Flow path module

Abstract

The utility model provides a flow path module. The flow path module comprises a flow path body and a connecting pipe. The flow path main body is formed by stacking and welding a plurality of layers of plates, the flow path main body comprises a circulation cavity and a switching port communicated with the circulation cavity, the switching port is formed in the plate on the outermost side, welding flux is arranged between every two adjacent plates, at least one of the two opposite surfaces of every two adjacent plates is provided with a groove structure, and the groove structures are used for containing the molten welding flux. The end of the connecting pipe is connected with the adapter.

Description

Technical Field

[0001] This application relates to the field of refrigeration technology, and in particular to a flow path module. Background Technology

[0002] The existing flow path module mainly includes a fluid inlet pipe, a flow path body, and a fluid outlet pipe. The fluid flows from the inlet pipe to the outlet pipe through the flow path body. However, in the existing flow path module, the flow path body is prone to leakage and seepage, which leads to a decrease in the performance of the flow path module, a shortened lifespan, increased usage costs, and reduced reliability. Utility Model Content

[0003] The main purpose of this application is to provide a flow path module that can minimize leakage and seepage in the main body of the flow path.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] According to one aspect of this application, a flow path module is provided, including a flow path body and a connecting pipe. The flow path body is formed by stacking and welding multiple layers of plates. The flow path body includes a flow cavity and an interface communicating with the flow cavity. The interface is formed on the outermost plate. Solder is disposed between adjacent plates. At least one of the opposite surfaces of two adjacent plates has a groove structure for accommodating molten solder. The end of the connecting pipe is connected to the interface.

[0006] According to one embodiment of this application, the solder includes solder pads disposed between two adjacent plates and avoiding the flow cavity.

[0007] According to one embodiment of this application, the dimension of the groove structure in the stacking direction of the plate is defined as the depth of the groove structure, and the maximum value of the depth of the groove structure is 0.01mm-0.1mm.

[0008] According to one embodiment of this application, both opposite surfaces of two adjacent plates have the groove structure.

[0009] According to one embodiment of this application, the groove structure communicates with the flow cavity.

[0010] According to one embodiment of this application, the groove structure extends to the outer side of the plate.

[0011] According to one embodiment of this application, there is a distance between the groove structure and the outer surface of the plate.

[0012] According to one embodiment of this application, the groove structure includes a plurality of grooves, and the distance between two adjacent grooves remains unchanged along the extension direction of the grooves.

[0013] According to one embodiment of this application, a plurality of grooves are arranged in parallel.

[0014] According to one embodiment of this application, the groove structure includes a plurality of grooves, which are arranged in an intersecting pattern.

[0015] According to one embodiment of this application, there are multiple adapters, and each adapter has a corresponding connecting pipe welded to it. The multiple adapters are distributed on at least two different surfaces of the flow path body.

[0016] As can be seen from the above technical solution, the advantages and positive effects of the flow path module proposed in this application are as follows:

[0017] The flow path module proposed in this application,

[0018] 1. The main body of the flow path is formed by stacking multiple layers of plates, and the spaces between adjacent plates are filled with solder. The structure is firm and stable, which can effectively reduce the occurrence of seepage and leakage in the main body of the flow path.

[0019] 2. In addition, a groove structure is provided on at least one of the two opposite surfaces of the two adjacent plates. After the solder melts, it fills the groove structure, which can further enhance the firmness and sealing of the connection between the plates of the flow path body, greatly reduce the probability of leakage and seepage, improve the reliability of the flow path module, and extend the service life of the flow path module. Attached Figure Description

[0020] The various objectives, features, and advantages of this application will become more apparent from the following detailed description of preferred embodiments in conjunction with the accompanying drawings. The drawings are merely illustrative illustrations of this application and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts. Wherein:

[0021] Figure 1 This is a schematic diagram of the flow path module of this application.

[0022] Figure 2 yes Figure 1 The main view.

[0023] Figure 3 yes Figure 1 Top view.

[0024] Figure 4 This is a schematic diagram of the first embodiment of the third plate of the plate material of the flow path body of this application.

[0025] Figure 5 yes Figure 4 The main view.

[0026] Figure 6 This is a schematic diagram of the second embodiment of the third plate of the plate material of the flow path body of this application.

