Silicon carbide wafer processing grinding wheel

Abstract

The utility model discloses a silicon carbide wafer processing grinding wheel which comprises an outer ring and an inner ring arranged in the outer ring, a bottom plate is arranged at the bottom of the outer ring, a plurality of heat dissipation fins are arranged on the bottom plate, a plurality of screw holes are formed in the bottom plate, an installation ring is arranged in the center of the bottom plate, four clamping blocks are arranged on the outer side of the inner ring, and the clamping blocks are connected with the installation ring. A connector is arranged at the bottom of the inner ring, a water inlet channel is formed in the connector, an annular water channel is formed in the inner ring, a plurality of water flowing channels are formed in the outer ring, heat dissipation is conducted on the outer ring through the heat dissipation fins, and due to the fact that the heat dissipation fins are designed in a porous honeycomb hollow mode, the heat dissipation efficiency is improved. In the process that the heat dissipation fins rotate along with the outer ring, the heat dissipation efficiency of the heat dissipation fins can be improved, heat dissipation can be conducted on the thinned grinding wheel through the structure, the heat dissipation efficiency of the thinned grinding wheel is improved, the thinned grinding wheel is prevented from being in a high-temperature state for a long time, the stability of the thinned grinding wheel is improved, and the service life of the thinned grinding wheel is prolonged.

Description

Technical Field

[0001] This utility model belongs to the technical field of wafer processing equipment, specifically relating to a silicon carbide wafer processing grinding wheel. Background Technology

[0002] Silicon carbide (SiC) wafer thinning wheels are precision machining tools specifically designed for thinning silicon carbide (SiC) wafers. Due to its high hardness, high thermal conductivity, and excellent electrical properties, silicon carbide is widely used in power semiconductors, radio frequency devices, and high-temperature electronic equipment. However, the high hardness and brittleness of silicon carbide make it difficult to process, requiring high-precision and highly stable grinding wheels. Silicon carbide wafer thinning wheels are key tools in silicon carbide wafer processing, primarily used to thin silicon carbide wafers to the target thickness and provide a foundation for subsequent polishing processes. With the widespread application of silicon carbide in the semiconductor industry, the performance optimization and manufacturing technology of thinning wheels are continuously improving.

[0003] However, existing thinning grinding wheels have poor heat dissipation. When the grinding wheel rotates at high speed, it comes into contact with the wafer and generates a lot of heat in a short time. This heat is not easily dissipated, causing the thinning grinding wheel to be in a high-temperature state for a long time, which affects the stability and service life of the thinning grinding wheel. Utility Model Content

[0004] The purpose of this invention is to provide a silicon carbide wafer processing grinding wheel to solve the problem mentioned in the background art that the existing thinning grinding wheels have poor heat dissipation. When the grinding wheel rotates at high speed and comes into contact with the wafer, it generates a lot of heat in a short time. This heat is not easily dissipated quickly, causing the thinning grinding wheel to be in a high-temperature state for a long time, which affects the stability and service life of the thinning grinding wheel.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a silicon carbide wafer processing grinding wheel, comprising an outer ring and an inner ring disposed inside the outer ring;

[0006] The inner ring is provided with a pair of latches on its inner side, and the outer ring is provided with a plurality of grinding teeth, with gap grooves provided between the grinding teeth respectively.

[0007] The outer ring has a base plate at its bottom, with multiple heat dissipation fins and multiple screw holes. A mounting ring is located at the center of the base plate. Four locking blocks are located on the outer side of the inner ring. A connector is located at the bottom of the inner ring, with a water inlet channel inside the connector. An annular water channel is located inside the inner ring, and multiple water flow channels are located inside the outer ring.

[0008] Preferably, the outer ring and the inner ring are integrally formed, the grinding teeth are fixedly connected to the outer ring, and the grinding teeth can grind the surface of the silicon carbide wafer.

[0009] Preferably, the base plate is welded to the mounting ring, the base plate is fixed to the outer ring by screws, the heat dissipation fins are welded to the base plate, the heat dissipation fins are provided with multiple honeycomb holes, and the heat dissipation fins can conduct heat to and dissipate heat from the outer ring.

[0010] Preferably, the inner side of the mounting ring is provided with four slots, the locking block is welded to the inner ring, the mounting ring can be engaged with the locking block through the slots, and the mounting ring can be sleeved with the inner ring.

[0011] Preferably, the connector is integrally formed with the outer ring, and the connector can be connected to an external water pipe, so that water can be supplied to the annular waterway through the connector and the water inlet channel.

[0012] Preferably, the water inside the annular waterway can flow out to the outside through the water flow channel and the water outlet, and the water flow channel, the annular waterway, the water inlet channel, the inner ring, and the outer ring are integrally formed.

