Circuit board unit and electronic equipment

Abstract

The utility model provides a circuit board unit and electronic equipment, and relates to the technical field of electronics. The circuit board unit comprises a circuit board and a magnetic sleeving piece; the circuit board comprises a board body, a first connecting part is arranged on the board body, the magnetic sleeving piece comprises a second connecting part and a first via hole, the second connecting part is connected with the first connecting part, the first via hole is used for penetrating of a pin of an electronic element, and the board body is used for being electrically connected with the pin. According to the technical scheme, the magnetic sleeving piece can be connected and fixed to the circuit board in advance, then the electronic element is installed and fixed, assembling of the circuit board unit can be achieved, the risk that pins of the electronic element are not sleeved with the magnetic sleeving piece can be reduced, and the reliability of the circuit board unit is improved. In addition, the risk that the magnetic sleeving piece falls off due to vibration and the like when the electronic component is installed can be avoided, the possibility of missing of the magnetic sleeving piece can be reduced, and the yield of the assembled circuit board unit can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and more specifically, to a circuit board unit and an electronic device. Background Technology

[0002] When mounting electronic components, such as power transistors, onto a circuit board, it is usually necessary to place magnetic components, such as ferrite beads, on the pins of the power transistors. The magnetic field generated by the magnetic components is used to suppress the spike current of the power transistors, thereby reducing noise and electromagnetic interference.

[0003] The current practice is to first attach magnetic components to the pins of electronic components, and then connect the pins to the circuit board. However, this method carries the risk of missing magnetic components, such as not attaching them properly or letting them fall off the pins, which can affect the yield of the final assembled circuit board unit. Utility Model Content

[0004] This disclosure aims to address, to some extent, the issue of how to avoid missing magnetic components and improve the yield of circuit board units in related technologies.

[0005] To address at least one aspect of the aforementioned problems, in a first aspect, this disclosure provides a circuit board unit, including a circuit board and a magnetic socket; the circuit board includes a board body, on which a first connecting portion is provided, the magnetic socket includes a second connecting portion and a first via, the second connecting portion being connected to the first connecting portion, the first via being used for the passage of pins of electronic components, and the board body being used for electrical connection with the pins.

[0006] Optionally, the first connecting portion and the second connecting portion are welded together.

[0007] Optionally, the first connecting portion includes a first welding portion disposed on the side of the plate body facing the magnetic sleeve, and the second connecting portion includes a second welding portion disposed on the magnetic sleeve, wherein the first welding portion and the second welding portion are connected by solder welding.

[0008] Optionally, the first connecting portion and the second connecting portion are bonded together.

[0009] Optionally, the first connecting part and the second connecting part are detachably connected.

[0010] Optionally, the first connecting part includes a first connecting hole disposed in the plate body, and the second connecting part includes a second connecting hole disposed in the magnetic sleeve, wherein the first connecting hole and the second connecting hole are connected by fasteners;

[0011] Alternatively, one of the first connecting portion and the second connecting portion includes a locking hole, and the other of the first connecting portion and the second connecting portion includes a snap-fit ​​member, which passes through the locking hole and snaps into the locking hole.

[0012] Optionally, the board body is further provided with a second via, which is connected to the first via, and the pin passes through the second via and the first via and is electrically connected to the board body.

[0013] Optionally, the board body has a first pad on the side opposite to the magnetic sleeve, and the pin is connected to the first pad by solder.

[0014] Optionally, the magnetic socket is provided with a plurality of the first through holes;

[0015] At least two of the plurality of first vias are respectively used for the passage of different pins of the same electronic component, and / or at least two of the plurality of first vias are respectively used for the passage of pins of different electronic components.

[0016] In a second aspect, this disclosure provides an electronic device including a circuit board unit as described in the first aspect above.

[0017] In the circuit board unit and electronic device disclosed herein, the circuit board body is provided with a first connecting part. The connection between the first connecting part and the second connecting part of the magnetic socket can fix the magnetic socket in position on the circuit board. The magnetic socket is provided with a first through hole. By passing the pins of the electronic components through the first through hole and electrically connecting the pins to the circuit board body, the circuit board unit can be assembled from the circuit board, the magnetic socket, and the electronic components. In other words, the magnetic socket can be pre-connected and fixed to the circuit board, and then the electronic components can be installed and fixed to achieve the assembly of the circuit board unit. This can reduce the risk of missing magnetic socket pins of electronic components and avoid the risk of the magnetic socket falling off due to vibration or other reasons during the installation of electronic components. The technical solution disclosed herein can reduce the possibility of missing magnetic sockets and improve the yield of the assembled circuit board unit. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the circuit board unit in the first embodiment of the present disclosure when the circuit board, magnetic socket and electronic components are in a separated state;

[0019] Figure 2 This is a schematic diagram of the circuit board unit in the first embodiment of the present disclosure, where the circuit board is connected to the magnetic sleeve and is separated from the electronic components.

