Super-flexible circuit board, flexible light source module and luminous body

Abstract

The utility model discloses a super flexible circuit board, a flexible light source module and a luminous body, a base material layer of the super flexible circuit board is a cloth layer made of insulation cloth or a paper layer made of high temperature resistant paper, an insulation glue layer covers the base material layer, and the base material layer and a copper foil circuit layer are bonded through the insulation glue layer. The base material layer is more excellent in flexibility and bending performance, cannot be broken and is easy to recover when being bent at will, can be attached to any curved surface and plane, and is wider in application range. When the insulating cloth is used as a base material, the insulating cloth has excellent air permeability and flame retardance; the insulating glue layer is a heat-conducting insulating glue layer made of heat-conducting insulating glue, and has excellent heat-conducting property and high-pressure resistance, so that heat generated by the circuit board during working can be quickly dissipated from the substrate layer, and the heat dissipation performance is improved. The ultra-flexible light source module made of the ultra-flexible circuit board can be better attached to a carrier, the heat dissipation performance is improved, the service life of a product is prolonged, light damage is reduced, and the ultra-flexible light source module can be applied to various lamps.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and in particular to an ultra-flexible circuit board, a flexible light source module, and a light emitter. Background Technology

[0002] In the prior art, flexible printed circuit boards (FPCs) are highly reliable and extremely flexible printed circuit boards made with polyimide or polyester film as the substrate. They are characterized by high wiring density, light weight, thinness, and good bending performance.

[0003] In the field of flexible electronics, heat-resistant films (polyimide or polyester films) are used as the substrate for flexible circuits to support them. Since the circuits generate heat during operation, the substrate needs to have certain heat resistance and thermal conductivity to effectively transfer and dissipate heat, thus eliminating the heat generation problems caused by the high integration of the circuits, especially in flexible LED light source circuit boards where LED chips generate significant heat during operation.

[0004] However, the thermal conductivity of polyester film is typically between 0.15 and 0.24 W / (m·K), while that of polyimide is generally between 0.2 and 0.3 W / (m·K). These relatively low thermal conductivity and poor air permeability result in poor heat dissipation. Consequently, existing flexible circuit boards cannot be used in circuit applications with high heat generation. Existing flexible LED light strips are all low-power, and flexible LED light source circuit boards cannot accommodate ordinary or high-power LED chips due to heat dissipation issues.

[0005] In addition, although substrates made of polyimide or polyester film have good flexibility and bendability, their flexibility and bendability still need to be improved in order to enable flexible LED light source circuit boards to fit various shaped carriers to form light source modules of various shapes. Utility Model Content

[0006] The main purpose of this utility model is to provide an ultra-flexible circuit board, a flexible light source module, and a light emitter, aiming to improve the flexibility, bendability, and heat dissipation performance of the circuit board, improve the flexibility, bendability, and heat dissipation performance of the light source module, and improve the compatibility between the light source module and the carrier.

[0007] This utility model proposes an ultra-flexible circuit board, including a substrate layer, an insulating adhesive layer, and a circuit layer. The substrate layer is a fabric layer made of insulating cloth or a paper layer made of high-temperature resistant paper. The insulating adhesive layer covers the substrate layer, and the substrate layer and the circuit layer are bonded together by the insulating adhesive layer.

[0008] Preferably, the insulating adhesive layer is a thermally conductive insulating adhesive layer made of thermally conductive insulating adhesive.

[0009] Preferably, the insulating fabric is a polymer fiber fabric.

[0010] Preferably, it further includes an encapsulation layer covering the upper layer, said encapsulation layer being a flexible insulating layer.

[0011] Preferably, the encapsulation layer is made of flexible insulating varnish or a flexible resin layer.

[0012] This invention proposes a flexible light source module, comprising an ultra-flexible circuit board and LED chips attached to the ultra-flexible circuit board. The ultra-flexible circuit board includes a substrate layer, an insulating adhesive layer, and a circuit layer. The substrate layer is a fabric layer made of insulating cloth or a paper layer made of high-temperature resistant paper. The insulating adhesive layer covers the substrate layer, and the substrate layer and the circuit layer are bonded together by the insulating adhesive layer.

