Electric control power device based on stacked structure
By designing an electronically controlled power device based on a stacked structure, including a thin-film capacitor, an inverter module, and a driver board, the problem of compact motor controller layout was solved, the versatility and stability of the electronically controlled power device were achieved, and production costs were reduced.
Patent Information
- Application Number
- CN202323061738.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-13
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2033-11-13
AI Technical Summary
Existing motor controllers have a problem with compact horizontal and vertical layout in vehicle motor controllers, which leads to most electric drive products being custom-developed components, increasing R&D and production costs.
The electronically controlled power device adopts a stacked structure and includes a design of film capacitors, inverter modules, driver boards and housing. The film capacitors are used for filtering and voltage regulation, the inverter modules convert DC power to AC power, the driver boards drive the inverter modules to work, and the housing is equipped with cooling tanks and water-cooled plates to achieve efficient heat dissipation.
It improves the versatility and stability of the electric power control device, alleviates the problem of compact layout, reduces production costs, and enhances the platformization of the motor controller.
Smart Images
Figure CN223872221U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of motor controller structure technology, and in particular to an electronically controlled power device based on a stacked structure. Background Technology
[0002] With the development of the electric vehicle industry, the requirements for the core components of electric vehicles are becoming increasingly stringent, especially the powertrain system. As a core component of the electric drive system in new energy vehicles, the high integration and platformization of the motor controller are key development directions to be considered in the future.
[0003] Currently, the most critical component restricting the platformization of electric control systems is the power module, which accounts for approximately 50% of the cost of the motor controller. Due to the differences in electric vehicle types, different electric vehicles often require motor controllers with different structures, resulting in electric drive products being mostly custom-developed components, requiring significant R&D, mold manufacturing, and production costs. In the current market, the horizontal layout of vehicle motor controllers remains a challenge. Utility Model Content
[0004] The main purpose of this invention is to provide an electric power control device based on a stacked structure, which aims to improve the versatility of the electric power control device so that it can solve the problem of compact horizontal and vertical layout of the electric drive system of new energy vehicles.
[0005] To achieve the above objectives, this utility model proposes an electrically controlled power device based on a stacked structure, the electrically controlled power device based on a stacked structure comprising:
[0006] Thin film capacitor, which is used for filtering and voltage regulation of DC power input;
[0007] A thin-film capacitor input / output assembly, wherein the thin-film capacitor input / output assembly is electrically connected to the thin-film capacitor;
[0008] An inverter module, the input terminal of which is electrically connected to the output terminal of a thin-film capacitor, is used to invert the input DC power supply into AC power supply and output it.
[0009] A driver board, the output end of which is electrically connected to the controlled end of the inverter module and is used to drive the inverter module to work;
[0010] The housing has a thin-film capacitor disposed inside it. The housing has a mounting side, the inverter module is disposed on the mounting side of the housing, and the drive board is disposed on the side of the inverter module facing away from the housing. The thin-film capacitor, the inverter module, and the drive board are arranged side by side along the thickness direction of the housing.
[0011] Optionally, the housing has a receiving groove with an opening on one side, the thin film capacitor is filled into the receiving groove through the opening, and a cooling groove is provided on the side of the receiving groove facing away from the housing. The cooling groove is filled with coolant, the opening is covered with a water-cooling plate, and the inverter module is in contact with the water-cooling plate.
[0012] Optionally, the outer casing also has a water inlet and a water outlet respectively connected to the cooling tank, and the water inlet and water outlet are located on opposite sides of the outer casing.
[0013] Optionally, the water-cooled plate is provided with a heat dissipation structure facing into the cooling tank.
[0014] Optionally, the water-cooled plate further includes a temperature detection module, which is disposed on the water-cooled plate and connected to the drive board.
[0015] The temperature detection module is used to detect the temperature of the inverter module and output a temperature detection signal to the driver board.
