Chemical mechanical polishing device

Abstract

The utility model provides a chemical mechanical grinding device which comprises a grinding disc, a grinding pad and a vacuum adsorption assembly. The grinding disc is provided with a central first groove and a surrounding second groove; the grinding pad is provided with a bulge which is matched with the first groove, so that accurate positioning is realized; a suction cup of the vacuum adsorption assembly is located in the second groove, connected with the vacuum pipeline through a branch pipeline and used for fixing the grinding pad. According to the device, the grinding pad is fixed in a vacuum adsorption mode, the problems that in a traditional adhesion mode, the grinding pad is not prone to being torn down and prone to being obliquely attached, and water enters the edge and fails are solved, rapid replacement, accurate positioning and stable adsorption are achieved, and the grinding effect and the equipment performance are improved. The fixing layer of the grinding pad can be made of Teflon or polyether ether copper and other materials, the number of the suction cups is not less than three, the suction cups can be uniformly or non-uniformly distributed, and the stability and the applicability are further enhanced. The grinding machine is simple in structure, convenient to operate and suitable for various grinding scenes including high-precision grinding, and therefore the grinding machine has a wide application range.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of wafer processing equipment relates to a chemical mechanical polishing device. BACKGROUND

[0002] In the semiconductor process, the wafer is an important raw material of semiconductor products, its main component is silicon, the outer contour is thin piece structure, usually also called silicon wafer, various circuit element structures can be processed on the wafer, and finally form a chip to realize the function control of circuit, which has the indispensable significance in high-end manufacturing industry.

[0003] Chemical mechanical polishing (CMP) is a key process in semiconductor manufacturing, which is used to realize the global planarization of wafer surface. The traditional CMP device usually uses adhesive method to fix the polishing pad on the polishing disc. This method has many problems: 1) difficult to replace: after long time use, the glue solidification causes the polishing pad difficult to tear off, and it takes a lot of time and manpower to replace, which affects the production efficiency. 2) risk of equipment damage: forcibly tearing off the polishing pad may damage the surface of the polishing disc, increasing the equipment maintenance cost. 3) residual glue problem: residual glue is difficult to clean, which affects the sticking effect of new polishing pad, may cause the polishing pad not to be fixed firmly, and shift during polishing, affecting the polishing precision. 4) inaccurate positioning: when manually sticking the polishing pad, there is lack of accurate positioning device, which is easy to stick skew, causing uneven distribution of polishing pressure, affecting the polishing effect and equipment stability. 5) risk of glue failure: during the CMP process, the polishing liquid and water may penetrate to the edge of the polishing pad, causing the glue to fail, which causes gap between the polishing pad and the polishing disc, affecting the edge polishing effect.

[0004] At present, it is necessary to provide a chemical mechanical polishing device to effectively solve the problems of difficult replacement of polishing pad, residual glue and inaccurate positioning in the prior art, reduce the risk of equipment damage and glue failure, and further improve the polishing effect and production efficiency.

[0005] It should be noted that the above introduction to the technical background is only to facilitate the clear and complete description of the technical scheme of the present application, and to facilitate the understanding of those skilled in the art. The above technical scheme cannot be considered as known to those skilled in the art only because it is described in the background section of the present application. CONTENT OF THE UTILITY MODEL

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a chemical mechanical polishing device to solve the problems of difficult replacement of polishing pad, residual glue and inaccurate positioning in the prior art, improve the polishing effect and production efficiency, and reduce the equipment maintenance cost.

[0007] To achieve the above object, the utility model provides a chemical mechanical polishing device, the chemical mechanical polishing device includes:

[0008] The grinding disc is provided with a first groove and a plurality of second grooves, the first groove is located at the center position of the grinding disc, and the second grooves are distributed around the first groove.

[0009] The grinding pad is provided with a protrusion, the protrusion is located at the center position of the grinding pad, and the cross -sectional shape of the protrusion is same with the cross -sectional shape of the first groove.

