Wafer loading and detecting integrated system

Abstract

The utility model discloses a wafer loading and detecting integrated system. The wafer loading and detecting integrated system comprises a wafer conveying box, a wafer loading and detecting device and a wafer loading and detecting device, the loading main body is internally provided with a first accommodating space and is provided with an opening in the height direction, and a bearing table is arranged at the opening; the lifting body is arranged in the gap, can ascend and descend in the height direction relative to the loading main body and is provided with a machine cover, and a limiting outlet is formed in the side, close to the outer cover, of the machine cover; and the limiting assembly comprises a swinging part rotating in the horizontal direction, the swinging part can stretch out along the limiting outlet, and in the stretching-out state, the projection of the swinging part in the vertical direction intersects with the edge part of the outer cover and is used for limiting relative movement of the outer cover and the lifting top frame. A limiting mode is changed into a non-contact limiting mode, the outer cover is limited in a non-contact limiting mode instead of a contact fixing mode, and the situation that the outer cleanliness of the wafer box is affected due to abrasion of the base caused by direct contact is avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to an integrated system for wafer loading and testing. Background Technology

[0002] In semiconductor manufacturing, wafer transport is crucial for integrated circuit production. To ensure wafer quality during transport between different processes and to prevent wafers from being contaminated by dust or other pollutants, more and more transport operations are using standard transport containers, namely, standard mechanical interface (SMIF) technology. This system reduces dust contamination of the wafer by significantly reducing the amount of dust flowing through it. This effect is achieved by mechanically ensuring that the gas around the wafer remains relatively still relative to the wafer during wafer transport, storage, and most processes, and by preventing dust particles from the external environment from entering the wafer environment. SMIF technology is centered on the concept of "isolation technology," which aims to prevent product contamination by enclosing the wafer in an ultra-clean environment while relaxing the cleanliness requirements outside this enclosed environment.

[0003] SMIF consists of three parts: a container used to enclose and transport packaged semiconductor wafers during the manufacturing process, an SMIF wafer cassette, input / output devices for opening the SMIF wafer cassette, an SMIF loading port, and a cleanroom that integrates the loading port through a process system. SMIF typically operates as follows: operators or automated material handling systems deliver the SMIF wafer cassette to the SMIF loading port. When the automated batch tracking system identifies the correct batch being loaded into the correct equipment, the SMIF loading port automatically opens the SMIF wafer cassette, removes the wafer, and places it in the equipment within the cleanroom for the appropriate process. Once the process step is complete, the wafer is returned to the SMIF wafer cassette and then carried by operators or transported by the automated material handling system to the next process step.

[0004] Existing technologies generally use a "contact" fixing method to fix the outer casing of the wafer cassette, temporarily fixing it to the base of the wafer cassette. However, this fixing method is prone to mechanical wear at the contact points, generating debris, causing wear on the outer casing and affecting cleanliness.

[0005] Therefore, it is necessary to provide an integrated wafer loading and inspection system to solve the above-mentioned problems in the prior art. Utility Model Content

[0006] The purpose of this invention is to provide an integrated wafer loading and inspection system that reduces mechanical wear caused by contact-type wafer cassette positioning and improves wafer cassette cleanliness.

[0007] To achieve the above objectives, the technical solution of this utility model is as follows:

[0008] An integrated wafer loading and inspection system, comprising:

[0009] A wafer transfer box includes a base, a wafer cassette, and an outer cover. The wafer cassette is placed on the base, and the outer cover is fastened to the outside of the base and houses the wafer cassette inside the outer cover. The bottom of the outer cover has an opening, and an edge portion extends outward along the edge of the opening.

[0010] The loading body has a first accommodating space inside and an opening along the height direction. A support platform is provided at the opening, and there is a gap between the periphery of the support platform and the first accommodating space.

[0011] A lifting body is provided within the gap and is capable of moving up and down relative to the loading body in the height direction. The lifting body is provided with a lifting top frame, and the lifting top frame is provided with a cover. A third accommodating space is provided inside the cover, and a limit outlet is provided on the side of the cover near the outer cover.

[0012] A limiting component is located within the third accommodating space. The limiting component includes a swinging part that rotates horizontally. The swinging part can extend out along the limiting outlet. In the extended state, the projection of the swinging part in the vertical direction intersects with the edge of the outer cover, thereby limiting the relative movement of the outer cover and the lifting top frame.

[0013] The beneficial effects provided by this utility model are as follows: by setting a limiting component, the limiting method between the outer cover and the limiting component is a non-contact limiting method. The "non-contact" limiting method replaces the "contact" fixing method to limit the outer cover, avoiding direct contact that could cause wear on the base and affect the cleanliness of the wafer box.

