Guide plate and coating equipment
By setting an array of columnar protrusions on the inner side of the guide plate, the liquid is guided by capillary force, which solves the problem of liquid splashing during the photolithography pattern manufacturing process and improves the quality and pattern uniformity of the wafer.
Patent Information
- Application Number
- CN202520456502.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-03-14
AI Technical Summary
During the photolithography pattern manufacturing process, in the coating and developing processes, liquid splashes back from the inside of the guide plate onto the wafer surface, causing photolithography pattern defects and pattern uniformity problems.
Design a flow guide plate with an array of columnar protrusions on the inner side. The liquid is guided from the top to the bottom by capillary force to prevent the liquid from splashing back onto the wafer surface. The anti-splashing effect is achieved by using a coating device.
This effectively prevents liquid from splashing onto the wafer surface, improving the uniformity of the photolithography pattern and the quality of the wafer.
Smart Images
Figure CN223857578U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a flow guide plate and coating equipment. BACKGROUND
[0002] In the manufacturing process of a photoresist pattern, the photoresist or developer is spread and thrown out from the surface of a wafer in a rotating manner, and the liquid is usually thrown out from the surface of the wafer to touch the inner side of a flow guide plate arranged along the circumference of the wafer and then flow into a waste liquid discharge pipeline along the inner side of the flow guide plate.
[0003] However, part of the liquid may splash back from the inner side of the flow guide plate to the surface of the wafer, causing defects of the photoresist pattern and affecting the pattern uniformity of the photoresist pattern, and thus affecting the quality of the wafer.
[0004] Therefore, it is necessary to develop a flow guide plate and coating equipment to avoid the liquid from splashing back to the surface of the wafer in the photoresist and developer processes, thereby causing defects of the wafer. CONTENT OF THE INVENTION
[0005] The purpose of the present application is to provide a flow guide plate and coating equipment to avoid the liquid from splashing back to the surface of the wafer in the photoresist and developer processes, thereby causing defects of the wafer.
[0006] In a first aspect, the embodiments of the present application provide a flow guide plate for a semiconductor device, comprising: a flow guide plate body formed by a hollow annular plate body, including an inner side and an outer side; and an anti-splashing part arranged on the inner side of the flow guide plate body, comprising a plurality of columnar protrusions arranged in an array, the bottom end of the columnar protrusion being connected to the inner side of the flow guide plate body.
[0007] In some embodiments, the area of the cross section of the columnar protrusion gradually increases from the top end of the columnar protrusion to the bottom end of the columnar protrusion.
[0008] In some embodiments, the columnar protrusion is conical.
[0009] In some embodiments, the spacing between adjacent columnar protrusions is 1.2 to 2.5 times the diameter of the bottom end of the columnar protrusion.
[0010] In some embodiments, the columnar protrusions are distributed at equal intervals.
[0011] In some embodiments, the height of the columnar protrusion is 10 to 50 mm.
[0012] In some embodiments, the columnar protrusion is perpendicular to the flow guide plate body.
[0013] In some embodiments, the deflector further comprises at least one deflector groove arranged on the inner side of the deflector body between the adjacent columnar protrusions.
[0014] In some embodiments, the deflector further comprises a blocking portion connected to the top end of the deflector body and arranged to tilt towards the center of the deflector body in a direction away from the deflector body.
[0015] In a second aspect, the embodiments of the present application further provide a coating device comprising: a chamber; and a deflector as described in the first aspect of the present application.
[0016] In some embodiments, the coating device further comprises: a supporting table for supporting a target object and rotating the target object; and an inner surrounding plate arranged around the supporting table below the target object; wherein the first flow path of the liquid is formed between the inner surrounding plate and the deflector, and the second flow path of the liquid is formed between the deflector and the inner wall of the chamber.
