Separated power supply type six-layer circuit board

Abstract

The utility model provides a power supply separation type six-layer circuit board which sequentially comprises a first signal layer, a second signal layer, a ground plane layer, a power supply plane layer, a third signal layer and a fourth signal layer from top to bottom, and a honeycomb-shaped ceramic substrate layer is arranged between a core plate of the second signal layer and the ground plane layer. A copper block layer is embedded in the position, corresponding to the high heat conduction area of the power supply plane layer, of the honeycomb-shaped ceramic substrate layer. A plurality of heat dissipation bonding pads are arranged on the lower surface of the fourth signal layer, and blind holes are formed between the power plane layer and the heat dissipation bonding pads; a plurality of ceramic heat conduction rods are arranged between the power supply plane layer and the fourth signal layer in a penetrating manner; the surface of the copper block layer is coated with a nickel layer. And a high heat dissipation function is realized.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a six-layer circuit board with a separate power supply. Background Technology

[0002] In current technologies, the development trend of circuit boards is towards high-density integration and miniaturization, material innovation, green and environmentally friendly manufacturing, intelligent and automated production, multi-functional integration, high-frequency and high-speed transmission requirements, and addressing the development of emerging fields such as 5G, the Internet of Things, and wearable devices. Six-layer circuit boards, as a type of multilayer board with medium to high complexity, exhibit significant advantages in signal integrity, power distribution, and EMI suppression; their structural design is a core aspect of the design phase. The core advantage of discrete power supply circuit boards lies in their independent power plane, which reduces noise interference and is suitable for voltage-domain systems such as industrial control equipment. Current discrete power supply six-layer circuit board structures primarily use the conventional first signal layer, second signal layer, ground plane layer, power plane layer, third signal layer, and fourth signal layer. When applied in high-power, high-density scenarios such as 5G base stations and autonomous driving controllers, significant shortcomings emerge, especially in terms of heat dissipation. Given this situation, improvements are urgently needed. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide a six-layer circuit board with a separate power supply and high heat dissipation function.

[0004] This invention provides a six-layer circuit board with a discrete power supply, comprising, from top to bottom, a first signal layer, a second signal layer, a ground plane layer, a power plane layer, a third signal layer, and a fourth signal layer. A honeycomb ceramic substrate layer is disposed between the core board of the second signal layer and the ground plane layer. A copper block layer is embedded in the honeycomb ceramic substrate layer at a position corresponding to the high thermal conductivity area of ​​the power plane layer. A plurality of heat dissipation pads are disposed on the lower surface of the fourth signal layer, and blind vias are formed between the power plane layer and the heat dissipation pads. A plurality of ceramic heat-conducting rods are disposed through the power plane layer and the fourth signal layer. The surface of the copper block layer is coated with a nickel layer.

[0005] Preferably, the core board of the second signal layer is a PTFE layer.

[0006] Preferably, the core board of the third signal layer is configured as a PTFE layer.

[0007] Preferably, the ceramic heat-conducting rod is an AIN ceramic rod.

[0008] Preferably, the core boards of both the first signal layer and the fourth signal layer are configured as FR-4 core boards; a silicone resin transition layer is provided between the honeycomb ceramic substrate layer and the first signal layer.

[0009] The beneficial effects of this utility model are as follows: by setting a honeycomb ceramic substrate layer, the heat dissipation function of this structure is improved by taking advantage of its thermal conductivity and high temperature resistance. In addition, a copper block layer is embedded in the position corresponding to the high thermal conductivity area of ​​the honeycomb ceramic substrate layer and the power plane layer, which not only improves the heat dissipation function but also enhances the support of the circuit board. The heat dissipation pads, blind holes, ceramic heat-conducting rods and other structures are set to further improve the heat dissipation function of this structure. Attached Figure Description

[0010] Figure 1 This is a cross-sectional view of the present invention.

[0011] The attached figures are labeled as follows: first signal layer 10, second signal layer 11, ground plane layer 13, power plane layer 14, third signal layer 15, fourth signal layer 16, honeycomb ceramic substrate layer 12, heat dissipation pad 17, blind via 18, ceramic heat-conducting rod 20, and copper block layer 19. Detailed Implementation

[0012] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with specific embodiments and accompanying drawings.

