Lightweight photovoltaic backboard with heat dissipation module

Abstract

The utility model discloses a light photovoltaic backplane with a heat dissipation module, which comprises a backplane body, a heat dissipation sheet and a fixing rod, the outer surface of the backplane body is sequentially provided with an anti-ultraviolet coating and a self-cleaning coating from inside to outside, the outer side of the backplane body is provided with a plurality of clamping grooves, and the clamping grooves are connected with the heat dissipation sheet. A clamping groove is formed in the outer side of the plate body, a threaded spiral groove used for fixing a fixing rod is formed in the outer side of the plate body, the cooling fin is inserted into the clamping groove in a penetrating mode, a heat conduction glue layer is arranged on the left side of the cooling fin, and the fixing rod is inserted into the cooling fin in a penetrating mode and fixedly connected with the plate body through a screw. According to the light photovoltaic backboard, through the arrangement of the clamping grooves, the cooling fins and the heat conduction glue layer, the cooling effect can be adjusted under the condition that the use of the light photovoltaic backboard is not affected, and meanwhile through the arrangement of the fixing rods, the fixing effect of the cooling fins can be improved, and the cooling fins are prevented from falling off.

Description

Technical Field

[0001] This utility model relates to the field of lightweight photovoltaic backsheet technology, specifically a lightweight photovoltaic backsheet with a heat dissipation module. Background Technology

[0002] Lightweight photovoltaic (PV) backsheets are lightweight encapsulation materials used in solar cell modules. They are significantly lighter than traditional PV backsheets, helping to reduce the overall weight of the PV module and facilitating handling and installation. Despite their light weight, lightweight PV backsheets still possess sufficient strength to withstand certain external forces and impacts, ensuring the structural safety of the PV module. However, lightweight PV backsheets typically require heat dissipation during use. Since their heat dissipation performance is fixed at the factory and cannot be adjusted to meet specific needs, their application range is limited, presenting certain shortcomings. Utility Model Content

[0003] The present invention aims to solve the problems existing in the prior art or related technologies.

[0004] Therefore, the technical solution adopted by this utility model is as follows: a lightweight photovoltaic backsheet with a heat dissipation module, comprising a plate body, a heat sink, and a fixing rod. Several slots are provided on the outer side of the plate body, the heat sink is inserted into the slots, a thermally conductive adhesive layer is provided on the left side of the heat sink, the fixing rod is inserted into the heat sink, and the fixing rod is fixedly connected to the plate body by screws.

[0005] Preferably, the outer surface of the plate is provided with an anti-ultraviolet coating and a self-cleaning coating from the inside out, and the anti-ultraviolet coating is formed by spraying UV paint.

[0006] Preferably, the outer side of the plate is provided with a threaded groove for fixing the fixing rod.

[0007] Preferably, the plurality of card slots are equidistantly distributed, and the cross-section of the plurality of card slots is rectangular.

[0008] Preferably, the thermally conductive adhesive layer is formed by uniformly applying thermally conductive adhesive onto the heat sink.

[0009] Preferably, two fixing rods are provided, and each fixing rod has several grooves on its inner side and mounting holes on its two fixing rods.

[0010] By adopting the above technical solution, the beneficial effects achieved by this utility model are as follows: By setting a slot, heat sink, and thermally conductive adhesive layer, the heat dissipation effect can be adjusted without affecting the use of the lightweight photovoltaic backsheet. At the same time, by setting a fixing rod, the fixing effect of the heat sink can be improved, preventing the heat sink from falling off. In use, the user can apply thermally conductive adhesive to one end of the heat sink, which forms a thermally conductive adhesive layer. Then, the heat sink is aligned with any slot on the board and snapped in. After snapping in, it is bonded with thermally conductive adhesive. Then, any number of heat sinks can be installed according to the above method. The more heat sinks there are, the larger the contact area between the backsheet and the air, and the better the heat dissipation effect. It can be adjusted according to actual needs, and has a wide range of applications. At the same time, the groove of the fixing rod can be aligned with the heat sink and snapped in. After snapping in, the fixing rod is moved so that the mounting hole is aligned with the threaded groove on the board. After alignment, the screw is passed through the mounting hole and connected to the threaded groove to fix the fixing rod. After fixing, several heat sinks can be fixed by the fixing rod, which can improve the fixing effect of the heat sink and prevent the heat sink from falling off. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model;

[0012] Figure 2 This utility model Figure 1 Schematic diagram of the middle plate structure;

[0013] Figure 3 This utility model Figure 1 Schematic diagram of the outer surface structure of the middle plate;

[0014] Figure 4 This utility model Figure 1 Schematic diagram of the heat sink structure;

[0015] Figure 5 This utility model Figure 1 A schematic diagram of the structure of the fixed rod in the middle.

[0016] Figure label:

[0017] 100. Plate body; 101. UV-resistant coating; 102. Self-cleaning coating; 110. Slot; 120. Threaded groove;

[0018] 200. Heat sink; 201. Thermal adhesive layer;

[0019] 300, fixing rod; 301, groove; 302, mounting hole. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features of the present utility model can be combined with each other.

[0021] The following description, in conjunction with the accompanying drawings, describes some embodiments of the present invention, providing a lightweight photovoltaic backsheet with a heat dissipation module.

