MOSFET chip packaging structure

Abstract

The utility model discloses a metal oxide semiconductor field effect transistor (MOSFET) chip packaging structure which comprises a packaging box, a plurality of heat dissipation holes are formed in the front side and the rear side of the outer wall of the packaging box, a chip board is arranged in the packaging box, a first source electrode pin and a second source electrode pin are arranged at the two ends of the chip board respectively, a sealing cover plate is arranged above the chip board, and the first source electrode pin and the second source electrode pin are arranged on the sealing cover plate. Inserting rods are fixedly arranged at the four corners of the bottom of the sealing cover plate, friction rotating shafts are fixedly arranged on the two sides of the outer wall of the sealing cover plate, a limiting assembly is arranged at the position, below the chip board, in the packaging box, and the limiting assembly comprises a containing frame, a reset spring and a threaded rod; the number of the placing frames is two, the placing frames are fixedly arranged at the bottom of the packaging box, a plurality of reset springs are arranged on the inner walls of the two placing frames, and one ends of the reset springs are connected with limiting plates. The MOSFET chips of different sizes can be packaged, and the packaging structure can be quickly disassembled and assembled, so that the MOSFET chips can be conveniently replaced or maintained.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field especially, and it relates to a MOSFET chip packaging structure. BACKGROUND

[0002] MOSFET (metal oxide semiconductor field effect transistor) is the field effect transistor of utilizing electric field effect to control semiconductor. Because MOSFET has the characteristics of realizing low-power consumption voltage control, in recent years, it is widely used in a large number of electronic equipment, including power supply, automobile electronics, computer and smart phone etc.

[0003] The prior art patent with the publication number CN221687524U proposes a MOSFET chip packaging structure, which is provided with a chip and a bottom plate made of heat-conducting material. The top of the chip is connected to the first source pin through a copper band, and the copper band is connected to the first source pin through resin. The conductive end of the bottom of the chip is connected to the second source pin, and the bottom of the chip is connected to the second source pin through resin. The top of the bottom plate is provided with a plurality of gas-permeable inner holes, which are connected to the gas-permeable outer holes through gas-permeable channels. The gas-permeable outer holes are arranged on the end face of the bottom. The top of the bottom is provided with a protective frame, and the protective frame is movably connected to the shell.

[0004] Although the above-mentioned chip packaging structure prevents dust from entering the shell, it is convenient for protecting the chip, but the above-mentioned packaging structure does not have the function of placing MOSFET chips of various sizes, and can only be limited to the installation of MOSFET chips of fixed size, which reduces the application range of the packaging structure. In view of the above problems, a MOSFET chip packaging structure is proposed for improvement and upgrading. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a MOSFET chip packaging structure to solve the problems raised in the background art.

[0006] To solve the above problems, the following technical scheme is provided:

[0007] A MOSFET chip packaging structure is designed, which comprises a packaging box. A plurality of heat dissipation holes are formed in the front and rear sides of the outer wall of the packaging box. A chip board is arranged inside the packaging box. First and second source pins are arranged at the two ends of the chip board respectively. A sealing cover plate is arranged above the chip board. Insert rods are fixedly arranged at the four corners of the bottom of the sealing cover plate, and friction shafts are fixedly arranged on the two sides of the outer wall of the sealing cover plate. A limiting assembly is arranged inside the packaging box below the chip board. The limiting assembly comprises a placing rack, a reset spring and a threaded rod. Two placing racks are arranged and fixedly arranged at the bottom of the packaging box.

[0008] Further, the inner walls of the two placement racks are provided with a plurality of reset springs, one end of each of the reset springs is connected to a limiting plate, the number of the threaded rods is two, and both of the threaded rods are threadedly connected to the inner walls of the packaging boxes.

[0009] Further, one end of each of the two threaded rods is fixedly connected with a threaded knob, and the threaded rod is rotatably connected to the rear side of the clamping plate, and the outer walls of the two clamping plates are provided with rubber pads.

[0010] Further, the outer walls of the clamping plates are symmetrically provided with limiting rods on both sides of the threaded rods, and one end of the limiting rod is arranged on the inner wall of the packaging box, and the limiting rod is telescopic.

[0011] Further, the outer walls of the two groups of friction rotating shafts are rotatably provided with clamping plates, and the clamping plates are provided with clamping grooves, the outer walls of the packaging boxes are provided with clamping columns on both sides, and the clamping columns and the clamping grooves are matched in size.