[0017] The deflector and the coating device provided by the present application have the following advantages, but are not limited to the following:
[0018] The deflector provided by the present application is provided with an anti-back-splashing portion corresponding to the edge of the target object, the anti-back-splashing portion comprises a plurality of columnar protrusions arranged in an array, and the columnar protrusions are configured to guide the liquid from the top end of the columnar protrusions to the bottom end of the columnar protrusions. Specifically, in the use process, the liquid on the target object is splashed to the deflector by the centrifugal force and contacts the anti-back-splashing portion, at the moment of contact, the liquid is guided from the top end of the columnar protrusions of the anti-back-splashing portion to the bottom end of the columnar protrusions, thereby avoiding the liquid from being back-splashed from the deflector to the target object.
[0019] The coating device provided by the present application is provided with the deflector, and the anti-back-splashing of the liquid in the process is realized. BRIEF DESCRIPTION OF DRAWINGS
[0020] The following drawings in detail describe the exemplary embodiments disclosed in the present application. The same reference signs in the several views of the drawings represent similar structures. A person of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, and the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of the present application, and other ways of embodiments can also achieve the same intention of the invention in the present application. It should be understood that the drawings are not drawn to scale.
[0021] Wherein:
[0022] Figure 1 The structural schematic diagram of the coating device and the deflector according to some embodiments of the present application;
[0023] Figure 2 is an enlarged view of the boxed area shown in FIG. 1; Figure 1
[0024] Figure 3 is a schematic diagram of the capillary force experienced by a liquid droplet between adjacent cylindrical protrusions;
[0025] Figure 4 is a schematic diagram of the capillary force experienced by a liquid droplet between adjacent cylindrical protrusions when the liquid droplet flows close to the bottom end of the cylindrical protrusions;
[0026] Figure 5 is a schematic diagram of the structure of the inner side of the deflector body according to some embodiments of the present application; and
[0027] Figure 6 is a schematic diagram of the structure of the inner side of the deflector body according to some embodiments of the present application; and Figure 5 is a partial schematic diagram of the longitudinal section of the A-A dashed line in FIG. 4. DETAILED DESCRIPTION
[0028] The following description provides specific details for the purpose of providing a thorough understanding of the application. Various modifications to the embodiments disclosed herein will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of the application. Therefore, the application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the claims.
[0029] The present application provides a deflector for semiconductor equipment, comprising a deflector body formed by a hollow annular plate body, including an inner side and an outer side; and an anti-back-splashing portion disposed on the inner side of the deflector body, comprising a plurality of cylindrical protrusions arranged in an array, the bottom end of the cylindrical protrusions being connected to the inner side of the deflector body.
[0030] The deflector provided by the present application is provided with an anti-back-splashing portion, which comprises a plurality of cylindrical protrusions arranged in an array, and the cylindrical protrusions are configured to guide liquid from the top end of the cylindrical protrusions to the bottom end of the cylindrical protrusions. Specifically, during use, the deflector body is arranged around a target object, and the anti-back-splashing portion is matched with the position of the target object, so that the liquid on the target object is splashed to the deflector by centrifugal force and comes into contact with the anti-back-splashing portion. At the moment of contact, the liquid is guided from the top end of the cylindrical protrusions of the anti-back-splashing portion to the bottom end of the cylindrical protrusions, thereby avoiding the liquid from being back-splashed from the deflector to the target object.
[0031] The deflector provided by the present application will be described in detail below in combination with specific embodiments and drawings.
[0032] Referring to Figure 1 , the present application provides a deflector 100 for semiconductor equipment.
[0033] The semiconductor equipment can be a spin-coating and developing equipment, or other equipment that needs to involve liquid coating. The semiconductor equipment comprises a chamber 200 configured to process a target object 11 (e.g. a wafer) inside the chamber 200.
[0034] The deflector 100 comprises a deflector body 101 surrounded by a hollow annular plate body, including an inner side and an outer side.
[0035] In use, the deflector body 101 is arranged around the target object 11. Liquid splashed from the surface of the target object 11 to the deflector body 101 is guided by the deflector body 101 to the bottom of the chamber 200.
[0036] However, the liquid splashed to the surface of the deflector body 101 can also be splashed back to the surface of the target object 11 by the deflector body 101, affecting the processing of the target object 11.
[0037] Therefore, the present application provides that the inner side of the deflector 100 is provided with an anti-splashing part 102.
