Circuit board heat dissipation structure and electronic equipment

Abstract

The utility model discloses a circuit board heat dissipation structure and equipment, the circuit board heat dissipation structure comprises a circuit board, heat conduction silica gel, a heat dissipation piece, a fixing block and a heat dissipation piece arranged on the circuit board, and the fixing block is arranged between the heat dissipation piece and the circuit board. The fixing block is used for fixing the heat-conducting silica gel on the side, away from the circuit board, of the sampling resistor and fixing the heat dissipation piece on the side, away from the sampling resistor, of the heat-conducting silica gel. According to the utility model, heat dissipation can be carried out on the sampling resistor under the condition that normal work of a circuit is not influenced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board heat dissipation technology, and in particular to a circuit board heat dissipation structure and electronic device. Background Technology

[0002] The sampling circuit primarily uses operational amplifiers to detect surface-mount sampling resistors for sampling calculations. However, as circuit power increases, the temperature of surface-mount devices rises continuously. If heat dissipation is not timely, circuit performance may degrade, especially in precision measurement and control circuits. Overheating of the sampling resistor can cause changes in its resistance value, directly affecting the current and voltage measurement results, thus impacting the stability and accuracy of the entire system. Related technologies mainly employ large-area copper-plated windows on the back to reduce device temperature. However, when applied to high-density PCBs, this can affect insulation performance, reduce the utilization rate of the PCB backside layout, and increase electromagnetic interference in high-frequency circuits, affecting normal circuit operation. Utility Model Content

[0003] This utility model provides a circuit board heat dissipation structure and electronic device that can dissipate heat from the sampling resistor without affecting the normal operation of the circuit.

[0004] In a first aspect, embodiments of the present invention provide a circuit board heat dissipation structure, comprising:

[0005] Circuit board;

[0006] A sampling resistor, wherein the sampling resistor is disposed on the circuit board;

[0007] Thermally conductive silicone;

[0008] Heat dissipation components;

[0009] A fixing block is installed between the heat sink and the circuit board. The fixing block is used to fix the thermally conductive silicone to the side of the sampling resistor away from the circuit board and to fix the heat sink to the side of the thermally conductive silicone away from the sampling resistor.

[0010] The circuit board heat dissipation structure has at least the following beneficial effects: with the increase of circuit power or the extension of circuit use time, the temperature of the sampling resistor will continuously rise, and if heat dissipation is not in time, the circuit performance may be reduced. Therefore, the fixing block installed between the heat dissipation member and the circuit board ensures that the heat-conducting silica gel can be fixed tightly on the side of the sampling resistor away from the circuit board, and the heat dissipation member is fixed stably on the side of the heat-conducting silica gel away from the sampling resistor, thereby forming an efficient heat transfer path, so that the heat continuously generated by the sampling resistor during operation can be transferred to the heat dissipation member through the heat-conducting silica gel, and then the heat is transferred away by the heat dissipation member. Therefore, through the positioning and fixing effect of the fixing block on the sampling resistor, the heat-conducting silica gel and the heat dissipation member, direct contact between the heat dissipation member and the circuit board is avoided, the back layout of the circuit board is protected from interference, the utilization rate of the back layout of the circuit board is improved, the circuit performance is not affected during normal operation, and the problem that the circuit performance is affected due to the delay of heat dissipation during operation of the sampling resistor is effectively prevented.

[0011] In the circuit board heat dissipation structure, the fixing block is provided with an installation slot penetrating through up and down, and the heat-conducting silica gel and the sampling resistor are located in the installation slot.

[0012] In the circuit board heat dissipation structure, the fixing block is provided with an installation slot penetrating through up and down.

[0013] In the circuit board heat dissipation structure, the thickness of the installation slot in the vertical direction is less than the thickness of the heat-conducting silica gel in the vertical direction.

[0014] In the circuit board heat dissipation structure, the circuit board is provided with a positioning slot, the fixing block is provided with a positioning sheet, and the positioning sheet is arranged in the positioning slot.