[0012] Further, the upper end face of the packaging box is provided with a plug hole, and one end of the plug rod is clamped in the plug hole.

[0013] Compared with the prior art, the device has the advantages that:

[0014] 1. The device is provided with a placement rack, a reset spring, a threaded knob, a threaded rod, a clamping plate, a limiting rod and other components, the MOSFET chip is limited by cooperating with the reset spring on the placement rack, and the clamping plate on the threaded rod is driven by rotating the two threaded knobs to fix the MOSFET chip, so that the MOSFET chip of different sizes can be packaged according to the requirement, the packaging fastness is improved, the application range of the packaging assembly is improved, and the structure is simple.

[0015] 2. The device is provided with a friction rotating shaft, a clamping plate, a clamping column, a plug rod and a sealing cover plate, the clamping plate on the two groups of friction rotating shafts is rotated to 90 degrees, the clamping groove on the clamping plate is dislocated with the clamping column, then the sealing cover plate is pulled out from the plug hole by the plug rod, the packaging structure can be quickly disassembled and assembled, the MOSFET chip can be replaced or repaired, time and labor are saved, and the operation is simple.

[0016] The specific embodiments of the present application are disclosed in detail in the following description and drawings, and the principles of the present application can be adopted in the manner. It should be understood that the embodiments of the present application are not limited in scope. The embodiments of the present application include many changes, modifications and equivalents within the scope of the appended claims and clauses. The specific embodiments of the present application are disclosed in detail in the following description and drawings, and the principles of the present application can be adopted in the manner. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are used to provide further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation to the present application. In the drawings:

[0018] Figure 1 It is a whole structure schematic view of a MOSFET chip packaging structure of the present application;

[0019] Figure 2 It is a split structure schematic view of a MOSFET chip packaging structure of the present application;

[0020] Figure 3 It is Figure 2 It is a split structure schematic view of a MOSFET chip packaging structure of the present application;

[0021] Figure 4 It is Figure 3 It is a split structure schematic view of a MOSFET chip packaging structure of the present application.

[0022] In the drawings: 1, packaging box; 2, sealing cover plate; 21, insertion rod; 22, friction rotating shaft; 23, clamping plate; 24, clamping groove; 25, clamping column; 3, first source electrode pin; 4, heat dissipation hole; 5, second source electrode pin; 6, chip plate; 7, limiting assembly; 71, placing rack; 72, reset spring; 73, limiting plate; 74, threaded knob; 75, threaded rod; 76, clamping plate; 77, limiting rod; 78, rubber pad. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, purposes and effects achieved by the present application easy to understand, the present application will be further described below in combination with specific embodiments.

[0024] As Figure 1 - Figure 4 As shown in the drawings, the present application provides a MOSFET chip packaging structure, which comprises a packaging box 1, a plurality of heat dissipation holes 4 are formed on the front and rear sides of the outer wall of the packaging box 1, a chip plate 6 is arranged inside the packaging box 1, a first source electrode pin 3 and a second source electrode pin 5 are respectively arranged at the two ends of the chip plate 6, a sealing cover plate 2 is arranged above the chip plate 6, an insertion rod 21 is fixedly arranged at the bottom corners of the sealing cover plate 2, and a friction rotating shaft 22 is fixedly arranged on the two sides of the outer wall of the sealing cover plate 2, a limiting assembly 7 is arranged below the chip plate 6 inside the packaging box 1, the limiting assembly 7 comprises a placing rack 71, a reset spring 72 and a threaded rod 75, and two placing racks 71 are fixedly arranged at the bottom of the packaging box 1.

[0025] Preferably, the inner wall of the two racks 71 is provided with a plurality of reset springs 72, one end of the reset springs 72 is connected to the limiting plate 73, the number of threaded rods 75 is two, and the two threaded rods 75 are threadedly connected to the inner wall of the packaging box 1, one end of the two threaded rods 75 is fixedly connected with the threaded knob 74, and the threaded rod 75 is rotatably connected to the rear side of the clamping plate 76, the outer wall of the two clamping plates 76 is provided with rubber pads 78, the outer wall of the clamping plate 76 is provided with limiting rods 77 on both sides of the threaded rod 75, and one end of the limiting rod 77 is arranged on the inner wall of the packaging box 1, the limiting rod 77 is telescopic, and the clamping plate 76 is convenient to limit when moving, and prevent side slip from moving.