[0038] Specifically, referring to Figure 2 , the anti-splashing part 102 comprises a plurality of columnar protrusions 102a arranged in an array, the bottom end of the columnar protrusions 102a is connected to the inner side of the deflector body 101, the top end of the columnar protrusions 102a is directed towards the target object 11, and the columnar protrusions 102a are used to guide the liquid from the top end of the columnar protrusions 102a to the bottom end of the columnar protrusions 102a.
[0039] By providing a plurality of columnar protrusions 102a, the contact area between the liquid and the columnar protrusions 102a is reduced, and the liquid will quickly enter the gap between the columnar protrusions 102a. Therefore, the liquid is not easy to be splashed back. In addition, the capillary force can be generated between adjacent columnar protrusions 102a to the liquid, so that the liquid is quickly guided to the bottom end of the columnar protrusions 102a when it contacts the top end of the columnar protrusions 102a, further avoiding the splashing back of the liquid.
[0040] In some embodiments, the columnar protrusions 102a are perpendicular to the inner side of the deflector body 101, so that the axis of the columnar protrusions 102a is parallel to the plane in which the target object 11 is located. In other embodiments, the top end of the columnar protrusions 102a can also be inclined to the top or bottom of the chamber 200.
[0041] In some embodiments, referring to Figure 4The plurality of columnar protrusions 102a are distributed at equal intervals in the circumferential direction (X direction in the figure) of the deflector body 101 and in the direction perpendicular to the circumferential direction of the deflector 100 (Y direction in the figure).
[0042] In some embodiments, according to Figure 2 and 3 , the cross-sectional area of the columnar protrusion 102a gradually increases from the top end of the columnar protrusion 102a to the bottom end of the columnar protrusion 102a. The cross-section of the columnar protrusion 102a refers to the cross-section perpendicular to the axis of the columnar protrusion 102a.
[0043] In some embodiments, the cross-section of the columnar protrusion 102a is circular, and the diameter of the bottom of the columnar protrusion 102a is 5 mm to 20 mm, for example, 5 mm, 6 mm, 7 mm, 9 mm, or 10 mm.
[0044] In some embodiments, the columnar protrusion 102a is conical.
[0045] Referring to Figure 4 and Figure 5 , the formula for calculating the capillary force is:
[0046]
[0047] In the formula, E is the capillary force experienced by the liquid droplet 12 between adjacent columnar protrusions 102a; γ is the surface tension of the liquid droplet 12; θ is the contact angle of the surface of the liquid droplet 12 with the side wall of the columnar protrusion 102a; H is the height of the columnar protrusion 102a; S is the liquid surface width of the liquid droplet 12 between adjacent columnar protrusions 102a; and L is the diameter of the bottom end of the columnar protrusion 102a.
[0048] As can be seen, by gradually increasing the cross-sectional area of the columnar protrusion 102a from the top end to the bottom end, the liquid surface width of the liquid droplet 12 at the bottom end of the columnar protrusion 102a is reduced, for example, as shown in Figure 4 and 5 The liquid surface width is reduced from S1 to S2, the capillary force experienced by the liquid droplet 12 is increased, and the flow of the liquid droplet 12 to the bottom end of the columnar protrusion 102a is further promoted. Therefore, the gradual increase in the cross-sectional area of the columnar protrusion 102a from the top end to the bottom end is conducive to promoting the flow of the liquid to the bottom end of the columnar protrusion 102a.
[0049] In some embodiments, the distance between adjacent columnar protrusions 102a is 1.2 to 2.5 times the diameter of the bottom end of the columnar protrusions 102a. It should be noted that the distance between adjacent columnar protrusions 102a refers to the distance between the axes of adjacent columnar protrusions 102a.
[0050] In some embodiments, the height of the columnar protrusions 102a is 10 to 50 mm, for example, 10 mm, 20 mm, 30 mm, 40 mm, or 50 mm.
[0051] In some embodiments, referring to Figure 5 and Figure 6 , the Figure 6 is a partial schematic view of the longitudinal section of the A-A dashed line in Figure 5 . The flow guide plate 100 further comprises at least one flow guide groove 104, which is arranged on the inner side of the flow guide plate body 101 and located between adjacent columnar protrusions 102a. The liquid guided by the columnar protrusions 102a to the bottom end of the columnar protrusions 102a flows to the bottom of the chamber 200 through the flow guide groove 104.