[0020] Figure 3This is a schematic diagram of the circuit board unit when the circuit board, magnetic socket and electronic components are in a connected state in the first embodiment of this disclosure;

[0021] Figure 4 This is a schematic diagram of the circuit board unit in the second embodiment of the present disclosure, where the magnetic socket is provided with multiple first vias for the same electronic component;

[0022] Figure 5 This is a schematic diagram of the circuit board unit structure in the third embodiment of the present disclosure, where the magnetic socket is provided with multiple first vias for different electronic components.

[0023] Figure 6 This is a schematic diagram of the circuit board unit structure when the second connecting portion of the magnetic socket in the fourth embodiment of this disclosure includes the first connecting hole.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1-Circuit board; 11-Board body; 12-First connecting part; 13-Second via; 14-Third connecting part; 2-Magnetic socket; 21-Second connecting part; 22-First via; 211-Second connecting hole; 3-Electronic component; 31-Component body; 32-Pin; 4-Fastener. Detailed Implementation

[0026] To make the above-mentioned objects, features and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0027] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0028] In the description of this specification, the references to terms such as "embodiment," "one embodiment," "some implementations," "exemplary," and "one implementation," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or implementation is included in at least one embodiment or implementation of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or implementation. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or implementations.

[0029] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature.

[0030] In the attached figures, the Z-axis represents the vertical direction, i.e., the up-down position, and the positive direction of the Z-axis (i.e., the direction the arrow points) indicates up, and the negative direction of the Z-axis indicates down; the X-axis represents the front-back position, and the positive direction of the X-axis (i.e., the direction the arrow points) indicates the front, and the negative direction of the X-axis indicates the back; the Y-axis represents the horizontal direction and is designated as the left-right position, and the positive direction of the Y-axis (i.e., the direction the arrow points) indicates the right, and the negative direction of the Y-axis indicates the left. It should be noted that the aforementioned representations of the Z-axis, Y-axis, and X-axis are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0031] When mounting electronic components, such as power transistors, onto a circuit board, it is usually necessary to place magnetic components, such as ferrite beads, on the pins of the power transistors. The magnetic field generated by the magnetic components is used to suppress the spike current of the power transistors, thereby reducing noise and electromagnetic interference.

[0032] The current practice typically involves first attaching a magnetic component to the pins of electronic components, and then connecting the pins to the circuit board. However, this method has two drawbacks: firstly, there is a risk that the magnetic component may be missing from the pins; secondly, during the connection process between the electronic component and the circuit board, the magnetic component may fall off due to vibration or other reasons. In other words, there is a risk of missing magnetic components, which in turn affects the yield rate of the final assembled circuit board unit.

[0033] Furthermore, since magnetic components are typically required on each pin, this usually necessitates additional tools and operational skills, increasing production costs and complexity and hindering the mass production of circuit board units.

[0034] In a first aspect, embodiments of the present disclosure provide a circuit board unit, including a circuit board 1 and a magnetic socket 2; the circuit board 1 includes a board body 11, on which a first connecting portion 12 is provided; the magnetic socket 2 includes a second connecting portion 21 and a first through hole 22, the second connecting portion 21 is connected to the first connecting portion 12, the first through hole 22 is used for the pins 32 of electronic components 3 to pass through, and the board body 11 is used for electrical connection with the pins 32.

[0035] like Figures 1 to 3 As shown, Figure 1 This is a schematic diagram of the circuit board unit when the circuit board 1, magnetic sleeve 2 and electronic component 3 are in a separated state in the first embodiment of this disclosure. Figure 2 This is a schematic diagram of the circuit board unit in the first embodiment of the present disclosure, where the circuit board 1 is connected to the magnetic sleeve 2 and is separated from the electronic component 3. Figure 3 This is a schematic diagram of the circuit board unit when the circuit board 1, magnetic socket 2, and electronic component 3 are in a connected state in the first embodiment of this disclosure.

