Chip packaging assembly for air cooling heat dissipation

Abstract

The utility model relates to the technical field of radiators, and discloses a chip packaging assembly for air-cooled heat dissipation. The chip packaging assembly comprises a vapor chamber, the bottom of the vapor chamber is provided with a receding cavity used for packaging a chip, the top of the vapor chamber is provided with a plurality of layers of heat dissipation fins, the chip packaging assembly further comprises a plurality of heat conduction pipes installed at the top end of the vapor chamber, one end of each heat conduction pipe is connected with an evaporation cavity of the vapor chamber in a conducting mode, and the other end of each heat conduction pipe sequentially penetrates through each layer of heat dissipation fins. One end, away from the vapor chamber, of the heat-conducting pipe is a closed-end structure; a copper powder structure layer is arranged on the inner wall of the heat conduction pipe. According to the chip packaging assembly, through the plurality of heat conduction pipes arranged at the top end of the vapor chamber and the copper powder structure layers arranged on the inner walls of the heat conduction pipes, heat can be uniformly conducted to each layer of heat dissipation fins through the heat conduction pipes, and the heat exchange efficiency between the vapor chamber and the heat dissipation fins is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, specifically a chip packaging component for air cooling. Background Technology

[0002] With the rapid development of science and technology, chips are showing a trend of high integration, complexity and high frequency. However, the increasing heat generation of chips has become a key factor hindering the improvement of chip performance and reliability. In order to ensure that the chip can achieve the maximum performance and stability, integrated heat sinks are needed to dissipate heat from the chip. However, most integrated heat sinks cannot be directly fixed on the BGA circuit board. Therefore, the method of setting a heat dissipation component on top of the chip and then mounting the integrated heat sink on the heat dissipation component for heat dissipation has been adopted by most manufacturers.

[0003] In existing technologies, most air-cooled heat dissipation systems consist of a VC heat sink encapsulated on top of the chip, with several heat-conducting fins connected to the evaporation end of the VC heat sink, and then cooled by a fan. Due to the large number of heat-conducting fins, the assembly and connection between them is complex. At the same time, the overall distribution of the heat-conducting fins at the evaporation end of the VC heat sink cannot be kept uniform, resulting in low heat exchange efficiency between the VC heat sink and the heat-conducting fins, which fails to meet the heat dissipation requirements of high-power chips.

[0004] Therefore, there is an urgent need for a chip packaging component for air cooling to solve the above problems. Utility Model Content

[0005] Based on the above, the purpose of this utility model is to provide a chip packaging component for air-cooled heat dissipation, so as to solve the problem of low heat exchange efficiency between the VC heat sink and the heat-conducting fins in the existing air-cooled heat dissipation system.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] This utility model provides a chip packaging assembly for air cooling, including a heat spreader plate. The bottom of the heat spreader plate is provided with a cavity for packaging the chip, and the top of the heat spreader plate is provided with several layers of heat dissipation fins. It also includes multiple heat pipes installed on the top of the heat spreader plate. One end of each heat pipe is electrically connected to the evaporation cavity of the heat spreader plate, and the other end passes through each layer of heat dissipation fins in sequence. The end of the heat pipe away from the heat spreader plate is a closed-end structure. The inner wall of the heat pipe is provided with a copper powder structure layer.

[0008] As an optional technical solution for chip packaging components used for air cooling, the heat sink fins are provided with bent portions at both ends, and the bent portions between each layer of heat sink fins are physically abutted.

[0009] As an optional technical scheme of the chip packaging assembly for air cooling heat dissipation, the heat plate comprises a base and a top cover packaged on the base, an evaporation cavity is formed between the base and the top cover, a plurality of connecting holes penetrating the evaporation cavity are arranged on the top cover, and the heat pipe is connected with the evaporation cavity in a conductive mode through the connecting holes.

[0010] As an optional technical scheme of the chip packaging assembly for air cooling heat dissipation, the bottom of the top cover and the upper end surface of the base are respectively provided with a copper powder structure layer, and the thickness of the copper powder structure layer is 0.2mm.

