Nickel plating device for semiconductor parts

Abstract

The utility model discloses a semiconductor part nickel plating device which comprises a nickel plating tank, a fixing assembly arranged at the upper end of the nickel plating tank, a rotating device which is detachably arranged on the fixing assembly and provided with an output wheel, a transmission assembly and a rotating frame used for installing a plurality of parts. The rotating frame is connected with the transmission assembly, the rotating device drives the rotating frame to rotate through the transmission assembly, and the rotating frame is located in the nickel plating tank. According to the nickel plating device, the rotating device drives the rotating frame to rotate through the transmission assembly, a part rotates in the nickel plating tank along with the rotating frame, and therefore a large number of particles are prevented from being adsorbed to the surface of the part, and the nickel plating quality is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of nickel plating equipment, and specifically to a nickel plating equipment for semiconductor parts. Background Technology

[0002] Nickel plating methods include electroless nickel plating, electroplating, mechanical plating, and hot-dip plating. The most commonly used nickel plating method is electroless nickel plating, also known as electroless nickel plating. It is an excellent film-forming technology that involves an autocatalytic reaction in a solution containing specific metal salts and reducing agents to precipitate metal and deposit it on the surface of the substrate to form a surface metal coating.

[0003] Electroless nickel plating is a simple, low-cost process that produces a uniform coating thickness. Nickel plating offers many advantages, most notably the high stability and superior passivation capabilities of the nickel layer, giving nickel-plated components strong resistance to alkalis and acids. Historically, electroless nickel plating is a mature and highly advanced technology in the United States, Japan, and Germany, with widespread applications across various industrial sectors. my country, however, started relatively late and lacks experience in electroless nickel plating, facing numerous challenges in the production process.

[0004] The biggest drawback of current electroless nickel plating is the persistent deposition of particulate matter on the component surface, particularly noticeable on the top surface of the component within the plating bath. Once these particles adhere to the surface, they severely impact the overall surface roughness. Furthermore, these irregular particles can affect the wafer transport system of semiconductor cavity equipment, significantly hindering the high-precision performance of the equipment. Therefore, a new technical solution is urgently needed to address at least one of these problems. Summary of the Invention

[0005] The purpose of this invention is to provide a nickel plating device for semiconductor parts. The rotating device drives the rotating frame to rotate through the transmission component. The parts follow the rotating frame to rotate in the nickel plating tank, thereby preventing a large number of particles from adsorbing on the surface of the parts and improving the quality of nickel plating.

[0006] To achieve the above-mentioned technical objectives and requirements, the technical solution adopted by this utility model is: a nickel plating apparatus for semiconductor components, characterized in that it includes a nickel plating tank, a fixing component disposed at the upper end of the nickel plating tank, a rotating device with an output wheel detachably disposed on the fixing component, a transmission component, and a rotating frame for mounting multiple components. The output wheel is connected to the transmission component, the rotating frame is connected to the transmission component, the rotating device drives the rotating frame to rotate through the transmission component, and the rotating frame is located inside the nickel plating tank.

[0007] As a preferred technical solution, the transmission assembly includes a support frame, a first side transmission shaft and a second side transmission shaft that are rotatably inserted into the support frame in a vertical direction, and a transmission belt;

[0008] The first side drive shaft is fitted with a first drive wheel, and the second side drive shaft is fitted with a second drive wheel. The drive belt is fitted onto the output wheel, the first drive wheel, and the second drive wheel. The lower end of the central drive shaft is rotatably connected to the support frame. The first side drive shaft and the second side drive shaft are rotatably connected to the support frame. The lower part of the support frame is rotatably provided with a first drive horizontal shaft and a second drive horizontal shaft. The first drive horizontal shaft is driven by the first side drive shaft, and the second drive horizontal shaft is driven by the second side drive shaft. The first drive horizontal shaft and the second drive horizontal shaft are arranged opposite to each other. The rotating frame is connected to the first drive horizontal shaft and the second drive horizontal shaft respectively.

[0009] As a preferred technical solution, a central drive shaft is rotatably provided on the upper side of the support frame, a third drive wheel is sleeved on the central drive shaft, and the conveyor belt is sleeved on the third drive wheel.

[0010] As a preferred technical solution, the rotating frame includes a first rotating frame and a second rotating frame arranged perpendicularly to each other.

[0011] As a preferred technical solution, a first transmission gear is sleeved on the lower end of the first side transmission shaft, a second transmission gear is sleeved on one end of the first transmission horizontal shaft, the first transmission gear meshes with the second transmission gear, a third transmission gear is sleeved on the lower end of the second side transmission shaft, and a fourth transmission gear is sleeved on one end of the second transmission horizontal shaft, the third transmission gear meshes with the fourth transmission gear.