[0015] In the circuit board heat dissipation structure, the circuit board heat dissipation structure further comprises a fixing bolt, both sides of the fixing block are provided with installation through holes, the circuit board is provided with a fixing hole, and the fixing bolt is sequentially arranged in the fixing hole and the installation through hole and is fixedly connected with the heat dissipation member.

[0016] In the circuit board heat dissipation structure, the heat dissipation member comprises a fixing part and a heat dissipation part, the heat dissipation part is arranged on the side of the fixing part away from the circuit board, and the fixing part is provided with a screw hole matched with the fixing bolt on the side close to the circuit board.

[0017] In the circuit board heat dissipation structure, the heat dissipation part comprises a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged side by side on the side of the fixing part away from the circuit board.

[0018] The circuit board heat dissipation structure provided in the embodiment of the present application is provided with a heat-conducting silicone grease layer between the sampling resistor and the heat-conducting silica gel.

[0019] In the second aspect, the embodiment of the present application provides an electronic device comprising the circuit board heat dissipation structure provided in the first aspect.

[0020] According to the electronic device provided in the embodiment of the present application, the following beneficial effects are achieved: with the increase of circuit power or the extension of circuit use time, the temperature of the sampling resistor will continuously rise, and if the heat dissipation is not timely, the circuit performance may be affected. Therefore, the fixing block installed between the heat dissipation member and the circuit board ensures that the heat-conducting silica gel is fixed tightly on the side of the sampling resistor away from the circuit board, and the heat dissipation member is fixed stably on the side of the heat-conducting silica gel away from the sampling resistor, thereby forming an efficient heat transfer path, so that the heat continuously generated by the sampling resistor during the working process can be transferred to the heat dissipation member through the heat-conducting silica gel, and then the heat is transferred away by the heat dissipation member. Therefore, through the positioning and fixing effect of the fixing block on the sampling resistor, the heat-conducting silica gel and the heat dissipation member, the direct contact between the heat dissipation member and the circuit board is avoided, the layout on the back surface of the circuit board is protected from interference, the utilization rate of the layout on the back surface of the circuit board is improved, the normal working of the circuit is not affected, and the problem that the circuit performance is affected due to the untimely heat dissipation of the sampling resistor during the working process is effectively prevented.

[0021] Other features and advantages of the present application will be set forth in the following description of the application, and in part will become apparent to those skilled in the art upon examination of the following or can be learned from practice of the present application. The objects and other advantages of the present application can be realized and attained by the structure particularly pointed out in the description and claims of the present application as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings are included to provide a further understanding of the technical scheme of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical scheme of the present application, and do not constitute a limitation on the technical scheme of the present application.

[0023] Figure 1 FIG. 1 is a structural schematic view of a circuit board heat dissipation structure provided in an embodiment of the present application;

[0024] Figure 2 FIG. 2 is a partial schematic view of the circuit board heat dissipation structure provided in the embodiment of the present application;

[0025] Figure 3 FIG. 3 is a structural schematic view of a fixing block provided in the embodiment of the present application;

[0026] Figure 4The utility model provides a fixed block's structure schematic drawing of another embodiment of the utility model;

[0027] Figure 5 For Figure 4 The utility model provides a fixed block's structure schematic drawing of another angle of another embodiment of the utility model.

[0028] Figure 6 The utility model provides a fixed block's structure schematic drawing of another embodiment of the utility model. Specific implementation

[0029] In order to make the utility model's purpose, technical scheme and advantage more clear and obvious, the following is combined with the embodiment, and the utility model is further detailedly explained.The specific embodiment described here is only used to explain the utility model, and is not used to limit the utility model.

[0030] It can be understood that, although the functional module division is carried out in the device schematic diagram, the logic order is shown in the flow chart, but in some cases, the steps shown or described can be executed in different module division in the device, or the order in the flow chart.Understanding, the terms "first", "second" and the like in the specification, claims or above-mentioned drawing are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence.