[0010] The vacuum adsorption assembly includes a plurality of suction cups and a vacuum pipeline, the number and position of the suction cup correspond to the second groove, and are connected to the vacuum pipeline through branch pipeline, and the grinding pad is fixed on the grinding disc through the suction cup.

[0011] Optionally, the cross -sectional shape of the first groove and the protrusion includes circle, regular polygon or irregular polygon, for positioning the relative position of the grinding disc and the grinding pad.

[0012] Optionally, the circumscribed circle diameter d1 of the cross -sectional shape of the first groove and the protrusion ranges from 50 to 200 mm.

[0013] Optionally, the depth h1 of the first groove ranges from 8 to 20 mm, the cross -sectional shape of the second groove is circle, the depth h2 of the second groove ranges from 15 to 40 mm, and the depth difference between the depth h3 of the protrusion and the depth h1 of the first groove ranges from 2 to 5 mm.

[0014] Optionally, the grinding pad includes a grinding layer and a fixed layer, and the protrusion is located at the fixed layer.

[0015] Optionally, the fixed layer includes one or a combination of Teflon fixed layer, polyether ether copper fixed layer.

[0016] Optionally, the second grooves are uniformly or non-uniformly distributed on the grinding disc.

[0017] Optionally, the suction cup includes one of silicone rubber suction cup, nitrile rubber suction cup, fluorine rubber suction cup or polyurethane rubber.

[0018] Optionally, the vacuum adsorption assembly further includes a vacuum source, a vacuum pressure sensor, a suction cup reset mechanism and a control valve.

[0019] Optionally, the control valve includes one of solenoid valve, manual valve or proportional valve.

[0020] The utility model provides a chemical mechanical polishing device, including the grinding disc, polishing pad and vacuum adsorption component. The grinding disc is equipped with the first recess groove of the central position and surrounds the second recess groove, the polishing pad is equipped with the protrusion matched with the first recess groove for accurate positioning, the vacuum adsorption component includes the sucking disc and vacuum pipeline, and the sucking disc is located in the second recess groove and connects the vacuum pipeline through the branch pipeline for adsorbing and fixing the polishing pad. The utility model discloses a polishing pad fixed through the vacuum adsorption mode, solves the problem of the traditional sticking mode that the polishing pad is not easy to tear off, easy to paste skew, edge water failure and the like, realizes quick replacement, accurate positioning and stable adsorption, improves the polishing effect and equipment performance. In addition, the fixed layer of polishing pad can adopt Teflon or polyether ether copper and the like, and the number of sucking disc is greater than or equal to 3, is evenly or unevenly distributed, and further enhances the stability and applicability. The utility model discloses simple structure, convenient operation is applicable to high-precision grinding scene. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The position structure schematic diagram of the polishing pad and the grinding disc when vacuum adsorption is shown in the utility model embodiment.

[0022] Figure 2 The explosion structure schematic diagram of the chemical mechanical polishing device provided by the utility model is shown.

[0023] Figure 3 The position structure schematic diagram of the polishing pad and the grinding disc when not vacuum adsorption is shown in the utility model embodiment.

[0024] Figure 4 The overhead structure schematic diagram of the first recess groove of the grinding disc of the utility model is circular and the second recess groove is evenly distributed.

[0025] Figure 5 The overhead structure schematic diagram of the first recess groove of the grinding disc of the utility model is an irregular polygon.

[0026] Figure 6 The overhead structure schematic diagram of the second recess groove of the grinding disc of the utility model is six.

[0027] MARKING OF DRAWINGS

[0028] 100 grinding disc

[0029] 110 first recess groove

[0030] 120 second recess groove

[0031] 200 polishing pad

[0032] 210 fixed layer

[0033] 211 protrusion

[0034] 220 polishing layer

[0035] 310 suction cup

[0036] 320 branch pipe DETAILED DESCRIPTION

[0037] The present application will be described in greater detail by way of specific embodiments, and as such, those skilled in the art can easily understand other advantages and functions of the present application from the contents disclosed in the specification. The present application can also be implemented or applied in other different embodiments, and each detail in the specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.