[0052] In some embodiments, the number of flow guide grooves 104 is multiple, and the multiple flow guide grooves 104 are equally spaced along the circumference of the flow guide plate body 101.
[0053] In some embodiments, the width of the flow guide groove 104 is 1.2 to 1.5 times the diameter of the bottom end of the columnar protrusions 102a. The width direction of the flow guide groove 104 is the x direction shown in Figure 5 .
[0054] In some embodiments, the flow guide plate 100 further comprises a blocking portion 103, which is connected to the top end of the flow guide plate body 101 and is arranged inclinedly away from the flow guide plate body 101 to the center of the flow guide plate body 101, so as to avoid the liquid splashing out of the target object 11 from splashing out of the chamber 200.
[0055] The present application also provides a coating device, which can be a coating apparatus used in a semiconductor process, referring to Figure 1 , the coating device comprises a chamber 200 and a flow guide plate 100 provided by the embodiments of the present application.
[0056] In some embodiments, the chamber 200 comprises a peripheral plate 201 and a bottom plate 202. The peripheral plate 201 is fixedly connected to the bottom plate 202.
[0057] In some embodiments, the bottom plate 202 comprises a liquid discharge port 202a for discharging the liquid in the chamber 200.
[0058] In some embodiments, the coating device further comprises a supporting table 300 for supporting the target object 11 and rotating the target object 11.
[0059] When it is required to coat liquid evenly on the surface of the target object 11 or remove liquid from the surface of the target object 11, the supporting table 300 is rotated to rotate the target object 11, so that liquid is coated evenly on the surface of the target object 11 or removed from the surface of the target object 11.
[0060] In some embodiments, the coating device further comprises an inner surrounding plate 400, which is arranged around the supporting table 300 below the target object 11.
[0061] The inner surrounding plate 400 and the deflector 100 form a first flow path for liquid, and the deflector 100 and the inner wall of the chamber 200 (i.e. the outer surrounding plate 201) form a second flow path for liquid. Generally, liquid leaving the surface of the target object 11 is guided by the deflector 100 to the bottom of the chamber 200, and then discharged from the chamber 200 through the liquid outlet 202a. If some liquid splashes out of the area surrounded by the deflector 100, the splashed liquid will flow to the bottom of the chamber 200 through the second flow path and then be discharged through the liquid outlet 202a.
[0062] In some embodiments, the inner surrounding plate 400 and the deflector 100 are fixedly connected to the bottom plate 202. The bottom plate 202 is connected to a lifting motor, which is configured to lift the bottom plate 202 so as to lift the inner surrounding plate 400, the deflector 100 and the outer surrounding plate 201 together relative to the supporting table 300.
[0063] In some embodiments, the process of preventing liquid from splashing back by using the deflector 100 and the device provided in the present application is as follows:
[0064] The target object 11 (for example, a wafer) to be processed is placed on the support table 300, the lifting of the base plate 202 is regulated by the lifting motor, the deflector 100 is lifted relative to the support table 300, the target object 11 is aligned with the anti-back-splashing part 102, then the target object 11 is rotated by rotating the support table 300, and liquid (for example, photoresist or developing solution) is dropped on the surface of the target object 11, the liquid spreads on the surface of the target object 11 or leaves the surface of the target object 11 under the action of centrifugal force, the liquid leaving the surface of the target object 11 is splashed to the deflector 100 and contacts the anti-back-splashing part 102, at the moment of contact, the liquid is drained from the top end of the columnar protrusion 102a of the anti-back-splashing part 102 to the bottom end of the columnar protrusion 102a, thereby avoiding back-splashing of the liquid from the deflector 100 to the target object 11.
[0065] It should be noted that different embodiments can produce different beneficial effects, and in different embodiments, the beneficial effects that can be produced can be any one or a combination of the above, or any other beneficial effects that can be obtained.