[0027] Figure 7 yes Figure 6 The main view.

[0028] The annotations in the attached figures are explained as follows:

[0029] 1-Flow Path Module

[0030] 10-Flow path main body;

[0031] 20- Takeover;

[0032] 30-soldering sheet;

[0033] 11 - First board;

[0034] 12 - Second board;

[0035] 13 - Third board;

[0036] 100-locking structure;

[0037] 101 - Flow chamber;

[0038] 102-Adapter;

[0039] 103-groove structure;

[0040] 131 - Outer surface. Detailed Implementation

[0041] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0042] In the following description of various exemplary embodiments of the present invention, reference is made to the accompanying drawings, which form part of the present invention, and which illustrate by way of example different exemplary structures, systems, and steps that can implement various aspects of the present invention. It should be understood that other specific solutions to components, structures, exemplary devices, systems, and steps may be used, and structural and functional modifications may be made without departing from the scope of the present invention. Furthermore, although the terms “above,” “between,” “within,” etc., may be used in this specification to describe different exemplary features and elements of the present invention, these terms are used herein only for convenience, such as the orientation according to the examples shown in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of the present invention.

[0043] It is understood that the terms "comprising" and "having," and any variations thereof, in the embodiments of this utility model are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to such processes, methods, products, or devices.

[0044] Relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship of one element to another, as illustrated in the figures. It should be understood that relative terms are intended to include different orientations of the device beyond those shown in the figures. For example, if a device in one of the figures is flipped, an element described as “down” or “bottom” of another element will be oriented “up” or “top” of that element. Thus, the exemplary term “down” can include both “down” and “up” orientations, and the term “bottom” can include both “bottom” and “top” orientations, depending on the specific orientation of the figure. Similarly, if a device in one of the figures is flipped, an element described as “down” or “bottom” of another element will be oriented “up” or “top” of that element. Thus, the exemplary term “bottom” or “below” can include both “up” and “down” orientations.

[0045] See Figures 1 to 4 This application provides a flow path module 1, including a flow path body 10 and a connecting pipe 20. The flow path body 10 is formed by stacking and welding multiple layers of plates. The flow path body 10 includes a flow cavity 101 and an interface 102 communicating with the flow cavity 101. The interface 102 is formed on the outermost plate. At least one of the two opposing surfaces of two adjacent plates has a groove structure 103, which is filled with molten solder. The end of the connecting pipe 20 is connected to the interface 102.

[0046] The flow path module 1 of this application has a groove structure 103 on the opposite surface of adjacent plates, which facilitates welding, improves the fluidity of the solder, enhances the strength of the weld, and prevents leakage or seepage of the flow path body 10.

[0047] The system includes multiple connecting pipes 20, which are used to connect to various components in the compressor, storage tank, outdoor heat exchanger, oil separator, various valves (four-way valve, electronic expansion valve, shut-off valve, etc.), and other piping in the refrigerant flow path. The flow path body 10 consists of a first plate 11, a second plate 12, and a third plate 13. The first plate 11 and the second plate 12 are located on the outermost side of the flow path body 10 and are equipped with multiple adapters 102. The multiple connecting pipes 20 are connected to the first plate 11 and the second plate 12 through these adapters 102. The flow cavity 101 is mainly formed by multiple stacked third plates 13. The first plate 11 and the second plate 12 enclose the flow cavity 101, and the adapters 102 communicate with the flow cavity 101. The shape of the flow cavity 101 can be adjusted according to actual needs. In this embodiment, the shape of the flow cavity 101 is approximately cross-shaped. In other embodiments, the shape of the flow cavity 101 can be adjusted and selected according to the position and number of the connecting pipes 20. Fluid can flow in from at least one of the plurality of nozzles 20, pass through the flow cavity 101 of the flow path body 10, and then flow out from the remaining nozzles 20.

[0048] In this embodiment, there are multiple adapters 102, and each adapter 102 has a corresponding connecting pipe 20 welded to it. The multiple adapters 102 are distributed on at least two different surfaces of the flow path body 10. The arrangement of multiple adapters 102 allows the flow path module 1 to be used for the flow of multiple fluids.

