%.

5. The heat dissipation device for a server according to claim 3, characterized in that, The steam pipe has multiple steam nozzles facing the second chamber.

6. The heat dissipation device for a server according to claim 5, characterized in that, The bottom of the first housing has a first opening, and the infusion tube has a second opening that communicates with the first opening. After the vaporized phase change working fluid is ejected from the steam nozzle, it enters the second chamber through the second opening and the first opening.

7. The heat dissipation device for a server according to claim 1, characterized in that, The first heat-conducting protrusion extends in a direction perpendicular to the heat-conducting plate and has a circular cross-section.

8. The heat dissipation device for a server according to any one of claims 1-7, characterized in that, The evaporation section includes a second housing, which is in thermal contact with the heating unit and defines the first chamber. The inner bottom wall of the second housing is provided with a plurality of second heat-conducting protrusions arranged in an array.

9. The heat dissipation device for a server according to claim 8, characterized in that, The second heat-conducting protrusion extends in a direction parallel to the inner bottom wall and has a triangular cross-section.

10. The heat dissipation device for a server according to claim 9, characterized in that, The surface of the second thermally conductive protrusion is coated with a porous material coating, which is suitable for increasing the contact area between the second thermally conductive protrusion and the phase change working fluid.

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