[0012] As a preferred technical solution, the fixing component includes a fixed upper plate, a fixed lower plate located below the fixed lower plate, and two mounting plates spanning the fixed upper plate and the fixed lower plate, wherein the rotating device is detachably connected to the mounting plates.

[0013] As a preferred technical solution, the upper fixed plate is detachably provided with a first bearing seat on the side opposite to the rotating device, and the lower fixed plate is detachably provided with a second bearing seat on the side opposite to the rotating device. The first bearing seat and the second bearing seat are aligned, and the central drive shaft is rotatably inserted into the first bearing seat and the second bearing seat.

[0014] As a preferred technical solution, the support frame includes a support upper plate, a first support vertical plate and a second support vertical plate symmetrically arranged on the support upper plate, a third bearing seat detachably provided at the lower part of the first support vertical plate, a fourth bearing seat detachably provided at the lower part of the second support vertical plate, a first transmission horizontal shaft rotatably inserted into the third bearing seat, and a second transmission horizontal shaft rotatably inserted into the fourth bearing seat.

[0015] As a preferred technical solution, the first rotating frame and the second rotating frame are respectively provided with a plurality of mounting grooves that penetrate radially at equal intervals.

[0016] As a preferred technical solution, a support frame is provided at the upper end of each of the two side plates of the nickel plating tank. A protrusion is provided at the upper end of the support frame, and a limiting groove is provided on the upper side of the protrusion. The two ends of the fixed upper plate are respectively provided in the corresponding limiting grooves.

[0017] The beneficial effects of this utility model are:

[0018] 1) The rotating device drives the rotating frame to rotate through the transmission component. The parts follow the rotating frame to rotate in the nickel plating tank, thereby preventing a large number of particles from adsorbing on the surface of the parts and improving the quality of nickel plating.

[0019] 2) The rotating device drives the conveyor belt to rotate, and the transmission belt drives the first side transmission shaft and the second side transmission shaft to rotate, thereby driving the first transmission horizontal shaft and the second transmission horizontal shaft to rotate, thus driving the rotating frame to rotate 360°.

[0020] 3) The central drive shaft acts as a tensioning element, improving the stability of the drive belt operation;

[0021] 4) Bearings can improve rotational stability;

[0022] 5) The limiting groove has a good limiting effect on the fixed upper plate. Attached Figure Description

[0023] Figure 1 This is a working diagram of a nickel plating apparatus provided in one embodiment of the present invention;

[0024] Figure 2 This is a structural diagram of a nickel plating apparatus provided in one embodiment of the present invention;

[0025] Figure 3 This is a structural diagram of a transmission component provided in one embodiment of the present invention.

[0026] exist Figures 1-3In the diagram, the components are as follows: 1. Nickel plating tank; 101. Support frame; 102. Protrusion; 1021. Limiting groove; 2. Rotating device; 3. Rotating frame; 301. First rotating frame; 302. Second rotating frame; 303. Mounting groove; 4. Support frame; 401. Support upper plate; 402. First support vertical plate; 403. Second support vertical plate; 5. First side drive shaft; 6. Second side drive shaft; 7. Drive belt; 8. First drive wheel; 9. Second drive wheel; 10. First drive horizontal shaft; 11. Second drive horizontal shaft; 12. Central drive shaft; 13. Third drive wheel; 14. First drive gear; 15. Second drive gear; 16. Third drive gear; 17. Fourth drive gear; 18. Fixed upper plate; 19. Fixed lower plate; 20. Mounting plate; 21. First shaft seat; 22. Second shaft seat; 23. Third shaft seat; 24. Fourth shaft seat; 25. Part. Detailed Implementation

[0027] The present invention will now be further described with reference to the accompanying drawings.

[0028] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "head," "tail," "top," "bottom," "left," "right," "front," "rear," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0029] Please see Figures 1-3 This utility model provides a nickel plating apparatus for semiconductor components, including a nickel plating tank 1, a fixing assembly disposed at the upper end of the nickel plating tank 1, a rotating device 2 with an output wheel detachably disposed on the fixing assembly, a transmission assembly, and a rotating frame 3 for mounting multiple components 25. The output wheel is connected to the transmission assembly, and the rotating frame 3 is connected to the transmission assembly. The rotating device 2 drives the rotating frame 3 to rotate through the transmission assembly. The rotating frame 3 is located inside the nickel plating tank 1. The rotating device 2 drives the rotating frame 3 to rotate through the transmission assembly, and the components 25 follow the rotating frame 3 to rotate in the nickel plating tank 1, thereby preventing a large amount of particulate matter from adsorbing onto the surface of the components 25 and improving the nickel plating quality.

