Intelligent control system for semiconductor equipment

Abstract

An intelligent control system for semiconductor equipment comprises an industrial personal computer with a built-in motion control board card, a coupler connected through an Ethernet communication network, a multi-level shaft control chain formed by sequentially connecting a plurality of shaft control modules in series, and sensor and actuator modules integrated on the shaft control modules. And the central control unit is deployed in the industrial personal computer and communicates with the motion control board card. The shaft control module comprises a servo or stepping driver and controls different shafts to move. The sensor unit is provided with a position encoder, a pressure sensor and an optical sensor, and the actuator unit is provided with a servo motor, a stepping motor and a rotating motor. The system adopts an EtherCAT bus to realize high-efficiency communication, realizes high-precision, high-efficiency and high-reliability semiconductor production control through multi-sensor fusion and actuator cooperative control, and the central control unit integrates a human-computer interaction interface and supports configuration and scheduling of various parameters.

Description

TECHNICAL FIELD

[0001] The utility model relates to the control technical field of semiconductor production equipment, specifically relates to a kind of semiconductor equipment intelligent control system. BACKGROUND

[0002] In the field of semiconductor manufacturing, with the increasing integration of chips, the process technology is more and more complex, the precision and stability of the production process have reached an unprecedented height. Traditional semiconductor production relies on a large number of manual operation and semi-automatic equipment, and the production efficiency and product quality are difficult to meet the rapid growth of market demand.

[0003] The traditional control system adopts a decentralized architecture, each axis is connected through an independent controller or a bus branch, which has the following problems:

[0004] Under the decentralized architecture, the control command needs to be transferred through multiple levels, it is difficult to achieve microsecond-level synchronization, resulting in insufficient multi-axis linkage precision and high communication delay;

[0005] New axis modules need to be rewired or adjust the bus topology, the system complexity is high, which makes the expansibility poor;

[0006] The sensors, actuators and drivers are arranged in a decentralized manner, which makes fault diagnosis difficult and results in high maintenance cost.

[0007] Therefore, how to overcome the above-mentioned defects has become an important issue for technicians in the field to solve. UTILITY MODEL CONTENT

[0008] The utility model aims at providing a kind of semiconductor equipment intelligent control system, namely the control system of semiconductor equipment, which realizes multi-axis high-precision synchronous control and high-efficiency data interaction through the deep integration of chain control architecture and EtherCAT bus.

[0009] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0010] The utility model embodiment discloses a kind of semiconductor equipment intelligent control system, comprising:

[0011] Industrial computer 1, its inside is equipped with central control unit 11, for coordinating each axis movement and production process scheduling;

[0012] Motion control board card 2 is connected with the central control unit 11 by industrial ethernet bus;

[0013] Coupler 3 is connected with the motion control board card 2 by industrial ethernet bus;

[0014] A multi-level shaft control chain 4 is formed by connecting a plurality of shaft control modules in series through an industrial Ethernet bus to form a chain control architecture; the shaft control modules include servo drives or step drives, which are respectively used to control the movement of X-axis, Y-axis, Z-axis, R-axis and deviation correction axis in a semiconductor production equipment;

[0015] A sensor and actuator module 5 is integrated in each shaft control module to collect motion data and execute control instructions.

[0016] Preferably, the industrial Ethernet bus is an EtherCAT bus 6.

[0017] Preferably, the plurality of shaft control modules include:

[0018] A first servo drive 41 is connected to the coupler 3 to control the X-axis movement of the substrate loading device in the semiconductor production equipment.

[0019] A second servo drive 42 is connected to the first servo drive 41 to control the Y-axis movement of the substrate loading device; in a specific implementation, the second servo drive 42 can be used to load the substrate to a designated position.

[0020] A third servo drive 43 is connected to the second servo drive 42 to control the Y-axis movement of the wafer suction device.

[0021] A fourth servo drive 44 is connected to the third servo drive 43 to control the Z-axis movement of the bonding device.

[0022] Preferably, the plurality of shaft control modules further include a first step drive 45 connected to the fourth servo drive 44 to control the R-axis, eutectic X-axis, eutectic Y-axis and eutectic R-axis movement.