[0011] As an optional technical scheme of the chip packaging assembly for air cooling heat dissipation, a plurality of heat conduction assemblies are arranged in an array in the evaporation cavity, the heat conduction assembly comprises a heat conduction column connected between the top cover and the base, and a heat conduction ring is sleeved on the heat conduction column.

[0012] As an optional technical scheme of the chip packaging assembly for air cooling heat dissipation, the heat conduction column and the heat conduction ring are in a cylindrical, elliptical or cuboid structure, and a plurality of evaporation capillary holes are arranged on the heat conduction ring.

[0013] As an optional technical scheme of the chip packaging assembly for air cooling heat dissipation, the avoidance cavity is arranged at the bottom of the base, and a heat conduction layer is coated in the avoidance cavity.

[0014] As an optional technical scheme of the chip packaging assembly for air cooling heat dissipation, a working medium injection pipe is arranged on one side of the base, one end of the working medium injection pipe is connected with the evaporation cavity in a conductive mode, and the other end of the working medium injection pipe extends to the outside of the base.

[0015] As an optional technical scheme of the chip packaging assembly for air cooling heat dissipation, a first blocking part is arranged on one side of the base, and a second blocking part is arranged at the bottom of the working medium injection pipe.

[0016] As an optional technical scheme of the chip packaging assembly for air cooling heat dissipation, a support block is arranged on the upper end surface of the base and on the left and right sides of the working medium injection pipe, and the top of the support block abuts against the top cover.

[0017] The beneficial effects of the utility model are as follows:

[0018] The utility model provides a chip packaging assembly for air cooling, the chip packaging assembly includes the heat spreader, the bottom of heat spreader is equipped with the empty cavity for encapsulating chip, its top is equipped with a plurality of layers of radiating fin, still include the multiple heat pipes of installing in the top of heat spreader, the one end of heat pipe is connected with the evaporative cavity of heat spreader, its other end is in proper order and is equipped with every layer radiating fin, and the one end of heat pipe far from heat spreader is closed end structure, be equipped with copper powder structure layer on the inner wall of heat pipe.

[0019] Under above structure, heat spreader carries out heat conduction to the chip encapsulated in empty cavity, and the working medium in evaporative cavity absorbs heat and evaporates, and then transfers the heat to the top cover of heat spreader and conducts to radiating fin through the top cover;Through setting heat pipe and copper powder structure layer on the inner wall of heat pipe, the gaseous working medium can penetrate into copper powder structure layer to conduct the heat evenly to heat pipe, and then conducts to radiating fin through heat pipe;That is to say, the working medium in evaporative cavity forms hot air flow after absorbing heat, and a part of hot air flow carries out heat exchange effect with the top cover of heat spreader, and another part spreads to heat pipe and carries out heat exchange effect with copper powder structure layer;Therefore, radiating fin can carry out heat exchange through heat spreader and heat pipe simultaneously, and the gaseous working medium carrying heat can penetrate into copper powder layer evenly, and then conducts the heat evenly to every layer of radiating fin through heat pipe, improves the heat exchange efficiency between radiating fin and heat spreader in the chip packaging assembly, and then increases the heat dissipation effect of the chip packaging assembly to chip. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the overall structure schematic drawing of chip packaging assembly in the utility model embodiment;

[0021] Figure 2 It is the section schematic drawing of chip packaging assembly in the utility model embodiment;

[0022] Figure 3 It is Figure 2 the enlarged schematic drawing of A in the middle;

[0023] Figure 4 It is the explosion schematic drawing of heat spreader in the utility model embodiment;

[0024] Figure 5 It is Figure 4 the enlarged schematic drawing of B in the middle;

[0025] Figure 6 It is the section schematic drawing of heat conducting ring in the utility model embodiment;

[0026] Figure 7 It is the bottom view of heat spreader in the utility model embodiment.