[0038] It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concept of the present application, and thus the diagrams only show the components related to the present application, not the number, shape and size of the components when actually implemented. The shape, number and proportion of each component when actually implemented can be arbitrarily changed, and the layout pattern of the components can also be more complex.

[0039] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0040] Referring to Figures 1-3 The chemical mechanical polishing device provided in the embodiments includes a polishing disc 100, a polishing pad 200 and a vacuum suction assembly (not labeled).

[0041] The polishing disc 100 is provided with a first groove 110 and a plurality of second grooves 120. The first groove 110 is located at the center of the polishing disc 100. The second grooves 120 are distributed around the first groove 110.

[0042] The polishing pad 200 is provided with a protrusion 211 located at the center of the polishing pad 200. The cross-sectional shape of the protrusion 211 is the same as that of the first groove 110.

[0043] The vacuum suction assembly includes a plurality of suction cups 310 and a vacuum pipe. The number and position of the suction cups 310 correspond to the second grooves 120, and the suction cups 310 are connected to the vacuum pipe through branch pipes 320. The polishing pad 200 is fixed to the polishing disc 100 through the suction cups 310.

[0044] Specifically, a high-precision grinding effect is achieved by ensuring a tight fit between the grinding disc 100 and the grinding pad 200. The grinding disc 100 is provided with a first groove 110 and multiple second grooves 120, wherein the number of second grooves 120 is at least three, ensuring the stable fixation and uniform force distribution of the grinding pad 200. The first groove 110 is located at the center of the grinding disc 100 and is used to match the protrusion 211 on the grinding pad 200, achieving precise positioning of the grinding disc 100 and the grinding pad 200. This center-positioning design not only improves the grinding accuracy but also reduces uneven grinding caused by positional deviations.

[0045] Furthermore, the grinding pad 200 is provided with the protrusion 211, which is located at the center of the grinding pad 200, and the cross-sectional shape of the protrusion 211 is the same as the cross-sectional shape of the first groove 110. The function of this structure is to achieve precise positioning between the grinding disc 100 and the grinding pad 200, ensuring accurate relative positioning during the grinding process. By matching the shape of the protrusion 211 with the first groove 110, the grinding pad 200 can be tightly embedded in the central groove of the grinding disc 100, thereby providing stable support and uniform grinding pressure distribution during the grinding process. This structure not only improves grinding accuracy but also enhances the stability of the grinding process and reduces uneven grinding caused by positional deviations. In addition, the matching design of the protrusion 211 and the first groove 110 simplifies the installation process of the grinding pad 200, reduces operational difficulty, and further improves the ease of use and maintenance efficiency of the equipment.

[0046] Furthermore, the vacuum adsorption assembly includes multiple suction cups 310 and a vacuum pipe. The number and position of the suction cups 310 correspond one-to-one with the second grooves 120 on the grinding disc 100, and are connected to the vacuum pipe via the branch pipe 320. When the vacuum pump is started, the air inside the suction cups 310 is extracted, creating a negative pressure. (See reference...) Figure 1 This design securely adheres the grinding pad 200 to the grinding disc 100. This not only improves the stability of the grinding pad 200 but also reduces replacement time and enhances the overall operating efficiency of the equipment. By rationally arranging the position and number of the suction cups 310, the distribution of vacuum adsorption force can be further optimized, ensuring the uniformity and stability of the grinding process.

[0047] As an example, the cross-sectional shape of the first groove 110 and the protrusion 211 includes a circle, a regular polygon, or an irregular polygon, for positioning the relative positions of the grinding disc 100 and the grinding pad 200.