[0023] A second step drive 46 is connected to the first step drive 45 to control the loading Z-axis, loading R-axis, unloading Z-axis and unloading R-axis movement of the wafer loading device.

[0024] A third step drive 47 is connected to the second step drive 46 to control the magazine X-axis, magazine Y-axis, wafer X-axis and wafer Y-axis movement.

[0025] A fourth step drive 48 is connected to the third step drive 47 to control the wafer picking Z-axis, wafer picking R-axis, pin Z-axis and pin cap Z-axis movement.

[0026] A fifth step drive 49 is connected to the fourth drive 48 to control the wafer deviation correction X-axis, wafer deviation correction Y-axis and wafer deviation correction Z-axis movement.

[0027] The coupler 3, the first servo driver 41, the second servo driver 42, the third servo driver 43, the fourth servo driver 44, the first step-by-step driver 45, the second step-by-step driver 46, the third step-by-step driver 47, the fourth step-by-step driver 48 and the fifth step-by-step driver 49 are connected in series.

[0028] Preferably, the sensor and the actuator module 5 are divided into a sensor unit 51 and an actuator unit 52; the sensor unit 51 comprises a position encoder 511 for feeding back the motion state, a pressure sensor 512 for feeding back the pressure state and an optical sensor 513 for wafer positioning, and the actuator unit 52 comprises a servo motor 521, a step-by-step motor 522 and a rotary motor 523, all of which are connected with the industrial Ethernet bus through corresponding servo drivers or step-by-step drivers.

[0029] Preferably, the motion control board card 2 is a solid high motion board card.

[0030] Preferably, the central control unit 11 is integrated with a touch display unit 12 for providing a man-machine interactive interface; the touch display unit 12 at least comprises a motion parameter configuration subunit 121, a temperature parameter configuration subunit 122, a camera parameter configuration subunit 123 and a system setting subunit 124.

[0031] Compared with the prior art, the embodiments of the utility model have the following beneficial effects:

[0032] 1. The present case forms a chain control architecture, realizes the series communication of "one master and multiple slaves" through the EtherCAT bus, reduces the wiring complexity, and improves the data transmission efficiency; at the same time, the motion control board card cooperates with the EtherCAT bus, supports the microsecond-level issuing and state feedback of multi-axis instructions, realizes microsecond-level synchronization, is beneficial to improving the wafer positioning and bonding precision of semiconductor equipment. The sensor and the actuator are integrated in the shaft control module, the signal transmission path is shortened, and the interference risk is reduced. At the same time, the newly added shaft control module only needs to be connected in series into the chain architecture, does not need to reconfigure the bus topology, and is convenient to expand; and the distributed design of multiple shaft control modules supports the rapid isolation and replacement of fault shafts, reduces the downtime, and improves the maintenance efficiency.

[0033] 2.The multiple-axis control module of the scheme is connected in series with multiple different function drivers such as servo drivers and stepper drivers, thereby constructing a high-efficiency centralized control network. The servo driver, with its high precision and fast response characteristics, can directly control the key axes of the substrate feeding device, such as the X-axis, Y-axis movement, and bonding Z-axis movement, thereby ensuring that the position accuracy of the wafer and the substrate reaches the micron level or even the nanometer level, and meeting the stringent requirements of semiconductor manufacturing. Moreover, the scheme realizes precise subdivision of functions according to the specific needs of different process links in semiconductor production. For example, the stepper driver is used to control the bonding R-axis, eutectic X-axis, eutectic Y-axis, and eutectic R-axis movement, so that each movement link of the bonding process and the eutectic welding process can be independently and accurately performed. This functional subdivision not only improves the overall performance of the equipment, but also optimizes the production process by reducing interference between different processes, thereby significantly improving production efficiency. In addition, when a new axis module needs to be added, the corresponding driver needs to be added to the serial link, without the need for large-scale rewiring or adjustment of the bus topology, thereby realizing rapid and low-cost equipment expansion and effectively solving the scalability problem under the traditional architecture. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0035] Figure 1 is the architecture schematic diagram of the semiconductor equipment intelligent control system of the present application.

[0036] Figure 2 is the structure block diagram of the sensor and actuator module of the present application.

