Double-sided FPC fingerprint module

By adopting a double-sided gold finger design and adding a reinforcing plate and ground signal layer in the FPC fingerprint module, the width and area problems caused by the single-sided design are solved, resulting in a smaller and stronger FPC module.

CN223842436UActive Publication Date: 2026-01-27TRULY OPTO-ELECTRONICS TECH LTD
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Patent Information

Application Number
CN202520408043.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-10
Publication Date
2026-01-27
Estimated Expiration
2035-03-10

AI Technical Summary

Technical Problem

The gold fingers in existing FPC fingerprint modules are designed to be single-sided, resulting in a large FPC width and connector area, which affects the device size and space utilization.

Method used

The design employs a double-sided FPC with gold fingers on both sides. A reinforcing plate and a ground signal layer are added between the gold fingers to reduce the number of interfaces, increase strength and signal isolation, and reduce the width of the FPC and the area occupied by the connector.

Benefits of technology

With its double-sided design, the FPC width and connector footprint are reduced by nearly half, saving module and overall space, improving installation convenience and service life, and enhancing signal isolation and impedance matching.

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Abstract

The utility model discloses a double-sided FPC fingerprint module. The double-sided FPC fingerprint module comprises a fingerprint module assembly, an FPC board, golden fingers and an auxiliary assembly, one end of the FPC board is electrically connected with the fingerprint module assembly; the golden fingers are electrically connected with the other end of the FPC board, and the golden fingers are mounted on the two surfaces of the end part of the FPC board; the auxiliary assembly comprises a reinforcing plate arranged in the middle of the FPC board and a ground signal layer arranged between the two golden fingers, and the positions, corresponding to the golden fingers, of the two sides of the reinforcing plate are covered with the ground signal layer; according to the utility model, through the double-sided design, the number of interfaces on each surface is reduced by half, so that the occupied FPC width is reduced by nearly half, and when the FPC golden finger is connected with a complete machine mainboard, only the upper and lower surfaces need to be in contact with the connector, so that the space of a module and the complete machine is saved, the size and size of the connector are reduced, and the reinforcing plate can increase the strength of the golden finger; the ground signal layer plays a role in signal isolation between the golden fingers on the two sides and signal impedance matching of the golden fingers on the single side.
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Description

Technical Field

[0001] This utility model relates to the field of fingerprint module technology, and in particular to a double-sided FPC fingerprint module. Background Technology

[0002] Currently, most mobile phones, tablets, and other devices are equipped with fingerprint recognition technology. The function of fingerprint recognition has evolved from simply unlocking the device to now encompassing unlocking, payment, and launching various applications, providing convenience for users while also protecting user information security. The foundation of fingerprint recognition technology is fingerprint acquisition, which is typically performed using a fingerprint recognition module. This module includes a fingerprint module, an FPC (Flexible Printed Circuit), and a gold finger electrically connected to the FPC.

[0003] A display module structure for an under-display fingerprint sensor on an LCD screen, disclosed in publication number CN215378979U, includes an LCD module FPC. A fingerprint module FPC is fastened to the LCD module FPC via connectors. An under-display fingerprint module is installed on the fingerprint module FPC, enabling the LCD module FPC and the fingerprint module FPC to be fastened together for easy assembly and disassembly. This is mainly achieved by setting gold fingers on the FPC to connect to the motherboard for signal transmission. For mobile phones and consumer products that prioritize small sizes, the size requirements for fingerprint modules are becoming increasingly smaller. Existing FPCs typically have single-sided gold fingers, as shown in the attached manual. Figure 1 As shown, the single-sided gold finger design structure has a large number of interfaces, so it occupies a large FPC width. When this FPC gold finger is connected to the motherboard, a connector with many interfaces is required. Therefore, the connector also occupies a large area on the motherboard, affecting the size of the motherboard and the size of the device connected to it. Utility Model Content

[0004] Based on this, it is necessary to provide a double-sided FPC fingerprint module to address the aforementioned technical problems. Through the double-sided design, the number of interfaces on each side is reduced by half, thus reducing the occupied FPC width by nearly half. When the FPC gold fingers connect to the motherboard, only the top and bottom surfaces need to contact the connector, reducing its size by nearly half. Consequently, the area occupied by the connector on the motherboard is also reduced by nearly half, thereby saving module and overall machine space, which is conducive to miniaturization and precision. The reinforcing plate can increase the strength at the gold fingers, facilitating the insertion of the gold fingers and connectors. A ground signal layer is added between the double-sided gold fingers to isolate the signals between the two sides of the gold fingers and to match the signal impedance of the single-sided gold fingers.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A double-sided FPC fingerprint module, comprising:

[0007] Fingerprint module components;

[0008] An FPC board, one end of which is electrically connected to the fingerprint module assembly;

[0009] Gold fingers, which are electrically connected to the other end of the FPC board, and gold fingers are installed on both sides of the end of the FPC board;

[0010] The auxiliary component includes a reinforcing plate placed in the middle of the FPC board and a ground signal layer placed between two gold fingers. The reinforcing plate is covered with a ground signal layer on both sides corresponding to the gold fingers.