[0013] Preferably, the water inside the annular water channel can dissipate heat and cool the inner and outer rings, and the water flowing out of the outlet hole can flow outward through the gap groove, and the water in the outlet hole can cool and dissipate heat for the grinding teeth.

[0014] Compared with the prior art, this utility model provides a silicon carbide wafer processing grinding wheel, which has the following beneficial effects:

[0015] 1. Through the coordinated design of the base plate, screws, mounting ring, locking block, and heat dissipation fins, efficient heat dissipation and stable operation of the thinned grinding wheel are achieved. The locking structure of the mounting ring and locking block effectively prevents the base plate from rotating during installation, ensuring the stability of the installation. The tightening of the screws further enhances the connection strength between the base plate and the outer ring. During the processing, the heat generated by grinding the teeth is conducted to the base plate through the outer ring and finally efficiently dissipated by the heat dissipation fins with a porous honeycomb hollow design. This design not only improves the heat dissipation efficiency but also avoids the thinned grinding wheel being in a high-temperature state for a long time, thereby significantly improving its stability and service life.

[0016] 2. Through the ingenious combination of connector, water inlet channel, annular water channel, flow channel and water outlet, additional heat dissipation is provided for the grinding wheel. After the connector is connected to an external water source, the water flows into the annular water channel of the inner ring through the water inlet channel, effectively reducing the temperature of the inner ring and preventing it from overheating. At the same time, the water flows out from the water outlet through the flow channel. When the outer ring rotates, the centrifugal force is used to uniformly cool the grinding teeth and the surface of the outer ring. This design significantly improves the overall heat dissipation efficiency of the grinding wheel and ensures its stability and reliability during long-term operation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the upper structure of this utility model.

[0018] Figure 2 This is a cross-sectional structural diagram of the present invention.

[0019] Figure 3 For the present utility model Figure 2 Schematic diagram of a partial structure.

[0020] Figure 4 This is a schematic diagram of the bottom structure of this utility model.

[0021] Figure 5 This is a schematic diagram of the structure after the base plate of this utility model is disassembled.

[0022] In the diagram: 1. Inner ring; 2. Outer ring; 3. Water outlet; 4. Bayonet; 5. Grinding teeth; 6. Gap groove; 7. Annular water channel; 8. Water inlet channel; 9. Connector; 10. Water flow channel; 11. Base plate; 12. Screw; 13. Heat dissipation fins; 14. Locking block; 15. Mounting ring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides, for example Figure 1-5 The silicon carbide wafer processing grinding wheel shown includes an outer ring 2 and an inner ring 1 disposed inside the outer ring 2;

[0025] A pair of bayonets 4 are provided on the inner side of the inner ring 1, and multiple grinding teeth 5 are provided on the outer ring 2, with gap grooves 6 provided between the grinding teeth 5 respectively.

[0026] The outer ring 2 has a base plate 11 at its bottom, with multiple heat dissipation fins 13 on the base plate 11 and multiple screw holes on the base plate 11. The base plate 11 has a mounting ring 15 at its center. The inner ring 1 has four locking blocks 14 on its outer side. The inner ring 1 has a connector 9 at its bottom, with a water inlet channel 8 inside the connector 9. The inner ring 1 has an annular water channel 7 inside, and the outer ring 2 has multiple water flow channels 10 inside.

[0027] In this embodiment, the silicon carbide wafer thinning wheel is a key tool in silicon carbide wafer processing. It is mainly used to thin the silicon carbide wafer to the target thickness and provide a basis for subsequent polishing processes. The installation and use of the processing wheel is as follows: First, the clamps 4 on the inner ring 1 are connected to the external equipment, and then the processing wheel is installed on the equipment. Then, the external equipment drives the wheel to rotate. When the grinding teeth 5 contact the wafer surface, the wafer surface can be ground. Through uniform grinding action, the wheel gradually thins and flattens the wafer surface, ensuring thickness uniformity and surface smoothness.

[0028] like Figure 1 , Figure 4 and Figure 5 As shown, the outer ring 2 and the inner ring 1 are integrally formed. The grinding teeth 5 are fixedly connected to the outer ring 2. The grinding teeth 5 can grind the surface of the silicon carbide wafer. The base plate 11 is welded to the mounting ring 15. The base plate 11 and the outer ring 2 are fixedly installed by screws 12. The heat dissipation fins 13 are welded to the base plate 11. The heat dissipation fins 13 are provided with multiple honeycomb holes. The heat dissipation fins 13 can conduct heat and dissipate heat from the outer ring 2. The inner side of the mounting ring 15 is provided with four slots. The locking block 14 is welded to the inner ring 1. The mounting ring 15 can be engaged with the locking block 14 through the slots. The mounting ring 15 can be sleeved with the inner ring 1.