[0026] Preferably, the outer wall of the two groups of friction rotating shafts 22 is rotatably installed with the clamping plate 23, and the clamping groove 24 is formed in the clamping plate 23, the outer wall of the packaging box 1 is provided with the clamping column 25 on both sides, the size of the clamping column 25 and the clamping groove 24 is matched, the upper end face of the packaging box 1 is provided with the insertion hole, and one end of the insertion rod 21 is clamped in the insertion hole, so that the sealing cover plate 2 is convenient to disassemble and assemble.

[0027] The use principle and use process of the utility model are as follows: when it is needed to place the MOSFET chip into the packaging structure, the MOSFET chip is placed into the packaging box 1, then the chip plate 6 is used to extrude the limiting plates 73 on the two racks 71, meanwhile, the MOSFET chip is limited by the plurality of reset springs 72, after the chip plate 6 is fixed, the first source pin 3 and the second source pin 5 on the outer side of the MOSFET chip are placed outside the packaging box 1, at this time, the threaded rod 75 is rotated in the packaging box 1 by rotating the front and rear threaded knobs 74, so that the clamping plate 76 is driven to fix the front and rear sides of the chip plate 6, meanwhile, the clamping plate 76 is limited by the limiting rod 77 when moving, so that the MOSFET chip of different sizes can be packaged and fixed, when the MOSFET chip is damaged after long-time use, the clamping groove 24 on the clamping plate 23 is dislocated from the clamping column 25 by rotating the clamping plate 23 on the two groups of friction rotating shafts 22 to 90 degrees, then the sealing cover plate 2 is pulled out from the insertion hole by the insertion rod 21, so that the MOSFET chip is convenient to replace or repair, the packaging structure is convenient to quickly disassemble and assemble, time and labor are saved.

[0028] In the description of the utility model, it needs to be explained that, unless there is definite provision and limitation, the terms "installation", "provided with", "connection" and the like should be understood in a broad sense, for example, "connection" can be fixed connection, can also be detachable connection, or integral connection, can be mechanical connection, can also be electrical connection, can be directly connected, also can be indirectly connected through intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific situation.

[0029] In the description of the present embodiment, the terms "upper", "lower", "right", "left", and the like, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second" are only used to distinguish in description, and have no special meaning.

Claims

1. A MOSFET chip package structure, characterized by, The application relates to a packaging box (1) which is provided with a plurality of heat dissipation holes (4) on the front and back sides of the outer wall, a chip plate (6) is arranged in the packaging box (1), first source electrode pins (3) and second source electrode pins (5) are arranged at the two ends of the chip plate (6), a sealing cover plate (2) is arranged above the chip plate (6), plug rods (21) are fixedly arranged at the four corners of the bottom of the sealing cover plate (2), friction rotating shafts (22) are fixedly arranged on the two sides of the outer wall of the sealing cover plate (2), a limiting assembly (7) is arranged below the chip plate (6) in the packaging box (1), the limiting assembly (7) comprises placing racks (71), reset springs (72) and threaded rods (75), the number of the placing racks (71) is two, and the placing racks (71) are fixedly arranged at the bottom of the packaging box (1).

2. The MOSFET chip package structure of claim 1, wherein, A plurality of reset springs (72) are arranged on the inner walls of the two placing racks (71), one end of the reset springs (72) is connected with a limiting plate (73), the number of the threaded rods (75) is two, and the two threaded rods (75) are threadedly connected to the inner walls of the packaging box (1).

3. The MOSFET chip package structure of claim 2, wherein, One end of the two threaded rods (75) is fixedly connected with a threaded knob (74), and the threaded rod (75) is rotatably connected to the rear side of a clamping plate (76), rubber pads (78) are arranged on the outer walls of the two clamping plates (76).

4. The MOSFET chip package structure of claim 3, wherein, Limiting rods (77) are symmetrically arranged on the outer walls of the clamping plates (76) on the two sides of the threaded rods (75), one end of the limiting rods (77) is arranged on the inner walls of the packaging box (1), and the limiting rods (77) are telescopic.

5. The MOSFET chip package structure of claim 1, wherein, Friction rotating shafts (22) are rotatably arranged on the outer walls of the two groups of friction rotating shafts (22), clamping plates (23) are arranged in the friction rotating shafts (22), clamping grooves (24) are formed in the clamping plates (23), clamping columns (25) are arranged on the two sides of the outer walls of the packaging box (1), and the clamping columns (25) and the clamping grooves (24) are matched in size.

6. The MOSFET chip package structure of claim 5, wherein, A plug hole is formed in the upper end face of the packaging box (1), and one end of the plug rod (21) is clamped in the plug hole.

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