[0013] Preferably, the insulating adhesive layer is a thermally conductive insulating adhesive layer made of thermally conductive insulating adhesive.

[0014] Preferably, the insulating fabric is a polymer fiber fabric.

[0015] Preferably, it further includes an encapsulation layer covering the upper layer, said encapsulation layer being a flexible insulating layer.

[0016] Preferably, the encapsulation layer is made of flexible insulating varnish or a flexible resin layer.

[0017] Preferably, the ultra-flexible circuit board is provided with driving lines, and the ultra-flexible circuit board is attached with components for driving and controlling the light source, forming a driving circuit.

[0018] This invention proposes a light-emitting body, comprising a carrier and at least one flexible light source module attached to the carrier. The flexible light source module includes an ultra-flexible circuit board and an LED chip attached to the ultra-flexible circuit board. The ultra-flexible circuit board includes a substrate layer, an insulating adhesive layer, and a circuit layer. The substrate layer is a fabric layer made of insulating cloth or a paper layer made of high-temperature resistant paper. The insulating adhesive layer covers the substrate layer, and the substrate layer and the circuit layer are bonded together by the insulating adhesive layer.

[0019] Preferably, the insulating adhesive layer is a thermally conductive insulating adhesive layer made of thermally conductive insulating adhesive.

[0020] Preferably, the insulating fabric is a polymer fiber fabric.

[0021] Preferably, it further includes an encapsulation layer covering the upper layer, said encapsulation layer being a flexible insulating layer.

[0022] Preferably, the encapsulation layer is made of flexible insulating varnish or a flexible resin layer.

[0023] Preferably, the ultra-flexible circuit board is provided with driving lines, and the ultra-flexible circuit board is attached with components for driving and controlling the light source, forming a driving circuit.

[0024] Preferably, the flexible light source module is bonded to the carrier with thermally conductive adhesive, and the carrier is a thermally conductive carrier made of thermally conductive material.

[0025] Preferably, the flexible light source module is bonded to the carrier with thermally conductive adhesive, and the carrier has heat dissipation holes at the position opposite to the flexible light source.

[0026] Preferably, the carrier is provided with a mounting groove adapted to the flexible light source module, and the flexible light source module is installed in the mounting groove.

[0027] The beneficial effects of this utility model are as follows:

[0028] The substrate layer of the ultra-flexible circuit board proposed in this utility model is an insulating cloth layer or a high-temperature resistant paper layer, and an insulating adhesive layer covers the substrate layer. The substrate layer and the circuit layer are bonded together by the insulating adhesive layer.

[0029] Using insulating fabric or high-temperature resistant paper as the substrate, it boasts superior flexibility and bendability. It won't break under any bending and easily recovers its shape. It can be cut and folded arbitrarily and adhered to any curved or flat surface, thus broadening its application range. Especially in flexible light source modules, LED chips are attached to them, and ultra-flexible circuit boards are used to create ultra-flexible light source modules. Like fabric or paper, these modules can be cut to the required shape and then adhered to a carrier to form any shape of light-emitting body.

[0030] When using insulating fabric as the substrate, it exhibits excellent breathability and flame retardancy. The insulating adhesive layer is made of thermally conductive insulating adhesive, possessing excellent thermal conductivity. This allows heat generated during circuit board operation to dissipate rapidly from the substrate layer, improving heat dissipation performance compared to existing flexible circuit boards. When applied to flexible light source modules, the improved heat dissipation performance eliminates limitations on LED power, enabling its application in various lighting fixtures.

[0031] The flexible light source module proposed in this utility model uses the aforementioned ultra-flexible circuit board as a substrate. Compared with existing flexible light strips, it has superior flexibility and bendability. It will not break even when bent and is easy to recover, so it can be attached to any curved or flat surface. It can be cut and folded at will, and like cloth or paper, it can be cut into the required shape according to needs. It can be folded and spliced ​​into various forms, adapting to more shaped carriers and having a wider range of applications.

