Heat dissipation device

Abstract

The utility model belongs to the technical field of laser equipment, and discloses a radiating device, which comprises a box body and a radiator, cooling liquid is loaded in the box body, and a stirring mechanism is arranged in the box body and used for promoting the cooling liquid to flow; the radiator is placed in the box body and comprises a vapor chamber used for placing a heat source and a shell arranged on the vapor chamber. Cooling liquid in the box body can be promoted to flow, and the problems of uneven heating, bubble heat insulation and the like are avoided.

Description

Technical Field

[0001] This utility model belongs to the field of laser equipment technology and discloses a heat dissipation device. Background Technology

[0002] With the development of the laser industry, laser optical power is increasing, and lasers are becoming smaller, lighter, and more integrated, placing increasingly higher demands on heat dissipation. However, traditional pure air cooling methods are no longer sufficient to meet these demands and cannot effectively dissipate heat from lasers with optical power exceeding 1000W. Therefore, some cooling devices incorporate water tanks to improve heat exchange efficiency, but this still cannot adequately meet the heat dissipation requirements. Utility Model Content

[0003] To address the aforementioned technical problems, this utility model discloses a heat dissipation device that can promote the flow of coolant in the housing and avoid problems such as uneven heating and heat insulation by air bubbles.

[0004] The specific technical solution of this utility model is as follows:

[0005] A heat dissipation device includes a housing and a radiator; the housing is filled with coolant and has a stirring mechanism to promote coolant flow; the radiator is placed in the housing and includes a heat spreader for placing a heat source and a housing disposed on the heat spreader.

[0006] This application involves preparing a sealed enclosure filled with coolant. Devices requiring high heat dissipation are immersed in this enclosure for cooling. A stirring mechanism agitates the coolant, promoting its flow and ensuring thorough mixing to prevent heat concentration. Alternatively, the device is placed in a heat sink, which is then immersed in the coolant. This allows the heat sink to dissipate heat first, followed by the coolant to further enhance cooling efficiency. The stirring mechanism also ensures the coolant flows within the enclosure, preventing uneven heating. Furthermore, when the coolant undergoes a liquid-gas phase change, bubbles generated around the heat sink are carried away by the flowing coolant, preventing slow heat dissipation due to air bubbles.

[0007] Preferably, the housing is provided with a condenser plate extending outward therefrom, the condenser plate having a cavity communicating with the housing, and the cavity being provided with fins.

[0008] When the coolant turns into gas, it enters the cavity of the condenser fins, absorbs heat through the condenser fins, and dissipates the heat released by the gas-liquid phase change into the air through the condenser fins. Then the gas re-condenses into liquid and returns to the housing by gravity. The fins can improve the heat exchange rate and facilitate the rapid condensation of gas into liquid.

[0009] Preferably, the outer side of the condenser plate is provided with four fins.

[0010] The heat released by the gas-liquid phase change is efficiently dissipated into the air through the fins, further improving the heat dissipation efficiency of the condenser.

[0011] Preferably, the housing and / or heat spreader are provided with heat dissipation fins.

[0012] The heat dissipation fins can increase the heat dissipation area and effectively improve heat dissipation efficiency.

[0013] Preferably, a safety valve is provided on the top of the housing to release pressure when the internal pressure of the housing exceeds a preset pressure.

[0014] When the internal air pressure of the enclosure exceeds the safe value that the shell can withstand, the internal gas is released through the safety valve to ensure system safety. At the same time, the release of heat to the outside also achieves emergency heat dissipation, thereby better ensuring the working effect of the device.

[0015] Preferably, it also includes a liquid replenishment device, which is connected to the water tank via a liquid replenishment pipe.

[0016] When the coolant in the enclosure is insufficient, it can be replenished using a coolant replenishment device to ensure the preset heat dissipation effect.

[0017] Preferably, it also includes a water level sensor and an alarm; the water level sensor is used to detect the liquid level in the tank, and the water level sensor is communicatively connected to the liquid replenishment device; the alarm is communicatively connected to the liquid replenishment device to issue an alarm message when the liquid replenishment device is low on coolant.

[0018] When the coolant replenishment device is low on coolant, the alarm will sound to prevent situations where the cabinet cannot be replenished when coolant is needed, thus avoiding overheating and damage to components due to insufficient coolant in the cabinet.