[0016] Optionally, the thin-film capacitor input / output assembly includes: a thin-film capacitor output positive electrode component, a thin-film capacitor output negative electrode component, a thin-film capacitor input positive electrode component, and a thin-film capacitor input negative electrode component;
[0017] The two ends of the positive output terminal component of the thin-film capacitor are respectively connected to the positive input terminal component of the thin-film capacitor and the inverter module; one end of the negative output terminal component of the thin-film capacitor is connected to the negative input terminal component of the thin-film capacitor.
[0018] Optionally, the inverter module includes a first insulating support and an IGBT chip;
[0019] The first insulating bracket is mounted on the housing and positioned close to the water-cooling plate;
[0020] Multiple IGBT chips are disposed on the first insulating bracket. The first insulating bracket is provided with clearance holes corresponding to the positions of each IGBT chip for them to pass through. Each IGBT chip passes through its corresponding clearance hole and is attached to the water-cooling plate.
[0021] Optionally, the electronically controlled power device based on the stacked structure further includes a negative electrode component, which is disposed between the drive board and the inverter module, and is connected to the thin-film capacitor output negative electrode component and the inverter module;
[0022] The negative electrode assembly includes a second insulating support, a third insulating support, and a negative electrode component. The second and third insulating supports are connected and fixed to the negative electrode component and are used for insulation of the negative electrode component. The negative electrode assembly is used to connect the output negative electrode component of the thin film capacitor to the inverter module.
[0023] Optionally, the power control device based on the stacked structure further includes an AC output component and an output component. The AC output component is disposed between the driver board and the inverter module, and the AC output component is connected to the inverter module and the output component.
[0024] The AC output component includes a fourth insulating bracket and an AC output component. The fourth insulating bracket is disposed on one side of the output component and is used for fixing and insulating the AC output component. The AC output component is used to connect the inverter module and the output component.
[0025] Optionally, the power control device based on the stacked structure further includes a current detection module, which is located in the driver board and corresponds to the output component. The current detection module is used to detect the current output by the power control device and output a current detection signal.
[0026] This utility model relates to an electric power control device based on a stacked structure, comprising a thin-film capacitor, a thin-film capacitor input / output assembly, an inverter module, a driver board, and a housing. Specifically, DC power is input through the thin-film capacitor input / output assembly, and the thin-film capacitor filters and regulates the DC power. The DC power input through the thin-film capacitor input / output assembly is then converted into AC power by the driver board driving the inverter module, and output as AC power. The inverter module is located on the mounting side of the housing; the driver board is located on the side of the inverter module facing away from the housing, and the thickness directions of the housing, inverter module, and driver board are consistent. This ensures the verticality of the electric power control device structure, effectively alleviating the problem of compact horizontal and vertical layout of the electric power control device in the electric drive system of new energy vehicles. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0028] Figure 1 This is a schematic diagram of the structure of the electrically controlled power device of this utility model;
[0029] Figure 2 This is another structural schematic diagram of the electrically controlled power device of this utility model;
[0030] Figure 3 This is another structural schematic diagram of the electrically controlled power device of this utility model;
[0031] Figure 4 This is a block diagram of the electrically controlled power device of this utility model;
[0032] Figure 5 This is an exploded view of the electrically controlled power device of this utility model;
[0033] Figure 6 This is an enlarged view of the temperature detection module of this utility model;
[0034] Figure 7 This is a schematic diagram of the needle-fin-shaped heat dissipation structure of this utility model;
[0035] Figure 8 This is a schematic diagram of the modular components of the electric power control device of this utility model.
[0036] Explanation of icon numbers:
[0037]
[0038] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0040] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0041] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.
[0042] With the development of the electric vehicle industry, the requirements for the core components of electric vehicles are becoming increasingly stringent, especially the powertrain system. As a core component of the electric drive system in new energy vehicles, the high integration and platformization of the motor controller are key development directions to be considered in the future.
[0043] Currently, the most critical component restricting the platformization of electric control systems is the power module, which accounts for approximately 50% of the cost of the motor controller. Due to the differences in electric vehicle types, different electric vehicles often require motor controllers with different structures, resulting in electric drive products being mostly custom-developed components, requiring significant R&D, mold manufacturing, and production costs. In the current market, the compact vertical and horizontal layout of vehicle motor controllers remains a challenge.