[0032] When using insulating fabric as the substrate, this ultra-flexible circuit board has excellent air permeability and flame retardancy. The insulating adhesive layer is made of thermally conductive insulating adhesive, which has excellent thermal conductivity and high voltage resistance. As a result, the heat generated by the circuit board can be quickly dissipated from the substrate layer, improving the heat dissipation performance and solving the heat dissipation problem of flexible light source modules. This allows the LED power to be no longer limited and can be used in various lighting fixtures.

[0033] The light-emitting body proposed in this utility model includes a carrier and a flexible light source module attached to the carrier. The flexible light source module includes an ultra-flexible circuit board and LED chips attached to the ultra-flexible circuit board, exhibiting excellent flexibility and bending performance. The flexible light source module can perfectly fit various curved and flat carriers. The flexible light source module can be cut, folded, or spliced ​​into the required shape according to needs, and then attached to the carrier, thus removing the limitations on the shape of the carrier.

[0034] When using insulating fabric as the substrate layer, the ultra-flexible circuit board also possesses excellent air permeability and flame retardancy. The insulating adhesive layer is a thermally conductive insulating adhesive layer with excellent thermal conductivity and high-voltage resistance, serving for thermal conduction, insulation, and adhesion. The insulating adhesive layer bonds the substrate layer to the circuit layer. The heat generated by the flexible light source module during operation can be quickly conducted to the carrier through the pores of the thermally conductive insulating adhesive layer and the fabric layer. The carrier and the air medium then conduct heat away from the power heating devices on the circuit through the principle of heat exchange, improving heat dissipation performance. Overall, this extends product lifespan and reduces light damage. Consequently, the brightness and shape of the light-emitting element are no longer limited, allowing its application in various types of lighting fixtures. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of the ultra-flexible circuit board in an embodiment of this utility model.

[0036] Figure 2 This is a schematic diagram of the ultra-flexible circuit board without an encapsulation layer and without being cut, as described in an embodiment of this utility model.

[0037] Figure 3 This is a schematic diagram of the light source structure in an embodiment of this utility model.

[0038] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0039] It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0040] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals identify the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0041] Reference Figure 1 and Figure 2 An embodiment of the ultra-flexible circuit board of this utility model is presented:

[0042] An ultra-flexible circuit board includes a substrate layer 1, an insulating adhesive layer 2, a copper foil circuit layer 3, and an encapsulation layer 4 covering the upper layer. The substrate layer 1 is a fabric layer made of insulating cloth or a paper layer made of high-temperature resistant paper. The insulating adhesive layer 2 covers the fabric layer, and the fabric layer and the copper foil circuit layer 3 are bonded together by the insulating adhesive layer 2. During manufacturing, the copper foil is bonded to the fabric layer through the insulating adhesive layer 2, and the copper foil circuit layer 3 is formed by an etching process.

[0043] Using insulating fabric or high-temperature resistant paper as the substrate, it boasts superior flexibility and bendability. It won't break under any bending and easily recovers its shape. It can be cut and folded arbitrarily and adhered to any curved or flat surface, thus broadening its application range. Especially in flexible light source modules, LED chips are attached to them, and ultra-flexible circuit boards are used to create ultra-flexible light source modules. Like fabric or paper, these modules can be cut to the required shape and then adhered to a carrier to form any shape of light-emitting body.

[0044] In a preferred embodiment, the substrate layer 1 is a fabric layer made of insulating cloth, the insulating adhesive layer 2 is a flexible thermally conductive insulating adhesive layer made of thermally conductive insulating adhesive, and the encapsulation layer 4 is coated on the surface of the circuit board, covering the copper foil circuit layer 3 inside, leaving electrical contacts for connecting components.

[0045] The substrate layer 1, insulating adhesive layer 2, and encapsulation layer 4 are all made of insulating materials, preventing leakage and ensuring greater safety.

[0046] The insulating fabric is made of high-molecular fiber cloth, such as glass fiber cloth and carbon fiber cloth, which has excellent heat resistance and breathability.

[0047] The encapsulation layer 3 is made of flexible insulating varnish and has insulating and flexible properties.