[0022] Reference Figure 1-5 This is the first embodiment of the present invention. This embodiment provides a lightweight photovoltaic backsheet with a heat dissipation module, including a plate body 100, a heat sink 200 and a fixing rod 300.

[0023] Specifically, the outer side of the panel 100 is provided with several slots 110, which are equidistantly distributed and have rectangular cross-sections. The outer surface of the panel 100 is provided with an anti-UV coating 101 and a self-cleaning coating 102 from the inside out. The anti-UV coating 101 is formed by spraying UV paint. The outer side of the panel 100 is provided with threaded grooves 120 for fixing the fixing rod 300. In use, the slots 110 are used to install the heat sink 200 so that heat can be dissipated through the heat sink 200. The anti-UV coating 101 can effectively block the damage of ultraviolet rays to the back panel and extend the service life of the back panel. The self-cleaning coating 102 can prevent dust from accumulating on the surface of the back panel, keep it clean, and improve the power generation efficiency of the photovoltaic module.

[0024] Specifically, the heat sink 200 is inserted inside the slot 110. A thermally conductive adhesive layer 201 is provided on the left side of the heat sink 200. The thermally conductive adhesive layer 201 is formed by uniformly applying thermally conductive adhesive to the heat sink 200. In use, the user can apply thermally conductive adhesive to one end of the heat sink 200 to form the thermally conductive adhesive layer 201. Then, the heat sink 200 is aligned with any slot 110 on the board 100 and snapped in place. After snapping in place, it is bonded with thermally conductive adhesive. Then, any number of heat sinks 200 can be installed in accordance with the above method. The more heat sinks 200 there are, the larger the contact area between the backplate and the air, and the better the heat dissipation effect. It can be adjusted according to actual needs, and has a wide range of applications.

[0025] Specifically, the fixing rod 300 is inserted into the heat sink 200 and is fixedly connected to the board 100 by screws. There are two fixing rods 300, and several grooves 301 are opened on the inner side of each fixing rod 300. There are mounting holes 302 on the two fixing rods 300. In use, the grooves 301 of the fixing rod 300 can be aligned with the heat sink 200 and snapped in place. After snapping in place, the fixing rod 300 can be moved so that the mounting holes 302 are aligned with the threaded grooves 120 on the board 100. After alignment, the screws are passed through the mounting holes 302 and connected to the threaded grooves 120 to fix the fixing rod 300. After fixing, several heat sinks 200 can be fixed by the fixing rod 300, which can improve the fixing effect of the heat sinks 200 and prevent the heat sinks 200 from falling off.

[0026] The working principle and usage process of this utility model are as follows: In use, the user can apply thermally conductive adhesive to one end of the heat sink 200, forming a thermally conductive adhesive layer 201. Then, align the heat sink 200 with any slot 110 on the board 100 and snap it in place. After snapping, it can be bonded using thermally conductive adhesive. Then, install any number of heat sinks 200 according to the above method. The more heat sinks 200 there are, the larger the contact area between the backplate and the air, and the better the heat dissipation effect. This can be adjusted according to actual needs, resulting in a wide range of applications. Simultaneously, the groove 301 of the fixing rod 300 can be aligned with the heat sink 200 and snapped in place. After snapping, move the fixing rod 300 so that the mounting hole 302 aligns with the threaded groove 120 on the board 100. After alignment, pass the screw through the mounting hole 302 and connect it to the threaded groove 120 to fix the fixing rod 300. After fixing, several heat sinks 200 can be fixed using the fixing rod 300, improving the fixing effect of the heat sink 200 and preventing it from falling off.

[0027] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A lightweight photovoltaic backsheet with a heat dissipation module, characterized in that, include: The outer side of the plate (100) is provided with several slots (110); the heat sink (200) is inserted into the slots (110), and the left side of the heat sink (200) is provided with a thermally conductive adhesive layer (201). A fixing rod (300) is inserted through the heat sink (200), and the fixing rod (300) is fixedly connected to the plate (100) by screws.

2. A lightweight photovoltaic backsheet with a heat dissipation module according to claim 1, characterized in that, The outer surface of the plate (100) is provided with an anti-ultraviolet coating (101) and a self-cleaning coating (102) from the inside to the outside. The anti-ultraviolet coating (101) is formed by spraying UV paint.

3. A lightweight photovoltaic backsheet with a heat dissipation module according to claim 1, characterized in that, The outer side of the plate (100) is provided with a threaded groove (120) for fixing the fixing rod (300).

4. A lightweight photovoltaic backsheet with a heat dissipation module according to claim 1, characterized in that, Several card slots (110) are equidistantly distributed, and the cross-section of each of the several card slots (110) is rectangular.

5. A lightweight photovoltaic backsheet with a heat dissipation module according to claim 1, characterized in that, The thermally conductive adhesive layer (201) is formed by uniformly applying thermally conductive adhesive onto the heat sink (200).

6. A lightweight photovoltaic backsheet with a heat dissipation module according to claim 1, characterized in that, Two fixing rods (300) are provided, and several grooves (301) are opened on the inner side of each fixing rod (300).

7. A lightweight photovoltaic backsheet with a heat dissipation module according to claim 6, characterized in that, The two fixing rods (300) are provided with mounting holes (302).

Images