[0049] In this embodiment, the outermost surface of the first plate 11 is connected to a connecting pipe 20 via an adapter 102, and the outermost surface of the second plate 12 is connected to multiple connecting pipes 20 via multiple adapters 102. In other embodiments, the outermost surface of the first plate 11 may be connected to multiple connecting pipes 20 via multiple adapters 102, and the outermost surface of the second plate 12 may be connected to a single connecting pipe 20 via an adapter 102. Alternatively, the outermost surface of the first plate 11 may be connected to multiple connecting pipes 20 via multiple adapters 102, and the outermost surface of the second plate 12 may be connected to multiple connecting pipes 20 via multiple adapters 102. The number of connecting pipes 20, the number of adapters 102, and their distribution can all be adaptively adjusted according to actual conditions.

[0050] In this application, locking structures 100 are provided at each of the four corners of the multilayer sheet, such as bolts or screws. Through holes are provided in the multilayer sheet at corresponding positions of the locking structures to allow the locking structures to pass through. The locking structures 100 can provide pre-tightening force before welding the multilayer sheet to press it together, thereby improving welding efficiency.

[0051] The flow path module 1 of this application is used in air conditioning systems, for example, installed inside the outdoor unit of an air conditioning system. The outdoor unit typically houses components forming the refrigerant circuit, such as a compressor, refrigerant tank, outdoor heat exchanger, oil separator, and various valves, as well as electrical installation units. The flow path module 1 of this application is typically installed horizontally on the indoor unit in a multi-layered sheet metal configuration, with an overall flat structure. This optimizes the piping structure within the indoor unit, improves piping integration, reduces piping space requirements, and decreases the overall size of the outdoor unit.

[0052] In this embodiment, the solder includes solder pads 30, which are disposed between two adjacent plates and avoid the flow cavity 101. The solder pads 30 ensure that when they melt, the solder is evenly distributed across the entire surface of the plates, resulting in a stronger connection and better sealing performance between adjacent plates. After melting, the solder pads 30 allow the solder to flow along the groove structure 103 of the plates, further enhancing the strong sealing performance between the two adjacent plates.

[0053] The solder pads 30 are disposed between multiple third plates 13. Solder pads 30 are also disposed between the first plate 11 and the third plate 13, and between the second plate 12 and the third plate 13.

[0054] In this embodiment, the dimension of the groove structure 103 in the stacking direction of the plates is defined as the depth of the groove structure 103. The maximum value of the depth of the groove structure 103 is 0.01mm-0.1mm, and can be 0.02mm, 0.05mm, 0.08mm, etc. The maximum depth of the groove structure 103 is 0.01mm-0.1mm, which can improve the fluidity of the solder while ensuring sufficient strength of the plate, and the solder can fully fill the groove structure 103 to firmly weld adjacent plates together.

[0055] In this embodiment, the groove structure 103 includes multiple grooves, all of which have the same depth. In other embodiments, the depths of the multiple grooves may also be different.

[0056] In this embodiment, both opposite surfaces of the two adjacent plates have groove structures 103. The presence of groove structures 103 on both opposite surfaces of the adjacent plates further improves solder flowability, enhances the weld strength of the plates, and further strengthens the leak-proof function of the fluid module.

[0057] See Figure 4 and Figure 5 In this embodiment, the groove structure 103 is connected to the flow cavity 101. The connection between the groove structure 103 and the flow cavity 101 makes the groove structure 103 easier to process and facilitates the discharge of gas generated by the melting of solder during welding, which is beneficial to improving the welding quality between the plates and improving the sealing performance of the flow path body 10.

[0058] In this embodiment, the groove structure 103 is spaced apart from the outer surface 131 of the plate. The groove structure 103 does not extend to the outer surface of the plate, which can prevent solder overflow and improve the welding seal during the plate welding process.

[0059] In this embodiment, multiple grooves are arranged in parallel, meaning the distance between two adjacent grooves remains constant along the groove's extension direction. This simplifies the groove manufacturing process, reduces costs, and ensures the consistency and synchronicity of solder flow after melting, further improving the welding quality and sealing performance between adjacent plates.

