Structure for improving heat dissipation capability of circuit board and satisfying vibration experiment

Abstract

The utility model discloses a structure for improving the heat dissipation capability of a circuit board and satisfying a vibration experiment, which not only can optimize the heat dissipation performance of the circuit board, but also can enhance the structural strength of the circuit board by improving the configuration mode of traditional pins, so that the circuit board can resist stress possibly generated in the vibration experiment. Particularly, part of pins are changed into surface-mounted pins, the heat dissipation area of the power device is increased, meanwhile, sufficient space is reserved for installation of the bus bars, the bus bars are directly connected with the power device, the heat dissipation capacity of the power device is further improved by increasing heat conduction paths, and therefore the heat dissipation performance of the whole circuit board is enhanced. The reinforcing plate is used for enhancing the overall strength of the circuit board, meets the vibration test, can effectively prevent the copper sheet of the circuit board from falling off in the vibration test of the surface-mounted pin, and avoids the damage to a power supply.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and more specifically, to a structure that improves the heat dissipation capacity of a circuit board and meets the requirements of vibration testing. Background Technology

[0002] In traditional power supply design, the layout of the printed circuit board (PCB) pin structure is a crucial aspect. To ensure the reliability and stability of the power supply structure, it is common practice to install pins using through-holes in the PCB. This method, by passing the pins through the PCB layers and securing them, effectively enhances the connection strength between the power supply components and the PCB, thus maintaining structural integrity and electrical connection reliability during harsh environmental tests such as vibration experiments. This traditional layout method was widely used in early power supply designs and achieved significant results in practical applications.

[0003] However, with the rapid development of modern electronic technology and the continuous improvement of application demands, the design requirements for power supplies have become increasingly stringent. Especially with the current trend towards miniaturization and integration, the size of power supplies needs to be continuously reduced to meet the installation requirements of various compact electronic devices. At the same time, with the increase in power density, the heat generated by the power supply during operation also increases significantly, placing higher demands on its heat dissipation capabilities. If heat dissipation is inadequate, power devices will operate in a high-temperature environment for extended periods, which will not only reduce device performance and lifespan but may also lead to damage due to excessive thermal stress, thereby affecting the reliability and safety of the entire power supply system.

[0004] In current circuit board layouts, it is necessary to rationally plan the placement of power devices within a limited space to ensure that the power devices have sufficient heat dissipation space. However, the method of mounting pins through holes in the circuit board occupies a considerable area because the pins need to pass through the circuit board layers, which is not conducive to the heat dissipation of power devices. Utility Model Content

[0005] To overcome the problem that existing methods of mounting pins through holes on circuit boards occupy a considerable area and are not conducive to heat dissipation of power devices, since the pins need to pass through the circuit board layers, this utility model provides a structure that improves the heat dissipation capacity of the circuit board and meets the requirements of vibration experiments.

[0006] The technical solution of this utility model is as follows:

[0007] A structure that improves the heat dissipation capacity of a circuit board and meets the requirements of vibration testing includes:

[0008] Pins are provided on the circuit board. The pins include surface-mount pins and through-hole pins. The surface-mount pins are close to the power devices on the circuit board. A busbar is provided on the other side of the circuit board at the corresponding position of the surface-mount pin. The busbar is connected to the power device. The through-hole pins are provided on both sides of the surface-mount pins.

[0009] A reinforcing plate is located above the circuit board, and both the surface-mount pins and the through-hole pins are connected to the reinforcing plate.

[0010] According to the present invention based on the above scheme, both the surface-mount pins and the plug-in pins penetrate the reinforcing plate.

[0011] According to the above-described scheme, this utility model further includes a plurality of auxiliary pins, which are used to connect the circuit board and the reinforcing plate.

[0012] According to the present invention based on the above scheme, the surface-mount pins are soldered to the surface of the circuit board.

[0013] According to the present invention based on the above scheme, the circuit board is provided with through holes, and the plug-in pins are soldered into the through holes.

[0014] According to the present invention based on the above scheme, the circuit board is provided with blind holes, and the plug-in pins are soldered into the blind holes.

[0015] According to the above-described scheme of this utility model, positioning holes are provided around the circuit board.

[0016] According to the above-described scheme of this utility model, the reinforcing plate is provided with a device avoidance area.

[0017] According to the above-described scheme of this utility model, the plug-in pin extends outward to form a step, and the reinforcing plate is located above the step.

[0018] According to the above-described solution, the beneficial effects of this utility model are as follows: This utility model provides a structure that improves the heat dissipation capacity of a circuit board while meeting vibration testing requirements. By modifying the traditional pin configuration, it not only optimizes the heat dissipation performance of the circuit board but also enhances its structural strength, enabling it to withstand stresses that may occur during vibration testing. Specifically, replacing some pins with surface-mount pins not only increases the heat dissipation area of ​​the power devices but also provides ample space for the installation of busbars. The busbars are directly connected to the power devices, further improving the heat dissipation capacity of the power devices by increasing the heat conduction path, thereby enhancing the overall heat dissipation performance of the circuit board. The reinforcing plate enhances the overall strength of the circuit board, meeting vibration testing requirements and effectively preventing the copper foil of the circuit board from detaching during vibration testing due to surface-mount pins, thus avoiding damage to the power supply. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a structural schematic diagram from another perspective of the present invention.