[0011] In a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, the reinforcing plate is made of FR4 material, the thickness of the reinforcing plate is 0.1mm-0.2mm, and the reinforcing plate is arranged along the length direction of the FPC plate.

[0012] In a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, both sides of the reinforcing plate are covered with an insulating separator layer, the thickness of which is 0.05mm-0.1mm.

[0013] As a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, the FPC board includes a flexible insulating layer and conductive layers disposed on both sides of the flexible insulating layer, and the outer layer of the conductive layer is coated with an insulating covering layer.

[0014] In a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, the two ends of the conductive layer are electrically connected to the corresponding fingerprint module components and the gold fingers, respectively.

[0015] In a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, the reinforcing plate is placed in the flexible insulating layer, and the two sides of the reinforcing plate are provided with a rough texture layer.

[0016] In a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, a plurality of heat-conducting cylinders are vertically arranged through the FPC board, and the heat-conducting cylinders are arranged through the reinforcing plate.

[0017] In a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, the two ends of the heat-conducting cylinder are provided with rolled edges, and the rolled edges are placed on the outside of the corresponding conductive layer.

[0018] In a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, the insulating covering layer penetrates into the inner and outer rings of the heat-conducting cylinder, and the multiple heat-conducting cylinders are distributed in the middle region of the FPC board.

[0019] In a preferred embodiment of the double-sided FPC fingerprint module provided by this utility model, the thickness of the insulating cover layer is 12.5μm-50μm.

[0020] Compared with the prior art, this utility model has the following beneficial effects: By setting gold fingers on both sides of the FPC board, unlike the traditional single-sided FPC gold finger design, the number of interfaces on the FPC board with the same width can be increased, thereby reducing the width of the FPC board and simultaneously reducing the width of the connector connected to the gold fingers. When the FPC gold fingers are connected to the motherboard, only the top and bottom contacts of the connector are needed, reducing the size by nearly half. Therefore, the area occupied by the connector on the motherboard is also reduced by nearly half, thus saving module and overall space, which is conducive to miniaturization and precision. When the width of the FPC board is reduced, the reinforcing plate can increase the strength at the gold fingers, making it easier for the gold fingers to be inserted into the connector, and increasing the strength of the non-bending area of ​​the FPC board, thus increasing the service life of the FPC board. Adding a ground signal layer between the double-sided gold fingers plays the role of signal isolation between the two sides of the gold fingers and signal impedance matching of the single-sided gold fingers. Attached Figure Description

[0021] To more clearly illustrate the solutions in this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the front and back structures of a fingerprint module in the prior art;

[0023] Figure 2 A front structural diagram of this utility model;

[0024] Figure 3 A schematic diagram of the reverse side structure provided by this utility model;

[0025] Figure 4 A cross-sectional view of the FPC board provided by this utility model;

[0026] Figure 5 This is a schematic diagram showing the position of the heat-conducting cylinder in the FPC board provided by this utility model.

[0027] The markings in the diagram are explained as follows:

[0028] 1. Fingerprint module assembly; 2. FPC board; 3. Gold fingers; 4. Flexible insulating layer; 5. Reinforcing plate; 6. Insulating separator layer; 7. Conductive layer; 8. Insulating cover layer; 9. Heat-conducting cylinder; 10. Rolled edge. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0030] As described in the background section, the gold fingers on existing FPCs are usually single-sided. Due to the large number of interfaces, they occupy a large width of FPC. When connecting the FPC gold fingers to the motherboard, a connector with many interfaces is required. As a result, the connector also occupies a large area on the motherboard, affecting the size of the motherboard and the size of the device connected to it.

[0031] To solve this technical problem, this utility model provides a double-sided FPC fingerprint module, which is applied in the field of fingerprint module technology.

[0032] For details, please refer to Figures 2-4 A double-sided FPC fingerprint module includes a fingerprint module assembly 1, an FPC board 2, gold fingers 3, and auxiliary components. The fingerprint module assembly 1 is a common fingerprint module assembly 1 used for collecting fingerprint information in the art, which is prior art. The working principle and specific structure of the present application will not be described in detail. One end of the FPC board 2 is electrically connected to the fingerprint module assembly 1, and the gold fingers 3 are electrically connected to the other end of the FPC board 2. Gold fingers 3 are installed on both sides of the end of the FPC board 2. The auxiliary components include a reinforcing plate 5 placed in the middle of the FPC board 2 and a ground signal layer placed between the two gold fingers 3. The reinforcing plate 5 is covered with a ground signal layer on both sides corresponding to the gold fingers 3.

