Circuit module heat dissipation structure and thermal management system controller module

Abstract

The utility model discloses a circuit module heat dissipation structure and a heat management system controller module, and relates to the technical field of circuit heat dissipation structures. The circuit module heat dissipation structure comprises an installation bottom shell which is used for installing a circuit module and is made of a metal material; the heat conduction filling layer is made of an insulating heat conduction material, and in a working state, the heat conduction filling layer is filled between the circuit module and the mounting bottom shell; the protective cover body is in heat conduction connection with the mounting bottom shell, and the protective cover body is made of a metal material, so that heat dissipation is performed through the mounting bottom shell and the protective cover body at the same time, the heat dissipation area of the circuit module is increased, heat generated during operation of an electronic device can be effectively and rapidly conducted out, and the service life of the electronic device is prolonged. And the circuit module is prevented from entering self-protection due to excessive heating. The thermal management system controller module comprises a controller body, and the controller body is matched with the circuit module heat dissipation structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit heat dissipation structure technical field, concretely relates to a circuit module heat dissipation structure and heat management system controller module. BACKGROUND

[0002] The electronic circuit heat dissipation structure or the heat dissipation system equipped is an important component of equipment, to cool electronic device through heat dissipation structure or heat dissipation system, avoid electronic device overtemperature operation. In new energy automobile industry, heat dissipation structure design is an important component of heat management system controller, is related to the exertion of controller electronic component and the normal work of controller, especially under the condition of limited space and higher power, the heat dissipation effect is crucial.

[0003] At present, in new energy automobile industry, the controller power of heat management system is usually higher, however the controller of heat management system is mostly plastic shell or single-face metal shell, and is matched with liquid cooling or fan cooling structure, resulting in that the cost of heat management system is higher, if not matched with liquid cooling or fan cooling structure, only utilizes single-face metal shell natural heat dissipation, then the surface area is smaller, and the heat dissipation capacity is lower, can not maintain high power work for a long time, limits the normal exertion of controller function. UTILITY MODEL CONTENT

[0004] The utility model provides a kind of circuit module heat dissipation structure and heat management system controller module, can effectively and quickly export the heat generated when electronic device operates, ensure that circuit module does not enter self-protection because of excessive heat, ensure the normal work of controller.

[0005] The utility model realizes by the following technical scheme:

[0006] First, the utility model provides a kind of circuit module heat dissipation structure, comprising: installation bottom shell, the installation bottom shell is used to install circuit module, and the installation bottom shell is metal material;Heat conduction filling layer, the heat conduction filling layer is insulating heat conducting material, in working condition, the heat conduction filling layer is filled between circuit module and the installation bottom shell;Protective cover, the protective cover is heat conduction connection with the installation bottom shell, and the protective cover is metal material.

[0007] The circuit module heat dissipation structure provided by the utility model, through the installation bottom shell and the protective cover body simultaneously carries out heat dissipation, increases the heat dissipation area of the circuit module, can effectively and quickly lead out the heat generated when the electronic device operates, ensures that the circuit module does not enter self-protection because of excessive heat, guarantees the normal work of the electronic component.

[0008] Therefore, the circuit module heat dissipation structure provided by the utility model carries out heat dissipation through the installation bottom shell and the protective cover body, increases the heat dissipation area of the circuit module, can effectively and quickly lead out the heat generated when the electronic device operates, ensures that the circuit module does not enter self-protection because of excessive heat, guarantees the normal work of the electronic component.

[0009] In an optional implementation, the protective cover body and the installation bottom shell are riveted and fixed, so as to ensure that the connection between the protective cover body and the installation bottom shell has sufficient stability, and the installation bottom shell and the protective cover body have sufficient contact area, so that the heat of the installation bottom shell can be quickly transmitted to the protective shell.

[0010] In an optional implementation, the outer side wall of the installation bottom shell is provided with a plurality of first heat dissipation vertical ribs, so as to increase the heat dissipation area of the installation bottom shell.

[0011] In an optional implementation, the interval between two adjacent first heat dissipation vertical ribs is 6mm to 7mm, so as to ensure that the first heat dissipation vertical ribs have sufficient heat dissipation area, and the heat generated by the first heat dissipation vertical ribs can be carried away by air in time.

[0012] In an optional implementation, the outer side wall of the installation bottom shell is further provided with a first heat dissipation horizontal rib, and the first heat dissipation horizontal rib transversely connects all the first heat dissipation vertical ribs, which can further increase the effective heat dissipation area of the installation bottom shell, and can quickly transmit the heat generated by the heat element concentrated area of the installation bottom shell to the first heat dissipation vertical rib area corresponding to the non-heat generating area of the circuit module, so as to avoid heat accumulation in the heat generating area and excessively high temperature, and further improve the heat dissipation efficiency of the heat dissipation structure.