[0014] Furthermore, the limiting component also includes:

[0015] A servo motor is connected to the cover. The servo motor has a rotating part and can drive the rotating part to rotate around its own axis as the rotation center. One side of the swinging part is connected to the rotating part, and the other side of the swinging part is connected to a limiting part. The limiting part has a protrusion facing the cover.

[0016] Furthermore, the limiting part has a limiting surface on one of its protruding sides, and the height difference between the limiting surface and the top surface of the edge of the outer cover is 0.5mm-1.5mm.

[0017] Furthermore, smooth portions are provided on both sides of the limiting surface.

[0018] Furthermore, it also includes a detection component disposed on the lifting top frame, the detection component being used to detect whether the wafer is parallel and placed individually in the wafer slot.

[0019] Furthermore, the wafer box has multiple parallel wafer slots for accommodating wafers inside, and the wafer box has an inlet end and a closed end. Multiple detection holes are opened on the outside of the wafer box.

[0020] The beneficial effects of this invention are as follows: Through the cooperation of the lifting body and the detection component, the wafer position can be accurately detected, ensuring that each wafer is located in only one wafer slot, preventing multiple wafers from being stacked in one slot, and reducing errors or damage caused by wafer stacking. Furthermore, the detection component can also detect whether the wafers are placed parallel. Detection of parallel placement effectively prevents wafers from tilting or crossing zones, improving the safety of wafer loading by the robotic arm and reducing the risk of wafer damage.

[0021] Furthermore, the detection component includes a through-beam sensor disposed on the lifting top frame. The through-beam sensor has a transmitting end and a receiving end, which are obliquely opposite to each other on both sides of the lifting top frame. The angle between the extension line from the inlet end to the closed end and the extension line from the transmitting end to the receiving end is an acute angle. The light beam emitted by the through-beam sensor can pass through the detection hole.

[0022] Furthermore, it also includes:

[0023] The frame is located on both sides of the loading body along the height direction;

[0024] A top seat is disposed at the end of the frame away from the loading body. The top seat has a second receiving space inside. A transfer port for the wafer cassette to pass through is formed between the top seat, the frame and the loading body.

[0025] A robotic arm is disposed within the second accommodating space, and the robotic arm is used to grip the wafer cassette and place it at the workstation.

[0026] Furthermore, it also includes a partition plate, which is fixedly connected to the lifting body. The partition plate is used to block or open the conveying port. When the partition plate opens the conveying port, the partition plate is located inside the top seat.

[0027] Furthermore, it also includes a lifting component, which is disposed within the top seat. The lifting component includes a lifting shaft, which is fixedly connected to the robotic arm. The lifting component is used to drive the robotic arm to extend or retract from the top seat. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the internal structure of the cover according to an embodiment of the present utility model;

[0029] Figure 2 This is a schematic diagram of the limiting component according to an embodiment of the present utility model.

[0030] Figure 3 This is a schematic diagram of the overall structure of the wafer loading and inspection integrated system of this utility model;

[0031] Figure 4 This is a schematic diagram of the isolation plate structure of the wafer loading and inspection integrated system of this utility model;

[0032] Figure 5 This is a schematic diagram of the lifting body in an embodiment of the present utility model;

[0033] Figure 6 This is an exploded view of the wafer transfer box according to an embodiment of the present invention;

[0034] Figure 7 This is a schematic diagram of the lifting body in the rising state according to an embodiment of the present invention;

[0035] Figure 8 This is a schematic diagram showing the arrangement of wafers in an embodiment of this utility model;

[0036] Figure 9 This diagram illustrates the placement of sensors in existing technology and the placement of sensors in an improved manner.

[0037] Reference numerals: 1. Loading body; 11. First accommodating space; 12. Base; 13. Wafer box; 14. Outer cover; 15. Edge; 17. Support platform; 18. Gap; 131. Inlet end; 132. Closed end; 2. Lifting body; 21. Lifting top frame; 3. Detection component; 31. Transmitter end; 32. Receiver end; 4. Frame; 41. Top seat; 411. Second accommodating space; 42. Conveyor port; 43. Robotic arm; 44. Isolation plate; 5. Limiting component; 51. Cover; 511. Third accommodating space; 512. Limiting opening; 52. Servo; 53. Swinging part; 54. Limiting part; 541. Limiting surface; 542. Rounded part; 6. Wafers placed across zones; 7. Correctly placed wafers; 8. Center line of wafer in front-back direction; 9. Prior art sensor placement; 91. Improved sensor placement; 92. Fixing base. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0039] In existing technologies, sensors are typically used to detect whether wafers are individually placed in a single wafer bay, thus preventing wafer stacking (i.e., multiple wafers in one wafer bay). However, wafers can also be placed at an angle, with one side higher than the other. This causes the wafer to deviate from its correct flat position, potentially extending into adjacent wafer bays, resulting in a tilted state, known as a tilting cross-area phenomenon. This tilting cross-area phenomenon can cause a robotic arm to initially contact one side of the wafer during pickup, dragging only that side. This can lead to the wafer rotating, falling from the robotic arm's fingertips, and causing damage.

