High-quality waterproof temperature sensor wire harness

Abstract

The utility model relates to the technical field of electronic components, and discloses a high-quality waterproof temperature sensor wire harness, which comprises a circuit board, a thermistor and a lead, the thermistor and the lead are arranged on the circuit board, a protection frame is arranged on the circuit board, an opening is arranged at the top of the protection frame along the height direction, and a glue protection layer is filled in the protection frame. And the rubber protection layer covers the thermistor and the end part of the lead. According to the utility model, the glue protection layer is filled from the top opening, so that the production efficiency is improved, and the product quality is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, specifically to a high-quality waterproof temperature sensor wire harness. Background Technology

[0002] Temperature sensing harnesses, as a key electronic component, primarily function to detect temperature values ​​and transmit them to the control system. Thermistors are its core component, and through various packaging methods, temperature sensing harnesses are widely used in various temperature detection, temperature compensation, and temperature control circuits. In these circuits, they play a crucial role, accurately converting temperature variables into the electrical signals required by the control system.

[0003] A typical temperature sensor harness structure consists of a housing and a thermistor fixed inside the housing. Two sets of wires are soldered onto the thermistor, extending out of the housing for electrical connection to the control system. Considering that some applications operate in humid environments, potting compound is used between the housing and the thermistor to prevent moisture damage. Once the compound cures, both the thermistor and the wires are covered, achieving good protection.

[0004] However, significant problems exist in the current production process of this temperature sensing harness. Due to the extremely limited internal space of the housing, the glue application process faces immense difficulties. Operators must apply glue precisely within this confined space, which not only demands exceptional skill but also consumes a significant amount of time, severely reducing the overall production efficiency of the harness. Furthermore, the high difficulty of the glue application process makes it difficult to ensure consistency in each application, resulting in inconsistent glue quality within the housing. This situation directly leads to a substantial increase in product defect rates, a significant reduction in product quality, and a series of negative impacts on the manufacturing company, including increased costs and decreased market competitiveness. Utility Model Content

[0005] The present invention aims to provide a high-quality waterproof temperature sensor wiring harness to improve the product quality and production efficiency of waterproof temperature sensor wiring harnesses.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high-quality waterproof temperature sensor harness, comprising a circuit board and a thermistor and wires disposed thereon, wherein the circuit board is provided with a protective frame, the protective frame has an opening at the top along the height direction, the protective frame is filled with an adhesive layer, and the adhesive layer covers the ends of the thermistor and wires.

[0007] The principles and advantages of this scheme are:

[0008] 1. Significantly Improved Ease of Adhesive Dispensing: Traditional adhesive dispensing openings are located on the side along the wire routing. Side dispensing is hampered by limited internal space and wire layout, requiring the dispensing operation to be performed in a complex and constrained environment, resulting in extremely high operational difficulty. During dispensing, operators must precisely control the amount and location of adhesive, and the process is easily affected by the spatial structure, making it difficult to ensure a smooth dispensing path. In contrast, this solution places the dispensing opening at the top, where the space is relatively open, and the dispensing path is not affected by factors such as wire routing. Based on fluid dynamics principles, the adhesive, guided by the top opening, flows more directly into the protective frame, reducing the bending and flow of adhesive in confined spaces. This design greatly simplifies the dispensing process, transforming the skill requirement from complex spatial dispensing techniques to routine vertical dispensing. Ordinary workers can master this skill with simple training, significantly improving the ease of dispensing.

[0009] 2. Effective Guarantee of Adhesive Quality: When applying adhesive from the side, due to space constraints and the complexity of adhesive flow direction, it is difficult to distribute the adhesive evenly within the protective frame under the influence of fluid dynamics. Near the injection port, adhesive tends to accumulate rapidly, resulting in an excessively thick adhesive layer; while in corners or narrow gaps far from the injection port, the adhesive is difficult to fully fill due to high flow resistance, easily leading to an insufficiently thin adhesive layer or even voids. This uneven adhesive distribution severely affects the product's protective performance. This solution uses top-application, utilizing gravity to allow the adhesive to flow vertically downwards into the protective frame. Under the combined effect of gravity and the adhesive's own surface tension, the adhesive can fill all areas within the protective frame more evenly, ensuring a uniform adhesive layer thickness. Products using top-application can control the adhesive layer thickness deviation within a very small range, providing stable and comprehensive protection for thermistors and wire ends, effectively improving the product's waterproof and electrical insulation performance, and significantly reducing the product defect rate compared to side-application.

[0010] 3. Significantly Improved Production Efficiency: Traditional side-applied glue application requires operators to spend considerable time precisely applying glue to overcome space constraints and ensure even distribution. Furthermore, the limited glue flow in confined spaces necessitates frequent pauses to allow the glue to flow naturally or to utilize auxiliary tools for even distribution, significantly extending the glue application cycle for individual products. This solution utilizes top-applied glue application, simplifying the process and dramatically increasing speed. With ample top space and smooth glue flow, frequent pauses are unnecessary. Based on production rhythm calculations, the number of glue application steps that can be completed per unit time increases by at least two times. With the same production equipment and personnel, top-applied glue application can increase the number of temperature sensor harnesses produced per unit time several times over, greatly improving overall production efficiency, effectively boosting enterprise capacity, meeting market demand, and bringing significant economic benefits to the company.

