Circuit board high-speed chip mounter

Abstract

The utility model relates to the technical field of circuit board processing, and discloses a circuit board high-speed chip mounter, which comprises a transmission table, an adjusting assembly, a support plate, a position catcher, a catching head, a controller and a cold and hot all-in-one machine, and is characterized in that the top of the transmission table is provided with the adjusting assembly, and the bottom of the adjusting assembly is fixedly provided with the support plate; the device has the advantages that the adsorption assembly is arranged, impact force generated in adsorption and fixation can be buffered, a circuit board is conveniently protected, the circuit board is prevented from being damaged by the adsorption impact force, the position trapper, the trapping head, the controller and the cold and hot all-in-one machine are arranged, and the adsorption assembly is arranged on the circuit board, so that the circuit board is prevented from being damaged by the adsorption impact force. The temperature around the capturing head can be kept constant, fogging on the surface of the capturing head is effectively avoided, detection fuzziness caused by fog is reduced, positioning of the position capturing device is more accurate, detection errors of the position capturing device are prevented, and the accuracy of the circuit board high-speed chip mounter is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a high-speed circuit board placement machine. Background Technology

[0002] The main function of a high-speed chip mounter is to quickly and accurately mount a large number of electronic components onto a circuit board. High-speed chip mounters can automatically complete the installation and soldering of a large number of components, which greatly improves production efficiency compared to manual operation.

[0003] Chinese patent CN220326161U discloses a high-speed chip mounter for SMI production lines, including a machine body with a mounting cavity. A slide rail is fixedly mounted on the inner wall of the mounting cavity, and a connecting rod is movably mounted within the slide rail. This invention, through the inclusion of a mounting box, a central control module, a battery, a push rod motor, a limit rod, a conductive plate, a connecting piece, conductive posts, and a negative terminal post, allows for a system where, during chip mounting, if the circuit board is misaligned, a position sensor sends a misalignment signal to the central control module. The central control module then activates the push rod motor, which pushes the conductive plate. The conductive plate then moves two conductive posts on one side, causing one conductive post to align with the positive terminal of the battery, and the other conductive post to align with the positive terminal post. At this point, an alarm is activated, alerting workers to the misalignment of the circuit board and prompting timely adjustment, thereby reducing the probability of defects and ensuring the production quality of the circuit board.

[0004] The above solution uses a receiving plate to catch components that fall during placement, preventing damage and reducing production losses. However, this solution does not protect the capture head in the position capture device, making it susceptible to surface fogging due to temperature differences. Fogging on the capture head affects the detection position and can lead to errors in placement by high-speed board placement machines. Utility Model Content

[0005] The purpose of this invention is to provide a high-speed chip mounter for circuit boards to solve the problems mentioned in the background art.

[0006] To address the above problems, this utility model provides a technical solution:

[0007] A high-speed chip mounter for circuit boards includes a transfer table, an adjustment assembly, a support plate, a position catcher, a catch head, a controller, and a heating and cooling integrated unit. The adjustment assembly is disposed on the top of the transfer table, the support plate is fixedly mounted on the bottom of the adjustment assembly, the position catcher is fixedly mounted on the bottom of the support plate, the catch head is fixedly mounted on the bottom of the position catcher, the controller is fixedly mounted on one side of the position catcher, and the heating and cooling integrated unit is fixedly mounted on one side of the controller.

[0008] As a preferred embodiment of this utility model, the bottom of the support plate is provided with an adsorption component, and a tin placement box is fixedly installed on the other side of the transmission table. The transmission table has symmetrically opened transmission slots inside, and transmission rollers are fixedly installed inside both transmission slots to facilitate the transmission of circuit boards and make the transmission more convenient.

[0009] As a preferred embodiment of this utility model, the adjustment component includes a lower electric slide rail, which is fixedly installed on one side of the transmission table. A lower track block is slidably connected to the outer end of the lower electric slide rail, and a fixing block is fixedly installed on the top of the lower track block, which can drive the adsorption head to adjust back and forth.

[0010] As a preferred embodiment of this utility model, an upper electric slide rail is fixedly installed on one side of the fixing block, an upper track block is slidably connected to the outer end of the upper electric slide rail, and a cylinder is fixedly installed on one side of the upper track block, which can drive the adsorption head to adjust left and right, and at the same time drive the adsorption head to adjust up and down.

[0011] In a preferred embodiment of this utility model, the adsorption assembly includes an adsorber, which is fixedly installed on the top of the support plate. An exhaust net is fixedly installed on the top of the adsorber, and a connecting pipe is fixedly installed on the bottom of the adsorber and through the support plate, which can adsorb and fix the parts.