[0030] like Figures 1-3As shown, the transmission assembly includes a support frame 4, a first side transmission shaft 5 and a second side transmission shaft 6 rotatably inserted vertically into the support frame 4, and a transmission belt 7. The first side transmission shaft 5 is fitted with a first transmission wheel 8, and the second side transmission shaft 6 is fitted with a second transmission wheel 9. The transmission belt 7 is fitted onto the output wheel, the first transmission wheel 8, and the second transmission wheel 9. The lower end of the central transmission shaft 12 is rotatably connected to the support frame 4. The first side transmission shaft 5 and the second side transmission shaft 6 are rotatably connected to the support frame 4. The lower part of the support frame 4 is rotatably provided with a first transmission horizontal shaft 10 and a second transmission horizontal shaft 11. The first transmission horizontal shaft 10 is connected to the first side transmission shaft 5, and the second transmission horizontal shaft 11 is connected to the second side transmission shaft 6. The first transmission horizontal shaft 10 and the second transmission horizontal shaft 11 are arranged opposite to each other. The rotating frame 3 is connected to the first transmission horizontal shaft 10 and the second transmission horizontal shaft 11 respectively.

[0031] The rotating device 2 drives the conveyor belt to rotate, and the transmission belt 7 drives the first side transmission shaft 5 and the second side transmission shaft 6 to rotate, thereby driving the first transmission horizontal shaft 10 and the second transmission horizontal shaft 11 to rotate. This drives the rotating frame 3 to rotate 360°, and the part 25 follows the rotating frame 3 to rotate in the nickel plating tank 1, thereby preventing a large number of particles from adsorbing on the surface of the part 25 and improving the nickel plating quality.

[0032] like Figures 1-3 As shown, a central drive shaft 12 is rotatably mounted on the upper side of the support frame 4. A third drive wheel 13 is sleeved on the central drive shaft 12. The conveyor belt is sleeved on the third drive wheel 13. The central drive shaft 12 rotates with the conveyor belt, which plays a tensioning role to prevent the conveyor belt from loosening and ensures stable operation of the conveyor belt.

[0033] like Figures 1-3 As shown, the rotating frame 3 includes a first rotating frame 301 and a second rotating frame 302 arranged vertically. The first rotating frame 301 and the second rotating frame 302 have simple structures, light weight, small obstruction area on parts, and good nickel plating effect.

[0034] like Figures 1-3 As shown, a first transmission gear 14 is sleeved on the lower end of the first side transmission shaft 5, a second transmission gear 15 is sleeved on one end of the first transmission horizontal shaft 10, and the first transmission gear 14 meshes with the second transmission gear 15. A third transmission gear 16 is sleeved on the lower end of the second side transmission shaft 6, and a fourth transmission gear 17 is sleeved on one end of the second transmission horizontal shaft 11, and the third transmission gear 16 meshes with the fourth transmission gear 17. Specifically, the transmission gears are bevel gears, which can transform vertical rotation into horizontal rotation, resulting in good transmission stability.

[0035] like Figures 1-3As shown, the fixing assembly includes a fixed upper plate 18, a fixed lower plate 19 located below the fixed lower plate 19, and two mounting plates 20 spanning the fixed upper plate 18 and the fixed lower plate 19. The rotating device 2 is detachably connected to the mounting plates 20, making installation and disassembly convenient.

[0036] like Figures 1-3 As shown, the fixed upper plate 18 is detachably provided with a first bearing seat 21 on the side opposite to the rotating device 2, and the fixed lower plate 19 is detachably provided with a second bearing seat 22 on the side opposite to the rotating side. The first bearing seat 21 and the second bearing seat 22 are aligned. The central transmission shaft 12 is rotatably inserted into the first bearing seat 21 and the second bearing seat 22. The support frame 4 includes a support upper plate 401, a first support vertical plate 402 and a second support vertical plate 403 symmetrically arranged on the support upper plate 401. A third bearing seat 23 is detachably provided at the lower part of the first support vertical plate 402, and a fourth bearing seat 24 is detachably provided at the lower part of the second support vertical plate 403. The first transmission horizontal shaft 10 is rotatably inserted into the third bearing seat 23, and the second transmission horizontal shaft 11 is rotatably inserted into the fourth bearing seat 24. The first bearing seat 21, the second bearing seat 22, the third bearing seat 23 and the fourth bearing seat 24 improve rotational stability.

[0037] like Figures 1-3 As shown, the first rotating frame 301 and the second rotating frame 302 are respectively provided with a plurality of mounting grooves 303 that pass through them radially at equal intervals, which facilitates the installation of parts 25.