[0019] Preferably, the outer wall of the housing is made of copper or a copper alloy or aluminum or an aluminum alloy.

[0020] Preferably, the heat spreader is made of a high thermal conductivity composite material.

[0021] In the prior art, heat spreaders are generally made of copper, which has a low thermal conductivity and obvious heat concentration. In this application, a high thermal conductivity composite material is used in the heat spreader to further enhance the thermal conductivity of the metal material while meeting the requirements of miniaturization and lightweighting.

[0022] Preferably, the heat spreader and the shell are integrally sintered.

[0023] The structure is simple to form, easy to manufacture, and has low time cost.

[0024] Compared with existing technologies, this invention can achieve better heat exchange in a smaller volume by using a built-in stirring mechanism and facilitating liquid-gas phase change. Its heat exchange coefficient is 2 to 10 times that of conventional water tanks. Through the pressure relief valve, it can rapidly cool down in extreme cases. The fins in the condenser can also accelerate the gas-liquid phase change, realizing heat dissipation of high-power heating devices. This results in high cooling efficiency of the coolant, which is 2 to 10 times more effective than existing water cooling methods. In addition, this invention has high safety performance, is easy to carry, and has low energy consumption. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the heat dissipation device in an embodiment of this utility model;

[0026] Figure 2 for Figure 1 Cross-sectional view;

[0027] Figure 3 This is a schematic diagram of the heat sink in an embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the hidden cover plate in an embodiment of the present utility model;

[0029] Figure 5 This is a cross-sectional view of the condenser plate in an embodiment of this utility model.

[0030] In the diagram: 1-Heat spreader; 2-Shell; 21-Outer wall; 3-Phase change material; 4-Cover plate; 5-Chip; 6-Interface section; 7-Mounting section; 8-Fiber optic cable; 9-Fin 1; 10-Fin 2; 11-Box body; 12-Stirring mechanism; 13-Condenser; 14-Fin 4; 15-Safety valve; 16-Replenishment equipment; 17-Replenishment pipe; 18-Observation window; 19-Cable; 20-Fin 3. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to specific embodiments.

[0032] This embodiment can be used as a pump source for lasers, and also for internal resonant cavities, beam combiners, and other devices within lasers. For ease of explanation, this embodiment uses a heating device as the pump source.

[0033] like Figures 1-4 As shown, a heat dissipation device includes a housing 11 and a radiator; the housing 11 is filled with coolant and a stirring mechanism 12 is provided in the housing 11 to promote the flow of coolant; the radiator is placed in the housing 11 and includes a heat spreader 1 for placing a heat source and a housing 2 disposed on the heat spreader 1.

[0034] The housing 11 contains coolant and maintains a certain vacuum level. The pump source, after being treated for waterproofing and oil resistance, is placed in the radiator. When the pump source operates, the heat on its surface is promptly dissipated by the radiator, and the dissipated heat is carried away by the coolant in the housing 11. The vacuum level inside the housing 11 can be adjusted according to the boiling point of the coolant, allowing the coolant to undergo a liquid-gas phase change when it absorbs heat to a certain temperature, thereby carrying away a large amount of heat dissipated by the pump source through vaporization. During this process, the stirring mechanism 12 operates simultaneously, causing the coolant to flow within the housing 11 and preventing uneven heating. Simultaneously, when the coolant undergoes a liquid-gas phase change, bubbles generated around the radiator are promptly carried away by the flowing coolant, preventing slow heat dissipation due to bubbles. In this embodiment, the stirring mechanism 12 is configured as a stirring paddle or an internal circulating water pump. It is known that, to ensure the vacuum level, a hole is provided on the housing 11, on which a valve can be installed to adjust the vacuum level.