[0060] The flow path module 1 of this application also has a second embodiment, in which the flow path module 1 of the second embodiment is related to... Figures 1 to 5 Compared to the flow path module 1 of the second embodiment, it has a substantially the same structure in its basic construction. Therefore, in the following description of the flow path module 1 of this second embodiment, it will not be described again. Figures 1 to 5 The structure has already been described in the implementation method. Additionally, regarding... Figures 1 to 5 The structures described in the embodiments are identical to those of the flow path module 1, and are labeled with the same reference numerals. Therefore, in the following description of this embodiment, the structures are mainly those of the same type. Figures 1 to 5 The differences between the flow path module 1 in the second embodiment and the previous embodiment will be explained. For the flow path module 1 in this second embodiment, see [link to relevant documentation]. Figures 6 to 7 The main difference lies in the different arrangement directions of the slot structures 103 in flow path module 1. Figures 1 to 5 In one embodiment, the grooves of the groove structure 103 extend parallel to the short side of the plate, thus the grooves are arranged along the long side of the plate. In the second embodiment, see... Figures 6 to 7 The grooves of the groove structure 103 extend parallel to the long side of the plate, so the grooves are arranged along the short side of the plate.

[0061] The flow path module 1 of this application also has a third embodiment, in which the flow path module 1 of the third embodiment is related to... Figures 1 to 5 Compared to the flow path module 1 of the third embodiment, it has a substantially the same structure in its basic construction. Therefore, in the following description of the flow path module 1 of this third embodiment, it will not be described again. Figures 1 to 5 The structure has already been described in the implementation method. Additionally, regarding... Figures 1 to 5 The structures described in the embodiments are identical to those of the flow path module 1, and are labeled with the same reference numerals. Therefore, in the following description of this embodiment, the structures are mainly those of the same type. Figures 1 to 5 The differences between the flow path module 1 in this third embodiment and the previous one will be explained. Specifically, the main difference in the flow path module 1 of this third embodiment is the different extension direction of the grooves in the groove structure 103. Figures 1 to 5In one embodiment, the groove of the groove structure 103 extends in a straight line and parallel to the short side of the plate. In the third embodiment, the groove of the groove structure 103 extends in an arc shape, and the distance between two adjacent grooves remains constant in the extension direction of the groove.

[0062] In fact, the groove structure 103 of this application has other arrangements that keep the distance between two adjacent grooves constant in the direction of groove extension. This arrangement is somewhat similar to the parallel arrangement of straight lines, except that the straight lines are replaced with other types of lines, such as broken lines, wavy lines, etc.

[0063] The flow path module 1 of this application also has a fourth embodiment, in which the flow path module 1 of the fourth embodiment is related to... Figures 1 to 5 Compared to the flow path module 1 of the previous embodiment, it has a substantially similar structure in its basic construction. Therefore, in the following description of the flow path module 1 of this fourth embodiment, it will not be described again. Figures 1 to 5 The structure has already been described in the implementation method. Additionally, regarding... Figures 1 to 5 The structures described in the embodiments are identical to those of the flow path module 1, and are labeled with the same reference numerals. Therefore, in the following description of this embodiment, the structures are mainly those of the same type. Figures 1 to 5 The differences between the flow path module 1 and the previous implementation will be explained. The main difference lies in the arrangement of the slot structures 103 in the flow path module 1. Figures 1 to 5 In this embodiment, the groove structures 103 are arranged in parallel. In the flow path module 1 of this fourth embodiment, the groove structures 103 of the plate material of the flow path body 10 are arranged in a cross pattern. They can be arranged in a cross pattern, a diamond pattern, a curved pattern, etc.

[0064] The flow path module 1 of this application also has a fifth embodiment, which is related to the flow path module 1 of the fifth embodiment. Figures 1 to 5 Compared to the flow path module 1 of the previous embodiment, it has a substantially similar structure in its basic construction. Therefore, in the following description of the flow path module 1 of this fifth embodiment, it will not be described again. Figures 1 to 5 The structure has already been described in the implementation method. Additionally, regarding... Figures 1 to 5 The structures described in the embodiments are identical to those of the flow path module 1, and are labeled with the same reference numerals. Therefore, in the following description of this embodiment, the structures are mainly those of the same type. Figures 1 to 5 The differences between the flow path module 1 in this fifth embodiment and the previous one will be explained. Specifically, the main difference in the flow path module 1 of this fifth embodiment lies in the extension type of the slot structure 103 within it. Figures 1 to 5 In one embodiment, the groove structure 103 is at a distance from the outer side surface 131 of the plate. In the fifth embodiment, the groove structure 103 extends to the outer side surface 131 of the plate.