[0044] This invention proposes an electronically controlled power device based on a stacked structure, which can effectively solve the problem of compact layout of motor controllers in the horizontal direction.
[0045] refer to Figure 1 and Figure 2 The electronically controlled power device based on a stacked structure includes:
[0046] Thin film capacitor 10, the thin film capacitor 10 is used for filtering and voltage regulation of DC power input;
[0047] A thin-film capacitor input / output assembly, wherein the thin-film capacitor input / output assembly is electrically connected to the thin-film capacitor 10;
[0048] Inverter module 30, the input terminal of which is electrically connected to the output terminal of film capacitor 10, is used to invert the input DC power supply into AC power supply and output it.
[0049] A drive board 40, the output terminal of which is electrically connected to the controlled terminal of the inverter module 30, and is used to drive the inverter module 30 to work;
[0050] The housing 20 has a mounting side, the inverter module 30 is located on the mounting side of the housing 20, and the drive board 40 is located on the side of the inverter module facing away from the housing. The thin film capacitor 10, the inverter module 30, and the drive board 40 are arranged side by side along the thickness direction of the housing.
[0051] In this embodiment, the thin-film capacitor 10 is disposed within the receiving slot of the housing 20, and an input / output interface is provided. The housing 20 can be an ADC12, i.e., a die-cast aluminum alloy housing. When the electronically controlled power device is operating, the current in the main circuit of the inverter module 30 will change due to changes in circuit load. At this time, the internal resistance of the battery pack generates a corresponding voltage, which changes with the current, causing a change in the main circuit voltage, i.e., ripple voltage. With the thin-film capacitor 10, this phenomenon can be largely suppressed. Furthermore, the inductance in the circuit from the inverter module 30 to the battery terminal will generate a voltage spike in the main circuit when the inverter module 30 switches on and off. This voltage spike may potentially break down the inverter module 30. Therefore, in practical applications of electronically controlled power devices, selecting the thin-film capacitor 10, which has strong withstand voltage, continuous high-frequency ripple current resistance, and low self-inductance, can further improve the stability and effectiveness of the electronically controlled power device operation.
[0052] In this embodiment, the thin-film capacitor input / output component can be made of materials with good conductivity, such as copper busbars or silver busbars. The thin-film capacitor input / output component is electrically connected to the thin-film capacitor 10 and extends outside the housing 20 to facilitate the input and output of DC power.
[0053] In this embodiment, the inverter module 30 can be implemented using an IGBT module, a MOSFET module, a transistor module, etc. The inverter module 30 is mounted on the housing 20 and is connected and fixed to the housing 20 via welding, locating pins of insulating components, and other corresponding connecting parts. Taking an IGBT module as an example, the input terminal of the inverter module 30 is electrically connected to the output terminal of the thin-film capacitor input component, and its output terminal is electrically connected to the AC output component 60 of the electronically controlled power device. The IGBT module has corresponding insulating components and corresponding welding pins for fixing the IGBT module. Furthermore, the IGBT module generates a large amount of heat when in operation; therefore, a corresponding heat dissipation structure should be provided to ensure the normal operation of the IGBT module. In the electronically controlled power device, the inverter module 30 controls the output of corresponding AC power from the input DC power according to the drive signal output by the driver board 40.
[0054] In this embodiment, the drive board 40 is located on the side of the inverter module 30 facing away from the housing 20, and the drive board 40 is provided with holes and / or positioning pins to fix it to the housing 20 and other components. Since the horizontal area of the power control device is reduced due to its stacked structure, the circuit area that can be arranged on the drive board 40 is also reduced, and therefore no control module is provided on the drive board 40. In practical applications, it is necessary to cooperate with other related component control modules to achieve control functions, such as an external control module MCU, or to share a control module with other devices. The drive board 40 is provided with a drive module, in which the drive circuit amplifies the power of the control signal generated by the control circuit to drive the power devices of the inverter module, switching them from an open state to a closed state. In addition, the drive board 40 is also provided with a protection circuit, responsible for monitoring abnormal conditions during equipment operation, such as current overload, temperature rise, etc., and triggering a protection mechanism to prevent equipment damage.