[0048] Specifically, referring to Figure 4 , the circular cross section of the first groove 110 is easy to process and has good centration, which is suitable for general grinding scenarios; regular polygons (such as squares, regular hexagons) can provide higher positioning accuracy and uniform grinding pressure distribution, which is suitable for high-precision grinding; referring to Figure 5 , the cross section of the first groove 110 is an irregular polygon, which can be customized according to special requirements to optimize local grinding effect. Especially when the grinding disc 100 is provided with an optical inspection window, the corresponding grinding disc 100 needs to be foolproof to adapt to the position requirements of the grinding disc 100. By flexibly selecting these shapes, the device can adapt to various grinding processes and improve grinding quality and equipment reliability. Therefore, when the grinding pad 200 is placed on the grinding disc 100, the protrusion 211 is embedded in the first groove 110, ensuring the relative position of the grinding pad 200 and the grinding disc 100 is accurate, so that the grinding pressure is uniformly distributed on the entire grinding pad 200, improving the grinding effect.

[0049] As an example, in the chemical mechanical grinding device of the utility model, the circumscribed circle diameter d1 of the cross section shape of the first groove 110 and the protrusion 211 ranges from 50 to 200 mm.

[0050] Specifically, referring to Figure 2 , the circumscribed circle diameter d1 ranges from 50 to 200 mm, including 50 mm, 80 mm, 100 mm, 150 mm, 180 mm, 200 mm, and any resin within this range. The circumscribed circle diameter d1 is based on the comprehensive consideration of the grinding requirements of different size wafers. Smaller circumscribed circle diameter d1, for example d1 = 50 mm, is suitable for small wafers or local grinding process, which can provide higher positioning accuracy and flexibility; while larger diameter d1, for example d1 = 200 mm, is suitable for large wafers or global planarization process, which ensures the stability and uniformity of the grinding process. In this embodiment, the circumscribed circle diameter d1 is 100 mm; by selecting the appropriate circumscribed circle diameter d1, the device can meet the needs of various grinding processes, while optimizing grinding efficiency and accuracy, and reducing equipment maintenance cost.

[0051] It should be noted that a plurality of second grooves 120 are distributed around the first groove 110 for mounting the suction disc 310 of the vacuum suction assembly, thereby fixing the polishing pad 200 on the polishing disc 100. The diameter of the second groove 120 can be the same as or different from that of the first groove 110; at the same time, the distribution of the second groove 120 and the first groove 110 is optimized to ensure that it does not affect the structural strength and stress distribution uniformity of the polishing disc 100 itself.

[0052] As an example, the depth h1 of the first groove 110 ranges from 8 to 20 mm; the cross-sectional shape of the second groove 120 is circular, and the depth h2 of the second groove 120 ranges from 15 to 40 mm; the depth difference Δh between the depth h3 of the protrusion 211 and the depth h1 of the first groove 110 ranges from 2 to 5 mm.

[0053] Specifically, the depth design of the first groove 110, the second groove 120 and the protrusion 211 is crucial to the fixing and polishing effect of the polishing pad 200. The depth h1 of the first groove 110 ranges from 8 to 20 mm, for example, 8 mm, 10 mm, 14 mm, 16 mm, 18 mm, 20 mm, etc. Any value within this range, the depth h1 of the first groove 110 ensures that the protrusion 211 and the groove are tightly matched but not too tight, facilitating the installation and removal of the polishing pad 200. In this embodiment, the depth h1 of the first groove is 10 mm. The depth h2 of the second groove 120 ranges from 15 to 40 mm, for example, 15 mm, 20 mm, 25 mm, 30 mm, 35 mm, 40 mm, etc. Any value within this range, in this embodiment, the depth h2 of the second groove 120 is 20 mm. The depth h2 of the second groove 120 takes into account the size and sealing of the suction disc 310, avoids vacuum leakage, and ensures that the suction disc 310 can effectively adsorb the polishing pad 200.