[0065] The flow path module 1 of this application also has a sixth embodiment, in which the flow path module 1 of the sixth embodiment is related to... Figures 1 to 5 Compared to the flow path module 1 of the previous embodiment, it has a substantially similar structure in its basic construction. Therefore, in the following description of the flow path module 1 of this sixth embodiment, it will not be described again. Figures 1 to 5 The structure has already been described in the implementation method. Additionally, regarding... Figures 1 to 5 The structures described in the embodiments are identical to those of the flow path module 1, and are labeled with the same reference numerals. Therefore, in the following description of this embodiment, the structures are mainly those of the same type. Figures 1 to 5 The differences between the flow path module 1 in this sixth embodiment and the previous one will be explained. Specifically, the flow path module 1 in this sixth embodiment differs mainly in the arrangement direction and extension type of the slot structures 103. Figures 1 to 5 In one embodiment, the groove of the groove structure 103 extends parallel to the short side of the plate, so the groove is arranged along the long side of the plate, and the groove structure 103 is at a distance from the outer side 131 of the plate. In the sixth embodiment, the groove of the groove structure 103 extends parallel to the long side of the plate, so the groove is arranged along the short side of the plate, and the groove structure 103 extends to the outer side 131 of the plate.

[0066] The flow path module 1 of this application also has a seventh embodiment, which is related to the flow path module 1 of this seventh embodiment. Figures 1 to 5 Compared to the flow path module 1 of the previous embodiment, it has a substantially similar structure in its basic construction. Therefore, in the following description of the flow path module 1 of this seventh embodiment, it will not be described again. Figures 1 to 5 The structure has already been described in the implementation method. Additionally, regarding... Figures 1 to 5 The structures described in the embodiments are identical to those of the flow path module 1, and are labeled with the same reference numerals. Therefore, in the following description of this embodiment, the structures are mainly those of the same type. Figures 1 to 5 The differences between the flow path module 1 in this seventh embodiment and the previous one will be explained. Specifically, the flow path module 1 in this seventh embodiment differs mainly in the extension direction and type of the slot structure 103. Figures 1 to 5 In one embodiment, the groove of the groove structure 103 extends in a straight line and is parallel to the short side of the plate. Thus, the grooves are arranged along the long side of the plate, and the groove structure 103 is at a distance from the outer side 131 of the plate. In the seventh embodiment, the groove of the groove structure 103 extends in an arc shape, and the distance between two adjacent grooves remains unchanged in the extension direction of the groove. The groove structure 103 extends to the outer side 131 of the plate.

[0067] The flow path module 1 of this application also has an eighth embodiment, which is related to the flow path module 1 of the eighth embodiment. Figures 1 to 5 Compared to the flow path module 1 of the previous embodiment, it has a substantially similar structure in its basic construction. Therefore, in the following description of the flow path module 1 of this eighth embodiment, it will not be described again. Figures 1 to 5 The structure has already been described in the implementation method. Additionally, regarding... Figures 1 to 5 The structures described in the embodiments are identical to those of the flow path module 1, and are labeled with the same reference numerals. Therefore, in the following description of this embodiment, the structures are mainly those of the same type. Figures 1 to 5 The differences between the flow path module 1 in this eighth embodiment and the previous embodiment will be explained. Specifically, the flow path module 1 in this eighth embodiment differs mainly in the arrangement and extension type of the slot structures 103. Figures 1 to 5 In one embodiment, the grooves of the groove structure 103 extend parallel to the short side of the plate, so that the grooves are arranged along the long side of the plate, and the groove structure 103 is at a distance from the outer surface 131 of the plate. In the eighth embodiment, the multiple grooves of the groove structure 103 are arranged in a cross pattern, and the groove structure 103 extends to the outer surface 131 of the plate. The grooves can be arranged in a cross pattern, a diamond pattern, or a curved pattern, etc.