[0031] At present, the sampling circuit mainly detects the patch type sampling resistor for sampling calculation through the operational amplifier, but with the improvement of circuit power, the temperature of patch type device will rise continuously, if the heat dissipation is not in time, the circuit performance can be reduced, especially in precision measurement and control circuit, the sampling resistor overheating can cause the resistance value of sampling resistor to change, and then directly affect the measurement result of current and voltage, thereby affecting the stability and accuracy of the whole system.In the related technology, mainly adopt the scheme of large area copper window on the back to reduce the temperature of device, but when applied to high density PCB board, the insulating property can be affected, the utilization rate of PCB board back layout is reduced, and the electromagnetic interference in high frequency circuit is increased, which affects the normal work of circuit.

[0032] Based on this, the utility model provides a kind of circuit board heat dissipation structure and electronic equipment, with the improvement of circuit power or the extension of circuit use time, the temperature of sampling resistance can constantly rise, if not in time heat dissipation, possibly lead to circuit performance decline, therefore, using the fixed block installed between heat sink and circuit board, ensure that heat-conducting silicone can be fixed to the side of sampling resistance away from circuit board, and firmly the heat sink is fixed to the side of heat-conducting silicone away from sampling resistance, to form an efficient heat transfer path, so that the heat that sampling resistance continuously generates in working process can be transferred to heat sink by setting heat-conducting silicone, then by heat sink, heat is removed;Therefore, by the positioning and fixing effect of fixed block to sampling resistance, heat-conducting silicone and heat sink, avoid the direct contact of heat sink and circuit board, both protect the back layout of circuit board from interference, improve the utilization of circuit board back layout, do not affect the normal work of circuit while can effectively prevent the problem that sampling resistance is affected circuit performance when working due to heat dissipation not in time.

[0033] The utility model embodiment is further described below with reference to the drawings.

[0034] The first aspect, refer to Figure 1 , Figure 1 The structure diagram of circuit board heat dissipation structure provided by the utility model embodiment.

[0035] It can be understood that the circuit board heat dissipation structure includes circuit board 100, sampling resistance 200, heat-conducting silicone 300, heat sink 500 and fixed block 400. Among them, sampling resistance 200 is installed on the side of circuit board 100, heat-conducting silicone 300 is arranged on the side of sampling resistance 200 away from circuit board 100, and heat sink 500 is arranged on the side of heat-conducting silicone 300 away from sampling resistance 200.

[0036] It should be noted that sampling resistance 200, heat-conducting silicone 300 and heat sink 500 are mutually adhered to form a stable and efficient heat transfer path, so that the heat of sampling resistance 200 can be transferred to heat sink 500 through heat-conducting silicone 300. Fixed block 400 is located between circuit board 100 and heat sink 500, and fixed block 400 is used to fix heat-conducting silicone 300 on the side of sampling resistance 200 away from circuit board 100 and fix heat sink 500 on the side of heat-conducting silicone 300 away from sampling resistance 200, that is, the position of heat-conducting silicone 300 and heat sink 500 can be fixed by fixed block 400, to avoid the dislocation of heat-conducting silicone 300 and heat sink 500 during use, thereby reducing the heat dissipation efficiency of sampling resistance 200.

[0037] It should be noted that, since the heat dissipation piece 500 and the heat-conductive silica gel 300 are both away from the circuit board 100 and do not directly contact the circuit board 100, they will not contact the electrical elements on the circuit board 100, and thus will not affect the insulation performance of the circuit board 100.

[0038] It should be noted that the circuit board 100 is also provided with a positioning slot 110 and a fixing hole 120 matched with the fixing bolt 600, as shown in Figure 3 It should be noted that, by setting a positioning piece 430 matched with the positioning slot 110 on the fixing block 400, the position of the fixing block 400 on the circuit board 100 can be fixed, and by setting a mounting through hole 420 matched with the fixing bolt 600 on the fixing block 400, the fixing bolt 600 can pass through the fixing hole 120 and the mounting through hole 420 in sequence and be connected with the heat dissipation piece 500, so as to fix the fixing block 400 between the heat dissipation piece 500 and the circuit board 100.

[0039] It should be noted that the sampling resistor 200 can be installed on the back of the circuit board 100, and the front of the circuit board 100 is provided with electrical elements required by the sampling circuit, and the sampling resistor 200 and the remaining electrical elements are connected by means of a hole in the circuit board 100.