[0011] 4. Reduced Production Costs: From a cost structure analysis, on the one hand, the significant increase in production efficiency leads to a greater number of products produced per unit time. According to the cost allocation principle, the labor costs originally allocated to each product are significantly reduced. In the side-applied glue production mode, labor costs account for a relatively high proportion of the total product cost; after adopting top-applied glue, as the output per unit time increases, the proportion of labor costs in the total product cost decreases significantly. On the other hand, the reduction in product defect rate directly reduces the cost of raw material waste caused by defective products. At the same time, the reduction in the number of defective products correspondingly reduces the labor, material, and time costs required for subsequent rework.

[0012] Furthermore, a through hole is provided on one side of the protective frame. The through hole is arched, and one end of the wire passes through the through hole and out of the protective frame.

[0013] Beneficial effects: The protective frame has through holes on the side for wires to pass through, which not only provides a dedicated channel for quick assembly and positioning of the protective frame and wires, improving assembly efficiency, but also effectively limits the offset and wobbling of the wires, reduces the pulling on the connection points between the wires and the circuit board, ensures connection stability, and further improves product quality.

[0014] Furthermore, the upper surface of the adhesive layer protrudes from the opening at the top of the protective frame, and the protruding part is arc-shaped.

[0015] Beneficial Effects: In this design, the upper surface of the adhesive layer protrudes from the top opening of the protective frame. This facilitates quality inspection and control; after application, workers can quickly determine whether the adhesive layer has achieved the designed filling level through simple visual inspection. Furthermore, the arc-shaped protrusion serves as a guide and positioning element during installation, effectively preventing reverse installation, improving installation clarity and efficiency, and reducing installation failure rates and costs. During product maintenance, the protrusion makes it easier to inspect the adhesive layer for damage or aging. Maintenance personnel can clearly observe the overall condition of the adhesive layer, improving the efficiency and accuracy of maintenance work and reducing maintenance costs.

[0016] Furthermore, the adhesive layer is formed by curing a high-temperature resistant resin encapsulating adhesive.

[0017] Beneficial Effects: The use of high-temperature resistant resin encapsulation to form a protective layer greatly enhances the product's stability in high-temperature environments. High-temperature resistant resin has a unique molecular structure, allowing it to remain solid at high temperatures compared to ordinary adhesives, maintaining its physical and chemical stability. Temperature sensor wiring harnesses encapsulated with high-temperature resistant resin can operate stably for extended periods in such high-temperature environments, ensuring that components such as thermistors and wires are not affected by high temperatures, effectively transmitting temperature signals, guaranteeing the normal operation of the entire temperature sensing system, broadening the product's applicable temperature range, and improving its reliability in high-temperature fields.

[0018] Furthermore, an adhesive layer is provided between the protective frame and the circuit board, and the adhesive layer is formed by curing epoxy resin adhesive.

[0019] Beneficial effects: The adhesive layer formed by the cured epoxy resin adhesive has high strength. The epoxy groups in the epoxy adhesive molecule react chemically with the atoms on the surface of the protective frame and the circuit board to form chemical bonds, making the connection between the protective frame and the circuit board extremely strong and protecting the internal structure. Epoxy resin adhesive also has excellent chemical corrosion resistance and weather resistance, effectively resisting the erosion of chemical substances and maintaining stable adhesive performance.

[0020] Furthermore, the circuit board is provided with soldering points for welding and fixing to the wires.

[0021] Beneficial effects: Soldering the wires to the circuit board not only ensures a strong connection between the two, but also effectively improves the electrical connection performance between the wires and the circuit board. Soldering allows the metal wires to fuse tightly with the conductive materials such as copper foil on the circuit board, forming a low-resistance connection path, reducing resistance loss during current transmission, and improving the accuracy and stability of signal transmission.

[0022] Furthermore, the thermistor is an NTC thermistor and is soldered and fixed to the circuit board.

[0023] Beneficial effects: This solution uses NTC thermistors, which have a wide temperature measurement range, high temperature measurement accuracy, and short thermal response time, making the temperature sensing harness suitable for various applications and effectively improving its practicality. The thermistor is soldered and fixed to the circuit board, eliminating the need for other thermal insulation media between them. This effectively improves the heat transfer efficiency between the circuit board and the NTC thermistor, shortens the thermal response time of the NTC thermistor, and enhances the temperature sensing sensitivity and accuracy of the temperature sensing harness. Attached Figure Description

[0024] Figure 1 This is a top view of an embodiment of the present utility model.

[0025] Figure 2This is a side view of an embodiment of the present utility model.

[0026] Figure 3 This is an exploded structural diagram of an embodiment of the present invention.

[0027] Figure 4 This is a schematic diagram of the internal structure of the protective frame according to an embodiment of the present utility model.