[0054] The depth difference Δh between the depth h3 of the protrusion 211 and the depth h1 of the first groove 110 ranges from 2 to 5 mm, for example, 2 mm, 3 mm, 4 mm, 5 mm, etc. Any value within this range, in this embodiment, the depth of the protrusion 211 is 5 mm, and the depth difference Δh between the depth h1 of the first groove 110 is 5 mm; the depth difference Δh ensures that the polishing pad 200 and the polishing disc 100 are tightly matched, while avoiding the difficulty of installation caused by being too tight. In addition, the range of the depth difference Δh can also effectively prevent the problem that the polishing pad 200 cannot be attached to the polishing disc 100 due to size deformation or processing error of the protrusion 211, thereby realizing accurate positioning and stable adsorption of the polishing pad 200, and ultimately improving the polishing effect and equipment performance.

[0055] As an example, the second grooves 120 are uniformly or non-uniformly distributed on the polishing disc 100.

[0056] Specifically, in the chemical mechanical polishing device, the distribution design of the second grooves 120 affects the adsorption effect of the vacuum adsorption assembly and the stability of the polishing pad 200. The second grooves 120 can be uniformly or non-uniformly distributed on the polishing disc 100, and the specific design needs to be optimized according to the actual application scene and polishing requirements.

[0057] Further, when the second grooves 120 are symmetrically and equidistantly distributed on the polishing disc 100, the adsorption force distribution can be uniform, the contact surface pressure of the polishing pad 200 and the polishing disc 100 can be consistent, the dynamic balance of the polishing disc 100 can be facilitated, the vibration of the equipment during operation can be reduced, it is suitable for conventional polishing scenes, the design is simple, and it is easy to process and maintain. Referring to Figure 4 and Figure 5 , the number of the second grooves 120 is 3, and the second grooves 120 are uniformly distributed at the intermediate positions of the center and the edge around the first groove 110, so that the polishing pad 200 and the polishing disc 100 are adsorbed at the positions of the second grooves 120, and the uniformity of the whole surface of the polishing pad 200 and the polishing disc 100 is realized. Referring to Figure 6 The number of the second grooves 120 is 6, and the positions of the second grooves 120 are uniformly distributed at the 1 / 3 position and the 2 / 3 position of the center and the edge around the first groove 110, respectively, so that the polishing pad 200 and the polishing disc 100 are attached. When the second grooves 120 are asymmetrically or non-equidistantly distributed on the polishing disc 100, the adsorption force distribution can be optimized according to the shape of the polishing pad 200 and the special requirements of the polishing area. At the same time, adsorption points need to be added at the edge or specific area of the polishing pad 200 to prevent the polishing pad 200 from being warped or falling off, so as to be suitable for the fixation of the polishing pad 200 with a special shape or asymmetry. Of course, in other embodiments, the positions of the second grooves 120 are flexible to meet the requirements of different polishing processes, improve the polishing efficiency and precision, and reduce the equipment maintenance cost.

[0058] As an example, the polishing pad 200 includes a polishing layer 220 and a fixing layer 210, and the protrusions 211 are located on the fixing layer 210.

[0059] Specifically, the polishing layer 220 is used to directly contact with the object to be polished to realize the polishing function, and the material thereof can be selected according to different polishing requirements to meet different polishing precision and removal rate requirements, which is not limited here.

[0060] Further, the fixing layer 210 is used to firmly fix the polishing pad 200 on the polishing disc 100, ensuring the stability of the polishing pad 200 during the polishing process. The material of the fixing layer 210 needs to have good mechanical strength and corrosion resistance.

[0061] For example, the fixing layer 210 includes one or a combination of Teflon fixing layer, polyether ether copper fixing layer.

[0062] Specifically, the Teflon fixing layer has excellent chemical corrosion resistance, low friction coefficient and good mechanical strength, which can effectively prevent the relative sliding between the polishing pad 200 and the polishing disc 100 during the polishing process, while reducing the erosion of the fixing layer 210 by the polishing liquid. The polyether ether copper (PEEK) fixing layer has high strength, high temperature resistance and good dimensional stability, which can withstand high pressure and high temperature environment during the polishing process, ensuring the stability of the polishing pad 200 during long-term use. By selecting Teflon or polyether ether copper as the material of the fixing layer 210, or using them in combination, the diversified performance requirements of the fixing layer 210 for different polishing processes can be met, thereby improving the polishing efficiency and quality.