[0040] Specifically, since the sampling resistor 200 is arranged on the back of the circuit board 100, that is, the heat-conductive silica gel 300, the heat dissipation piece 500 and the fixing block 400 are all located on the back of the circuit board 100, the influence of the heat-conductive silica gel 300, the heat dissipation piece 500 and the fixing block 400 on the electrical elements on the front of the circuit board 100 can be reduced. In addition, since the heat-conductive silica gel 300 is arranged on the side away from the circuit board 100 of the sampling resistor 200, and the heat dissipation piece 500 is arranged on the side away from the sampling resistor 200 of the heat-conductive silica gel 300, the heat dissipation piece 500 and the heat-conductive silica gel 300 are both away from the circuit board 100 and do not directly contact the circuit board 100, so that the utilization rate of the layout on the back of the circuit board 100 can be effectively improved.

[0041] It should be noted that the sampling resistor 200 is connected with the circuit board 100 through a tin tray.

[0042] Referring to Figure 2 , Figure 2 A partial schematic view of a circuit board heat dissipation structure provided by the embodiment of the present application.

[0043] It can be understood that the sampling resistor 200 is installed on one side of the circuit board 100, the heat-conducting silica gel 300 is arranged on the side of the sampling resistor 200 away from the circuit board 100, and the sampling resistor 200 and the heat-conducting silica gel 300 are arranged in the interior of the fixing block 400, that is, the position of the heat-conducting silica gel 300 can be fixed through the fixing block 400, so that the heat dissipation efficiency of the sampling resistor 200 is prevented from being reduced due to movement of the heat-conducting silica gel 300.

[0044] It should be noted that the sampling resistor 200, the heat-conducting silica gel 300 and the heat-dissipating piece 500 are mutually attached, the heat transfer path is the sampling resistor 200-heat-conducting silica gel 300-heat-dissipating piece 500, and then the heat-dissipating piece 500 transfers the heat generated by the sampling resistor 200 by heat exchange with air.

[0045] Referring to Figure 3 , Figure 3 A structure diagram of the fixing block is provided for an embodiment of the utility model.

[0046] It can be understood that the fixing block 400 is provided with an installation groove 410 penetrating through the upper and lower parts, the heat-conducting silica gel 300 and the sampling resistor 200 are located in the installation groove 410, the heat-conducting silica gel 300 is limited through the installation groove 410, and the heat-conducting silica gel 300 is prevented from being dislocated in the use process, wherein the length of the installation groove 410 can be equal to the length of the heat-conducting silica gel 300, and the width of the installation groove 410 can be equal to the width of the heat-conducting silica gel 300. In addition, in order to guarantee normal assembly of the installation groove 410 and the heat-conducting silica gel 300, a certain space can be reserved according to the size of the installation groove 410 and the heat-conducting silica gel 300, that is, the length of the installation groove 410 can be greater than the length of the heat-conducting silica gel 300, and the width of the installation groove 410 can be greater than the width of the heat-conducting silica gel 300.

[0047] It should be noted that the sampling resistor 200 and the heat-conducting silica gel 300 are arranged in the interior of the installation groove 410, that is, the position of the heat-conducting silica gel 300 can be fixed through the installation groove 410, and since the installation groove 410 penetrates through the upper and lower parts, the installation groove 410, the heat-dissipating piece 500 and the sampling resistor 200 will surround the heat-conducting silica gel 300, so that the movement space of the heat-conducting silica gel 300 is reduced.

[0048] Referring to Figure 4 , Figure 4 A structure diagram of the fixing block is provided for another embodiment of the utility model.

[0049] It can be understood that the side surface of the fixing block 400 is provided with an upper and lower through installation groove 410, and the heat-conducting silica gel 300 and the sampling resistor 200 are located in the installation groove 410. After the upper and lower through installation groove 410 is provided on the side surface of the fixing block 400, the fixing block 400 includes a first part 401 and a second part 402 located on both sides of the first part 401, wherein the first part 401 and the second part 402 are in abutment with the heat-conducting silica gel 300. By providing the upper and lower through installation groove 410 on the side surface of the fixing block 400, the user can conveniently install the heat-conducting silica gel 300 into the installation groove 410.