[0013] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0014] Please refer to Figure 1 As shown, this utility model provides a six-layer circuit board with a separate power supply, which includes, from top to bottom, a first signal layer 10, a second signal layer 11, a ground plane layer 13, a power plane layer 14, a third signal layer 15, and a fourth signal layer 16. A honeycomb ceramic substrate layer 12 is disposed between the core board of the second signal layer 11 and the ground plane layer 13. A copper block layer 19 is embedded in the honeycomb ceramic substrate layer 12 at the position corresponding to the high thermal conductivity area of ​​the power plane layer 14. A plurality of heat dissipation pads 17 are disposed on the lower surface of the fourth signal layer 16. A blind via 18 is opened between the power plane layer 14 and the heat dissipation pads 17. A plurality of ceramic heat-conducting rods 20 are disposed through the power plane layer 14 and the fourth signal layer 16. The surface of the copper block layer 19 is coated with a nickel layer.

[0015] During fabrication, first prepare the honeycomb ceramic substrate, copper block, and ceramic heat-conducting rod, then laminate them according to the following stacking order:

[0016] First signal layer 10 - PP - Second signal layer 11 - Honeycomb ceramic substrate layer 12 - Ground plane layer 13 - PP - Power plane layer 14 - Third signal layer 15 - PP - Fourth signal layer 16. Subsequent post-processing includes laser drilling, fixing of the ceramic heat-conducting rod 20, and surface treatment.

[0017] In this embodiment, the core plate of the second signal layer 11 is a PTFE layer, the core plate of the third signal layer 15 is a PTFE layer, the ceramic heat-conducting rod 20 is an AlN ceramic rod, and the core plates of the first signal layer 10 and the fourth signal layer 16 are both FR-4 core plates; a silicone resin transition layer is provided between the honeycomb ceramic substrate layer 12 and the first signal layer 10. By providing the silicone resin transition layer, stress during lamination is buffered, delamination that may occur due to differences in thermal expansion coefficients during production is reduced, production difficulty is reduced, and production quality and efficiency are improved.

[0018] This embodiment features a honeycomb ceramic substrate layer, leveraging its superior thermal conductivity and high-temperature resistance to enhance heat dissipation. Furthermore, copper blocks are embedded in the high thermal conductivity areas of the honeycomb ceramic substrate layer and the power plane layer, improving both heat dissipation and the board's structural support. The inclusion of heat dissipation pads, blind vias, and ceramic heat-conducting rods further enhances the structure's heat dissipation capabilities. This embodiment is suitable for high-power, high-density applications such as 5G base stations and autonomous driving controllers.

[0019] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A six-layer circuit board with discrete power supply, comprising, from top to bottom, a first signal layer (10), a second signal layer (11), a ground plane layer (13), a power plane layer (14), a third signal layer (15), and a fourth signal layer (16), characterized in that: A honeycomb ceramic substrate layer (12) is provided between the core board of the second signal layer (11) and the ground plane layer (13). A copper block layer (19) is embedded in the honeycomb ceramic substrate layer (12) at the position corresponding to the high thermal conductivity area of ​​the power plane layer (14). A plurality of heat dissipation pads (17) are provided on the lower surface of the fourth signal layer (16). A blind hole (18) is opened between the power plane layer (14) and the heat dissipation pads (17). A plurality of ceramic heat-conducting rods (20) are provided through the power plane layer (14) and the fourth signal layer (16). The surface of the copper block layer (19) is coated with a nickel layer.

2. The six-layer circuit board with discrete power supply according to claim 1, characterized in that: The core board of the second signal layer (11) is set as a PTFE layer.

3. A six-layer circuit board with a separate power supply according to claim 1, characterized in that: The core board of the third signal layer (15) is configured as a PTFE layer.

4. A six-layer circuit board with a separate power supply according to claim 1, characterized in that: The ceramic heat-conducting rod (20) is configured as an AIN ceramic rod.

5. A six-layer circuit board with discrete power supply according to claim 1, characterized in that: The core boards of the first signal layer (10) and the fourth signal layer (16) are both set as FR-4 core boards; a silicone resin transition layer is provided between the honeycomb ceramic substrate layer (12) and the first signal layer (10).

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