[0038] like Figures 1-3 As shown, a support frame 101 is provided at the upper end of each of the two side plates of the nickel plating tank 1. A protrusion 102 is provided at the upper end of the support frame 101. A limiting groove 1021 is provided on the upper side of the protrusion 102. The two ends of the fixed upper plate 18 are respectively provided in the corresponding limiting grooves 1021. The limiting grooves 1021 have a good limiting effect on the fixed upper plate 18. The fixed upper plate 18 is fixedly connected or overlapped with the protrusion 102, and is installed according to the actual site conditions.

[0039] The above embodiments are merely descriptions for clearly illustrating the present utility model, and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all implementations here, and the obvious variations or modifications derived therefrom are still within the protection scope of the present utility model.

Claims

1. A nickel plating apparatus for semiconductor components, characterized in that, The device includes a nickel plating tank, a fixing assembly disposed at the upper end of the nickel plating tank, a rotating device with an output wheel detachably disposed on the fixing assembly, a transmission assembly, and a rotating frame for mounting multiple parts. The output wheel is connected to the transmission assembly, and the rotating frame is connected to the transmission assembly. The rotating device drives the rotating frame to rotate through the transmission assembly. The rotating frame is located inside the nickel plating tank. The rotating frame includes a first rotating frame and a second rotating frame arranged perpendicularly to each other. The transmission assembly includes a support frame, a first side transmission shaft and a second side transmission shaft rotatably inserted vertically into the support frame, and a transmission belt. The first side drive shaft is fitted with a first drive wheel, and the second side drive shaft is fitted with a second drive wheel. The drive belt is fitted onto the output wheel, the first drive wheel, and the second drive wheel. A central drive shaft is rotatably mounted on the upper side of the support frame. A third drive wheel is fitted onto the central drive shaft, and the conveyor belt is fitted onto the third drive wheel. The lower end of the central drive shaft is rotatably connected to the support frame. The first side drive shaft and the second side drive shaft are rotatably connected to the support frame. A first transmission horizontal shaft and a second transmission horizontal shaft are rotatably mounted on the lower part of the support frame. The first transmission horizontal shaft is driven by the first side drive shaft, and the second transmission horizontal shaft is driven by the second side drive shaft. The first transmission horizontal shaft and the second transmission horizontal shaft are arranged opposite to each other. The rotating frame is connected to the first transmission horizontal shaft and the second transmission horizontal shaft respectively.

2. The nickel plating apparatus for semiconductor components according to claim 1, characterized in that, A first transmission gear is fitted at the lower end of the first side transmission shaft, a second transmission gear is fitted at one end of the first transmission horizontal shaft, the first transmission gear meshes with the second transmission gear, a third transmission gear is fitted at the lower end of the second side transmission shaft, and a fourth transmission gear is fitted at one end of the second transmission horizontal shaft, the third transmission gear meshes with the fourth transmission gear.

3. The nickel plating apparatus for semiconductor components according to claim 1, characterized in that, The fixing assembly includes a fixed upper plate, a fixed lower plate located below the fixed lower plate, and two mounting plates spanning the fixed upper plate and the fixed lower plate. The rotating device is detachably connected to the mounting plates.

4. The nickel plating apparatus for semiconductor components according to claim 3, characterized in that, The upper fixed plate is detachably provided with a first bearing seat on the side opposite to the rotating device, and the lower fixed plate is detachably provided with a second bearing seat on the side opposite to the rotating device. The first bearing seat and the second bearing seat are aligned, and the central drive shaft is rotatably inserted into the first bearing seat and the second bearing seat.

5. The nickel plating apparatus for semiconductor components according to claim 1, characterized in that, The support frame includes a support upper plate, a first support vertical plate and a second support vertical plate symmetrically arranged on the support upper plate, a third bearing seat detachably provided at the lower part of the first support vertical plate, a fourth bearing seat detachably provided at the lower part of the second support vertical plate, a first transmission horizontal shaft rotatably inserted into the third bearing seat, and a second transmission horizontal shaft rotatably inserted into the fourth bearing seat.

6. The nickel plating apparatus for semiconductor components according to claim 1, characterized in that, The first rotating frame and the second rotating frame are each provided with a plurality of mounting slots that pass through them radially at equal intervals.

7. The nickel plating apparatus for semiconductor components according to claim 4, characterized in that, The two side plates of the nickel plating tank are each provided with a support frame at their upper ends. The upper end of the support frame is provided with a protrusion, and the upper side of the protrusion is provided with a limiting groove. The two ends of the fixed upper plate are respectively provided with the corresponding limiting grooves.

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