[0050] It should be noted that the circuit board 100 is provided with a positioning slot 110, and the positioning slot 110 is located on one side of the sampling resistor 200. The first part 401 of the fixing block 400 is provided with a positioning piece 430 matched with the positioning slot 110, and the positioning piece 430 is arranged in the positioning slot 110. As shown in Figure 5 Figure 5 As shown in Figure 4 As shown in the structural schematic view of another angle of the fixing block, the extension direction of the positioning piece 430 is the vertical direction, that is, the positioning piece 430 is perpendicular to the circuit board 100. When the user assembles the circuit board heat dissipation structure, the positioning piece 430 and the positioning slot 110 can play a positioning role, reducing the assembly difficulty of the user. Therefore, by providing the positioning slot 110 and the positioning piece 430, the user can conveniently assemble and limit the position of the fixing block 400.

[0051] Specifically, the length of the positioning piece 430 in the vertical direction can be greater than the length of the positioning slot 110 in the vertical direction, reducing the possibility of dislocation of the fixing block 400.

[0052] ​It should be noted that the circuit board heat dissipation structure further comprises a fixing bolt 600, the circuit board 100 is provided with a fixing hole 120 matched with the fixing bolt 600, and the two sides of the mounting groove 410 are provided with mounting through holes 420 matched with the fixing bolt 600. The mounting through holes 420 are located on the same straight line with the fixing hole 120, and the fixing bolt 600 is sequentially arranged in the fixing hole 120 and the mounting through hole 420 and is fixedly connected with the heat dissipation piece 500. The position of the fixing block 400 and the heat dissipation piece 500 can be fixed by the fixing bolt 600. Among them, the mounting through hole 420 is arranged on the outside of the second part 402, that is, the position of the fixing block 400 can be fixed by the fixing bolt 600 and the mounting through hole 420. When the user fixes and cooperates the fixing bolt 600 and the heat dissipation piece 500, the heat dissipation piece 500 and the circuit board 100 will extrude the fixing block 400, and then fix the fixing block 400. Since the heat-conducting silica gel 300 is installed in the mounting groove 410 of the fixing block 400, the position of the heat-conducting silica gel 300, the fixing block 400 and the heat dissipation piece 500 can be fixed by the fixing block 400 and the fixing bolt 600.

[0053] It can be understood that if the positioning slot 110 is arranged on the long side of the sampling resistor 200, the fixing hole 120 is arranged on the short side of the sampling resistor 200; similarly, if the positioning slot 110 is arranged on the short side of the sampling resistor 200, the fixing hole 120 is arranged on the long side of the sampling resistor 200.

[0054] Specifically, the first thickness of the heat-conducting silica gel 300 in the vertical direction is greater than the second thickness of the fixing block 400 in the vertical direction, that is, the top of the heat-conducting silica gel 300 is higher than the top of the fixing block 400. When the user fixes and cooperates the circuit board 100, the fixing block 400 and the heat dissipation piece 500 by the fixing bolt 600, if the first thickness of the heat-conducting silica gel 300 in the vertical direction is greater than the second thickness of the fixing block 400 in the vertical direction, the heat dissipation piece 500 will extrude the heat-conducting silica gel 300 to make the heat-conducting silica gel 300 deform, thereby limiting the movement of the heat-conducting silica gel 300 in the vertical direction. The difference between the first thickness of the heat-conducting silica gel 300 in the vertical direction and the second thickness of the fixing block 400 in the vertical direction is a first difference.

[0055] Specifically, since the sampling resistor 200 has a certain thickness and the sampling resistor 200 and the heat-conducting silica gel 300 are located in the mounting groove 410, the third thickness of the heat-conducting silica gel 300 in the vertical direction is greater than the fourth thickness of the fixed block 400 in the vertical direction, but the difference between the third thickness and the fourth thickness is less than the first difference. When the heat-conducting silica gel 300 is installed above the sampling resistor 200, although the difference between the third thickness and the fourth thickness is less than the first difference, the sampling resistor 200 will play a role of raising the heat-conducting silica gel 300, so that the top of the heat-conducting silica gel 300 is higher than the top of the fixed block 400. When the user fixes the circuit board 100, the fixed block 400 and the heat-dissipating piece 500 through the fixing bolt 600, the heat-dissipating piece 500 will extrude the heat-conducting silica gel 300 to make the heat-conducting silica gel 300 deform, thereby limiting the movement of the heat-conducting silica gel 300 in the vertical direction.