[0035] like Figure 1 and Figure 2 As shown, to further improve heat dissipation, the housing 11 is provided with condenser fins 13 extending outwards. Furthermore, as... Figure 5 As shown, the condenser 13 has a cavity communicating with the housing 11, and fins 20 are provided in the cavity. The condenser 13 is located above the housing 11, so when the coolant changes phase to gas, it can carry heat to the cavity of the condenser 13. Since fins 14 are also provided extending from the outside of the condenser 13, the fins 14 can improve the heat exchange capacity of the condenser 13, allowing the gas to quickly condense into liquid, and then flow back into the housing 11 under the action of gravity, thereby achieving coolant circulation while meeting high heat dissipation efficiency. Thus, this embodiment effectively controls the coolant within a safe temperature range through liquid-gas circulation, thereby ensuring heat dissipation effect. It should be noted that in this embodiment, multiple condenser 13s are arranged side by side, and the fins 14 extend along the arrangement direction of the condenser 13s. Any two adjacent condenser 13s can be connected by fins 14, or condenser 13s can be provided on both sides of each condenser 13. The fins 20 extend along a direction perpendicular to the arrangement of the condenser fins 13 to provide heat exchange space.

[0036] like Figure 1 and Figure 2As shown, to further improve the safety of this embodiment, a safety valve 15 is provided on the top of the housing 11 to release pressure when the internal pressure of the housing 11 exceeds a preset pressure. Furthermore, a liquid replenishment device 16 is also included, which is connected to the water tank via a liquid replenishment pipe 17. While the pressure relief provided by the safety valve 15 offers good safety and emergency cooling, it can also cause coolant loss. Therefore, this embodiment uses the liquid replenishment device 16 for liquid replenishment. At least a portion of the housing 11 is made of a transparent material, such as glass or transparent plastic, to form an observation window 18, allowing the user to observe the liquid level. When the liquid level is low, coolant can be added to the housing 11. Of course, this embodiment can also achieve automatic liquid replenishment. Therefore, this embodiment also includes a water level sensor and an alarm; the water level sensor is used to detect the liquid level in the housing 11 and is communicatively connected to the liquid replenishment device 16; the alarm is communicatively connected to the liquid replenishment device 16 to issue an alarm message when the liquid replenishment device 16 is low on coolant. The water level sensor can be a weight sensor or an infrared sensor. A weight sensor uses weight changes to indicate whether replenishment is needed, while an infrared sensor uses liquid level changes. Therefore, when replenishment is required, the water level sensor sends replenishment information to the replenishment device 16, thus meeting the replenishment demand. If the coolant in the replenishment device 16 is insufficient, an alarm can be triggered to alert the user, preventing heat loss from the pump source due to insufficient coolant.

[0037] like Figure 3 and Figure 4 As shown, in this embodiment, the housing 2 includes multiple outer walls 21 connected end-to-end, and at least one outer wall 21 is filled with a phase change material 3. The housing 2 has an annular structure, typically composed of multiple outer walls 21 connected end-to-end, and is sealed at the bottom by a heat spreader 1 and at the top by a cover plate 4, thereby allowing the pump source to be located inside the housing 2, as shown. Figure 4 As shown, in a preferred technical solution, the pump source is placed on the heat spreader 1, so that the heat emitted by the pump source can directly act on the heat spreader 1, thereby effectively absorbing the heat emitted by the heat source through the heat spreader 1. Specifically, the pump source chip 5 is directly placed on the heat spreader 1 and arranged in an array. Since at least one outer wall 21 is filled with phase change material 3, the phase change of the phase change material 3 under temperature difference can effectively achieve heat storage, thereby increasing the heat capacity of the heat source and playing a role in heat buffering, thus better avoiding heat concentration. Furthermore, as... Figure 4As shown, the outer wall 21 for filling the phase change material 3 has multiple filling cavities, and the phase change material 3 is encapsulated within these cavities. Furthermore, the heat dissipation fins of the housing 2 are located on the outer wall 21 filled with the phase change material 3. Specifically, in this embodiment, the housing 2 has a rectangular structure, with an interface portion 6 and a mounting portion 7 respectively provided on one pair of outer walls 21, and the other pair of outer walls 21 filled with the phase change material 3. The interface portion 6 is used to connect to the pump source for power connection; that is, the cable 19 can be connected to the pump source through the interface portion 6. The mounting portion 7 is used to install the optical fiber 8; that is, the optical fiber 8 is positioned and installed through the mounting portion 7 so that the pump source emits laser light from that location. It is known that both the cable 19 and the optical fiber 8 exit from the housing. In this embodiment, the phase change material 3 is an alkane-based phase change material.