[0027] In the drawing:

[0028] 1, hot plate; 10, top cover; 101, connecting hole; 11, base; 12, evaporation cavity; 13, heat conduction assembly; 130, heat conduction column; 131, heat conduction ring; 132, evaporation capillary hole; 14, empty cavity; 140, heat conduction layer; 15, working medium injection pipe; 16, first blocking part; 17, second blocking part; 18, support block;

[0029] 2, heat dissipation fin; 20, bending part;

[0030] 3, heat pipe; 30, copper powder structure layer. DETAILED DESCRIPTION

[0031] The utility model will be described in further detail below in combination with the drawings and examples. It can be understood that the specific examples described here are only used to explain the utility model and are not limited to the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for ease of description, not all the structures.

[0032] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0033] In the utility model, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0034] In the description of the embodiment, the terms "upper", "lower", "left", "right" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and are not indicative or implied that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the utility model.

[0035] In the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more than two. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0036] As Figures 1-7 Indicated, the utility model provides a kind of for air cooling heat dissipation chip package assembly, the chip package assembly includes heat spreader 1, the bottom of heat spreader 1 is equipped with the empty cavity 14 for encapsulating chip, its top is equipped with several layers of heat dissipation fin 2;It further includes the multiple heat pipes 3 of installing at the top end of heat spreader 1, one end of heat pipe 3 is connected with the evaporative cavity 12 of heat spreader 1, its other end is sequentially arranged in each layer of heat dissipation fin 2, the end of heat pipe 3 away from heat spreader 1 is closed end structure;Copper powder structure layer 30 is equipped on the inner wall of heat pipe 3.

[0037] The chip package assembly for air cooling heat dissipation provided by the utility model carries out heat conduction by heat spreader 1 relative to the chip encapsulated in empty cavity 14, and the working medium in evaporative cavity 12 absorbs heat and evaporates, and then transfers heat to the top cover 10 of heat spreader 1 and conducts to heat dissipation fin 2 through the top cover 10;By setting heat pipe 3 and copper powder structure layer 30 on the inner wall of heat pipe 3, gaseous working medium can penetrate into copper powder structure layer 30, so that heat is evenly conducted to heat pipe 3, and then conducted to heat dissipation fin 2 through heat pipe 3 for heat dissipation;That is to say, the working medium in evaporative cavity 12 forms hot air flow after absorbing heat, and a part of hot air flow carries out heat exchange effect with the top cover 10 of heat spreader 1, and another part spreads into heat pipe 3 and carries out heat exchange effect with copper powder structure layer 30;Therefore, heat dissipation fin 2 can carry out heat exchange through heat spreader 1 and heat pipe 3 simultaneously, and gaseous working medium carrying heat can uniformly penetrate into copper powder layer, and heat is evenly conducted to each layer of heat dissipation fin 2 through heat pipe 3, so that the heat exchange efficiency between heat dissipation fin 2 and heat spreader 1 in the chip package assembly is improved, and the heat dissipation effect of the chip package assembly on chip is further increased.

[0038] Specifically, as Figures 1 to 3As shown, the heat dissipation fins 2 are arranged in a spaced stacked manner at the evaporation end of the vapor chamber 1, and the area of the heat dissipation fins 2 fully covers the vapor chamber 1, and the bottommost heat dissipation fin 2 and the vapor chamber 1 are in heat transfer through the heat conduction layer 140 coated on the upper end surface of the vapor chamber 1; the chip is packaged in the hollow cavity 14 at the bottom of the vapor chamber 1; the opposite two side edges of the heat dissipation fins 2 are provided with bending portions 20 upward, the bending portions 20 physically abut against the bottom of the heat dissipation fins 2 above, so that the stability between the plurality of heat dissipation fins 2 is higher, and the deformation of the heat dissipation fins 2 caused by the chip packaging assembly during transportation or installation is prevented, so as to affect the heat dissipation effect and service life. Further, the thickness of the heat dissipation fins 2 is 0.1mm~0.3mm, and the flow channel spacing between the heat dissipation fins 2 is preferably 2mm, and the heat dissipation effect is best under the thickness and spacing.