[0056] Similarly, in the case that the thickness of the heat-conducting silica gel 300 in the vertical direction is greater than the thickness of the fixed block 400 in the vertical direction, the difference between the thickness of the heat-conducting silica gel 300 in the vertical direction and the thickness of the fixed block 400 in the vertical direction can be adjusted according to the thickness of the sampling resistor 200.

[0057] It should be noted that a heat-conducting silicone grease layer is arranged between the sampling resistor 200 and the heat-conducting silica gel 300. By arranging the heat-conducting silicone grease layer between the sampling resistor 200 and the heat-conducting silica gel 300, the heat transfer efficiency between the sampling resistor 200 and the heat-conducting silica gel 300 can be effectively improved. In addition, a heat-conducting silicone grease layer can also be arranged between the heat-conducting silica gel 300 and the mounting groove 410. By arranging the heat-conducting silicone grease layer between the heat-conducting silica gel 300 and the mounting groove 410, if there is a gap between the heat-conducting silica gel 300 and the mounting groove 410, the heat-conducting silicone grease layer can fill the gap, thereby improving the heat transfer efficiency of the circuit board heat dissipation structure.

[0058] It can be understood that the fixed block 400 can be composed of a first fixed block and a second fixed block, the heat-conducting silica gel 300 includes a first surface, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface, wherein the first surface of the heat-conducting silica gel 300 is in abutment with the side of the sampling resistor 200 away from the circuit board 100, the sixth surface of the heat-conducting silica gel 300 is in abutment with the side of the heat-dissipating piece 500 close to the circuit board 100, the first positioning slot and the second positioning slot are formed on the circuit board 100, and the first positioning slot and the second positioning slot are respectively located on the two sides of the sampling resistor 200; the first fixed block is in abutment with the second surface of the heat-conducting silica gel 300 and the third surface of the heat-conducting silica gel 300, the second fixed block is in abutment with the fourth surface of the heat-conducting silica gel 300 and the fifth surface of the heat-conducting silica gel 300, the first fixed block is provided with a first positioning sheet matched with the first positioning slot on the side close to the circuit board 100, and the second fixed block is provided with a second positioning sheet matched with the second positioning slot on the side close to the circuit board 100. The first fixed block and the second fixed block apply force to two opposite corners of the heat-conducting silica gel 300, so as to fix the position of the heat-conducting silica gel 300.

[0059] Referring to Figure 6 , Figure 6 A structure diagram of the heat-dissipating piece is provided.

[0060] It can be understood that the heat-dissipating piece 500 includes a fixed part 510 and a heat-dissipating part, the heat-dissipating part is arranged on the side of the fixed part 510 away from the circuit board 100, the fixed part 510 is provided with a threaded hole matched with the fixed bolt 600 on the side close to the circuit board 100, and the fixed bolt 600 is sequentially arranged in the fixed hole 120 and the mounting through hole 420 and then connected with the threaded hole. The heat-dissipating part includes a plurality of heat-dissipating fins 520, and the plurality of heat-dissipating fins 520 are arranged side by side on the side of the fixed part 510 away from the circuit board 100, wherein the plurality of heat-dissipating fins 520 extend along the vertical direction and the spacing distances between the heat-dissipating fins 520 are equal. The heat-dissipating fins 520 are arranged on the side of the fixed part 510 away from the circuit board 100, the surface area of the heat-dissipating part is increased, the contact area between the heat-dissipating part and air is expanded, and thus the heat-dissipating efficiency is improved.

[0061] Specifically, a plurality of air guide grooves are formed on the heat-dissipating fin 520, and the air guide grooves extend along the horizontal direction. By forming the plurality of air guide grooves on the heat-dissipating fin 520, the direction and speed of air flow can be changed, and thus the heat-dissipating efficiency is improved.