[0063] Further, the protrusion 211 is arranged at the center of the fixing layer 210 and embedded in the first groove 110, further preventing the displacement or deformation of the polishing pad 200 under the action of high-speed rotation and polishing force.

[0064] For example, the suction cup 310 includes one of a silicone rubber suction cup, a nitrile rubber suction cup, a fluororubber suction cup or a polyurethane rubber.

[0065] Specifically, the suction cup 310 is suitable for different working environments and requirements according to the different characteristics of the above-mentioned materials. The silicone rubber suction cup has good elasticity, resistance, high temperature resistance and long service life, which can be used in high temperature environment that may occur during the polishing process, and can be used for a long time. The nitrile rubber suction cup is suitable for most smooth and slightly rough surfaces due to its excellent wear resistance and oil resistance. The fluororubber suction cup can withstand high temperature up to 250°C and has chemical corrosion resistance, which is suitable for high temperature and chemical corrosion resistant scenes. The polyurethane rubber suction cup has good toughness and wear resistance, which is suitable for material polishing with high surface requirements. In actual application, by selecting appropriate suction cup material, the stability of the polishing pad 200 during the polishing process can be ensured, and the polishing efficiency and quality can be improved.

[0066] For example, the vacuum suction assembly further includes a vacuum source, a vacuum pressure sensor (not labeled), a suction cup reset mechanism (not labeled) and a control valve (not labeled).

[0067] Specifically, as an example, the vacuum suction assembly not only includes the suction cup 310, but also further integrates the vacuum source, the vacuum pressure sensor, the suction cup reset mechanism, and the control valve. The components work together to ensure the efficiency and stability of the grinding process.

[0068] Further, the vacuum source serves as the power source of the vacuum suction assembly, and enables the suction cup 310 to firmly adsorb the grinding pad 200 by generating negative pressure. In a chemical mechanical grinding device, the vacuum source generally needs to have sufficient pumping capacity to ensure that the vacuum degree is stable during the grinding process. The vacuum pressure sensor is used to monitor the vacuum degree in the vacuum suction assembly in real time. By accurately measuring the vacuum degree, the system can automatically adjust the power of the vacuum source to ensure that the vacuum degree is always within the optimal working range. This not only improves the adsorption stability of the grinding pad 200, but also avoids damage to the grinding pad 200 or the grinding disc 100 caused by excessively high vacuum degree. In addition, referring to Figure 3 During the replacement of the grinding pad 200, the suction cup reset mechanism can quickly release the vacuum in the suction cup 310, allowing the grinding pad 200 to separate from the suction cup 310, making it easy to replace. This function significantly shortens the replacement time of the grinding pad 200 and improves the overall operation efficiency of the chemical mechanical grinding device. The control valve is used to accurately control the on-off of the air path of the vacuum suction assembly. During the grinding process, the control valve can quickly switch between vacuum suction and release states as needed to ensure stable adsorption and quick replacement of the grinding pad 200 during the grinding process. By integrating the vacuum source, the vacuum pressure sensor, the suction cup reset mechanism, and the control valve, the vacuum suction assembly realizes efficient fixation and quick replacement of the grinding pad 200 in the chemical mechanical grinding equipment, significantly improving the grinding efficiency and the stability of the equipment operation.

[0069] As an example, the control valve includes one of a solenoid valve, a manual valve, or a proportional valve.

[0070] Specifically, in a chemical mechanical grinding device, the control valve can achieve quick adsorption and release of the grinding pad 200. The solenoid valve realizes quick response and automatic control through the on-off of the solenoid coil, and is suitable for accurately controlling the timing of vacuum adsorption and release to ensure stable adsorption and quick replacement of the grinding pad 200. The manual valve is used for equipment maintenance or debugging stage, allowing manual operation to control the vacuum suction assembly. The proportional valve can adjust the valve opening according to the input signal to realize fine control of the vacuum degree, and is suitable for specific requirements of adsorption force size in different grinding processes, such as adjusting the vacuum degree to avoid material deformation when grinding thin or soft materials.