[0013] In an alternative embodiment, the outer sidewall of the protective cover is provided with a plurality of second heat dissipation vertical ribs to increase the effective heat dissipation area of the protective cover.

[0014] In an alternative embodiment, the outer sidewall of the protective cover is provided with a plurality of second heat dissipation horizontal ribs to further increase the effective heat dissipation area of the protective cover, and the horizontal ribs are substantially longitudinal along the length direction of the cover to improve the structural strength of the cover.

[0015] In an alternative embodiment, the second heat dissipation vertical ribs and the second heat dissipation horizontal ribs are arranged in an alternating manner to ensure that the protective cover can uniformly dissipate heat.

[0016] In an alternative embodiment, the heat conduction filling layer is made of insulating heat-conducting silica gel material to ensure that the heat generated at each part of the circuit module can be directly transmitted to the mounting bottom shell while ensuring sufficient heat conduction efficiency of the heat conduction filling layer.

[0017] In a second aspect, the utility model provides a kind of heat management system controller module, including controller body, and the controller body is adapted with above-mentioned circuit module heat dissipation structure.

[0018] The heat management system controller module provided by the utility model is adapted with the above-mentioned circuit module heat dissipation structure, that is, the controller body is simultaneously cooled by the mounting bottom shell and the protective cover, which can effectively and quickly export the heat generated during the operation of electronic devices, ensure that the heat management system controller module does not enter self-protection due to excessive heating, and ensure the normal operation of the controller.

[0019] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0020] 1. The circuit module heat dissipation structure provided by the utility model, including installation bottom shell, heat conduction filling layer and protective cover body, installation bottom shell and protective cover body are metal material, can carry out heat conduction and heat dissipation efficiently, heat conduction filling layer is filled between circuit module and installation bottom shell under the working condition of insulating heat conducting material, when circuit module works, the heat generated by electronic components on it is transferred to installation bottom shell through heat conduction filling layer, so that the air around installation bottom shell is heated to make the air natural convection and radiative heat transfer with surrounding objects, at the same time, protective cover body and installation bottom shell are in heat conduction connection, and the heat obtained by installation bottom shell can be transferred to protective cover body, so that the air around protective cover body is heated to make the air natural convection and radiative heat transfer with surrounding objects, therefore, the circuit module heat dissipation structure provided by the utility model carries out heat dissipation through installation bottom shell and protective cover body simultaneously, increases the heat dissipation area of circuit module, can effectively and quickly export the heat generated when electronic devices operate, and ensures that the circuit module will not enter self-protection because of excessive heat, guaranteeing the normal work of the controller.

[0021] 2. The heat management system controller module provided by the utility model, the controller body is adapted with the above-mentioned circuit module heat dissipation structure, so that the controller body carries out heat dissipation through installation bottom shell and protective cover body simultaneously, can effectively and quickly export the heat generated when electronic devices operate, and ensures that the heat management system controller module will not enter self-protection because of excessive heat, guaranteeing the normal work of the controller. Therefore, the module does not need to be additionally configured with liquid cooling or fan heat dissipation structure, reduces the heat dissipation structure cost of the module, and saves the energy consumption caused by heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0023] In the drawings:

[0024] Figure 1 It is a structure schematic view of the circuit module heat dissipation structure of the utility model embodiment

[0025] Figure 2 It is a top view structure schematic view of the heat management system controller module of the utility model embodiment

[0026] Figure 3 It is an A-A surface structure schematic view of the utility model embodiment Figure 2

[0027] ​Figure 4 It is the bottom structure schematic view of the heat management system controller module of the embodiment of the utility model;

[0028] Figure 5 It is the B-B surface structure schematic view of the embodiment of the utility model. Figure 4

[0029] Mark and corresponding component name in the drawing:

[0030] 10-mounting bottom shell, 11-first radiating vertical rib, 12-first radiating horizontal rib, 20-circuit module, 30-heat conduction filling layer, 40-protection cover body, 41-second radiating vertical rib, 42-second radiating horizontal rib, 50-controller body. Specific embodiments

[0031] To make the purpose, technical scheme and advantage of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application, obviously, the described embodiments are part of the embodiments of the present application, not all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] In the description of the embodiments of the present application, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or is the orientation or positional relationship commonly placed when the product of the application is used, or is the orientation or positional relationship commonly understood by the person skilled in the art, only for the convenience of describing the present application and simplifying the description, and is not intended to indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0033] In the description of the present application, unless otherwise explicitly specified and limited, the terms "set", "open", "mount", "connected", "connected" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected, can be directly connected, can be indirectly connected through an intermediate medium, can be the communication inside two elements. For the person skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] Embodiment 1

[0035] Combined Figure 1 ​The embodiment provides a heat dissipation structure of a circuit module 20, which comprises a mounting bottom shell 10, a heat conduction filling layer 30 and a protective cover 40.