[0033] This utility model provides a double-sided FPC fingerprint module. By setting gold fingers 3 on both sides of the FPC board 2, unlike the traditional single-sided FPC gold finger 3 design, it can increase the number of interfaces of the FPC board 2 with the same width, thereby reducing the width of the FPC board 2. At the same time, it can reduce the width of the connector connected to the gold fingers 3. The double-sided design reduces the number of interfaces on each side by half, so the occupied FPC width is reduced by nearly half. When the FPC gold fingers 3 are connected to the motherboard, only the top and bottom contacts of the connector are needed, reducing the size by nearly half. Therefore, the area occupied by the connector on the motherboard is also reduced by nearly half, thus saving module and overall space, which is conducive to miniaturization and precision. When the width of the FPC board 2 is reduced, the reinforcing plate can increase the strength at the gold fingers 3, making it easier for the gold fingers 3 to be inserted into the connector, and increasing the strength of the non-bending area of ​​the FPC board 2, increasing the service life of the FPC board 2. A ground signal layer is added between the double-sided gold fingers 3, which plays a role in signal isolation between the two sides of the gold fingers 3 and signal impedance matching of the single-sided gold fingers 3.

[0034] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0035] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] Example 1

[0038] Please refer to Figures 2-4 A double-sided FPC fingerprint module includes a fingerprint module assembly 1, an FPC board 2, gold fingers 3, and auxiliary components. One end of the FPC board 2 is electrically connected to the fingerprint module assembly 1, and the gold fingers 3 are electrically connected to the other end of the FPC board 2. Gold fingers 3 are installed on both sides of the end of the FPC board 2. The FPC board 2 connects the gold fingers 3 and the fingerprint module assembly 1. The FPC board 2 has a certain degree of flexibility, which facilitates installation and connection, and improves the convenience of fingerprint module installation.

[0039] It is worth mentioning that the auxiliary components include a reinforcing plate 5 placed in the middle of the FPC board 2 and a ground signal layer placed between the two gold fingers 3. The reinforcing plate 5 is covered with a ground signal layer on both sides corresponding to the gold fingers 3. The reinforcing plate can increase the strength at the gold fingers 3, making it easier for the gold fingers 3 to be inserted into the connector, and also increasing the strength of the non-bending area of ​​the FPC board 2, thus increasing the service life of the FPC board 2. Adding a ground signal layer between the two gold fingers 3 serves to isolate the signal between the two gold fingers 3 and match the signal impedance of the single gold finger 3.

[0040] In addition, the reinforcing plate 5 is made of FR4 material and has a thickness of 0.1mm-0.2mm. The reinforcing plate 5 is arranged along the length of the FPC board 2 to provide a certain rigid support between the double-sided gold fingers 3, thereby facilitating the insertion of the gold finger 3 ends into the connector and improving the ease of installation. At the same time, it can increase the strength of the PCB board and improve the strength of the entire fingerprint module. Both sides of the reinforcing plate 5 are covered with an insulating separation layer 6, which has a thickness of 0.05mm-0.1mm. The insulating separation layer 6 can further separate the circuit parts on both sides of the FPC board 2, reduce the mutual interference of circuits, make the fingerprint module more stable, and reduce the probability of failure.

[0041] Example 2

[0042] The double-sided FPC fingerprint module provided in Embodiment 1 is further optimized, specifically, as follows: Figures 2-4 As shown, the FPC board 2 includes a flexible insulating layer 4 and conductive layers 7 placed on both sides of the flexible insulating layer 4. The flexible insulating layer 4 is made of polyimide or polyester and mainly provides flexible support and electrical insulation. The conductive layer 7 is made of rolled copper, which has good ductility and is suitable for dynamic bending. The two ends of the conductive layer 7 are electrically connected to the corresponding fingerprint module component 1 and the gold finger 3, respectively, for stable data transmission.

[0043] In addition, such as Figure 4 As shown, the outer layer of the conductive layer 7 is coated with an insulating cover layer 8. The insulating cover layer 8 has a thickness of 12.5μm-50μm and is composed of polyimide, polyester film, and adhesive. It serves to protect the circuit, prevent oxidation and mechanical damage to the copper foil of the conductive layer 7, and avoid short circuits. The reinforcing plate 5 is placed in the flexible insulating layer 4. The two sides of the reinforcing plate 5 are provided with a rough texture layer, which facilitates the stable installation of the reinforcing plate 5 in the FPC board 2, improves the adhesion between the two, reduces the possibility of separation, improves product quality, and ensures that the FPC board 2 can still maintain high strength even when the width is reduced.