[0012] As a preferred embodiment of this utility model, an adsorption head is fixedly installed at the bottom of the connecting tube, a filter screen is fixedly installed inside the adsorption head, and multiple protective pads are installed at the bottom of the adsorption head to protect the circuit board being adsorbed.

[0013] The beneficial effects of this utility model are as follows: by setting up an adsorption component, the impact force generated during adsorption and fixation can be buffered, which helps protect the circuit board and avoids damage to the circuit board from the impact force of adsorption. By setting up a position capture device, a capture head, a controller, and a heating and cooling integrated machine, the temperature around the capture head can be kept constant, effectively preventing fogging on the surface of the capture head, reducing detection blurring caused by fog, making the position capture device more accurate, preventing errors in the position capture device detection, and improving the accuracy of the high-speed board placement machine. Attached Figure Description

[0014] For ease of explanation, this utility model is described in detail below with reference to the specific embodiments and accompanying drawings.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the adjustment component structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the adsorption component structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the anti-fogging mechanism of this utility model.

[0019] In the diagram: 1. Transmission table; 2. Adjustment component; 21. Lower electric slide rail; 22. Lower track block; 23. Fixing block; 24. Upper electric slide rail; 25. Upper track block; 26. Cylinder; 3. Support plate; 4. Position capture device; 5. Capture head; 6. Controller; 7. Integrated heating and cooling unit; 8. Adsorption component; 81. Adsorber; 82. Exhaust screen; 83. Connecting pipe; 84. Adsorption head; 85. Filter screen; 86. Protective pad; 9. Tin placement box; 10. Transmission trough; 11. Transmission roller. Detailed Implementation

[0020] The technical solutions of the present invention will now be clearly and completely described with reference to the accompanying drawings of the embodiments of the present invention. Example 1

[0021] Please see Figure 1-4 This utility model provides a technical solution: a high-speed board placement machine, including a transfer table 1, an adjustment component 2, a support plate 3, a position catcher 4, a catcher head 5, a controller 6, and a cooling and heating integrated machine 7. The top of the transfer table 1 is provided with the adjustment component 2, the bottom of the adjustment component 2 is fixedly installed with the support plate 3, the bottom of the support plate 3 is fixedly installed with the position catcher 4, the position catcher 4 facilitates the positioning of the board, the bottom of the position catcher 4 is fixedly installed with the catcher head 5, the side of the position catcher 4 is fixedly installed with the controller 6, and the side of the controller 6 is fixedly installed with the cooling and heating integrated machine 7. The cooling and heating integrated machine 7 uses Freon to achieve the principle of cooling and heating. In a cooling and heating integrated machine 7 system, Freon is compressed by a compressor for recycling. The bottom of the support plate 3 is provided with an adsorption component 8, the other side of the transfer table 1 is fixedly installed with a solder placement box 9, and the transfer table 1 has symmetrically opened transfer grooves 10 inside, and transfer rollers 11 are fixedly installed inside both transfer grooves 10.

[0022] The staff inserts the circuit board into the transmission groove 10 and uses the transmission roller 11 to transfer the circuit board. When the equipment is in use, the controller 6 is started, and the controller 6 starts the integrated cooling and heating unit 7. The integrated cooling and heating unit 7 keeps the temperature constant on the capture head 5 at the bottom of the position capture device 4, which can effectively prevent fogging on the surface of the capture head 5. Example 2

[0023] The adjustment assembly 2 includes a lower electric slide rail 21, which is fixedly installed on one side of the transmission table 1. A lower track block 22 is slidably connected to the outer end of the lower electric slide rail 21. A fixing block 23 is fixedly installed on the top of the lower track block 22. An upper electric slide rail 24 is fixedly installed on one side of the fixing block 23. An electric motor is installed inside the lower electric slide rail 21 and the upper electric slide rail 24. It is supplied with electrical energy by a power source and converted into mechanical energy to drive the movement of the slide rail. An upper track block 25 is slidably connected to the outer end of the upper electric slide rail 24. A cylinder 26 is fixedly installed on one side of the upper track block 25.