[0048] Using insulating fabric as the substrate, it possesses high-temperature resistance and excellent breathability. The insulating adhesive layer is made of thermally conductive insulating adhesive, exhibiting excellent thermal conductivity and high-voltage resistance. This allows heat generated during circuit board operation to dissipate rapidly from the substrate layer, significantly improving heat dissipation performance compared to existing flexible circuit boards. Consequently, the power of power-generating devices is no longer limited. Especially when applied to flexible LED light sources, the improved heat dissipation performance eliminates the limitation on LED power in the light source board, enabling its application in various lighting fixtures.

[0049] Reference Figures 1 to 3 An embodiment of the flexible light source module of this utility model is proposed:

[0050] A flexible light source module includes an ultra-flexible circuit board 10 and an LED chip 20 attached to the ultra-flexible circuit board 10. The ultra-flexible circuit board 10 has the same structure as the ultra-flexible circuit board in the above-described embodiment, including a substrate layer 1, an insulating adhesive layer 2, a copper foil circuit layer 3, and an encapsulation layer 4. In the embodiment, the substrate layer 1 is a fabric layer made of insulating cloth, and the insulating adhesive layer 2 is a thermally conductive insulating adhesive layer made of thermally conductive insulating adhesive. The insulating adhesive layer 2 covers the fabric layer, and the fabric layer and the copper foil circuit layer 3 are bonded together by the insulating adhesive layer 2. The encapsulation layer 4 is coated on the surface of the circuit board, covering the copper foil circuit layer 3, and leaving electrical contacts for connecting the LED chip 20.

[0051] The substrate layer 1 of the ultra-flexible circuit board 10 is an insulating fabric layer with good breathability, flexibility, and bendability; the insulating adhesive layer 2 is a thermally conductive insulating adhesive layer, used for heat conduction, insulation, and adhesion. The flexible light source module uses the above-mentioned ultra-flexible circuit board as the substrate. Compared with existing flexible light strips, its flexibility and bendability are superior. It will not break after being bent and is easy to recover, so it can be attached to any curved or flat surface. It can be cut and folded at will, and like cloth or paper, it can be cut into the required shape according to needs. It can be folded and spliced ​​into various forms, adapting to more shaped carriers and having a wider range of applications.

[0052] The ultra-flexible circuit board 10 uses insulating fabric as the substrate, which has excellent air permeability and flame retardancy; the insulating adhesive layer 2 is made of thermally conductive insulating adhesive, which has excellent thermal conductivity and high voltage resistance. As a result, the heat generated by the circuit board can be quickly dissipated from the substrate layer, the heat dissipation performance is improved, the heat dissipation problem of flexible light source module is solved, and the LED power is no longer limited, so it can be used in various lighting fixtures.

[0053] In a preferred embodiment, the ultra-flexible circuit board 10 is further provided with a drive circuit, and drive components are attached to the ultra-flexible circuit board 10 to form a drive circuit, thereby eliminating the need for an external drive power supply.

[0054] Reference Figures 1 to 3An embodiment of the light-emitting body of this utility model is proposed:

[0055] A light-emitting device includes a carrier and a flexible light source module attached to the carrier. The flexible light source module has the same structure as the flexible light source module in the embodiments described above, including an ultra-flexible circuit board 10 and an LED chip 20 attached to the ultra-flexible circuit board 10. The ultra-flexible circuit board 10 includes a substrate layer 1, an insulating adhesive layer 2, a copper foil circuit layer 3, and an encapsulation layer 4. The substrate layer 1 is a fabric layer made of insulating cloth, and the insulating adhesive layer 2 is a thermally conductive insulating adhesive layer made of thermally conductive insulating adhesive. The insulating adhesive layer 2 covers the fabric layer, and the fabric layer and the copper foil circuit layer 3 are bonded together by the insulating adhesive layer 2. The encapsulation layer 4 is coated on the surface of the circuit board, covering the copper foil circuit layer 3, and leaving electrical contacts for connecting the LED chip 20.