[0071] In summary, the chemical mechanical polishing device provided by the utility model, including grinding disc, grinding pad and vacuum adsorption assembly. The grinding disc is equipped with the first recess in the center position and the second recess around; The grinding pad is equipped with the protrusion matched with the first recess, used for accurate positioning; The vacuum adsorption assembly includes the suction cup and the vacuum pipeline, the suction cup is located in the second recess and connects the vacuum pipeline through the branch pipeline, used for adsorbing and fixing the grinding pad. The utility model discloses a kind of grinding pad fixed by vacuum adsorption mode, solve the problem that grinding pad is not easy to tear off, easy to paste skew, edge water failure and other problems existing in traditional sticking mode, realize quick replacement, accurate positioning and stable adsorption, improve the grinding effect and equipment performance. In addition, the fixed layer of grinding pad can use Teflon or polyether ether copper and other materials, the number of suction cup is not less than 3, evenly or unevenly distributed, further enhance stability and applicability. Its structure is simple, convenient to operate, applicable to a variety of grinding scenes, including but not limited to high-precision grinding, so it has a wide range of use places. The utility model effectively overcomes the shortcomings in the prior art and has high industrial utilization value.

[0072] The above embodiments only exemplarily illustrate the principles and effects of the utility model, and are not used to limit the utility model. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A chemical mechanical polishing apparatus characterized by comprising: The chemical mechanical polishing device comprises: a polishing disc provided with a first groove and a plurality of second grooves, the first groove being located at the center of the polishing disc, and the second grooves being distributed around the first groove; a polishing pad provided with a protrusion, the protrusion being located at the center of the polishing pad, and the cross-sectional shape of the protrusion being the same as that of the first groove; a vacuum suction assembly comprising a plurality of suction cups and a vacuum pipeline, the number and position of the suction cups corresponding to the second grooves, and the suction cups being connected to the vacuum pipeline through branch pipelines, and the polishing pad being fixed to the polishing disc through the suction cups.

2. The chemical mechanical polishing apparatus of claim 1, wherein: The cross-sectional shape of the first groove and the protrusion comprises a circle, a regular polygon or an irregular polygon, for positioning the relative positions of the polishing disc and the polishing pad.

3. The chemical mechanical polishing apparatus of claim 2, wherein: The diameter d1 of the circumscribed circle of the cross-sectional shape of the first groove and the protrusion ranges from 50 to 200 mm.

4. The chemical mechanical polishing apparatus of claim 1, wherein: The depth h1 of the first groove ranges from 8 to 20 mm; the cross-sectional shape of the second groove is a circle, and the depth h2 of the second groove ranges from 15 to 40 mm. The depth difference between the depth h3 of the protrusion and the depth h1 of the first groove ranges from 2 to 5 mm.

5. The chemical mechanical polishing apparatus of claim 1, wherein: The polishing pad comprises a polishing layer and a fixing layer, and the protrusion is located at the fixing layer.

6. The chemical mechanical polishing apparatus of claim 5, wherein: The fixing layer comprises one or a combination of a Teflon fixing layer and a polyether ether copper fixing layer.

7. The chemical mechanical polishing apparatus of claim 1, wherein: The second grooves are uniformly or non-uniformly distributed on the polishing disc.

8. The chemical mechanical polishing apparatus of claim 1, wherein: The suction cup comprises one of a silicone rubber suction cup, a nitrile rubber suction cup, a fluororubber suction cup or a polyurethane rubber.

9. The chemical mechanical polishing apparatus of claim 1, wherein: The vacuum suction assembly further comprises a vacuum source, a vacuum pressure sensor, a suction cup reset mechanism and a control valve.

10. The chemical mechanical polishing apparatus of claim 9, wherein: The control valve comprises one of an electromagnetic valve, a manual valve or a proportional valve.

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