[0066] The above has described the basic concept, and it is obvious that the above detailed disclosure is only as an example for those skilled in the art, and does not constitute a limitation on the specification. Although it is not explicitly stated here, those skilled in the art can make various modifications, improvements and corrections to the present application. Such modifications, improvements and corrections are suggested in the specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present application.
[0067] It should be noted that in the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be rotatably connected, or it can be slidably connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in conjunction with the specific circumstances.
[0068] In addition, when the terms "first", "second", "third" and the like are used in the description of the present application to describe various features, these terms are only used to distinguish these features, and cannot be understood as indicating or implying the relevance between the features, the relative importance of the features, or implicitly indicating the number of the indicated features.
[0069] In addition, the description herein makes reference to idealized illustrative cross-sectional and / or plan and / or elevational views. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, examples of the embodiments should not be construed as limited to the precise shapes illustrated herein but are to include deviations in shapes that result from such
[0070] Also, the use of "an" or "the" to refer to an element or class of elements, along with the
[0071] Also, the use of "an" or "the" to refer to an element or class of elements, along with the
[0072] Finally, it should be understood that the embodiments described herein are intended to be illustrative only and that the scope of the present application is properly determined by a fair reading (and a fair construction) of the claims that follow.
Claims
1. A flow guide plate for a semiconductor device, characterized by comprising: The application relates to a flow guide plate. The flow guide plate comprises a flow guide plate body and an anti-back-splashing part. The anti-back-splashing part is arranged on the inner side of the flow guide plate body and comprises a plurality of columnar protrusions arranged in an array.
2. The deflector of claim 1, wherein The cross-sectional area of the columnar protrusions gradually increases from the top end to the bottom end.
3. The deflector of claim 2, wherein The columnar protrusions are conical.
4. The deflector of claim 3, wherein The distance between adjacent columnar protrusions is 1.2-2.5 times the diameter of the bottom end of the columnar protrusions.
5. The deflector of claim 1, wherein The columnar protrusions are equally spaced.
6. The deflector of claim 1, wherein The height of the columnar protrusions is 10-50 mm.
7. The deflector of claim 1, wherein The columnar protrusions are perpendicular to the flow guide plate body.
8. The deflector of claim 1, wherein At least one flow guide groove is arranged on the inner side of the flow guide plate body and between adjacent columnar protrusions.
9. The deflector of claim 1, wherein A blocking part is connected to the top end of the flow guide plate body and is arranged to be inclined to the center of the flow guide plate body.
10. A coating apparatus characterized by, The application relates to a flow guide plate. The flow guide plate comprises a flow guide plate body and an anti-back-splashing part. The anti-back-splashing part is arranged on the inner side of the flow guide plate body and comprises a plurality of columnar protrusions arranged in an array. The cross-sectional area of the columnar protrusions gradually increases from the top end to the bottom end.
11. The coating apparatus of claim 10, wherein, The columnar protrusions are conical. The distance between adjacent columnar protrusions is 1.2-2.5 times the diameter of the bottom end of the columnar protrusions. The columnar protrusions are equally spaced. The height of the columnar protrusions is 10-50 mm. The columnar protrusions are perpendicular to the flow guide plate body. At least one flow guide groove is arranged on the inner side of the flow guide plate body and between adjacent columnar protrusions. A blocking part is connected to the top end of the flow guide plate body and is arranged to be inclined to the center of the flow guide plate body. The application relates to a flow guide plate. The flow guide plate comprises a flow guide plate body and an anti-back-splashing part. The anti-back-splashing part is arranged on the inner side of the flow guide plate body and comprises a plurality of columnar protrusions arranged in an array. The cross-sectional area of the columnar protrusions gradually increases from the top end to the bottom end. The columnar protrusions are conical. The distance between adjacent columnar protrusions is 1.2-2.5 times the diameter of the bottom end of the columnar protrusions. The columnar protrusions are equally spaced. The height of the columnar protrusions is 10-50 mm. The columnar protrusions are perpendicular to the flow guide plate body. At least one flow guide groove is arranged on the inner side of the flow guide plate body and between adjacent columnar protrusions. A blocking part is connected to the top end of the flow guide plate body and is arranged to be inclined to the center of the flow guide plate body.