[0062] Specifically, the heat-dissipating fin 520 can also be a corrugated heat-dissipating fin, that is, the shape of the heat-dissipating fin 520 is corrugated. By increasing the corrugated shape of the fin, the contact area between the heat-dissipating fin 520 and air is increased, and in addition, the corrugated shape can also enhance the disturbance of fluid, destroy the heat transfer boundary layer, and thus improve the heat transfer coefficient.

[0063] Specifically, the heat dissipation fins 520 can also be spiral fins, and the spiral shape can guide air to form a turbulent flow inside the pipe, enhancing the heat and mass transfer process.

[0064] It should be noted that the circuit board heat dissipation structure can be applied to an air conditioner outdoor unit, which includes a fan including an air inlet and an air outlet, wherein the heat dissipation member 500 of the circuit board heat dissipation structure faces the air outlet of the fan. When the fan is in a working state, the air flow rate of the air outlet increases, thereby increasing the speed of air flowing through the heat dissipation fins 520, thereby improving the heat dissipation efficiency of the circuit board 100 heat dissipation mechanism.

[0065] In a second aspect, the utility model provides a kind of electronic equipment, including the circuit board heat dissipation structure of above first aspect embodiment, including circuit board 100, sampling resistance 200, heat-conducting silica gel 300, heat dissipation member 500 and fixed block 400.Wherein, sampling resistance 200 is installed in one side of circuit board 100, heat-conducting silica gel 300 is set in the side of sampling resistance 200 away from circuit board 100, heat dissipation member 500 is set in the side of heat-conducting silica gel 300 away from sampling resistance 200.

[0066] According to the electronic equipment provided by the utility model embodiment, with the improvement of circuit power or the extension of circuit use time, the temperature of the sampling resistor will continue to rise, and if it cannot be cooled in time, it may cause the circuit performance to decline, therefore, by using the fixed block installed between the heat dissipation member and the circuit board, the heat-conducting silica gel is ensured to be tightly fixed on the side of the sampling resistor away from the circuit board, and the heat dissipation member is stably fixed on the side of the heat-conducting silica gel away from the sampling resistor, thereby forming an efficient heat transfer path, so that the heat continuously generated by the sampling resistor during operation can be transferred to the heat dissipation member through the heat-conducting silica gel, and then the heat is transferred away by the heat dissipation member;Therefore, by positioning and fixing the sampling resistor, the heat-conducting silica gel and the heat dissipation member through the fixed block, the direct contact between the heat dissipation member and the circuit board is avoided, which not only protects the back layout of the circuit board from being disturbed and improves the utilization rate of the back layout of the circuit board, but also effectively prevents the problem that the sampling resistor affects the circuit performance due to the delay of heat dissipation during operation.

[0067] The utility model embodiments are described in detail above in conjunction with the drawings, but the utility model is not limited to the above embodiments, and various changes can be made within the knowledge range of ordinary skilled persons in the technical field without departing from the purpose of the utility model.

Claims

1. A heat dissipation structure for a circuit board, characterized in that, The circuit board heat dissipation structure comprises a circuit board, a sampling resistor, a heat conductive silica gel, a heat dissipation piece and a fixing block. The circuit board heat dissipation structure comprises a circuit board, a sampling resistor, a heat conductive silica gel, a heat dissipation piece and a fixing block. The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor. The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor. The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor.

2. The circuit board heat dissipating structure according to claim 1, wherein The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor.

3. The circuit board heat dissipating structure according to claim 1, wherein The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor.

4. The circuit board heat dissipating structure according to claim 1, wherein The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor.

5. The circuit board heat dissipating structure according to claim 1, wherein The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor.

6. The circuit board heat dissipating structure according to claim 5, wherein The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor.

7. The circuit board heat dissipating structure according to claim 6, wherein The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor.

8. The circuit board heat dissipating structure according to claim 1, wherein The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor.

9. An electronic device, comprising: The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor. The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor. The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor. The fixing block is arranged between the heat dissipation piece and the circuit board, and is used for fixing the heat conductive silica gel to a side of the sampling resistor away from the circuit board and fixing the heat dissipation piece to a side of the heat conductive silica gel away from the sampling resistor. The fixing block is

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