[0055] In this embodiment, to achieve a reduction in the overall horizontal volume of the electronically controlled power device, the thickness of the housing 20, inverter module 30, and drive board 40 is consistent. Corresponding components, such as input / output components, are used to achieve the circuit connection of the DC power input, film capacitor 10, inverter module 30, and drive board 40 within structural constraints. Then, corresponding connecting parts, such as bolts and clips, are used to connect and fix the housing 20, inverter module 30, and drive board 40.
[0056] refer to Figure 5 In one embodiment of the present invention, the outer shell 20 has a receiving groove with an open side. The thin film capacitor 10 is filled into the receiving groove through the open side. A cooling groove is provided on the side of the receiving groove facing away from the outer shell. The cooling groove is filled with coolant. The open side is covered with a water-cooling plate 21. The inverter module is in contact with the water-cooling plate.
[0057] In this embodiment, to protect the film capacitor 10 and make reasonable use of space, a receiving groove with one open side is provided on the outer casing 20. This open receiving groove is located on the mounting side of the outer casing 20 to house the film capacitor 10, which is then encapsulated with potting compound. The potting compound can be epoxy resin, silicone resin, polyurethane, etc. Furthermore, after encapsulating the film capacitor 10 with potting compound, a cooling groove is formed on the open side to fill with coolant. The formation direction of this cooling groove corresponds to the inverter module 30 to achieve optimal heat dissipation. For example, the cooling groove can specifically be a first cooling groove and a second cooling groove, respectively corresponding to the IGBT module 31, with a protrusion between the two sets of cooling grooves to accommodate the coolant. The outer casing 20 outside the cooling groove has a corresponding positioning groove for mounting the sealing ring 100. The outer casing 20 is provided with a water-cooled plate 21 corresponding to the opening. The water-cooled plate 21 is in contact with the outer casing 20 and the sealing ring 100 to achieve isolation and sealing between the inverter module 30 and the coolant.
[0058] Optionally, the water-cooled plate 21 can be made of copper-aluminum material or aluminum brazing composite material. The water-cooled plate 21 has a side facing the mounting side of the outer casing 20 and a side facing away from the mounting side of the outer casing 20, and each side has different configurations. Specifically, the side of the water-cooled plate 21 facing away from the mounting side of the outer casing 20 has multiple sets of solder paste printing stations corresponding to the inverter module 30 for adding solder paste, so that the inverter module 30 can be fixed to the water-cooled plate 21 by reflow soldering with the solder paste, and this also facilitates heat transfer.
[0059] refer to Figure 3 In one embodiment of the present invention, the outer shell 20 further has a water inlet 300 and a water outlet 200 respectively connected to the cooling tank, and the water inlet 300 and the water outlet 200 are disposed on opposite sides of the outer shell 20.
[0060] In this embodiment, when the electronically controlled power device is operating, the inverter module 30 generates a large amount of heat. If the inverter module 30 is not cooled in time, its performance, safety, and stability will be severely affected. The coolant used can be an aqueous solution of ethylene glycol, an alcohol solution, or other similar coolants. For example, an aqueous solution of ethylene glycol is a 1:1 mixture of ethylene glycol and distilled water. In practical applications, aqueous solutions are often used as coolants due to their high specific heat capacity, low flow resistance, and low cost. However, considering environmental factors, aqueous solutions have a high freezing point and are prone to solidification at lower temperatures, increasing their volume and negatively impacting the stability of the electronically controlled power device structure. Therefore, adding miscible ethylene glycol to the aqueous solution provides better antifreeze properties.
[0061] In addition, the outer casing 20 has an outlet 200 and an inlet 300 on each side of its width for injecting and draining coolant. Both the outlet 200 and inlet 300 are connected to external flow cooling equipment for timely coolant replacement. Furthermore, the outlet 200 and inlet 300 are positioned precisely in the middle of both sides of its width. This structure allows for uniform heat dissipation of the inverter module 30 and achieves a lower flow resistance value; other structural arrangements might result in uneven cooling of the IGBTs, leading to overheating of individual chips and increased flow resistance.