[0039] Further, as shown in Figure 4 The vapor chamber 1 includes a base 11 and a top cover 10 packaged on the base 11, and the base 11 and the top cover 10 form an evaporation cavity 12, and the top cover 10 is provided with a plurality of connecting holes 101 penetrating the evaporation cavity 12, and the open end of the heat pipe 3 is connected with the evaporation cavity 12 through the connecting hole 101; and the outer wall of the heat pipe 3 and the heat dissipation fins 2 are effectively connected in heat conduction through welding, and the copper powder structure layer 30 is arranged on the inner wall of the heat pipe 3, so that the working medium (such as pure water) in the evaporation cavity 12 can uniformly penetrate into the copper powder layer after absorbing the heat generated by the chip, and the heat can be uniformly conducted to each heat dissipation fin 2 through the heat pipe 3 for heat dissipation. This structure can effectively compensate for the occurrence of holes in the heat conduction layer 140 between the heat dissipation fins 2 and the vapor chamber 1, so that the vapor chamber 1 cannot uniformly conduct heat to the heat dissipation fins 2, further improving the heat conduction efficiency between the vapor chamber 1 and the heat dissipation fins 2.

[0040] It should be noted that the mounting structure of the heat dissipation fins 2 on the vapor chamber 1 is not limited to horizontal stacking, but can also be vertically spaced, so as to meet the needs of different environments for packaging chips. When the heat dissipation fins 2 are vertically spaced, the heat pipe 3 is arranged in an "L" shape between each layer of heat dissipation fins 2; the heat pipe 3 can also be arranged in a "U" shape, and the two ends are open and connected with the evaporation cavity 12; that is, the above two structures can be provided with an external fan on both sides of the heat dissipation fins 2 or above the heat dissipation fins 2, so that the fan can cool the flow channel between the plurality of heat dissipation fins 2, improving the heat dissipation effect of the chip packaging assembly.

[0041] In the present embodiment, as shown in Figure 5 and Figure 6As shown, the bottom of the top cover 10 and the upper end surface of the base 11 are respectively provided with a copper powder structure layer 30, a plurality of heat conduction assemblies 13 are arranged in the evaporation cavity 12, the heat conduction assembly 13 is composed of a heat conduction column 130 connected between the top cover 10 and the base 11 and a heat conduction ring 131 sleeved on the heat conduction column 130, and further, the heat conduction column 130 and the heat conduction ring 131 are in the structure of a cylinder, an ellipsoid or a cuboid; the heat conduction ring 131 is provided with a plurality of evaporation capillary holes 132; under this structure, the evaporation capillary hole 132 and the copper powder structure layer 30 can accelerate the heat circulation speed of the working medium in the evaporation cavity 12, so that the heat absorbed by the working medium is more quickly and uniformly conducted to the top cover 10; the heat conduction column 130 further improves the heat conduction efficiency, and the thickness of the copper powder structure layer 30 can be 0.1mm or 0.2mm, and the thickness of the copper powder structure layer 30 mentioned in the embodiment is preferably 0.2mm, and the copper powder structure layer 30 can be replaced by a copper mesh structure; the heat pipe 3 is a copper material with good heat conduction performance to increase the heat exchange efficiency.

[0042] Further, as shown in Figure 5 and Figure 7 , one side of the base 11 is provided with a working medium injection pipe 15, one end of the working medium injection pipe 15 is connected to the evaporation cavity 12 in a lead-through manner, and the other end extends to the outside of the base 11; the working medium (such as pure water) is injected into the evaporation cavity 12 through the working medium injection pipe 15, and the amount of working medium injection is generally about 70% of the volume of the evaporation cavity 12, and after the working medium is injected, the evaporation cavity 12 needs to be vacuumized and sealed; therefore, the first sealing part 16 is arranged on the side of the base 11 where the working medium injection pipe 15 is located, and the second sealing part 17 is arranged at the bottom of the base 11 where the working medium injection pipe 15 is located; the working medium injection pipe 15 is sealed by two sealing parts, which improves the sealing performance of the evaporation cavity 12 and prevents the working medium from leaking. In order to improve the stability of the working medium injection pipe 15 and prevent the working medium injection pipe 15 from being broken during sealing, and in order to improve the operability of the working medium injection pipe 15 during sealing, support blocks 18 are arranged on the upper end surface of the base 11 and located on the left and right sides of the working medium injection pipe 15, and the top of the support block 18 abuts against the top cover 10, thereby providing stronger support and protection for the working medium injection pipe 15.