[0036] Specifically, the circuit board 1 has a conductive circuit (not shown in the figure) and a first connecting part 12 on its board body 11. The board body 11 is connected to the second connecting part 21 through the first connecting part 12 to fix the magnetic sleeve 2 in the position of the circuit board 1. The specific structure and connection method of the first connecting part 12 and the second connecting part 21 are not limited and will be further explained later.

[0037] After fixing the magnetic socket 2 to the circuit board 1, insert the pin 32 of the electronic component 3 into the first through hole 22 and electrically connect the pin 32 to the conductive circuit on the board body 11 to realize the installation of the electronic component 3. The method of electrically connecting the pin 32 to the conductive circuit is not a limitation and can adopt relevant technologies, which will be further explained later.

[0038] In this embodiment, the board body 11 of the circuit board 1 is provided with a first connecting part 12. The connection between the first connecting part 12 and the second connecting part 21 of the magnetic socket 2 can fix the magnetic socket 2 in position on the circuit board 1. The magnetic socket 2 is provided with a first through hole 22. By passing the pin 32 of the electronic component 3 through the first through hole 22 and electrically connecting the pin 32 to the board body 11, the assembly of the circuit board 1, the magnetic socket 2 and the electronic component 3 can be realized to obtain the circuit board unit. That is to say, the magnetic socket 2 can be pre-connected and fixed to the circuit board 1, and then the electronic component 3 can be installed and fixed to realize the assembly of the circuit board unit. This can reduce the risk of the pin 32 of the electronic component 3 being missing from the magnetic socket 2, and can also avoid the risk of the magnetic socket 2 falling off due to vibration or other reasons during the installation of the electronic component 3. The technical solution disclosed herein can reduce the possibility of missing the magnetic socket 2 and improve the yield of the finally assembled circuit board unit.

[0039] In addition, in some scenarios, the magnetic socket 2 can be pre-connected and fixed to the circuit board 1. When assembling the circuit board unit, only the electronic component 3 needs to be installed, which can improve the installation efficiency of the electronic component 3 to a certain extent.

[0040] In an optional connection scheme between the magnetic socket 2 and the circuit board 1, the first connecting part 12 and the second connecting part 21 are welded together.

[0041] For example, the first connection portion 12 includes a pad disposed on the board body 11, and the conductive circuit of the conductive board body 11 is electrically connected to the second connection portion 21 through the pad.

[0042] In this way, the magnetic socket 2 and the circuit board 1 can achieve a relatively stable connection, with a simple structure and strong practicality.

[0043] Optionally, the first connecting part 12 includes a first welding part, which is disposed on the side of the plate body 11 facing the magnetic sleeve 2, and the second connecting part 21 includes a second welding part disposed on the magnetic sleeve 2. The first welding part and the second welding part are connected by solder welding.

[0044] like Figures 1 to 4 As shown, specifically, the first welding part is a solder pad provided on the surface of the board body 11 facing the magnetic sleeve 2, and the second welding part is formed on the surface of the magnetic sleeve 2 facing the board body 11, and the two are connected by solder.

[0045] This facilitates the connection between the first and second welding parts. Furthermore, in some scenarios, such as when there are many magnetic sockets 2, surface mount technology can be used to mount the magnetic sockets 2 onto the circuit board 1.

[0046] Of course, it should be understood that a positioning structure can also be provided between the magnetic sleeve 2 and the plate body 11. For example, a positioning hole can be provided on the plate body 11, and a positioning post can be provided on the magnetic sleeve 2. The positioning post is inserted into the positioning hole for positioning. This will not be described in detail here.

[0047] In an optional connection scheme between the magnetic socket 2 and the circuit board 1, the first connecting part 12 and the second connecting part 21 are bonded together.

[0048] For example, the first connecting part 12 includes an adhesive surface disposed on the plate body 11, and the second connecting part 21 includes another adhesive surface disposed on the end face of the magnetic sleeve 2, and the two adhesive surfaces are connected by adhesive.

[0049] In the optional connection scheme between the magnetic socket 2 and the circuit board 1, the first connecting part 12 and the second connecting part 21 are detachably connected.

[0050] Thus, the first connecting part 12 and the second connecting part 21 can be disassembled when necessary, thereby enabling the electronic component 3 to be disassembled from the circuit board 1 and separating the two. The structure is simple and highly practical.

[0051] In an optional embodiment where the first connecting part 12 and the second connecting part 21 are detachably connected, the first connecting part 12 includes a first connecting hole provided in the plate body 11, and the second connecting part 21 includes a second connecting hole 211 provided in the magnetic sleeve 2. The first connecting hole and the second connecting hole 211 are connected by a fastener 4.