[0062] refer to Figure 7 In one embodiment of this utility model, the water-cooled plate 21 is provided with a heat dissipation structure facing the cooling tank.
[0063] In this embodiment, the inverter module 30 will experience a significant temperature increase when operating at high power. Prolonged operation at high temperatures will drastically shorten the lifespan and degrade the performance of the inverter module 30. Therefore, in practical applications, heat dissipation during inverter module 30 operation must be considered. Specifically, the inverter module 30 and the water-cooled plate 21 can be fixed together by soldering with solder paste, transferring heat to the water-cooled plate 21. Therefore, the heat dissipation structure is positioned on the side of the water-cooled plate 21 facing the cooling tank. Optional heat dissipation structures include finned heat dissipation structures and honeycomb heat dissipation structures. Taking the finned heat dissipation structure as an example, it enables efficient water cooling of the inverter module 30. This method allows the inverter power module to directly contact the coolant, reducing the overall thermal resistance of the module by approximately 30%. Furthermore, the finned structure significantly increases the heat dissipation surface area, thus greatly improving heat dissipation efficiency, and allowing for a higher power density design for the inverter module 30. Specifically, when the electronically controlled power device is operating, the inverter module 30 inside the device performs the function of inverting DC and AC power. This process generates significant losses, which are produced as heat within the inverter module 30. The inverter module 30 is fixed to the side of the water-cooled plate 21 facing away from the outer casing 20 using solder paste and reflow soldering. The other side of the water-cooled plate 21 has multiple sets of needle-fin-shaped heat dissipation structures corresponding to the inverter module 30, which are in direct contact with the coolant. When the heat from the inverter module 30 is transferred to the water-cooled plate 21, the coolant passes through the heat dissipation columns, carrying away the heat and thus cooling the inverter module 30.
[0064] refer to Figure 5 and Figure 6 In one embodiment of the present invention, the water-cooled plate 21 further includes a temperature detection module 70, which is disposed on the water-cooled plate 21 and connected to the drive plate 40.
[0065] The temperature detection module 70 is used to detect the temperature of the inverter module 30 and output a temperature detection signal to the driver board 40.
[0066] In this embodiment, the temperature detection module 70 can be implemented using a detection circuit based on a thermistor, such as a resistor voltage divider circuit based on an NTC resistor or an NTC probe, or a resistor voltage divider circuit based on a PTC resistor or a PTC probe. Optionally, the temperature detection module 70 can also be implemented using a temperature sensor, such as an infrared temperature sensor or a thermocouple temperature sensor. Since the temperature detection module 70 is located on the water-cooled plate 21 and is relatively far from the drive board 40, it needs to have clearance holes for components such as the first insulating bracket 32 to pass through and connect to the drive board 40. Furthermore, multiple sets of temperature detection modules 70 can be provided, each set located at different positions on the water-cooled plate 21. The drive board 40 can determine multiple temperature values based on multiple temperature detection signals and calculate the actual ambient temperature using a preset temperature algorithm, such as average value or weighted calculation, thereby improving the accuracy of detecting the ambient temperature of the inverter module 30. The drive board 40 performs corresponding control actions on the inverter module 30 through the temperature detection signals transmitted by the temperature detection modules 70. For example, when the temperature detection module 70 transmits the detection signal to the drive board 40, the drive board 40 recognizes that the temperature is higher than the preset value and controls the inverter module 30 to reduce the power, thereby reducing the operating temperature and ensuring the safety and stability of the electric power control device.
[0067] refer to Figure 8 In one embodiment of the present invention, the thin-film capacitor input / output component includes: a thin-film capacitor output positive electrode component, a thin-film capacitor output negative electrode component, a thin-film capacitor input positive electrode component, and a thin-film capacitor input negative electrode component.
[0068] The two ends of the positive output component of the thin-film capacitor are connected to the positive input component of the thin-film capacitor and the inverter module 30, respectively; one end of the negative output component of the thin-film capacitor is connected to the negative input component of the thin-film capacitor.
