Slicing mechanism for silicon wafers

Abstract

The utility model relates to the technical field of silicon wafer separating devices, in particular to a silicon wafer separating mechanism which is arranged close to the water surface of a cleaning pool and comprises a frame body and a conveying assembly, and the conveying assembly is of a belt conveying structure; the adsorption assembly is used for adsorbing the silicon wafer below a belt in the belt transmission structure, so that the silicon wafer moves along with the belt in water; and the spray head is used for spraying water between the silicon wafers so as to realize separation of the adjacent silicon wafers. According to the invention, a mode of wafer separation in water is adopted, buoyancy of water is utilized, and silicon wafers are separated in a mode of spraying water into water, so that excessive suction during wafer suction is prevented, and the reliability of equipment is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer separating device, in particular to a silicon wafer separating mechanism. BACKGROUND

[0002] There are a large number of impurities on the surface of the silicon wafer after processing, and the impurities will cause a large number of defects in the product, so the silicon wafer needs to be cleaned. After the degumming machine completes the degumming work, the silicon wafer is sent to the wafer inserting machine by the tray, and the silicon wafer is inserted into the flower basket for cleaning by the cleaning machine. The water absorption plate assembly is needed to separate the silicon wafer and insert it into the flower basket during the wafer inserting process. CONTENT

[0003] The technical problem to be solved by the present application is that the existing silicon wafer after degumming is adhered together and is difficult to separate.

[0004] Therefore, the present application provides a silicon wafer separating mechanism.

[0005] The technical scheme adopted by the present application to solve the technical problem is:

[0006] A silicon wafer separating mechanism is arranged close to the water surface of a cleaning pool, comprising,

[0007] a frame body, and

[0008] a transmission assembly, which is a belt transmission structure;

[0009] an adsorption assembly, which is used for adsorbing the silicon wafer below the belt in the belt transmission structure, so that the silicon wafer moves with the belt in the water;

[0010] a nozzle, which is used for spraying water towards the silicon wafers to separate the adjacent silicon wafers.

[0011] Further, a plurality of nozzles are arranged, and the plurality of nozzles are front nozzles and side nozzles respectively, and the front nozzles and the side nozzles spray water towards the silicon wafer layer from different directions.

[0012] Further, the transmission assembly comprises a main plate, a belt and a motor, the main plate is fixedly connected between the frame bodies, main shafts are rotatably connected between the frame bodies, the motor is connected to the frame bodies for driving the main shafts to rotate, the main shafts are located above the main plate, a plurality of first rollers are coaxially connected to the main shafts, second rollers are rotatably connected to the front ends and the rear ends of the main plate, and the belt is wound on the first rollers and the second rollers.

[0013] Further, the motor is a stepping motor.

[0014] Further, the main plate is inclinedly arranged, and the front end of the main plate is located below the rear end.

[0015] Further, the adsorption assembly comprises a water suction pipe, a water suction end of the water suction pipe is arranged towards the main plate, and the main plate is a water permeable plate.

[0016] Further, the adsorption assembly further comprises a support, and the water suction pipe is arranged above the main plate through the support.

[0017] Further, a silicon wafer sensor is connected to the front end of the main plate, and the silicon wafer sensor is electrically connected with the spray head.

[0018] The beneficial effects of the utility model are that the belt below the main plate is transmitted towards the front end, the front spray head and the side spray head spray water towards the silicon wafer layer at the same time, so as to separate the adjacent silicon wafers, and the single wafer adsorption transmission of the silicon wafer is realized. In the mechanism, the main plate is below the water surface, so that the silicon wafers can be blown apart to realize wafer separation under the combined action of the water buoyancy and the spray head in water.

[0019] The wafer separation mode in water is adopted, the force acting on the silicon wafer is small, so the silicon wafer is not damaged and the product breakage rate is reduced, and the wafer separation effect is better by utilizing the water buoyancy. The silicon wafers are separated by spraying water in water, so that the silicon wafers are not sucked too much during wafer suction, and the equipment reliability is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0020] The utility model is further described below in combination with the drawings and embodiments.

[0021] Figure 1 It is the overall structure schematic view of the wafer separation mechanism in the utility model.

[0022] Figure 2 It is the structure schematic view of the position relationship between the front spray head and the side spray head in the utility model.

[0023] In the drawing: 1, frame body; 2, transmission assembly; 21, main plate; 22, belt; 23, motor; 24, first roller; 25, second roller; 26, main shaft; 3, adsorption assembly; 31, water suction pipe; 32, support; 4, wafer separation assembly; 41, front spray head; 42, side spray head. DETAILED DESCRIPTION

[0024] The utility model will be further described in combination with the drawings. These drawings are all simplified schematic views, and only illustrate the basic structure of the utility model in a schematic manner, so that only the structures related to the utility model are shown.

[0025] In the description of the utility model, it is necessary to understand that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the utility model. Furthermore, the features limited by "first" and "second" can explicitly or implicitly include one or more features. In the description of the utility model, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0026] In the description of the utility model, it should be explained that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0027] A silicon wafer splitting mechanism is arranged close to the water surface of a cleaning tank, comprising a frame body 1, a transmission assembly 2, an adsorption assembly 3 and a splitting assembly 4.