[0038] like Figure 4 As shown, in this embodiment, the housing 2 and / or the heat spreader 1 are provided with heat dissipation fins. That is, in this embodiment, at least one of the housing 2 and the heat spreader 1 is provided with heat dissipation fins. In this embodiment, the housing 2 is provided with fin one 9, and the heat spreader 1 is provided with fin two 10. Fin one 9 forms wings facing both sides of the housing 2, and fin two 10 is formed on the heat spreader 1 facing away from the housing 2. Of course, fin two 10 can also be on the same side as the housing 2. Thus, the heat emitted by the chip 5 can be effectively dissipated directly through the heat spreader 1 and fin two 10, while heat is stored through the phase change material 3, and then dissipated even more efficiently through fin one 9.

[0039] In this embodiment, the outer wall 21 of the housing 2 is made of copper, copper alloy, aluminum, or aluminum alloy. Copper-aluminum alloy can effectively combine the advantages of lightweight and high heat dissipation. The heat spreader 1 is made of a high thermal conductivity composite material, which can be copper-diamond composite material, copper-carbon nanotube composite material, aluminum-diamond composite material, aluminum-graphene composite material, aluminum-silicon carbide composite material, aluminum-graphite composite material, carbon fiber-aluminum composite material, or carbon nanotube-aluminum composite material. Existing heat spreaders 1 are generally made of copper, which has a low thermal conductivity and obvious heat concentration. By using a high thermal conductivity composite material in the heat spreader 1, the heat exchange capacity of this embodiment is improved. This quickly dissipates the heat from the pump source chip 5, avoiding heat concentration. At the same time, compared with the conventional capillary liquid-gas heat spreader 1, the heat spreader 1 made of a high thermal conductivity composite material in this embodiment will not fail due to high acceleration.

[0040] To simplify the process, in this embodiment, the heat spreader 1 and the housing 2 are integrally sintered or welded. Specifically, a blank is obtained by integrally sintering or welding using a high thermal conductivity composite material through a mold. The blank is then machined to obtain the heat spreader 1 with the actual structure. The housing 2 is machined to form the filling cavity. The housing 2 and the heat spreader 1 are integrally sintered or welded together. Then, the pump source is placed in the housing 2, specifically, the chip 5 is placed on the heat spreader 1. Next, the phase change material 3 is injected, and finally, the fiber optic cable 8 is installed and connected to electricity. This forms the heat sink for the pump source of the laser.

[0041] The above are merely preferred embodiments of this utility model. It should be noted that the above preferred embodiments should not be considered as limitations on this utility model, and the scope of protection of this utility model should be determined by the scope defined in the claims. For those skilled in the art, several improvements and modifications can be made without departing from the spirit and scope of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A heat dissipation device, characterized in that, include: A housing containing coolant, and an agitation mechanism is provided in the housing to promote coolant flow; as well as A radiator, which is placed in a housing, includes a heat spreader for housing a heat source and a housing disposed on the heat spreader.

2. The heat dissipation device as described in claim 1, characterized in that, The housing extends outwards and is provided with condenser fins. The condenser fins have cavities that communicate with the housing and are provided with fins in the cavities.

3. A heat dissipation device as described in claim 2, characterized in that, The outer side of the condenser plate is provided with four fins.

4. A heat dissipation device as described in claim 1, characterized in that, The housing and / or heat spreader are provided with heat dissipation fins.

5. A heat dissipation device as described in claim 1, characterized in that, The top of the enclosure is equipped with a safety valve to release pressure when the internal pressure of the enclosure exceeds a preset pressure.

6. A heat dissipation device as described in claim 5, characterized in that, Also includes: A fluid replenishment device, which is connected to a water tank via a fluid replenishment pipe.

7. A heat dissipation device as described in claim 6, characterized in that, Also includes: A water level sensor is used to detect the liquid level in the tank, and the water level sensor is communicatively connected to the liquid replenishment device. as well as An alarm is provided, which is communicatively connected to the coolant replenishment device to issue an alarm message when the coolant replenishment device is low on coolant.

8. A heat dissipation device as described in claim 1, characterized in that, The outer wall of the shell is made of copper or copper alloy or aluminum or aluminum alloy.

9. A heat dissipation device as described in claim 1, characterized in that, The heat spreader is made of a high thermal conductivity composite material.

10. A heat dissipation device as described in claim 1, characterized in that, The heat spreader and the shell are integrally sintered.

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