[0028] Figure 5 This is a side view of the adhesive protective layer according to an embodiment of the present invention. Detailed Implementation

[0029] The following detailed description illustrates the specific implementation method:

[0030] The reference numerals in the accompanying drawings include: 1. Circuit board; 2. Thermistor; 3. Wire; 4. Solder joint; 5. Protective frame; 6. Through hole; 7. Opening; 8. Adhesive layer.

[0031] The basic implementation examples are as follows: Figures 1-5 As shown:

[0032] A high-quality waterproof temperature sensor harness, such as Figure 1 As shown, the device includes a circuit board 1, a thermistor 2, and wires 3 mounted on it. The circuit board 1 is made of FR-4 epoxy fiberglass board. The circuit board 1 has solder points 4, and the ends of the wires 3 are soldered to the circuit board 1 via these solder points 4. The thermistor 2 is an NTC thermistor and is soldered to the circuit board 1. Soldering the circuit board 1 to the thermistor 2 and wires 3 not only ensures a strong connection but also eliminates the need for other heat insulation media between the components and the circuit board 1. This improves the thermal conductivity between the circuit board 1 and the thermistor 2, reduces resistance loss during current transmission in the wires 3, and enhances the accuracy and stability of signal transmission.

[0033] Combination Figure 3 As shown, the circuit board 1 is provided with a protective frame 5, which is formed by four side plates. The protective frame 5 has an opening 7 at the top along the height direction. One side of the protective frame 5 is provided with a through hole 6, which is arched. The end of the wire 3 away from the solder joint 4 passes through the through hole 6 and exits the protective frame 5. The protective frame 5 surrounds the thermistor 2 and the solder joint 4.

[0034] Combination Figure 2 , Figure 4As shown, the protective frame 5 is filled with an adhesive layer 8, which covers the thermistor 2 and the ends of the wire 3. The adhesive layer 8 is formed by curing a high-temperature resistant resin encapsulant. During the encapsulation process, the encapsulant is poured in through the opening 7 at the top of the protective frame 5 and then baked to cure. Compared with the traditional side-pouring method, this solution uses the opening 7 at the top of the protective frame 5 as the pouring port, which not only has a larger pouring port area and faster pouring speed, effectively improving production efficiency, but also allows the glue to flow vertically from top to bottom into the protective frame 5 under the action of gravity. Under the combined effect of gravity and the surface tension of the glue itself, the glue can fill the various areas inside the protective frame 5 more evenly, ensuring that the thickness of the adhesive layer 8 is uniform and improving product quality.

[0035] Combination Figure 2 , Figure 5 As shown, the upper surface of the adhesive layer 8 protrudes from the opening 7 at the top of the protective frame 5, and the protruding part is an upward-curving arc. This design facilitates quality inspection and control. After the adhesive is poured, workers can quickly determine whether the adhesive layer 8 has reached the designed filling state through simple visual inspection. On the other hand, the arc-shaped protrusion serves as a guide and positioning element during installation, effectively preventing reverse installation, improving installation identification and assembly efficiency, and reducing installation failure rate and cost. During product maintenance, the protruding part makes it easier to check whether the adhesive layer 8 is damaged or aged. Maintenance personnel can clearly observe the overall condition of the adhesive layer 8, improving the efficiency and accuracy of maintenance work and reducing maintenance costs.

[0036] An adhesive layer is provided between the protective frame 5 and the circuit board 1. The adhesive layer is formed by curing epoxy resin adhesive. The adhesive layer formed in this way not only has high strength, making the connection between the protective frame 5 and the circuit board 1 extremely firm and protecting the internal structure, but also has good chemical corrosion resistance and weather resistance, which can effectively resist the erosion of chemical substances and maintain stable bonding performance.

[0037] In this embodiment, a label is affixed to one of the wires 3 extending out of the protective frame 5. The label is printed with a QR code, which contains the production date, material number, version number, and other information of the temperature sensing harness, facilitating product traceability of the temperature sensing harness in the future.

[0038] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A high-quality waterproof temperature sensor harness, comprising a circuit board and a thermistor and wires disposed thereon, characterized in that: The circuit board is provided with a protective frame, and the protective frame has an opening at the top along the height direction. The protective frame is filled with an adhesive layer, which covers the thermistor and the end of the wire.

2. The high-quality waterproof temperature sensor harness according to claim 1, characterized in that: One side of the protective frame has a through hole, which is arched, and one end of the wire passes through the through hole and out of the protective frame.

3. The high-quality waterproof temperature sensor harness according to claim 1, characterized in that: The upper surface of the adhesive protective layer protrudes from the opening at the top of the protective frame, and the protruding part is arc-shaped.

4. The high-quality waterproof temperature sensor harness according to claim 3, characterized in that: The adhesive layer is formed by curing a high-temperature resistant resin encapsulating adhesive.

5. The high-quality waterproof temperature sensor harness according to claim 2, characterized in that: An adhesive layer is provided between the protective frame and the circuit board, and the adhesive layer is formed by curing epoxy resin adhesive.

6. The high-quality waterproof temperature sensor harness according to claim 5, characterized in that: The circuit board is provided with soldering points for welding and fixing to wires.

7. The high-quality waterproof temperature sensor harness according to claim 1, characterized in that: The thermistor is an NTC thermistor and is soldered and fixed to the circuit board.

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