[0052] like Figure 6 As shown, Figure 6 This is a schematic diagram of the circuit board unit structure when the second connecting portion 21 of the magnetic socket 2 includes the first connecting hole in the fourth embodiment of this disclosure. The first connecting hole is not shown in the figure.

[0053] For example, fastener 4 can be a screw that passes through the second hole and is threaded into the first hole. The number of fasteners 4 can be set to multiple as needed. Figure 6 The image shows three scenarios.

[0054] In an alternative embodiment where the first connecting part 12 and the second connecting part 21 are detachably connected, one of the first connecting part 12 and the second connecting part 21 includes a locking hole, and the other of the first connecting part 12 and the second connecting part 21 includes a snap-fit ​​member, which passes through the locking hole and snaps into the locking hole.

[0055] For example, the plate body 11 is provided with a locking hole, and the end of the locking member passes through the locking hole and engages with the edge of the locking hole, preventing the locking member from disengaging from the locking hole. This scheme is not shown in the figure.

[0056] In this way, the magnetic socket 2 can be fixed in position on the circuit board 1 without the need for fastener 4, which facilitates the installation and removal of the magnetic socket 2.

[0057] In an optional embodiment where the first connecting part 12 and the second connecting part 21 are detachably connected, the first connecting part 12 includes a first magnetic part, and the second connecting part 21 includes a second magnetic part, and the first magnetic part and the second magnetic part are magnetically attracted to each other.

[0058] The structural composition of the first magnetic attraction part and the second magnetic attraction part is not limited, and related technologies can be adopted.

[0059] In some designs, the magnetic adsorption of the two components can serve to position the magnetic sleeve 2. For example, the first magnetic adsorption part and the second magnetic adsorption part are respectively concave and convex structures to prevent fooling.

[0060] Optionally, in the above embodiments, the board body 11 further includes a second via 13, which communicates with the first via 22. The pin 32 passes through the second via 13 and the first via 22 and is electrically connected to the board body 11. The second via 13 is located in... Figure 1 As shown in the example.

[0061] When the magnetic socket 2 is installed on the circuit board 1, the position of the second via 13 on the board body 11 corresponds to the position of the first via 22 on the magnetic socket 2, so that the pin 32 of the electronic component 3 can pass through the first via 22 and be inserted into the second via 13, and the pin 32 can be pre-positioned by the second via 13.

[0062] The method of electrical connection between pin 32 and board body 11 is not limited; the two are usually connected by soldering.

[0063] Optionally, the board body 11 has a first pad on the side away from the magnetic socket 2, and the pin 32 is connected to the first pad by solder.

[0064] In other words, the pin 32 of electronic component 3 passes through the first hole of magnetic socket 2 and the second hole on board body 11 and is soldered to the first pad on the back of board body 11. Specifically, the two are soldered together. The first pad is electrically connected to the conductive circuit on board body 11, and the first pad is not shown in the diagram.

[0065] Thus, when connecting electronic component 3 to circuit board 1, solder coating and soldering are performed on the back of the board body 11, which facilitates the operation.

[0066] Of course, it should be understood that in some solutions, the board body 11 has a second pad on the side facing the magnetic socket 2, and the pin 32 is connected to the second pad by solder. In this case, in some scenarios, the diameter of the second pad needs to be smaller than the diameter of the first via 22. This solution is not shown in the figure and will not be described in detail here.

[0067] Of course, in some solutions, the pins 32 of the electronic component 3 can be fixed to the magnetic socket 2 by welding, snap-fit ​​or other connection methods, which can also reduce the strength requirements of the connection between the pins 32 and the board body 11.

[0068] In the above embodiments, optionally, the magnetic socket 2 is provided with a plurality of first vias 22; at least two of the plurality of first vias 22 are respectively used for the passage of different pins 32 of the same electronic component 3.

[0069] like Figure 4 As shown, Figure 4 This is a schematic diagram of the circuit board unit structure in the second embodiment of the present disclosure, where the magnetic socket 2 is provided with multiple first vias 22 corresponding to the same electronic component 3. It shows that the electronic component 3 is a power transistor with three pins 32. In this case, the magnetic socket 2 is provided with three first vias 22, and the three first vias 22 are respectively provided to the three pins 32 of the same power transistor.

[0070] In this way, different pins 32 of the same electronic component 3 can be fitted using a single magnetic socket 2, which can reduce the number of magnetic sockets 2 required and thus improve the overall assembly efficiency of the circuit board unit.