[0037] Figure 3 is the structure block diagram of the touch display unit of the present application. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings of the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0039] It should be noted that the terms "first", "second", "third", "fourth" and the like in the description and claims of the utility model are used only to distinguish different objects, and are not used to describe a specific order. The terms "include" and "have" and any variations of them in the embodiments of the utility model are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0040] As shown in Figures 1-3 A semiconductor equipment intelligent control system comprises:

[0041] The industrial computer 1 is used as an upper computer.

[0042] The motion control board card 2 is used as a master station and is connected with the industrial computer 1 through an EtherCAT bus. The motion control board card 2 adopts a Googol motion board card / Googol motion control card, such as a multi-axis motion control card with a model number of GT800-PCI-11, can support multi-axis linkage control, and realizes microsecond-level data interaction with a coupler through the EtherCAT bus. Compared with ordinary control cards, the Googol motion control card has higher precision, timeliness and expandability, and meets the requirements of the system on precision, real-time performance and expandability.

[0043] The coupler 3 is connected with the motion control board card 2 through an Ethernet bus and is used as an expansion bus node. Specifically, the EtherCAT bus is particularly suitable for the requirements of multi-axis motion control and semiconductor manufacturing involved in the system due to its ultra-high speed, low delay, high synchronization precision and other characteristics.

[0044] The multi-level shaft control chain 4 is formed in a chain control architecture by sequentially connecting a plurality of shaft control modules through an industrial Ethernet bus.

[0045] The shaft control module comprises a servo driver or a stepping driver and is used for controlling the movement of X-axis, Y-axis, Z-axis, R-axis and a deviation correction shaft in a semiconductor production device.

[0046] The signal transmission path of the chain control architecture is: motion control board card -> coupler -> a plurality of shaft control modules connected in sequence.

[0047] The sensor and actuator module 5 is integrated in each shaft control module and is used for collecting motion data and executing control instructions.

[0048] The central control unit 11 is disposed in the industrial computer, communicates with the motion control board card 2, and is used for coordinating shaft movement and production process scheduling.

[0049] As described above, the chain control architecture is formed, the series communication of "one master and multiple slaves" is realized through the EtherCAT bus, the wiring complexity is reduced, and the data transmission efficiency is improved. Meanwhile, the motion control board and the EtherCAT bus cooperate to support the microsecond-level issuing and state feedback of multi-axis instructions, realize microsecond-level synchronization, and help improve the wafer positioning and bonding precision of semiconductor equipment. The sensors and actuators are integrated in the shaft control module, which shortens the signal transmission path and reduces the interference risk. At the same time, the newly added shaft control module only needs to be connected in series to the chain architecture, without the need to reconfigure the bus topology, and the expansion is convenient. The distributed design of multiple shaft control modules supports rapid isolation and replacement of fault shafts, reduces downtime, and improves maintenance efficiency.

[0050] As shown in Figure 1 as a specific embodiment, the plurality of shaft control modules includes:

[0051] The first servo driver 41 is connected with the coupler 3, and is used to control the X-axis movement of the substrate loading device in the semiconductor production equipment.

[0052] The second servo driver 42 is connected with the first servo driver 41, and is used to control the Y-axis movement of the substrate loading device. In specific implementation, the substrate can be loaded to the designated position by cooperating with the second servo driver 42.

[0053] The third servo driver 43 is connected with the second servo driver 42, and is used to control the Y-axis movement of the wafer suction device.

[0054] The fourth servo driver 44 is connected with the third servo driver 43, and is used to control the bonding Z-axis movement. Specifically, the bonding Z-axis is the mounting axis in the bonding process, which is responsible for moving the wafer downward to the position in contact with the substrate to complete the bonding action.

[0055] The first stepper driver 45 is connected with the fourth servo driver 44, and is used to control the bonding R-axis, eutectic X-axis, eutectic Y-axis and eutectic R-axis movement. Specifically, the bonding R-axis is the rotation axis in the bonding process, which is used for angle alignment of the wafer and the substrate; the eutectic X-axis (i.e. eutectic welding X-axis) and the eutectic Y-axis (i.e. eutectic welding Y-axis) drive the precise positioning of the welding head in the plane; and the eutectic Y-axis (i.e. eutectic welding rotation axis) adjusts the inclination angle of the welding head.