[0040] The following is in conjunction with the appendix Figure 1 -Appendix Figure 9 The specific embodiments of this utility model will be further described in detail below.

[0041] An integrated wafer loading and inspection system includes a wafer transfer box, a loading body 1, a lifting body 2, an inspection component 3, and a limiting component 5.

[0042] The wafer transfer box includes a base 12, a wafer cassette 13, and an outer cover 14. The wafer cassette 13 is placed on the base 12, and the outer cover 14 is fastened to the outside of the base 12 and houses the wafer cassette 13 inside the outer cover 14. The bottom of the outer cover 14 has an opening, and an edge portion 15 extends outward along the edge of the opening.

[0043] The loading body 1 has a first accommodating space 11 inside, and the loading body 1 has an opening along its own height direction, with the opening located at the top. A support platform 17 is provided at the opening, and the periphery of the support platform 17 has a gap 18 with the first accommodating space 11. A lifting body 2 is provided within the gap 18 and can be raised and lowered relative to the loading body 1 along the height direction. A lifting top frame 21 is provided on the lifting top frame 21, and a cover 51 is provided on the lifting top frame 21. A third accommodating space 511 is provided inside the cover 51, and a limit outlet is provided on the side of the cover 51 near the outer cover 14. A limit component 5 is located in the third accommodating space 511. The limit component 5 includes a swing part 53 that rotates in the horizontal direction. The swing part 53 can extend along the limit outlet. In the extended state, the projection of the swing part 53 in the vertical direction intersects with the edge 15 of the outer cover 14, which is used to limit the relative movement of the outer cover 14 and the lifting top frame 21.

[0044] The wafer cassette 13 has multiple parallel wafer slots and inspection holes for accommodating wafers. The wafer cassette 13 has an inlet end 131 and a closed end 132 positioned opposite each other. The inlet end 131 is used to place the wafers into the wafer slots. A lifting body 2 is disposed within the first accommodating space 11 and can move up and down relative to the loading body 1 in the height direction. Specifically, the lifting body 2 is lifted using an electric cylinder or a lead screw mechanism. The extension end of the electric cylinder is fixedly connected to the lifting body 2 to drive the lifting body 2 to move up and down in the height direction of the loading body 1. A lifting top frame 21 is provided on the lifting body 2, and the lifting top frame 21 is fitted onto the outer periphery of the wafer cassette 13.

[0045] In some embodiments of this invention, the detection component 3 is disposed on the lifting top frame 21. The detection component 3 is used to detect whether the wafers are parallel and individually placed in the wafer tray. The detection component 3 includes a through-beam sensor disposed on the lifting top frame 21. The through-beam sensor has a transmitting end 31 and a receiving end 32, which are obliquely opposite to each other on both sides of the lifting top frame 21. The angle between the extension line between the inlet end 131 and the closed end 132 and the extension line between the transmitting end 31 and the receiving end 32 is an acute angle. As the lifting top frame 21 rises, the transmitting end 31 and the receiving end 32 detect the state and position of the wafers in the wafer tray 13. Specifically, the transmitting end 31 of the through-beam sensor emits a beam of light, which can be visible light or infrared light. When the lifting top frame 21 rises, the beam of light emitted by the transmitting end 31 passes through the area where the wafer is located. If the wafer 7 is correctly placed, the beam of light will reach the receiving end 32 along a predetermined path. The receiving end 32 is responsible for receiving the beam of light passing through the transmitting end 31. If the wafers are not placed correctly, such as in the case of stacking, the light beam may be blocked by the stacked wafers, preventing the receiver 32 from receiving sufficient light signals. When the receiver 32 detects a change in the light signal, the photoelectric element inside the sensor converts the light signal into an electrical signal, which is then amplified, processed, and output to the controller for alarm display. This allows the system to determine if there is an abnormal wafer placement. If wafers 6 are placed across different zones, the light beam emitted by the transmitter 31 will also be blocked, causing the receiver 32 to either not receive any light or not receive sufficient light signals for alarm display.