[0069] In this embodiment, the thin-film capacitor 10 is encapsulated in the open receiving slot of the housing 20. To enable the thin-film capacitor 10 to filter and regulate the input DC power supply and to handle the DC power input, a positive output terminal, a negative output terminal, a positive input terminal, and a negative input terminal of the thin-film capacitor are respectively provided on the mounting side of the housing 20. Specifically, one end of the positive output terminal and the negative output terminal of the thin-film capacitor are electrically connected to the input and output terminals of the inverter module 30, respectively. In practical applications, the inverter module 30 often has multiple sub-modules, which can be connected using corresponding components. The positive input terminal and the negative input terminal of the thin-film capacitor are electrically connected to both ends of the thin-film capacitor and the positive and negative output terminals of the thin-film capacitor, respectively. Through the corresponding connections of these components, the DC power input is achieved.
[0070] refer to Figure 4 and Figure 5 In one embodiment of the present invention, the inverter module 30 includes a first insulating bracket 32 and an IGBT chip 31;
[0071] The first insulating bracket 32 is mounted on the outer casing 20 and positioned close to the water-cooling plate 21;
[0072] Multiple IGBT chips 31 are disposed on the first insulating bracket 32. The first insulating bracket 32 is provided with clearance holes corresponding to the positions of each IGBT chip 31 for them to pass through. Each IGBT chip 31 passes through its corresponding clearance hole and is attached to the water-cooled plate 21.
[0073] In this embodiment, the first insulating bracket 32 and the IGBT chip 31 are disposed on the mounting side of the housing 20. The first insulating bracket 32 has a positioning structure corresponding to the IGBT chip 31, allowing the IGBT chip 31 to be mounted and positioned using this structure. Furthermore, the first insulating bracket 32 has multiple sets of clearance holes, each corresponding to one of the IGBT chips 31, to facilitate the IGBT chip 31's contact and fixation with the water-cooling plate 21. Specifically, each set of IGBT chips 31 is connected and fixed by laser welding, and each set of IGBT chips 31 is electrically connected to the driver board 40. Additionally, each set of IGBT chips 31 is connected to the positive output component of the thin-film capacitor, the negative output component 50, and the AC output component 60, respectively, to invert the input DC power into AC power for output. By using a power IGBT composed of multiple sets of IGBT chips 31 connected in parallel, the power density of the electronically controlled power device can be improved, and its reliability and stability enhanced. The first insulating bracket 32 serves two purposes: firstly, to insulate the IGBT chip 31 from the housing 20, and secondly, to position the IGBT chip 31 for welding.
[0074] Optionally, the first insulating bracket 32 can be made of a solid insulating material, such as plastic, high-strength glass, or engineering ceramics. The first insulating bracket 32 is disposed between the IGBT chip 31 and the water-cooling plate 21, and includes multiple sets of corresponding clearance holes to allow the water-cooling plate 21 to be directly fixed to the IGBT chip 31 via reflow soldering using solder paste. Furthermore, the first insulating bracket 32 has multiple sets of corresponding holes and / or positioning pins to position the IGBT chip 31 and the water-cooling plate 21 together and fix them to the housing 20 of the film capacitor 10 using bolts. In practical applications, other holes and / or positioning pins can be provided to facilitate the installation and connection of other related components.
[0075] refer to Figure 4 and Figure 5 In one embodiment of the present invention, the electronically controlled power device based on the stacked structure further includes a negative electrode component 50, which is disposed between the drive board 40 and the inverter module 30, and is connected to the thin film capacitor output negative electrode component 51 and the inverter module 30.
[0076] The negative electrode assembly 50 includes a second insulating bracket 52, a third insulating bracket 53, and a negative electrode component 51. The second insulating bracket 52 and the third insulating bracket 53 are connected to the negative electrode component 51 and are mounted on the mounting side of the housing 20, and are used for insulation of the negative electrode component 51. The negative electrode assembly 50 is used to connect the thin film capacitor output negative electrode component 51 and the inverter module 30.
