Adjustable semiconductor wafer electroplating clamp

Abstract

The utility model relates to the technical field of wafer electroplating clamps, in particular to an adjustable semiconductor wafer electroplating clamp which comprises a clamp body used for clamping a wafer and an electric suction cup used for fixing the wafer, the electric suction cup is arranged in the middle of the clamp body, and a centering clamp assembly is arranged on the front side of the clamp body. The centering clamp assembly comprises a fixed block, a two-way threaded rod, moving plates, an arc-shaped plate, a guide rod and a rotating block, the arc-shaped plate is tightly attached to the front side of the clamp body, the moving plates are fixedly connected to the two sides of the arc-shaped plate, and the guide rod penetrates through the middles of the two moving plates; according to the wafer centering device, through the arrangement of the centering clamp assembly, a wafer can be conveniently and rapidly placed in the middle, the tedious process of manual adjustment is avoided, and through the arrangement of the fixing assembly, installation of the centering clamp assembly is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer electroplating fixture technical field, concretely is a kind of adjustable semiconductor wafer electroplating fixture. BACKGROUND

[0002] Semiconductor wafer is the basic material for making silicon semiconductor circuit, usually by high-purity polycrystalline silicon after a series of process treatment, semiconductor wafer electroplating fixture is a kind of equipment used in semiconductor manufacturing process, mainly used for electroplating treatment on wafer surface, it is fixed by clamping wafer and ensures the stability of wafer in electroplating process, so as to ensure the quality and efficiency of electroplating.

[0003] Common electroplating fixture on market when using, wafer is moved to the middle position of fixture, the electric chuck at the bottom of fixture is fixed to wafer, then control the pressure plate in electroplating device and press down, wafer is moved to electroplating liquid as a whole and is electroplated, since wafer is not conveniently centered when placing, it needs to be adjusted by user multiple times, process is tedious, therefore, aiming at above problem, a kind of adjustable semiconductor wafer electroplating fixture is provided. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of adjustable semiconductor wafer electroplating fixture to solve the problem that wafer is centered when placing process is tedious.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of adjustable semiconductor wafer electroplating fixture, including the fixture main part for clamping wafer and the electric chuck for fixing wafer, the fixture main part middle position is equipped with electric chuck, the fixture main part front side is equipped with centering fixture assembly, the centering fixture assembly includes fixed block, bidirectional screw rod, moving plate, arc plate, guide rod and rotating block, the arc plate is closely attached to the fixture main part front side, the arc plate both sides are fixedly connected with moving plate, the guide rod is penetrated in the middle of two moving plates, another two moving plate inner side is screw-connected with bidirectional screw rod, the guide rod and bidirectional screw rod both sides are equipped with fixed block, one side of one fixed block is equipped with rotating block.

[0007] Preferably, the both ends of the guide rod and the two fixed blocks are fixedly connected, and one end of the bidirectional screw rod is fixedly connected with one of the fixed blocks.

[0008] Preferably, one end of the bidirectional screw rod is fixedly connected with one of the fixed blocks and the rotating block, and the inner side of the arc plate is fixedly connected with a rubber layer arranged in an arc shape.

[0009] Preferably, one side of the fixed block is provided with a fixing assembly, the fixing assembly comprising a spring telescopic rod, a fixing frame, a hand screw bolt and a fitting block.

[0010] Preferably, one side of the fixed block is fixedly connected with a spring telescopic rod, one side of the spring telescopic rod is fixedly connected with a fixing frame, one side of the fixing frame is threadedly connected with a hand screw bolt, and one end of the hand screw bolt is fixedly connected with a fitting block.