[0044] Example 3

[0045] Further optimization of the double-sided FPC fingerprint module provided in Embodiment 1 or 2: Multiple heat-conducting cylinders 9 are vertically arranged through the FPC board 2, and the heat-conducting cylinders 9 penetrate the reinforcing plate 5. During data transmission, the heat on the FPC board 2 with double-sided conductive layers 7 and double-sided gold fingers 3 is relatively concentrated. The heat-conducting cylinders 9 can conduct heat, transferring it to the side with lower temperature when heat is concentrated on one side, thereby reducing heat concentration and improving the service life of the FPC board 2 with double-sided gold fingers 3. The heat-conducting cylinders 9 have rolled edges 10 at both ends, positioned on the outside of the corresponding conductive layers 7. The rolled edges 10 fix the two ends of the heat-conducting cylinders 9 to the FPC board 2, locking them together through physical connection, improving the overall structural stability and increasing the adhesion strength between different layers on the FPC board 2.

[0046] In addition, the insulating covering layer 8 penetrates into the inner and outer rings of the heat-conducting cylinder 9, and multiple heat-conducting cylinders 9 are distributed in the middle area of ​​the FPC board 2. While improving the heat dissipation capacity of the FPC board 2, it can also increase its strength and improve its service life.

[0047] The usage process of the double-sided FPC fingerprint module provided by this utility model is as follows: By setting gold fingers 3 on both sides of the FPC board 2, which is different from the traditional single-sided FPC gold finger 3 design, the number of interfaces of the FPC board 2 with the same width can be increased, thereby reducing the width of the FPC board 2 and simultaneously reducing the width of the connector connected to the gold fingers 3, saving module and overall space. When the width of the FPC board 2 is reduced, the reinforcing plate can increase the strength at the gold fingers 3, making it easier for the gold fingers 3 to be inserted into the connector, and increasing the strength of the non-bending area of ​​the FPC board 2, increasing the service life of the FPC board 2. A ground signal layer is added between the double-sided gold fingers 3, which plays the role of signal isolation between the two sides of the gold fingers 3 and signal impedance matching of the single-sided gold fingers 3.

[0048] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0049] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A double-sided FPC fingerprint module, characterized in that, It includes: Fingerprint module components; An FPC board, one end of which is electrically connected to a fingerprint module assembly; gold fingers, which are electrically connected to the other end of the FPC board, and gold fingers are installed on both sides of the end of the FPC board; an auxiliary component, which includes a reinforcing plate placed in the middle of the FPC board and a ground signal layer placed between two gold fingers, and ground signal layers are covered on both sides of the reinforcing plate corresponding to the gold fingers.

2. The double-sided FPC fingerprint module according to claim 1, characterized in that, The reinforcing plate is made of FR4 material, and its thickness is 0.1mm-0.2mm. The reinforcing plate is arranged along the length of the FPC plate.

3. A double-sided FPC fingerprint module according to claim 1, characterized in that, Both sides of the reinforcing plate are covered with an insulating separator layer, the thickness of which is 0.05mm-0.1mm.

4. A double-sided FPC fingerprint module according to claim 1, characterized in that, The FPC board includes a flexible insulating layer and conductive layers placed on both sides of the flexible insulating layer, and the outer layer of the conductive layer is coated with an insulating covering layer.

5. A double-sided FPC fingerprint module according to claim 4, characterized in that, The two ends of the conductive layer are electrically connected to the corresponding fingerprint module components and the gold finger, respectively.

6. A double-sided FPC fingerprint module according to claim 4, characterized in that, The reinforcing plate is placed in the flexible insulating layer, and the two sides of the reinforcing plate are provided with a rough texture layer.

7. A double-sided FPC fingerprint module according to claim 4, characterized in that, Multiple heat-conducting cylinders are vertically arranged through the FPC board, and the heat-conducting cylinders penetrate the reinforcing plate.

8. A double-sided FPC fingerprint module according to claim 7, characterized in that, The heat-conducting cylinder has rolled edges at both ends, and the rolled edges are positioned on the outside of the corresponding conductive layer.

9. A double-sided FPC fingerprint module according to claim 8, characterized in that, The insulating covering layer penetrates into the inner and outer rings of the heat-conducting cylinder, and multiple heat-conducting cylinders are distributed in the central area of ​​the FPC board.

10. A double-sided FPC fingerprint module according to claim 4, characterized in that, The thickness of the insulating covering layer is 12.5μm-50μm.

Citation Information

Patent Citations

  • Display module structure for fingerprints under LCD (liquid crystal display) screen

    CN215378979U