[0036] In combination with Figure 1 and Figure 3 , a plurality of first heat dissipation vertical ribs 11 are arranged on the outer side wall of the mounting bottom shell 10, so as to increase the heat dissipation area of the mounting bottom shell 10.

[0037] The interval between two adjacent first heat dissipation vertical ribs 11 is determined according to design requirements and the material strength of the mounting bottom shell 10. In the embodiment, the interval between two adjacent first heat dissipation vertical ribs 11 is 6mm-7mm, so as to ensure that the first heat dissipation vertical ribs 11 have sufficient heat dissipation area and the heat generated by the first heat dissipation vertical ribs 11 can be carried away by air in time.

[0038] It can be understood that the heat conduction filling layer 30 is filled between the inner side wall of the mounting bottom shell 10 and the bottom surface of the substrate of the circuit module 20. In the embodiment, the heat conduction filling layer 30 is made of insulating heat conductive gel material, which can conduct heat and has high flexibility and can fill the gap between the inner side wall of the mounting bottom shell 10 and the bottom surface of the substrate of the circuit module 20, so as to ensure that the heat conduction filling layer 30 has sufficient heat conduction efficiency and the heat generated by the circuit module 20 can be directly transmitted to the mounting bottom shell 10.

[0039] In combination with Figure 1 and Figures 3-5 , the outer side wall of the mounting bottom shell 10 is further provided with first heat dissipation horizontal ribs 12, the first heat dissipation horizontal ribs 12 are transversely connected to all the first heat dissipation vertical ribs 11, on one hand, the effective heat dissipation area of the mounting bottom shell 10 can be further increased, and on the other hand, the heat generated by the heat element concentrated area of the circuit module 20 on the mounting bottom shell 10 can be more quickly transmitted to the first heat dissipation vertical rib 11 area corresponding to the non-heat generating area of the circuit module 20, so as to further improve the heat dissipation efficiency of the heat dissipation structure. It can be understood that the first heat dissipation horizontal ribs 12 are arranged in the area corresponding to the heat element concentrated area of the circuit module 20 on the mounting bottom shell 10.

[0040] In combination with Figure 2 and Figure 3 Specifically, the outer side wall of the protective cover 40 is provided with a plurality of second heat dissipation vertical ribs 41, so as to increase the effective heat dissipation area of the protective cover 40.

[0041] On this basis, the outer side wall of the protective cover 40 is provided with a plurality of second heat dissipation horizontal ribs 42 to further increase the effective heat dissipation area of the protective cover 40.

[0042] Again in combination Figure 2 The second heat dissipation vertical ribs 41 and the second heat dissipation horizontal ribs 42 are arranged in an alternating and staggered manner to ensure that the protective cover 40 can uniformly dissipate heat, and at the same time, the horizontal ribs extend longitudinally along the length direction of the cover, thereby improving the structural strength of the cover.

[0043] It should be noted that the protective cover 40 is riveted and fixed (edge riveting) to the mounting bottom shell 10 to ensure that the connection between the protective cover 40 and the mounting bottom shell 10 is stable enough, and at the same time, to ensure that there is enough contact area between the mounting bottom shell 10 and the protective cover 40, so that the heat of the mounting bottom shell 10 can be quickly transferred to the protective shell.

[0044] In summary, the circuit module 20 heat dissipation structure provided in the embodiment includes a mounting bottom shell 10, a heat conduction filling layer 30, and a protective cover 40. The mounting bottom shell 10 and the protective cover 40 are both made of metal material, which can efficiently conduct and dissipate heat. The heat conduction filling layer 30 is made of insulating and heat-conducting material and is filled between the circuit module 20 and the mounting bottom shell 10 in a working state, so that the circuit module 20, the heat conduction filling layer 30, and the mounting bottom shell 10 form a heat conduction structure. At the same time, the protective cover 40 is in heat-conducting connection with the mounting bottom shell 10, so that the protective cover 40 and the mounting bottom shell 10 form a heat conduction structure.