[0043] Specifically, as shown in Figure 7 , the avoidance cavity 14 is arranged at the bottom of the base 11, and the avoidance cavity 14 is coated with a heat conduction layer 140, and the vapor chamber 1 is packaged on the chip for heat conduction through the heat conduction layer 140. In the embodiment, the heat conduction layer 140 is an indium sheet layer or a heat-conducting silica gel layer.

[0044] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Although the present application is disclosed as above in the preferred embodiment, it is not intended to limit the present application. Any skilled person in the art can make some changes or modifications to the disclosed technical content without departing from the technical solution of the present application, and any equivalent embodiment with equivalent changes is equivalent to the above embodiment. Any simple modification, equivalent change and modification of the above embodiment according to the present application technical solution are within the scope of the present application technical solution.

Claims

1. A chip package assembly for air cooling, comprising a vapor chamber, the bottom of the vapor chamber is provided with a cavity for packaging a chip, and the top of the vapor chamber is provided with a plurality of layers of heat dissipation fins, characterized in that, Further comprising a plurality of heat-conducting pipes installed at the top end of the vapor chamber, one end of the heat-conducting pipe is in communication with the evaporation cavity of the vapor chamber, and the other end is sequentially arranged through each layer of the heat dissipation fins, and the end of the heat-conducting pipe away from the vapor chamber is a closed end structure; a copper powder structure layer is arranged on the inner wall of the heat-conducting pipe.

2. The chip package assembly for air cooling according to claim 1, wherein, Both ends of the heat dissipation fin are respectively provided with a bending part, and the bending parts between each layer of the heat dissipation fins are physically abutted.

3. The chip package assembly for air cooling according to claim 2, wherein, The vapor chamber comprises a base and a top cover encapsulated on the base, an evaporation cavity is formed between the base and the top cover, a plurality of connecting holes penetrating through the evaporation cavity are arranged on the top cover, and the heat-conducting pipe is in communication with the evaporation cavity through the connecting hole.

4. The chip package assembly for air cooling according to claim 3, wherein, The bottom of the top cover and the upper end surface of the base are respectively provided with a copper powder structure layer, and the thickness of the copper powder structure layer is 0.2MM.

5. The chip package assembly for air cooling according to claim 4, wherein, A plurality of heat-conducting components are arranged in an array in the evaporation cavity, the heat-conducting component comprises a heat-conducting column connected between the top cover and the base, and a heat-conducting ring is sleeved on the heat-conducting column.

6. The chip package assembly for air cooling according to claim 5, wherein, The heat-conducting column and the heat-conducting ring are cylindrical, or ellipsoidal, or cuboid structures; and a plurality of evaporation capillary holes are arranged on the heat-conducting ring.

7. The chip package assembly for air cooling according to claim 6, wherein The empty cavity is arranged at the bottom of the base, and a heat-conducting layer is coated in the empty cavity.

8. The chip package assembly for air cooling according to claim 7, wherein, A working medium injection pipe is installed on one side of the base, one end of the working medium injection pipe is in communication with the evaporation cavity, and the other end extends to the outside of the base.

9. The chip package assembly for air cooling according to claim 8, wherein, A first sealing part is arranged on one side of the base where the working medium injection pipe is located; and a second sealing part is arranged at the bottom of the base where the working medium injection pipe is located.

10. The chip package assembly for air cooling according to claim 9, wherein, Supporting blocks are arranged on the upper end surface of the base and on the left and right sides of the working medium injection pipe, and the top of the supporting block abuts against the top cover.

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