[0068] The flow path module 1 of this application also has a ninth embodiment, which is related to the flow path module 1 of the ninth embodiment. Figures 1 to 5 Compared to the flow path module 1 of the previous embodiment, it has a substantially similar structure in its basic construction. Therefore, in the following description of the flow path module 1 of this ninth embodiment, it will not be described again. Figures 1 to 5 The structure has already been described in the implementation method. Additionally, regarding... Figures 1 to 5 The structures described in the embodiments are identical to those of the flow path module 1, and are labeled with the same reference numerals. Therefore, in the following description of this embodiment, the structures are mainly those of the same type. Figures 1 to 5 The differences between the flow path module 1 in this ninth embodiment and the previous one will be explained. Specifically, the main difference in the flow path module 1 of this ninth embodiment lies in the specific structural form of the slot structure 103 within the flow path module 1. Figures 1 to 5 In one embodiment, the groove of the groove structure 103 extends parallel to the short side of the plate, so that the groove is arranged along the long side of the plate, and the groove structure 103 is at a distance from the outer side 131 of the plate. In the ninth embodiment, the groove structure 103 can be designed as a knurled form, both straight knurling and mesh knurling are acceptable, and other types of knurling are also acceptable.

[0069] It is understood that the various embodiments / implementations provided by this utility model can be combined with each other without creating contradictions, and will not be described one by one here.

[0070] In the above exemplary embodiments, the flow path module proposed by this utility model is described using an application in a refrigeration system as an example. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions, or other changes may be made to the specific embodiments to apply the relevant designs of this utility model to other types of devices, and these changes are still within the scope of the principle of the flow path module proposed by this utility model.

[0071] It should be noted that the flow path modules shown in the accompanying drawings and described in this specification are merely a few examples among many flow path modules capable of employing the principles of this invention. It should be clearly understood that the principles of this invention are by no means limited to any detail or component of the flow path modules shown in the accompanying drawings or described in this specification.

[0072] In the embodiments of the utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the utility model according to the specific circumstances.

[0073] In the description of the utility model embodiments, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the utility model embodiments and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model embodiments.

[0074] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the utility model. When introducing elements / components / etc. described and / or illustrated herein, the terms "a," "a," and "the above" are used to indicate the presence of one or more elements / components / etc. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0075] The above are merely preferred embodiments of the utility model and are not intended to limit the utility model. For those skilled in the art, various modifications and variations can be made to the utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the utility model should be included within the protection scope of the utility model.

Claims

1. A flow path module, characterized in that, include: The flow path body is formed by stacking and welding multiple layers of plates. The flow path body includes a flow cavity and a transition interface communicating with the flow cavity. The transition interface is formed on the outermost plate. Solder is disposed between adjacent plates. At least one of the two opposing surfaces of two adjacent plates has a groove structure for accommodating molten solder. A connector, the end of which is connected to the adapter.

2. The flow path module as described in claim 1, characterized in that, The solder includes solder pads disposed between two adjacent plates and avoiding the flow cavity.

3. The flow path module as described in claim 1, characterized in that, The depth of the groove structure is defined as the dimension of the groove structure in the stacking direction of the plates. The maximum value of the depth of the groove structure is 0.01mm-0.1mm.

4. The flow path module as described in claim 1, characterized in that, Both opposite surfaces of the two adjacent plates have the groove structure.

5. The flow path module as described in claim 1, characterized in that, The groove structure connects to the flow cavity.

6. The flow path module as described in claim 1, characterized in that, The groove structure extends to the outer side of the plate.

7. The flow path module as described in claim 1, characterized in that, There is a distance between the groove structure and the outer surface of the plate.

8. The flow path module as described in any one of claims 1 to 7, characterized in that, The groove structure includes multiple grooves, and the distance between two adjacent grooves remains constant along the extension direction of the grooves.

9. The flow path module as described in claim 8, characterized in that, The plurality of grooves are arranged in parallel.

10. The flow path module according to any one of claims 1 to 7, characterized in that, The groove structure includes multiple grooves, which are arranged in a cross pattern.

11. The flow path module as described in any one of claims 1 to 7, characterized in that, There are multiple adapters, and each adapter has a corresponding connecting pipe welded inside it. The multiple adapters are distributed on at least two different surfaces of the flow path body.

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