Heat dissipation structure of liquid crystal display module

Abstract

The utility model provides a heat dissipation structure of a liquid crystal display module, which comprises a fixed frame, a mounting frame is fixedly mounted in the fixed frame, a backlight plate is mounted on the upper surface of the mounting frame, a display screen is fixedly mounted on the upper surface of the backlight plate, and a heat dissipation mechanism is arranged in the fixed frame. And a cleaning mechanism is arranged outside the heat dissipation mechanism, a bottom plate is arranged at the bottom of the fixing frame, and a connecting mechanism is arranged between the bottom plate and the fixing frame. Through the use of the cleaning mechanism, the U-shaped cleaning strip is connected with the heat dissipation fins in a clamping manner, so that dust on the surfaces of the heat dissipation fins can be easily cleaned. A user only needs to push the push block to drive the moving piece and the U-shaped cleaning strip on the moving piece to slide along the sliding groove, so that dust among the heat dissipation fins is effectively removed, smooth transfer of heat is ensured, efficient operation of a heat dissipation system is maintained, the heat dissipation efficiency is improved, and the cleaning process is greatly simplified.

Description

Technical Field

[0001] This utility model relates to the field of liquid crystal display modules, and more specifically, to a heat dissipation structure for a liquid crystal display module. Background Technology

[0002] A liquid crystal display (LCD) module is the core component of liquid crystal display technology. It is assembled from a complex system of components including liquid crystal display devices, connectors, peripheral control and driving circuits, printed circuit boards (PCBs), backlights, structural components, and polarizers. The working principle of an LCD module is based on the physical properties of liquid crystal molecules. When a voltage is applied to the electrodes, the liquid crystal molecules change, thereby altering the light transmittance of the liquid crystal and achieving the display effect.

[0003] The prior art disclosed in patent publication (announcement) number CN222322073U is a heat dissipation structure for a liquid crystal display module, including a liquid crystal display screen. A back cover is provided on the back of the liquid crystal display screen. A heat dissipation groove is formed on the upper end of the surface of the back cover. A cooling box is installed on the lower end of the surface of the back cover. Cooling fans are installed on both the left and right sides of the surface of the cooling box. A semiconductor cooling chip is installed on the back of the cooling box. A heat exchange plate is provided on the inner side of the cooling box. A filter screen is provided on the inner side of the cooling box at the edge of the heat exchange plate.

[0004] The aforementioned patent document discloses a heat dissipation structure for a liquid crystal display module, which can solve the problems of poor heat dissipation and susceptibility to environmental influences in the prior art. However, the water-cooling structure in the patent has many components, which not only increases the processing difficulty but also increases the overall cost. Its shortcomings are:

[0005] In the liquid crystal display module heat dissipation structure disclosed in the above patent documents, although the combination of water cooling and heat dissipation fan effectively improves the heat dissipation performance, after long-term use, dust easily accumulates on the surface of the heat exchange plate. This dust will hinder the effective transfer of heat and thus affect the efficiency of the entire heat dissipation system.

[0006] Furthermore, while the device achieves good heat dissipation, its complex structure also brings inconvenience in disassembly and maintenance. The high degree of integration of components such as the semiconductor cooling chip, cooling fan, and heat exchanger makes it difficult to disassemble when internal maintenance or replacement of parts is required, often requiring a lot of time and effort.

[0007] Therefore, we have made improvements and proposed a heat dissipation structure for liquid crystal display modules. Utility Model Content

[0008] To address the shortcomings of existing technologies, this utility model provides a heat dissipation structure for a liquid crystal display module, solving the problems mentioned in the background art.

[0009] To achieve the above-mentioned objectives, this utility model provides the following technical solution:

[0010] A heat dissipation structure for the liquid crystal display module is proposed to solve the above problems.

[0011] The application is as follows:

[0012] The device includes a fixed frame, an installation frame is fixedly installed inside the fixed frame, a backlight panel is installed on the upper surface of the installation frame, and a display screen is fixedly installed on the upper surface of the backlight panel. A heat dissipation mechanism is provided inside the fixed frame, and a cleaning mechanism is provided outside the heat dissipation mechanism. A base plate is provided at the bottom of the fixed frame, and a connecting mechanism is provided between the base plate and the fixed frame.