[0011] Compared with the prior art, the utility model has the advantages that:

[0012] In the utility model, the wafer is placed between the two arc-shaped plates on the front side of the clamp main body, and then the rotating block is rotated to control the two arc-shaped plates to move in opposite directions to center the wafer. The rubber layer prevents the arc-shaped plate from damaging the surface of the wafer when the arc-shaped plate approaches the wafer. When the rubber layer and the wafer are tightly fitted, the centering purpose is achieved. At this time, the suction cup is controlled to adsorb and fix the wafer, avoiding the tedious process of manually adjusting the position of the wafer multiple times, so that the wafer is easily centered. The fixing assembly, spring telescopic rod, fixing frame, hand screw bolt and fitting block are arranged to clamp the fixing frame at the side plate of the electroplating tank, control the hand screw bolt to control the fitting of the fitting block and the side plate of the electroplating tank, fix the centering clamp assembly, and facilitate disassembly and assembly. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a schematic view of the overall structure of the utility model;

[0014] Figure 2 It is a schematic view of the centering clamp assembly structure of the utility model;

[0015] Figure 3 It is a schematic view of the A structure of the utility model. Figure 2

[0016] In the drawing: 1, clamp main body; 2, electric suction cup; 3, centering clamp assembly; 31, fixed block; 32, two-way threaded rod; 33, moving plate; 34, arc-shaped plate; 35, guide rod; 36, rotating block; 4, rubber layer; 5, fixing assembly; 51, spring telescopic rod; 52, fixing frame; 53, hand screw bolt; 54, fitting block. DETAILED DESCRIPTION

[0017] ​Clearly, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0018] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0019] In addition, it should be noted that the use of "first", "second" and the like words to define parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, and therefore cannot be understood as limiting the scope of protection of the present application.

[0020] Please refer to Figures 1-3 The present application provides a technical scheme:

[0021] An adjustable semiconductor wafer electroplating clamp, comprising a clamp body 1 for clamping the wafer and an electric suction cup 2 for fixing the wafer, the electric suction cup 2 is arranged at the middle position of the clamp body 1, a centering clamp assembly 3 is arranged at the front side of the clamp body 1, the centering clamp assembly 3 comprises a fixed block 31, a bidirectional threaded rod 32, a moving plate 33, an arc plate 34, a guide rod 35 and a rotating block 36, the arc plate 34 is closely attached to the front side of the clamp body 1, the moving plates 33 are fixedly connected to the two sides of the arc plate 34, the guide rod 35 penetrates through the middle of the two moving plates 33, the bidirectional threaded rods 32 are threadedly connected to the inner sides of the other two moving plates 33, the fixed blocks 31 are arranged on the two sides of the guide rod 35 and the bidirectional threaded rod 32, the rotating block 36 is arranged on one side of one of the fixed blocks 31, the centering clamp assembly 3 is arranged, so that the wafer can be quickly placed in the center, avoiding the tedious process of manual adjustment, and the fixed assembly 5 is arranged, facilitating the installation of the centering clamp assembly 3.

[0022] The two ends of the guide rod 35 are fixedly connected to two of the fixing blocks 31, and one end of the bidirectional threaded rod 32 is fixedly connected to one of the fixing blocks 31, which facilitates the use of the bidirectional threaded rod 32. One end of the bidirectional threaded rod 32 passes through one of the fixing blocks 31 and is fixedly connected to the rotating block 36. An arc-shaped rubber layer 4 is fixedly connected to the inner side of the arc plate 34, which facilitates the use of the rotating block 36 and makes it less likely to damage the edge of the arc plate 34 when it is close to the wafer. A fixing component 5 is provided on one side of the fixing block 31. The fixing component 5 includes a spring telescopic rod 51, a fixing frame 52, a hand-tightening bolt 53 and a bonding block 54, which facilitates the installation of the centering clamp component 3. A spring telescopic rod 51 is fixedly connected to one side of the fixing block 31, a fixing frame 52 is fixedly connected to one side of the spring telescopic rod 51, a hand-tightening bolt 53 is threadedly connected to one side of the fixing frame 52, and a bonding block 54 is fixedly connected to one end of the hand-tightening bolt 53, which facilitates the use of the bonding block 54.