[0028] The transmission assembly 2 comprises a main plate 21, a belt 22 and a motor 23, the main plate 21 is fixedly connected between the frame bodies 1, the main plate 21 is located below the water surface, the main plate 21 is arranged obliquely, a main shaft 26 is rotatably connected between the frame bodies 1, the motor 23 is connected to the frame body 1, the main shaft 26 is connected to the output end of the motor 23, the motor 23 adopts a stepping motor 23, the main shaft 26 is located above the main plate 21, a plurality of first rollers 24 are coaxially connected to the main shaft 26, the two sides of the front end and the two sides of the rear end of the main plate 21 are rotatably connected with second rollers 25, the belt 22 is wound on the first rollers 24 and the second rollers 25, the belt 22 passes through the bottom of the main plate 21, and the silicon wafer floated from the cleaning tank is driven to move in the water towards the front end of the main plate 21.

[0029] The adsorption assembly 3 comprises a water suction pipe 31 and a support 32, the water suction pipe 31 is connected between the frame bodies 1 through the support 32, the water suction end of the water suction pipe 31 is arranged towards the main plate 21, the main plate 21 is a water-permeable plate, the water suction pipe 31 sucks the water on the silicon wafer through the main plate 21, and the silicon wafer is adsorbed on the belt 22, and the silicon wafer and the belt 22 are driven to realize transmission by friction.

[0030] The fragmentation assembly 4 comprises a plurality of spray heads, which are front spray heads 41 and side spray heads 42 respectively, and the front spray heads 41 and the side spray heads 42 are arranged below the main plate 21, the front spray heads 41 are arranged close to the rear end of the main plate 21, and the front spray heads 41 spray water forward along the plane where the main plate 21 is located, and the side spray heads 42 are arranged in two, and the two side spray heads 42 are arranged on both sides of the main plate 21, after the silicon wafers are adsorbed on the belt 22 below the main plate 21, there may be a situation that a plurality of silicon wafers are adsorbed and transmitted in a stacked manner, at this time, the front spray heads 41 and the side spray heads 42 spray water towards the gap between the silicon wafers to separate the silicon wafers, so that the silicon wafers are fragmented and single- wafer adsorption and transmission are realized.

[0031] The implementation principle of the present application is:

[0032] After the silicon wafers are degreased, the silicon wafers in the material support are stacked together, the silicon wafers stacked together are adsorbed below the main plate 21 by the water suction pipe 31, and are transmitted towards the front end through the belt 22 below the main plate 21, the front end of the main plate 21 is connected with a silicon wafer inductor, when the silicon wafer inductor senses the silicon wafers, the front spray heads 41 and the side spray heads 42 are opened, the front spray heads 41 and the side spray heads 42 spray water towards the gap between the silicon wafer layers at the same time, so as to separate the adjacent silicon wafers, and realize single- wafer adsorption and transmission of the silicon wafers. In the mechanism, the main plate 21 is located below the water surface, so that the silicon wafers can be blown apart to realize fragmentation by the water buoyancy and the effect of the spray heads. The front end of the main plate 21 can also be connected with a guide wheel to guide the transmission of the silicon wafers.

[0033] The water fragmentation method has small force acting on the silicon wafers, so it will not damage the silicon wafers and reduce the product breakage rate, and the water buoyancy can make the fragmentation effect better. The water in the water is sprayed to separate the silicon wafers, prevent multiple adsorption when the silicon wafers are adsorbed, and ensure the reliability of the equipment.

[0034] Based on the above ideal embodiments of the present application, through the above description, relevant personnel can make various changes and modifications without deviating from the technical idea of the present application. The technical scope of the present application is not limited to the contents in the specification, and must be determined by the scope of the claims.

Claims

1. A silicon wafer slicing mechanism, wherein the mechanism is disposed near the water surface of a cleaning tank, characterized in that, The utility model relates to a silicon wafer cleaning device, including, Frame body (1) and, Transmission assembly (2), the transmission assembly (2) is the belt (22) transmission structure; Suction assembly (3) is used for suctioning silicon wafer below the belt (22) in the belt (22) transmission structure, so that silicon wafer moves with the belt (22) in water; Spray head is provided with multiple, multiple spray head is front spray head (41) and side spray head (42) respectively, and front spray head (41) and side spray head (42) are watered to silicon wafer layer from different directions, to realize adjacent silicon wafer separation; The transmission assembly (2) includes main plate (21), belt (22) and motor (23), the main plate (21) is fixedly connected between frame body (1), the frame body (1) is rotatably connected with main shaft (26), the motor (23) is connected on frame body (1) and is used to drive main shaft (26) rotation, the main shaft (26) is located above main plate (21), a plurality of first pulley (24) are coaxially connected on the main shaft (26), the both sides of the front end of main plate (21) and the both sides of the rear end are rotatably connected second pulley (25), the belt (22) is around first pulley (24) and second pulley (25) The main plate (21) is below water level, and the belt (22) passes the bottom of main plate (21), and drives the silicon wafer floated from the cleaning pool to move in water towards the front end of main plate (21).

2. The silicon wafer dicing mechanism of claim 1, wherein, The motor (23) is a stepper motor (23).

3. The silicon wafer dicing mechanism of claim 1, wherein, The main plate (21) is inclinedly arranged, and the front end of the main plate (21) is below the rear end.

4. The silicon wafer dicing mechanism of claim 1, wherein, The suction assembly (3) includes water suction pipe (31), and the water suction end of the water suction pipe (31) is arranged towards the main plate (21), and the main plate (21) is a water-permeable plate.

5. The silicon wafer dicing mechanism of claim 4, wherein, The suction assembly (3) further includes support (32), and the water suction pipe (31) is arranged above the main plate (21) through the support (32).

6. The silicon wafer dicing mechanism of claim 1, wherein, The front end of the main plate (21) is connected with a silicon wafer sensor, and the silicon wafer sensor is electrically connected with the spray head.

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