[0024] In high-speed surface mount technology (SMT), the lower electric slide rail 21 is activated, which drives the lower track block 22 for adjustment. The lower track block 22 drives the fixing block 23 for adjustment, which drives the upper electric slide rail 24 for adjustment. The upper electric slide rail 24 drives the upper track block 25 for adjustment. Then, the upper electric slide rail 24 is activated, which drives the upper track block 25 for adjustment. The upper track block 25 drives the capture head 5 for adjustment, adjusting the SMT component to the required position. The cylinder 26 is then activated, which drives the SMT component downwards, placing the SMT component onto the surface of the circuit board. Example 3

[0025] The adsorption assembly 8 includes an adsorber 81, which is fixedly installed on the top of the support plate 3. An exhaust screen 82 is fixedly installed on the top of the adsorber 81. A connecting pipe 83 is fixedly installed on the bottom of the adsorber 81 and through the support plate 3. An adsorption head 84 is fixedly installed at the bottom of the connecting pipe 83. A filter screen 85 is fixedly installed inside the adsorption head 84. Multiple protective pads 86 are installed on the bottom of the adsorption head 84.

[0026] Start the adsorber 81, which draws in air and exhausts it through the exhaust net 82. The adsorber 81 sucks the iron sheet parts onto the surface of the protective pad 86. During the adsorption process, the filter net 85 filters out impurities in the air.

[0027] In summary, the working principle of this technical solution is as follows: The operator places the circuit board inside the transfer groove 10, and the transfer roller 11 transports the circuit board. The suction unit 81 is activated, drawing in air, which is then expelled using the exhaust screen 82. The suction unit 81 draws the iron sheet parts onto the surface of the protective pad 86. During the suction process, the filter screen 85 filters impurities from the air. In high-speed placement, the lower electric slide rail 21 is activated, driving the lower track block 22 for adjustment. The lower track block 22 then drives the fixing block 23 for adjustment, and the fixing block 23 is powered on. The upper electric slide rail 24 is adjusted, and the upper electric slide rail 24 drives the upper track block 25 to adjust. Then, the upper electric slide rail 24 is started, and the upper electric slide rail 24 drives the upper track block 25 to adjust. The upper track block 25 drives the capture head 5 to adjust, and the patch part is adjusted to the required position. The cylinder 26 is started, and the cylinder 26 drives the patch part to adjust downward, so that the patch is attached to the surface of the circuit board. When the equipment is in use, the controller 6 is started, and the controller 6 starts the integrated cooling and heating machine 7. The integrated cooling and heating machine 7 keeps the capture head 5 at the bottom of the position capture device 4 at a constant temperature, which can effectively prevent fogging on the surface of the capture head 5.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-speed chip mounter for circuit boards, characterized in that, The device includes a transmission platform (1), an adjustment component (2), a support plate (3), a position catcher (4), a catcher head (5), a controller (6), and a cooling and heating unit (7). The top of the transmission platform (1) is provided with the adjustment component (2), the bottom of the adjustment component (2) is fixedly installed with the support plate (3), the bottom of the support plate (3) is fixedly installed with the position catcher (4), the bottom of the position catcher (4) is fixedly installed with the catcher head (5), the side of the position catcher (4) is fixedly installed with the controller (6), and the side of the controller (6) is fixedly installed with the cooling and heating unit (7).

2. The high-speed chip mounter for circuit boards according to claim 1, characterized in that, The bottom of the support plate (3) is provided with an adsorption component (8), and a tin placement box (9) is fixedly installed on the other side of the transmission platform (1). The transmission platform (1) is symmetrically provided with transmission grooves (10), and transmission rollers (11) are fixedly installed inside the two transmission grooves (10).

3. A high-speed chip mounter for circuit boards according to claim 1, characterized in that, The adjustment component (2) includes a lower electric slide rail (21), which is fixedly installed on one side of the transmission platform (1). The lower electric slide rail (21) is slidably connected to a lower track block (22) at its outer end, and a fixing block (23) is fixedly installed on the top of the lower track block (22).

4. A high-speed chip mounter for circuit boards according to claim 3, characterized in that, An upper electric slide rail (24) is fixedly installed on one side of the fixed block (23), and an upper track block (25) is slidably connected to the outer end of the upper electric slide rail (24). A cylinder (26) is fixedly installed on one side of the upper track block (25).

5. A high-speed chip mounter for circuit boards according to claim 2, characterized in that, The adsorption assembly (8) includes an adsorber (81), which is fixedly installed on the top of the support plate (3). An exhaust net (82) is fixedly installed on the top of the adsorber (81), and a connecting pipe (83) is fixedly installed on the bottom of the adsorber (81) and through the support plate (3).

6. A high-speed chip mounter for circuit boards according to claim 5, characterized in that, An adsorption head (84) is fixedly installed at the bottom of the connecting tube (83), a filter screen (85) is fixedly installed inside the adsorption head (84), and multiple protective pads (86) are installed at the bottom of the adsorption head (84).

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