[0046] In the prior art, the sensor is located at the centerline 8 in the front-back direction of the wafer. When a cross-region tilt occurs, the height of the centerline 8 region in the front-back direction of the wafer does not change, causing the prior art to fail to detect the tilting cross-region phenomenon. The sensor placement 9 in the prior art is significantly different from the improved sensor placement of this utility model.

[0047] In some embodiments of this utility model, frames 4 are also provided on both sides of the loading body 1 along the height direction, and a top seat 41 is provided at the end of the frame 4 away from the loading body 1. The top seat 41 has a second receiving space 411 inside, wherein a transfer port 42 for the wafer cassette 13 to pass through is formed between the top seat 41, the frame 4 and the loading body 1. A robotic arm 43 is disposed in the second receiving space 411. The robotic arm 43 is used to grip the wafer cassette 13 and place it on the workstation. Specifically, the robotic arm 43 has a large arm, a small arm and a mechanical gripper, wherein the large arm can rotate horizontally relative to the small arm, and the small arm can rotate relative to the mechanical gripper. The mechanical gripper has two opposing gripping parts, which can grip the wafer when they come close to each other.

[0048] In some embodiments of this utility model, a lifting component is also provided inside the top seat 41. The lifting component includes a lifting shaft, which is fixedly connected to the robotic arm 43. The lifting component is used to drive the robotic arm 43 to extend or retract from the top seat 41. A partition plate 44 is fixedly connected to the lifting body 2. The partition plate 44 rises and falls synchronously with the lifting body 2. When the partition plate 44 rises until it is completely inside the top seat 41, the partition plate 44 can open the conveying port 42 to facilitate the subsequent extension of the robotic arm 43. When the partition plate 44 descends to near the base 12, the partition plate 44 can block the conveying port 42 to prevent external environmental contamination of the wafer.

[0049] In some embodiments of this utility model, an outer cover 14 is provided on the lifting top frame 21. The bottom of the outer cover 14 has an opening, and an edge portion 15 is provided on the side near the opening. In order to facilitate the removal of the wafer cassette 13 from the SMIF, the outer cover 14 needs to be fixed, and then the outer cover 14 is separated from the base 12 by the lifting body 2 of the SMIF to remove the wafer cassette 13.

[0050] In this embodiment of the invention, a strip-shaped cover 51 is provided on the lifting top frame 21, and a third receiving space 511 is provided inside the cover 51. The third receiving space 511 is located in the middle region of the cover 51. A limiting component 5 is provided inside the cover 51, which is located within the third receiving space 511 to limit the relative movement between the outer cover 14 and the lifting top frame 21. Specifically, a limiting outlet is provided on the side of the cover 51 near the outer cover 14. The limiting outlet is interconnected with the third receiving space 511, and the limiting component 5 includes a servo motor 52, a swinging part 53, and a limiting part 54. A fixing seat 92 is provided on one side of the servo motor 52, and the servo motor 52 is mounted on the cover 51 through the fixing seat 92. The top of the servo motor 52 has a rotating part, which can drive the rotating part to rotate around its own axis as the center of rotation. The swinging part 53 can extend along the limiting outlet. In the extended state, the projection of the swinging part 53 in the vertical direction intersects with the edge 15 of the outer cover 14.

[0051] The swing section 53 is plate-shaped, with one side connected to the rotating section and the other side connected to the limiting section 54. The limiting section 54 has a protrusion facing the cover 51, and the bottom surface of the protrusion is smooth. The side of the limiting section 54 with the protrusion has a limiting surface 541. When it is necessary to limit the outer cover 14 and the base 12, the servo motor 52 is driven, which drives the rotating section to rotate. The rotation of the rotating section will drive the swing section 53 connected to it to rotate, thereby causing the limiting section 54 to pass through the limiting outlet of the third receiving space 511. At this time, the height difference between the limiting surface 541 at the bottom of the limiting section 54 and the top surface of the edge 15 of the outer cover 14 is 0.5mm-1.5mm.

[0052] In some embodiments of this utility model, the height difference is 1mm. In this case, the limiting method between the outer cover 14 and the base 12 is non-contact limiting. The non-contact limiting method replaces the contact fixing method to limit the outer cover 14 within a small range, avoiding direct contact that could cause wear on the base 12 and affect the external cleanliness of the wafer box 13.

[0053] In some other embodiments of this utility model, the limiting surface 541 is provided with a smooth portion 542 relative to the base 12. In order to avoid the vibration of the external environment affecting the rotation of the limiting portion 54, the smooth portion 542 is provided at the cutting-in and cutting-out parts of the limiting portion 54 relative to the base 12 driven by the servo motor 52. The smooth portion 542 can make the cutting-in and cutting-out of the limiting portion 54 smoother when external interference or vibration occurs.