[0029] Preferably, the base plate 11, screws 12, mounting ring 15, locking block 14, and heat dissipation fins 13 are configured such that the mounting ring 15 is engaged with the locking block 14 via a slot, preventing the base plate 11 from rotating during installation. The base plate 11 is then fixed to the outer ring 2 using screws 12. During wafer processing, heat from the grinding teeth 5 is conducted to the outer ring 2, and then further transferred to the base plate 11 at the bottom of the outer ring 2. The heat is then dissipated through the heat dissipation fins 13. Furthermore, the porous honeycomb design of the heat dissipation fins 13 increases their heat dissipation efficiency as they rotate with the outer ring 2. This structure effectively dissipates heat from the thinning grinding wheel, improving its heat dissipation efficiency, preventing the thinning grinding wheel from operating at high temperatures for extended periods, and enhancing its stability and lifespan.

[0030] like Figure 1 , Figure 2 and Figure 3As shown, the connector 9 is integrally formed with the outer ring 2. The connector 9 can be connected to an external water pipe. Water can be supplied to the annular water channel 7 through the connector 9 and the water inlet channel 8. The water inside the annular water channel 7 can flow out to the outside through the water flow channel 10 and the water outlet 3 respectively. The water flow channel 10, the annular water channel 7, the water inlet channel 8 are integrally formed with the inner ring 1 and the outer ring 2. The water inside the annular water channel 7 can dissipate heat and cool the inner ring 1 and the outer ring 2. The water flowing out of the water outlet 3 can flow out through the gap groove 6. The water in the water outlet 3 can cool and dissipate heat for the grinding teeth 5.

[0031] Preferably, by configuring the connector 9, water inlet channel 8, annular water channel 7, water flow channel 10, and water outlet 3, after connecting the connector 9 to an external water source, water can be supplied to the annular water channel 7 inside the inner ring 1 through the water inlet channel 8. The water flow through the annular water channel 7 can cool the inner ring 1 and prevent it from overheating. At the same time, the water flow can flow out of the water outlet 3 through the water flow channel 10. When the outer ring 2 rotates, the water flows out from the water outlet 3 and, under the action of centrifugal force, cools the grinding teeth 5 around it and the surface of the outer ring 2, thereby improving the heat dissipation efficiency of the grinding wheel.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A silicon carbide wafer processing grinding wheel, comprising an outer ring (2) and an inner ring (1) disposed inside the outer ring (2); The inner ring (1) is provided with a pair of bayonets (4) on its inner side, and the outer ring (2) is provided with a plurality of grinding teeth (5), and the grinding teeth (5) are respectively provided with gap grooves (6); Its features are: The outer ring (2) has a base plate (11) at its bottom, and the base plate (11) has multiple heat dissipation fins (13) and multiple screw holes. The base plate (11) has an installation ring (15) at its center. The inner ring (1) has four locking blocks (14) on its outer side. The inner ring (1) has a connector (9) at its bottom, and the connector (9) has a water inlet channel (8) inside. The inner ring (1) has an annular water channel (7) inside. The outer ring (2) has multiple water flow channels (10) inside.

2. The silicon carbide wafer machining grinding wheel according to claim 1, characterized in that: The outer ring (2) and the inner ring (1) are integrally formed, and the grinding teeth (5) are fixedly connected to the outer ring (2). The grinding teeth (5) can grind the surface of the silicon carbide wafer.

3. The silicon carbide wafer machining grinding wheel according to claim 2, characterized in that: The base plate (11) is welded to the mounting ring (15), and the base plate (11) is fixedly installed to the outer ring (2) by screws (12). The heat dissipation fins (13) are welded to the base plate (11), and the heat dissipation fins (13) are provided with multiple honeycomb holes. The heat dissipation fins (13) can conduct heat and dissipate heat to the outer ring (2).

4. The silicon carbide wafer machining grinding wheel according to claim 3, characterized in that: The mounting ring (15) has four slots on its inner side. The locking block (14) is welded to the inner ring (1). The mounting ring (15) can be engaged with the locking block (14) through the slots. The mounting ring (15) can be sleeved with the inner ring (1).

5. The silicon carbide wafer machining grinding wheel according to claim 1, characterized in that: The connector (9) is integrally formed with the outer ring (2). The connector (9) can be connected to an external water pipe. Water can be supplied to the annular waterway (7) through the connector (9) and the water inlet channel (8).

6. The silicon carbide wafer machining grinding wheel according to claim 5, characterized in that: Water inside the annular waterway (7) can flow out to the outside through the water flow channel (10) and the water outlet (3), respectively. The water flow channel (10), the annular waterway (7), the water inlet channel (8), the inner ring (1), and the outer ring (2) are integrally formed.

7. A silicon carbide wafer machining grinding wheel according to claim 6, characterized in that: The water inside the annular water channel (7) can dissipate heat and cool the inner ring (1) and outer ring (2). The water flowing out of the outlet hole (3) can flow out through the gap groove (6). The water in the outlet hole (3) can cool and dissipate heat on the grinding teeth (5).

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