[0056] The substrate layer 1 of the ultra-flexible circuit board 10 is an insulating fabric layer with good breathability, flexibility, and bendability; the insulating adhesive layer 2 is a thermally conductive insulating adhesive layer, used for heat conduction, insulation, and adhesion. The flexible light source module can perfectly fit various curved and flat carriers. The flexible light source module can be cut, folded, or spliced ​​into the required shape according to needs and then attached to the carrier, so the shape of the carrier is no longer limited. The carrier can be a planar or three-dimensional structure, such as a disc, ring, polyhedron, etc. In this embodiment, the carrier is a disc-shaped lamp housing, and the flexible light source module is laid flat and attached inside the lamp housing.

[0057] The carrier can be made of a thermally conductive or non-thermally conductive material. In this embodiment, the carrier is a thermally conductive carrier made of a thermally conductive material, and the flexible light source module is bonded to the carrier with thermally conductive adhesive. The flexible light source module can perfectly fit and contact various curved and flat carriers, increasing the thermal conductivity area. The heat generated by the flexible light source module during operation is dissipated through the thermally conductive insulating adhesive layer and the fabric layer, and can be quickly conducted to the carrier. The carrier and the air medium then conduct heat away from the power heating devices in the circuit through the principle of heat exchange, improving heat dissipation performance. Overall, the product lifespan is extended, and light damage is reduced. As a result, the brightness and shape of the light source are no longer limited, and it can be used in various types of lamps.

[0058] When the carrier is a non-thermal conductive material, the flexible light source module is bonded to the carrier with thermally conductive adhesive. The carrier has heat dissipation holes at the position opposite to the flexible light source module, and heat is dissipated from the heat dissipation holes.

[0059] Furthermore, the carrier is equipped with mounting grooves adapted to the flexible light source module. The flexible light source module is installed in the mounting grooves, which are filled with thermally conductive adhesive to improve heat dissipation efficiency. Moreover, the flexible light source module is recessed into the mounting grooves, with the front end of the flexible light source module flush with the light source surface of the carrier, allowing the outer cover to be installed close to the light source surface of the carrier.

[0060] In a preferred embodiment, the ultra-flexible circuit board is further provided with driving circuitry. Driving components are attached to the ultra-flexible circuit board to form a driving circuit, thereby forming a flexible light source module with driving capability, so that the light emitter no longer needs to be equipped with a driving power supply.

[0061] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. An ultra-flexible circuit board, comprising a substrate layer, an insulating adhesive layer, and a circuit layer, characterized in that, The substrate layer is an insulating fabric layer or a high-temperature resistant paper layer. The insulating adhesive layer covers the substrate layer, and the substrate layer and the circuit layer are bonded together by the insulating adhesive layer.

2. The ultra-flexible circuit board according to claim 1, characterized in that, The insulating adhesive layer is a thermally conductive insulating adhesive layer made of thermally conductive insulating adhesive.

3. The ultra-flexible circuit board according to claim 1, characterized in that, The insulating fabric is a polymer fiber fabric.

4. The ultra-flexible circuit board according to claim 1, 2, or 3, characterized in that, It also includes an encapsulation layer covering the upper layer, which is a flexible insulating layer.

5. The ultra-flexible circuit board according to claim 4, characterized in that, The encapsulation layer is made of flexible insulating varnish or a flexible resin layer.

6. A flexible light source module, characterized in that, It includes the ultra-flexible circuit board according to any one of claims 1-5 and the LED chip attached to the ultra-flexible circuit board.

7. The flexible light source module according to claim 6, characterized in that, The ultra-flexible circuit board is provided with driving lines, and components for driving and controlling the light source are attached to the ultra-flexible circuit board to form a driving circuit.

8. A light-emitting body, comprising a carrier and at least one flexible light source module attached to the carrier, characterized in that, The flexible light source module is the flexible light source module according to any one of claims 6-7.

9. The light-emitting body according to claim 8, characterized in that, The flexible light source module is bonded to the carrier with thermally conductive adhesive, and the carrier is a thermally conductive carrier made of thermally conductive material.

10. The light emitter according to claim 8, characterized in that, The flexible light source module is bonded to the carrier with thermally conductive adhesive, and the carrier has heat dissipation holes at the position opposite to the flexible light source.

11. The light emitter according to claim 8, 9, or 10, characterized in that, The carrier is provided with a mounting groove adapted to the flexible light source module, and the flexible light source module is installed in the mounting groove.

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