[0054] In summary, this invention, by incorporating a limiting component 5, achieves a non-contact limiting method between the outer cover 14 and the base 12. This non-contact method replaces the traditional contact fixing method, providing a small-range limitation on the outer cover 14 and preventing wear on the base 12 caused by direct contact, thus avoiding impact on the external cleanliness of the wafer cassette 13. Simultaneously, an obliquely positioned through-beam sensor allows the system to accurately detect the wafer placement status. Specifically, the sensor can distinguish between wafer stacking and tilting / crossing phenomena by detecting changes in the reflected beam.

[0055] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. An integrated system for wafer loading and inspection, comprising loading and inspecting wafer transport boxes, characterized in that, The application relates to a wafer conveying box, which comprises a base, a wafer box and a cover, the wafer box is arranged on the base, the cover is buckled on the outside of the base and the wafer box is accommodated in the cover, the bottom of the cover is provided with an opening, and an edge portion is formed by extending outward along the edge of the opening. The loading main body is internally provided with a first containing space and has an opening in the height direction, a bearing table is arranged at the opening, and the periphery of the bearing table has a gap with the first containing space. The lifting body is arranged in the gap and can be lifted in the height direction relative to the loading main body, a lifting top frame is arranged on the lifting body, a machine cover is arranged on the lifting top frame, a third containing space is arranged in the machine cover, and a limiting outlet is arranged on the side of the machine cover close to the cover. The limiting assembly is arranged in the third containing space, the limiting assembly comprises a swing portion which rotates in the horizontal direction, the swing portion can extend out of the limiting outlet, and in the extended state, the projection of the swing portion in the vertical direction intersects with the edge portion of the cover, so as to limit the relative movement of the cover and the lifting top frame. The limiting assembly further comprises:

2. The wafer loading and inspection integrated system of claim 1, wherein, A steering engine is connected with the machine cover, the steering engine has a rotating portion, and the steering engine can drive the rotating portion to rotate around the axis of the steering engine; one side of the swing portion is connected with the rotating portion, and the other side of the swing portion is connected with a limiting portion, the limiting portion has a protrusion, and the protrusion faces the machine cover. The side of the limiting portion with the protrusion is provided with a limiting surface, and the height difference between the limiting surface and the top surface of the edge portion of the cover is 0.5mm-1.5mm.

3. The wafer load and inspection integrated system of claim 2, wherein, The two sides of the limiting surface are provided with smooth portions.

4. The wafer loading and inspection integrated system of claim 3, wherein, Further comprising a detection assembly arranged on the lifting top frame, a plurality of wafer grooves for containing wafer pieces are arranged in the wafer box in parallel, and the detection assembly is used for detecting whether the wafer pieces are parallel and placed in the wafer grooves.

5. The wafer loading and inspection integrated system of claim 3, wherein, The wafer box has an inlet end and a closed end, and a plurality of detection holes are arranged on the outside of the wafer box.

6. The wafer loading and inspection integrated system of claim 5, wherein, The detection assembly comprises a pair of photoelectric sensors arranged on the lifting top frame, the pair of photoelectric sensors have a transmitting end and a receiving end, the transmitting end and the receiving end are oppositely arranged on the two sides of the lifting top frame in an inclined manner, the included angle between the extension line between the transmitting end and the receiving end and the extension line between the inlet end and the closed end is an acute angle, and the light beam emitted by the pair of photoelectric sensors can pass out of the detection hole.

7. The wafer loading and inspection integrated system of claim 6, wherein, Further comprising:

8. The wafer loading and inspection integrated system of claim 1, wherein, A frame is arranged on the two sides of the loading main body in the height direction; A top base is arranged on the end of the frame away from the loading main body, the top base is internally provided with a second containing space, and the top base, the frame and the loading main body form a conveying opening for the wafer box to pass through; A mechanical arm is arranged in the second containing space, and the mechanical arm is used for clamping and placing the wafer box on a work station. Further comprising an isolation plate which is fixedly connected with the lifting body, the isolation plate is used for blocking or opening the conveying opening, and when the isolation plate opens the conveying opening, the isolation plate is located in the top base.

9. The wafer loading and inspection integrated system of claim 8, wherein, ​ 10. The wafer loading and inspection integrated system of claim 8, wherein, Further comprising a lifting member, the lifting member is arranged in the top base, the lifting member comprises a lifting shaft, the lifting shaft is fixedly connected with the mechanical arm, and the lifting member is used for driving the mechanical arm to extend out of or retract into the top base.

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