[0056] The second stepper driver 46 is connected with the first stepper driver 45, and is used for controlling the feeding Z axis, the feeding R axis, the unloading Z axis and the unloading R axis of the wafer feeding device. Specifically, the feeding Z axis is used for controlling the vertical lifting movement of the feeding manipulator, so as to adjust the height of the manipulator to grab or place the wafer to the processing position. The feeding R axis is used for controlling the rotation movement of the feeding manipulator around the rotation axis, so as to adjust the direction or angle of the wafer, and ensure the alignment with the processing platform. The unloading Z axis is used for controlling the vertical lifting movement of the unloading manipulator, so as to vertically extract the processed wafer from the processing platform. The unloading R axis is used for controlling the rotation movement of the unloading manipulator around the rotation axis, so as to adjust the direction of the wafer in the unloading process, and ensure the correct placement of the wafer to the target position. Specifically, the feeding Z axis refers to the step of transferring the wafer from the wafer to a certain position such as a visual detection platform for intermediate transfer, and then feeding to the processing position before formal processing. The unloading Z axis is used for vertically extracting the processed wafer from the processing platform, which is the end stage of the processing flow.

[0057] The third stepper driver 47 is connected with the second stepper driver 46, and is used for controlling the movement of the magazine X axis, the magazine Y axis, the wafer X axis and the wafer Y axis. In specific implementation, the magazine X axis and the magazine Y axis are controlled to move the magazine from the storage position to the processing position. The wafer X axis and the wafer Y axis are controlled to adjust the position of the wafer.

[0058] The fourth stepper driver 48 is connected with the third stepper driver 47, and is used for controlling the movement of the wafer taking Z axis, the wafer taking R axis, the pin Z axis and the pin cap Z axis. In specific implementation, the wafer taking Z axis is used to control the vertical lifting or reaching movement of the wafer taking manipulator after the wafer is taken out from the wafer, so as to accurately grab or place the wafer. The wafer taking R axis is used to control the rotation of the wafer taking manipulator around the rotation axis, so as to adjust the direction of the wafer to match the processing requirement. The pin Z axis is used to control the vertical lifting movement of the pin, so as to eject the wafer during the processing. The pin cap is controlled to move vertically, so as to adjust the contact pressure between the end of the pin and the wafer. The wafer taking Z axis specifically refers to the operation of the specific step of separating the wafer from the wafer.

[0059] The fifth stepper driver 49 is connected with the fourth driver 48, and is used for controlling the movement of the wafer deviation X axis, the wafer deviation Y axis and the wafer deviation Z axis. In specific implementation, the deviation X axis is used for fine adjustment in the horizontal X axis direction, so as to correct the left and right deviation of the wafer. The deviation Y axis is used for fine adjustment in the horizontal Y axis direction, so as to correct the front and back deviation of the wafer. The deviation Z axis is used for fine adjustment in the vertical Z axis direction, so as to correct the height or inclination angle of the wafer.

[0060] The coupler 3, the first servo driver 41, the second servo driver 42, the third servo driver 43, the fourth servo driver 44, the first step-by-step driver 45, the second step-by-step driver 46, the third step-by-step driver 47, the fourth step-by-step driver 48, and the fifth step-by-step driver 49 are connected in series in turn. In this way, the signal path of the entire system is:

[0061] Motion control board card 2 → coupler 3 → first servo driver 41 → second servo driver 42 → third servo driver 43 → fourth servo driver 44 → first step-by-step driver 45 → second step-by-step driver 46 → third step-by-step driver 47 → fourth step-by-step driver 48 → fifth step-by-step driver 49.