[0023] Workflow: During operation, the equipment is powered by an external power source. When using the adjustable semiconductor wafer electroplating fixture, the centering fixture assembly 3 must first be installed. This involves the user clamping the fixing frame 52 onto the outside of the side plate of the electroplating tank, then rotating the hand-tightening bolt 53 to one side, causing the contact block 54 to move towards the side plate of the electroplating tank until it is tightly fitted, thus completing the installation of the centering fixture assembly 3. The spring telescopic rod 51 is suitable for electroplating tanks of different widths. Next, the wafer to be electroplated is placed on the surface of the fixture body 1, specifically in front of the electric suction cup 2, between the two arc-shaped plates 34. Then, the user controls the bidirectional threaded rod 32 to rotate to one side by holding the outer side of the rotating block 36. During rotation, because two of the moving plates 33 are threadedly connected to the bidirectional threaded rod 32, these two moving plates... The 33-axis moves the arc-shaped plate 34 toward the wafer, while the other two moving plates 33 slide outside the guide rod 35. During rotation, the two arc-shaped plates 34 gradually approach the wafer until the rubber layer 4 and the wafer are tightly attached, completing the centering. At this time, the electric suction cup 2 is activated to fix the wafer position. Then, the rotating block 36 is rotated in the opposite direction to control the two arc-shaped plates 34 to move in the opposite direction until they are away from the fixture body 1. At this time, the pressure plate of the electroplating device presses down, moving the fixture body 1 and the wafer toward the bottom of the electroplating tank until the wafer is completely in the electroplating solution, allowing for the next operation. The centering fixture component 3 facilitates the quick centering of the wafer, avoiding the tedious process of manual adjustment. The fixing component 5 facilitates the installation of the centering fixture component 3.

[0024] The contents not described in detail in the specification belong to the prior art known to the person skilled in the art. The standard parts used in the utility model can be purchased from the market, and the special-shaped parts can be ordered according to the description and the drawings, the specific connection mode of each part adopts the conventional means such as bolt, rivet and welding in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, which will not be described in detail here.

[0025] Although the embodiments of the utility model have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. An adjustable semiconductor wafer plating jig comprising a jig body (1) for clamping a wafer and an electric chuck (2) for fixing the wafer, characterized in that: The middle position of the clamp body (1) is provided with an electric suction cup (2), and the front side of the clamp body (1) is provided with a central clamp assembly (3), the central clamp assembly (3) includes a fixed block (31), a bidirectional threaded rod (32), a moving plate (33), an arc plate (34), a guide rod (35) and a rotating block (36), the arc plate (34) is closely attached to the front side of the clamp body (1), the arc plate (34) is fixedly connected with the moving plate (33) on both sides, the guide rod (35) penetrates through the middle of the two moving plates (33), the bidirectional threaded rod (32) is threadedly connected with the inner side of the other two moving plates (33), the guide rod (35) and the bidirectional threaded rod (32) are provided with the fixed block (31) on both sides, and one side of one of the fixed blocks (31) is provided with the rotating block (36).

2. The adjustable semiconductor wafer plating fixture of claim 1, wherein: Both ends of the guide rod (35) and two of the fixed blocks (31) are fixedly connected, and one end of the bidirectional threaded rod (32) and one of the fixed blocks (31) are fixedly connected.

3. The adjustable semiconductor wafer plating fixture of claim 1, wherein: One end of the bidirectional threaded rod (32) penetrates through one of the fixed blocks (31) and the rotating block (36) and is fixedly connected, and the arc plate (34) is fixedly connected with an arc-shaped rubber layer (4) on the inner side.

4. The adjustable semiconductor wafer plating fixture of claim 1, wherein: One side of the fixed block (31) is provided with a fixing assembly (5), the fixing assembly (5) includes a spring telescopic rod (51), a fixed frame (52), a hand screw bolt (53) and a fitting block (54).

5. The adjustable semiconductor wafer plating fixture of claim 1, wherein: One side of the fixed block (31) is fixedly connected with the spring telescopic rod (51), one side of the spring telescopic rod (51) is fixedly connected with the fixed frame (52), one side of the fixed frame (52) is threadedly connected with the hand screw bolt (53), and one end of the hand screw bolt (53) is fixedly connected with the fitting block (54).

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