[0045] In use, the circuit module 20 is installed and fixed on the mounting bottom shell 10 (usually through screw installation), and the heat conduction filling layer 30 is compressed by the circuit module 20. When the circuit module 20 works, the heat generated by the electronic components thereon is transferred to the mounting bottom shell 10 through the heat conduction filling layer 30, so as to heat the surrounding air through the mounting bottom shell 10 to cause natural convection of the air and radiation heat transfer with the surrounding objects.

[0046] At the same time, the protective cover 40 is in heat-conducting connection with the mounting bottom shell 10, so that the protective cover 40 and the mounting bottom shell 10 form a heat conduction structure.

[0047] In summary, the circuit module 20 heat dissipation structure provided in the embodiment includes a mounting bottom shell 10, a heat conduction filling layer 30, and a protective cover 40. The mounting bottom shell 10 and the protective cover 40 are both made of metal material, which can efficiently conduct and dissipate heat. The heat conduction filling layer 30 is made of insulating and heat-conducting material and is filled between the circuit module 20 and the mounting bottom shell 10 in a working state, so that the circuit module 20, the heat conduction filling layer 30, and the mounting bottom shell 10 form a heat conduction structure. At the same time, the protective cover 40 is in heat-conducting connection with the mounting bottom shell 10, so that the protective cover 40 and the mounting bottom shell 10 form a heat conduction structure.

[0048] It is known that the circuit module 20 heat dissipation structure provided by the above embodiment is not limited to be used for the automobile circuit, and can also be used for other circuit modules 20 needing heat dissipation.

[0049] Embodiment 2

[0050] In combination Figures 2-5 The embodiment provides a heat management system controller module, which comprises a controller body 50, and the controller body 50 is adapted with the circuit module 20 heat dissipation structure.

[0051] That is, the heat management system controller module provided by the embodiment can effectively and quickly export the heat generated by the electronic device during operation through the installation of the bottom shell 10 and the protective cover body 40, so that the heat management system controller module will not enter the self-protection due to excessive heat, and the normal work of the controller is ensured.

[0052] The specific embodiments are described above, and the purposes, technical solutions and beneficial effects of the utility model are further described in detail. It should be understood that the above description is only a specific embodiment of the utility model, and is not used to limit the protection scope of the utility model. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A heat dissipation structure for a circuit module (20), characterized by comprising: The application relates to a circuit module (20) heat dissipation structure. The application comprises: An installation bottom shell (10) used for installing a circuit module (20), wherein the installation bottom shell (10) is made of metal; A heat conduction filling layer (30) made of insulating heat conduction material, wherein the heat conduction filling layer (30) fills between the circuit module (20) and the installation bottom shell (10) in a working state; 2. The circuit module (20) heat dissipation structure according to claim 1, characterized in that, A protective cover body (40) in heat conduction connection with the installation bottom shell (10), wherein the protective cover body (40) is made of metal.

3. The circuit module (20) heat dissipation structure according to claim 1, characterized in that, The protective cover body (40) and the installation bottom shell (10) are fixed by riveting.

4. The circuit module (20) heat dissipation structure according to claim 3, characterized in that, An outer side wall of the installation bottom shell (10) is provided with a plurality of first heat dissipation vertical ribs (11).

5. The circuit module (20) heat dissipation structure according to claim 3, wherein, The interval between two adjacent first heat dissipation vertical ribs (11) is 6-7 mm.

6. The circuit module (20) heat dissipation structure according to claim 1, wherein, The outer side wall of the installation bottom shell (10) is further provided with first heat dissipation horizontal ribs (12) which are transversely connected to all the first heat dissipation vertical ribs (11).

7. The circuit module (20) heat dissipation structure according to claim 6, characterized in that, An outer side wall of the protective cover body (40) is provided with a plurality of second heat dissipation vertical ribs (41).

8. The circuit module (20) heat dissipation structure according to claim 7, characterized in that, An outer side wall of the protective cover body (40) is provided with a plurality of second heat dissipation horizontal ribs (42).

9. The heat dissipation structure for a circuit module (20) according to any one of claims 1 to 7, characterized by The second heat dissipation vertical ribs (41) and the second heat dissipation horizontal ribs (42) are arranged in an interval staggered mode.

10. A thermal management system controller module comprising a controller body (50), characterised in that, The heat conduction filling layer (30) is made of insulating heat conduction gel material. The controller body (50) is adapted to the circuit module (20) heat dissipation structure as claimed in any one of claims 1-9.

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