[0077] In this embodiment, it is understood that the negative electrode assembly 50 is a connection component between the inverter module 30 and the thin-film capacitor output negative electrode component 51, thereby realizing the connection between the inverter module 30 and the thin-film capacitor output negative electrode component 51. The second insulating bracket 52 and the third insulating bracket 53 are both provided with connection components for connecting and fixing to the negative electrode component 51. Specifically, the connection component can be multiple sets of snap-fit pins. The second insulating bracket 52 and the third insulating bracket 53 are connected and fixed to the negative electrode assembly 50 through multiple sets of snap-fit pins, positioning the negative electrode assembly 50 between the inverter module 30 and the drive board 40 and preventing the negative electrode assembly 50 from sliding. Furthermore, the third insulating bracket 53 is provided with multiple sets of clearance holes, allowing the inverter module 30 to be electrically connected to the drive board 40 through these clearance holes; the negative electrode assembly 50 is provided with clearance holes, allowing the temperature detection module 70 to be electrically connected to the drive board 40 through these clearance holes. The negative electrode component 50 is connected to the negative electrode component 51 of the thin film capacitor and the inverter module 30. Under the condition of ensuring that the overall structure of the electronically controlled power device is in vertical optimization, the circuit of the thin film capacitor 10 and the inverter module 30 is constructed.
[0078] refer to Figure 4 and Figure 5 In one embodiment of the present invention, the power control device based on the stacked structure further includes an AC output component 60 and an output component 90. The AC output component 60 is disposed between the drive board 40 and the inverter module 30, and the AC output component 60 is connected to the inverter module 30 and the output component 90.
[0079] The AC output component 60 includes a fourth insulating bracket 62 and an AC output component 61. The fourth insulating bracket 62 is disposed on one side of the output component and is used for fixing and insulating the AC output component 61. The AC output component 60 is used to connect the inverter module 30 and the output component.
[0080] In this embodiment, it is understood that the AC output component 60 is a connecting component between the inverter module 30 and the output component 90, realizing the connection between the inverter module 30 and the output component. The fourth insulating bracket 62 is provided with a connecting component for connecting and fixing to the AC output component 61. Specifically, this connecting component can be multiple sets of pin holes. The fourth insulating bracket 62 is positioned against the housing 20 through these pin holes, positioning the AC output component 60 between the inverter module 30 and the drive board 40, preventing the AC output component 61 from sliding. Furthermore, the AC output component 61 and the corresponding fourth insulating bracket 62 are provided with corresponding positioning pins, and are fixed by hot riveting using riveting posts on the fourth insulating bracket 62. While ensuring the overall structure of the power control device is in vertical optimization, the AC output of the inverter module 30 is achieved.
[0081] Optionally, to realize the modularity of the internal components of the electronically controlled power device, an output component 90 can be used as the final AC power output, and the AC output component 60 can be set as an intermediate component between the inverter module 30 and the output component, which facilitates the transfer connection of the electronically controlled power device. In addition, an output component 90 can be set separately, and a rectifier or the like can be set on the output component.
[0082] refer to Figure 5 In one embodiment of the present invention, the power control device based on the stacked structure further includes a current detection module 80, which is disposed in the drive board 40 and corresponds to the output component. The current detection module 80 is used to detect the current output by the power control device and output a current detection signal.
[0083] In this embodiment, multiple current detection modules 80 are disposed in the drive board 40, and each set of current detection modules 80 corresponds to a set of output components. The current detection modules 80 can be implemented using electromagnetic current transformers, electronic current transformers, etc. Specifically, taking a Hall current detection chip as an example, the current detection module 80 generates a magnetic field of corresponding strength when the alternating current passes through the copper busbar and the current changes. To better enable the Hall current detection chip to detect changes in magnetic field strength, multiple shielding covers are added in this embodiment. The shielding covers are C-shaped and located below each set of output components, with the Hall current detection chip located at the opening. The Hall current detection chip ensures that the magnetic field generated by the alternating current passing through the output components when the current changes is concentrated only at the Hall current detection chip. Furthermore, the shielding covers and output components are combined using a plastic encapsulation method and are provided with a series of pin holes for connection and fixation to the drive board 40 and the housing 20. The vertical height of the shielding covers should be as high as possible above the Hall current detection chip to minimize interference from external stray magnetic fields. The Hall current detection chip detects changes in the magnetic field generated by the output component to determine the specific AC output of the electronically controlled power device, such as the intensity and duration of the AC output. These information can be detected by the Hall current detection chip and transmitted to the driver board 40.