[0021] In the figure, the various attached figures are labeled as follows:

[0022] 10. Circuit board; 11. Surface mount pin; 12. Plug-in pin; 121. Step; 13. Power device; 14. Busbar; 15. Reinforcing plate; 16. Auxiliary pin; 17. Through hole; 18. Positioning hole; 19. Device clearance area. Detailed Implementation

[0023] To make the technical problems, technical solutions and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0024] It should be noted that the terms "comprising" and "having," and any variations thereof, in the specification and claims of this utility model are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices. Terms such as "set up" should be interpreted broadly; for example, it can refer to a fixed connection, a detachable connection, or an integral part; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two elements or the interaction between two elements, unless otherwise expressly defined. Terms such as "upper," "lower," "left," "right," "front," "rear," and "bottom" indicate orientations or positions based on the orientations or positions shown in the accompanying drawings, and are only for ease of description and should not be construed as limiting the present technical solution.

[0025] It should be noted that with the rapid development of modern electronic technology and the continuous improvement of application demands, the design requirements for power supplies have become increasingly stringent. Especially with the current trend towards miniaturization and integration, the size of power supplies needs to be continuously reduced to meet the installation requirements of various compact electronic devices. At the same time, with the increase in power density, the heat generated by the power supply during operation also increases significantly, placing higher demands on the power supply's heat dissipation capabilities. If heat dissipation is inadequate, power devices will operate in a high-temperature environment for extended periods, which will not only reduce the performance and lifespan of the devices but may also lead to damage due to excessive thermal stress, thereby affecting the reliability and safety of the entire power supply system.

[0026] In current circuit board layouts, it is necessary to rationally plan the placement of power devices within a limited space to ensure that the power devices have sufficient heat dissipation space. However, the method of mounting pins through holes in the circuit board occupies a considerable area because the pins need to pass through the circuit board layers, which is not conducive to the heat dissipation of power devices.

[0027] like Figures 1-2 As shown, this embodiment provides a structure that improves the heat dissipation capacity of a circuit board and meets vibration test requirements. By improving the traditional pin configuration, not only can the heat dissipation performance of the circuit board 10 be optimized, but its structural strength can also be enhanced, enabling it to withstand the stress that may be generated during vibration testing. Specifically, some pins are replaced with surface-mount pins 11, which not only increases the heat dissipation area of ​​the power device 13, but also provides sufficient space for the installation of the busbar 14. The busbar 14 is directly connected to the power device 13, and by increasing the heat conduction path, the heat dissipation capacity of the power device 13 is further improved, thereby enhancing the overall heat dissipation performance of the circuit board 10. The reinforcing plate 15 is used to enhance the overall strength of the circuit board 10 to meet vibration test requirements and can effectively prevent the copper foil of the circuit board 10 from falling off during vibration testing due to the surface-mount pins 11, thus avoiding damage to the power supply.

[0028] Specifically, the structure for improving the heat dissipation capacity of circuit board 10 and meeting vibration test requirements includes pins and a reinforcing plate 15. The pins are located on circuit board 10 and include surface-mount pins 11 and through-hole pins 12. The surface-mount pins 11 are attached to the surface of circuit board 10 and are close to the power device 13 on circuit board 10. This not only increases the heat dissipation area of ​​the power device 13 and improves heat dissipation efficiency, but also provides sufficient space for the subsequent installation of busbars 14. On the other side of circuit board 10, busbars 14 are located at the corresponding positions of the surface-mount pins 11. Busbars 14 are connected to the power device 13. The direct connection between busbars 14 and power device 13 increases the heat conduction path, further improving the heat dissipation capacity of the power device 13, thereby enhancing the overall heat dissipation performance of circuit board 10. Through-hole pins 12 are located on both sides of the surface-mount pins 11 and are used for through-hole connections with circuit board 10.

[0029] The reinforcing plate 15 is located above the circuit board 10. The reinforcing plate 15 is used to enhance the overall strength of the circuit board 10. Both the surface-mount pins 11 and the through-hole pins 12 are connected to the reinforcing plate 15. This not only helps to maintain the stability of the circuit board 10 in vibration tests, but also effectively prevents the surface-mount pins 11 from loosening due to vibration or causing the copper foil of the circuit board 10 to fall off, thereby avoiding potential damage to the power supply system.

[0030] In one embodiment, both the surface-mount pin 11 and the plug-in pin 12 penetrate the reinforcing plate 15.