[0062] As described above, the multiple-axis control module of the present scheme is connected in series through multiple different function drivers such as servo drivers and step-by-step drivers, thereby constructing an efficient centralized control network. The servo driver, with its high precision and fast response characteristics, can directly control the key axes of the substrate feeding device, such as the X-axis, Y-axis movement, and bonding Z-axis movement, etc., to ensure that the position accuracy of the wafer and the substrate reaches the micron level or even the nanometer level, meeting the stringent requirements of semiconductor manufacturing. Moreover, the present scheme realizes precise subdivision of functions according to the specific needs of different process links in semiconductor production. For example, the step-by-step driver is used to control the bonding R-axis, eutectic X-axis, eutectic Y-axis, and eutectic R-axis movement simultaneously, so that each movement link of the bonding process and eutectic welding process can be independently and accurately performed. This functional subdivision not only improves the overall performance of the equipment, but also optimizes the production process by reducing interference between different processes, significantly improving production efficiency. In addition, when a new axis module needs to be added, the corresponding driver only needs to be added to the serial link, without the need for large-scale rewiring or adjustment of the bus topology, realizing rapid and low-cost equipment expansion, and effectively solving the scalability problem under the traditional architecture.

[0063] Since the substrate loading device X-axis movement, the substrate loading device Y-axis movement needs long stroke, high speed, large load, the wafer suction device Y-axis movement needs medium and short stroke, medium load, and the bonding Z-axis needs to control the contact pressure of the wafer and the substrate, the torque control mode of the servo system can avoid the wafer from being damaged, so servo drivers are used. The servo driver is usually used for the shaft which needs high precision, high response and closed loop control, to ensure higher precision and response. Since the bonding R-axis, the eutectic X / Y / R-axis belongs to small range rotation / planar motion, the speed requirement is low; and the loading / unloading Z / R-axis is a fixed stroke with vertical lifting and rotating motion, the step angle precision of the stepper motor is sufficient; in addition, the correction X / Y / Z-axis belongs to fine tuning motion with short stroke, and the subdivision technology of the stepper driver can realize sub-micron resolution. Therefore, the stepper driver can be used to meet the control of low speed, medium precision and low cost demand of the motion shaft. In this way, in the selection of the driver, the control accuracy, load characteristics, speed and acceleration requirements, cost and system complexity and other factors are fully considered. For high-precision, large-load, high-speed motion components, servo drivers are selected to ensure performance; for motion components with low precision requirements, small load and low speed, stepper drivers with lower cost and simpler system are selected. This differentiated selection strategy not only guarantees the overall performance of the equipment, but also effectively controls the cost, reduces the system complexity, and realizes the dual goals of cost effectiveness and system simplification.

[0064] As shown in Figure 2 The sensor and actuator module 5 is divided into a sensor unit 51 and an actuator unit 52; the sensor unit 51 includes a position encoder 511 for feeding back the motion state, a pressure sensor 512 for feeding back the pressure state, and an optical sensor 513 for wafer positioning; the actuator unit 52 includes a servo motor 521, a stepper motor 522, and a rotary motor 523, all of which are connected through corresponding servo drivers or stepper drivers and an EtherCAT bus.

[0065] As described above, the position encoder 511 data is fed back to the motion control board 2 in real time through EtherCAT, realizing microsecond-level closed-loop control and improving the real-time performance and precision of the control. The pressure sensor 512 cooperates with the servo driver to realize constant force control in the bonding process and avoid wafer cracking. The optical sensor 513 identifies the wafer position and feeds back to the central control unit 11 to generate compensation instructions. In this way, through multi-sensor fusion, the data of the position, pressure, and optical sensors are interacted in real time through the EtherCAT bus; and through actuator cooperative control, the servo / stepper / rotary motor is dispatched by a unified instruction, supporting complex process sequences; and through the high integration and intelligent cooperation of sensors and actuators, the system of the present application can realize a comprehensive breakthrough in precision, efficiency and reliability in semiconductor equipment, providing a standardized solution for high-end manufacturing.

[0066] As shown in Figure 3 The central control unit 11 integrates a touch display unit 12 for providing a human-computer interaction interface, and the touch display unit 12 at least includes a motion parameter configuration subunit 121, a temperature parameter configuration subunit 122, a camera parameter configuration subunit 123, and a system setting subunit 124. In this way, the system supports the configuration and scheduling of the motion parameter, the temperature parameter, and the camera parameter, so as to accurately control the production parameter, monitor the production process in real time, and effectively reduce the product defective rate.