[0084] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. An electrically controlled power device based on a stacked structure, characterized in that, The stacked structure-based electronically controlled power device includes: Thin film capacitor, which is used for filtering and voltage regulation of DC power input; A thin-film capacitor input / output assembly, wherein the thin-film capacitor input / output assembly is electrically connected to the thin-film capacitor; An inverter module, the input terminal of which is electrically connected to the output terminal of a thin-film capacitor, is used to invert the input DC power supply into AC power supply and output it. A driver board, the output end of which is electrically connected to the controlled end of the inverter module and is used to drive the inverter module to work; The housing has a thin-film capacitor disposed inside it. The housing has a mounting side, the inverter module is disposed on the mounting side of the housing, and the drive board is disposed on the side of the inverter module facing away from the housing. The thin-film capacitor, the inverter module, and the drive board are arranged side by side along the thickness direction of the housing.
2. The electronically controlled power device based on a stacked structure as described in claim 1, characterized in that, The housing has a receiving groove with an opening on one side. The thin film capacitor is filled into the receiving groove through the opening. A cooling groove is provided on the side of the receiving groove facing away from the housing. The cooling groove is filled with coolant. The opening is covered with a water-cooling plate. The inverter module is in contact with the water-cooling plate.
3. The electronically controlled power device based on a stacked structure as described in claim 2, characterized in that, The outer casing also has an inlet and an outlet that are respectively connected to the cooling tank, and the inlet and outlet are located on opposite sides of the outer casing.
4. The electronically controlled power device based on a stacked structure as described in claim 2, characterized in that, The water-cooled plate is provided with a heat dissipation structure facing the cooling tank.
5. The electronically controlled power device based on a stacked structure as described in claim 2, characterized in that, The water-cooled plate also includes a temperature detection module, which is disposed on the water-cooled plate and connected to the drive board. The temperature detection module is used to detect the temperature of the inverter module and output a temperature detection signal to the driver board.
6. The electronically controlled power device based on a stacked structure as described in claim 1, characterized in that, The thin-film capacitor input / output assembly includes: a thin-film capacitor output positive electrode component, a thin-film capacitor output negative electrode component, a thin-film capacitor input positive electrode component, and a thin-film capacitor input negative electrode component; The two ends of the positive output terminal of the thin-film capacitor are connected to the positive input terminal of the thin-film capacitor and the inverter module, respectively; one end of the negative output terminal of the thin-film capacitor is connected to the negative input terminal of the thin-film capacitor.
7. The electronically controlled power device based on a stacked structure as described in claim 2, characterized in that, The inverter module includes a first insulating bracket and an IGBT chip; The first insulating bracket is mounted on the housing and positioned close to the water-cooling plate; Multiple IGBT chips are disposed on the first insulating bracket. The first insulating bracket is provided with clearance holes corresponding to the positions of each IGBT chip for them to pass through. Each IGBT chip passes through its corresponding clearance hole and is attached to the water-cooling plate.
8. The electronically controlled power device based on a stacked structure as described in claim 4, characterized in that, The electronically controlled power device based on the stacked structure also includes a negative electrode component, which is disposed between the drive board and the inverter module, and is connected to the thin film capacitor output negative electrode component and the inverter module; The negative electrode assembly includes a second insulating bracket, a third insulating bracket, and a negative electrode component. The second and third insulating brackets are respectively connected to the negative electrode component and fixed on the mounting side of the housing, and are used for insulation of the negative electrode component. The negative electrode assembly is used to connect the output negative electrode component of the thin film capacitor to the inverter module.