[0071] It should be understood that in some scenarios, multiple first through holes 22 can be connected, thereby facilitating the forming of the magnetic socket 2.

[0072] In the above embodiments, optionally, the magnetic socket 2 is provided with a plurality of first vias 22; at least two of the plurality of first vias 22 are respectively used for the insertion of pins 32 of different electronic components 3.

[0073] like Figure 5 As shown, Figure 5 This is a schematic diagram of the circuit board unit structure in the third embodiment of this disclosure, where the magnetic socket 2 is provided with multiple first vias 22 for different electronic components 3. It shows the case where the magnetic socket 2 is used to mount two electronic components 3, with a total of six pins 32.

[0074] This can further reduce the number of magnetic sockets 2 required and improve the overall assembly efficiency of the circuit board unit.

[0075] In the above embodiments, it should be understood that the structure of the electronic component 3 itself is not a limitation. The large surface of the component body 31 of the electronic component 3 can be arranged opposite to the board body 11, and the pins 32 can be bent and extend into the first via 22 and the second via 13. Of course, the large surface of the component body 31 of the electronic component 3 can also be arranged perpendicular to the board body 11, and the pins 32 can be straight and extend into the first via 22 and the second via 13.

[0076] Secondly, embodiments of this disclosure provide an electronic device that includes the circuit board unit as described in the first aspect above. The electronic device may be a power conversion device, such as an inverter, which will not be described in detail here.

[0077] While the above disclosure is provided, the scope of protection of this disclosure is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of this disclosure, and all such changes and modifications will fall within the scope of protection of this disclosure.

Claims

1. A circuit board unit, characterized in that, The circuit board (1) includes a circuit board body (11) and a magnetic socket (2). The circuit board (1) includes a board body (11) and a first connecting part (12) is provided on the board body (11). The magnetic socket (2) includes a second connecting part (21) and a first through hole (22). The second connecting part (21) is connected to the first connecting part (12). The first through hole (22) is used for the pin (32) of the electronic component (3) to pass through. The board body (11) is used to electrically connect with the pin (32).

2. The circuit board unit as described in claim 1, characterized in that, The first connecting part (12) is welded to the second connecting part (21).

3. The circuit board unit as described in claim 2, characterized in that, The first connecting part (12) includes a first welding part, which is disposed on the side of the plate body (11) facing the magnetic sleeve (2). The second connecting part (21) includes a second welding part disposed on the magnetic sleeve (2). The first welding part and the second welding part are connected by solder welding.

4. The circuit board unit as described in claim 1, characterized in that, The first connecting part (12) is bonded to the second connecting part (21).

5. The circuit board unit as described in claim 1, characterized in that, The first connecting part (12) and the second connecting part (21) are detachably connected.

6. The circuit board unit as described in claim 5, characterized in that, The first connecting part (12) includes a first connecting hole disposed on the plate body (11), and the second connecting part (21) includes a second connecting hole (211) disposed on the magnetic sleeve (2). The first connecting hole and the second connecting hole (211) are connected by a fastener (4). Alternatively, one of the first connecting portion (12) and the second connecting portion (21) includes a card hole, and the other of the first connecting portion (12) and the second connecting portion (21) includes a snap-fit ​​member, which passes through the card hole and snaps into the card hole; Alternatively, the first connecting part (12) includes a first magnetic attraction part disposed on the plate body (11), and the second connecting part (21) includes a second magnetic attraction part disposed on the magnetic sleeve (2), and the first magnetic attraction part and the second magnetic attraction part are magnetically attracted and connected.

7. The circuit board unit as claimed in claim 1, characterized in that, The board body (11) is also provided with a second via (13), which is connected to the first via (22). The pin (32) passes through the second via (13) and the first via (22) and is electrically connected to the board body (11).

8. The circuit board unit as claimed in claim 7, characterized in that, The board body (11) has a first pad on the side opposite to the magnetic sleeve (2), and the pin (32) is connected to the first pad by solder.

9. The circuit board unit as described in any one of claims 1 to 8, characterized in that, The magnetic sleeve (2) is provided with a plurality of first through holes (22); At least two of the plurality of first vias (22) are respectively used for the passage of different pins (32) of the same electronic component (3), and / or at least two of the plurality of first vias (22) are respectively used for the passage of pins (32) of different electronic components (3).

10. An electronic device, characterized in that, Includes the circuit board unit as described in any one of claims 1 to 9.

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