[0067] The above has carried out the detailed introduction to the semiconductor equipment intelligent control system disclosed by the embodiment of the utility model, the principle and implementation mode of the utility model have been described in this paper by applying specific examples, the above embodiment is only used for helping understanding the method and core idea of the utility model; simultaneously, for the general technical personnel of the field, according to the idea of the utility model, there will be changes in specific implementation mode and application range, and the above, the content of the specification should not be understood as the limitation of the utility model.

Claims

1. A smart control system for semiconductor equipment, characterized in that, include: An industrial computer (1) is provided with a central control unit (11) inside, which is used to coordinate the movement of each axis and the scheduling of the production process; The motion control board (2) is connected to the central control unit (11) via an industrial Ethernet bus; The coupler (3) is connected to the motion control board (2) via an industrial Ethernet bus; A multi-level axis control chain (4) is formed by connecting multiple axis control modules in series via an industrial Ethernet bus to form a chain control architecture; the axis control module includes a servo driver or a stepper driver, which are used to control the movement of the X-axis, Y-axis, Z-axis, R-axis and the correction axis in the semiconductor production equipment, respectively; The sensor and actuator module (5) is integrated into each axis control module and is used to collect motion data and execute control commands.

2. The intelligent control system for semiconductor equipment according to claim 1, characterized in that, The industrial Ethernet bus is an EtherCAT bus (6).

3. The intelligent control system for semiconductor equipment according to claim 1 or 2, characterized in that, The plurality of axis control modules include: The first servo driver (41) is connected to the coupler (3) and is used to control the substrate loading device in the semiconductor production equipment to perform X-axis movement. The second servo driver (42) is connected to the first servo driver (41) and is used to control the half substrate loading device to perform Y-axis movement. The third servo driver (43) is connected to the second servo driver (42) and is used to control the Y-axis movement of the wafer picking device; The fourth servo driver (44), connected to the third servo driver (43), is used to control the Z-axis motion of the fit.

4. The intelligent control system for semiconductor equipment according to claim 3, characterized in that, The multiple axis control modules further include: a first stepper driver (45), connected to a fourth servo driver (44), used to control the movement of the bonding R-axis, eutectic X-axis, eutectic Y-axis and eutectic R-axis; The second stepper driver (46) is connected to the first stepper driver (45) and is used to control the movement of the loading Z-axis, loading R-axis, unloading Z-axis and unloading R-axis of the wafer loading device; The third stepper driver (47) is connected to the second stepper driver (46) and is used to control the movement of the material box X-axis, material box Y-axis, wafer X-axis and wafer Y-axis; The fourth stepper driver (48) is connected to the third stepper driver (47) and is used to control the movement of the wafer pick-up Z-axis, wafer pick-up R-axis, ejector pin Z-axis and ejector pin cap Z-axis. The fifth stepper driver (49) is connected to the fourth stepper driver (48) and is used to control the movement of the wafer correction X-axis, wafer correction Y-axis and wafer correction Z-axis. The coupler (3), the first servo driver (41), the second servo driver (42), the third servo driver (43), the fourth servo driver (44), the first stepper driver (45), the second stepper driver (46), the third stepper driver (47), the fourth stepper driver (48), and the fifth stepper driver (49) are connected in series.

5. The intelligent control system for semiconductor equipment according to claim 1 or 2, characterized in that, The sensor and actuator module (5) is divided into a sensor unit (51) and an actuator unit (52). The sensor unit (51) includes a position encoder (511) that provides feedback on motion status, a pressure sensor (512) that provides feedback on pressure status, and an optical sensor (513) for wafer positioning. The actuator unit (52) includes a servo motor (521), a stepper motor (522), and a rotary motor (523), all of which are connected to an industrial Ethernet bus through corresponding servo drivers or stepper drivers.

6. The intelligent control system for semiconductor equipment according to claim 1, characterized in that, The motion control board (2) is a Googol motion board.

7. The intelligent control system for semiconductor equipment according to claim 1, characterized in that, The central control unit (11) integrates a touch display unit (12) to provide a human-computer interaction interface; The touch display unit (12) includes at least: a motion parameter configuration subunit (121), a temperature parameter configuration subunit (122), a camera parameter configuration subunit (123), and a system setting subunit (124).

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