[0031] In one embodiment, a plurality of auxiliary pins 16 are also included, which are distributed between the circuit board 10 and the reinforcing plate 15. The auxiliary pins 16 are used to connect the circuit board 10 and the reinforcing plate 15. The presence of the auxiliary pins 16 not only increases the contact area between the circuit board 10 and the reinforcing plate 15 and improves the reliability of the connection, but also helps to disperse stress in vibration tests and protect the circuit board 10 from damage.

[0032] In one embodiment, the surface-mount pin 11 is soldered to the surface of the circuit board 10. Soldering is a reliable and commonly used connection method that provides strong mechanical strength and good electrical conductivity. Through this connection method, the surface-mount pin 11 can be stably fixed to the circuit board 10, and is not easy to loosen or fall off, thereby ensuring the stability and reliability of the circuit board 10.

[0033] In one embodiment, the circuit board 10 has through holes 17, and plug-in pins 12 are soldered into the through holes 17. This arrangement not only ensures a secure connection between the plug-in pins 12 and the circuit board 10, but also helps to improve the overall structural strength of the circuit board 10. At the same time, the design of the through holes 17 also facilitates the plug-in connection of the plug-in pins 12 with other circuit boards 10 or components, improving the compatibility and scalability of the circuit board 10.

[0034] In other alternative embodiments, to optimize the layout of the circuit board 10 and reduce space occupation, the circuit board 10 is provided with blind holes, into which plug-in pins 12 are soldered. A blind hole is a hole that opens only from one side of the circuit board 10, allowing plug-in pins 12 to be inserted from one side of the circuit board 10 and soldered to the bottom of the blind hole. This design not only saves space on the circuit board 10 but also helps to improve the overall structural strength of the circuit board 10.

[0035] In one embodiment, positioning holes 18 are provided around the circuit board 10. The positioning holes 18 not only ensure the stability and accuracy of the circuit board 10 during installation, but also facilitate rapid and precise assembly using automated equipment, thereby improving production efficiency and assembly accuracy.

[0036] In one embodiment, the reinforcing plate 15 includes a device clearance area 19. The device clearance area 19 is tailored to the size and layout of electronic components (such as integrated circuits, capacitors, resistors, etc.) already installed or planned to be installed on the circuit board 10. Through the clever design of the clearance area, the reinforcing plate 15 can connect to the circuit board 10 without interfering with the normal operation of other electronic components, while providing additional structural support and enhancing the durability and shock resistance of the entire circuit board 10 assembly.

[0037] In one embodiment, the plug-in pin 12 extends outward to form a step 121, and the reinforcing plate 15 is located above the step 121. The step 121 provides a gap between the circuit board 10 and the reinforcing plate 15 to prepare for the installation of other devices.

[0038] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0039] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A structure that improves the heat dissipation capacity of a circuit board and meets the requirements of vibration testing, characterized in that, include: Pins are provided on the circuit board. The pins include surface-mount pins and through-hole pins. The surface-mount pins are close to the power devices on the circuit board. A busbar is provided on the other side of the circuit board at the corresponding position of the surface-mount pin. The busbar is connected to the power device. The through-hole pins are provided on both sides of the surface-mount pins. A reinforcing plate is located above the circuit board, and both the surface-mount pins and the through-hole pins are connected to the reinforcing plate.

2. The structure according to claim 1 for improving the heat dissipation capacity of a circuit board and meeting the requirements of vibration testing, characterized in that, Both the surface-mount pins and the plug-in pins penetrate the reinforcing plate.

3. The structure according to claim 1 for improving the heat dissipation capacity of a circuit board and meeting the requirements of vibration testing, characterized in that, It also includes several auxiliary pins for connecting the circuit board and the reinforcement plate.

4. A structure for improving the heat dissipation capacity of a circuit board and meeting vibration test requirements according to claim 1, 2, or 3, characterized in that, The surface-mount pins are soldered to the surface of the circuit board.

5. A structure for improving the heat dissipation capacity of a circuit board and meeting vibration test requirements according to claim 1, 2, or 3, characterized in that, The circuit board has through holes, and the plug-in pins are soldered into the through holes.

6. A structure for improving the heat dissipation capacity of a circuit board and meeting vibration test requirements according to claim 1, 2, or 3, characterized in that, The circuit board has blind holes, and the plug-in pins are soldered into the blind holes.

7. The structure according to claim 1 for improving the heat dissipation capacity of a circuit board and meeting the requirements of vibration testing, characterized in that, The circuit board has positioning holes around its perimeter.

8. The structure according to claim 1 for improving the heat dissipation capacity of a circuit board and meeting the requirements of vibration testing, characterized in that, The reinforcing plate has a device avoidance area.

9. A structure for improving the heat dissipation capacity of a circuit board and meeting vibration test requirements according to claim 1 or 8, characterized in that, The plug-in pins extend outward to form a step, and the reinforcing plate is located above the step.

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