[0013] The heat dissipation mechanism includes a heat-conducting plate, which is disposed on the lower surface of the mounting frame. Thermally conductive silicone is disposed inside the mounting frame and between the backlight panel and the heat-conducting plate. Several heat dissipation fins are fixedly installed on the lower surface of the heat-conducting plate.

[0014] As a preferred technical solution of this application, a fixing rod is fixedly installed on the lower surface of the four corners of the mounting frame, and a first mounting hole is opened on the four corner surfaces of the heat-conducting plate, and the first mounting hole is slidably connected to the fixing rod.

[0015] As a preferred technical solution of this application, mounting grooves are provided on both sides of the bottom end of the fixed frame, and a cooling fan is fixedly installed inside the mounting groove.

[0016] As a preferred technical solution of this application, the cleaning mechanism includes a movable part, and a plurality of U-shaped cleaning strips are fixedly installed on the surface of the movable part, and the U-shaped cleaning strips are connected to the heat dissipation fins by a snap-fit ​​connection.

[0017] As a preferred technical solution of this application, a connecting block is fixedly installed on one side surface of the movable component, and a push block is fixedly installed on the other side surface of the connecting block. A sliding groove is opened on one side surface of the fixed frame, and the connection between the connecting block and the sliding groove is a sliding connection.

[0018] As a preferred technical solution of this application, the connecting mechanism includes a fixed cylinder, which is fixedly installed on the upper surface of the four corners of the base plate and is connected to the base plate. The connection between the fixed cylinder and the fixed rod is a sliding connection, and the fixed rod is internally threaded with screws, which will block and tighten the base plate.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] In the scheme of this application:

[0021] 1. The cleaning mechanism, with its U-shaped cleaning strip engaging with the heatsink fins, easily removes dust from the fin surface. Users simply push the pusher to move the moving part and its U-shaped cleaning strip along the groove, effectively removing dust from between the heatsink fins, ensuring smooth heat transfer, and maintaining the efficient operation of the cooling system. This not only improves heat dissipation efficiency but also greatly simplifies the cleaning process.

[0022] 2. The sliding connection design between the fixed cylinder and the fixed rod, achieved through the use of a connecting mechanism, not only ensures the flexibility and precision of the heat dissipation module during installation but also enables the entire structure to maintain good stability under external forces. Furthermore, the threaded connection of the screws inside the fixed rod further enhances the tightness between the heat dissipation structure and the base plate, effectively preventing loosening due to vibration or long-term use. This connecting mechanism makes maintenance or disassembly exceptionally simple, significantly saving time and reducing maintenance costs. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the upper part of this utility model;

[0024] Figure 2 This is a three-dimensional structural diagram of the bottom of this utility model;

[0025] Figure 3 This is a frontal cross-sectional view of the present invention.

[0026] Figure 4 This utility model Figure 3 Enlarged structural diagram of section A in the middle;

[0027] Figure 5 This is a three-dimensional schematic diagram of the cleaning mechanism of this utility model;

[0028] Figure 6 This is a schematic diagram of the structure of the movable component and the U-shaped cleaning strip of this utility model.

[0029] The image shows:

[0030] 1. Fixing frame; 2. Mounting frame; 3. Backlight panel; 4. Display screen; 5. Heat dissipation mechanism; 501. Heat-conducting plate; 502. Thermal conductive silicone; 503. Heat dissipation fins; 504. Fixing rod; 505. First mounting hole; 506. Mounting groove; 507. Cooling fan; 6. Cleaning mechanism; 601. Moving part; 602. U-shaped cleaning strip; 603. Connecting block; 604. Push block; 605. Slide groove; 7. Base plate; 8. Connecting mechanism; 801. Fixing cylinder; 802. Screw. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described examples are only some embodiments of this utility model, and not all embodiments.

[0032] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0033] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] In the description of this utility model, it should be noted that the terms "upper" and "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first" and "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] To address the technical problems mentioned in the background section, the following heat dissipation structure for a liquid crystal display module is provided:

[0037] Combination Figure 1 - Figure 6As shown, the present invention provides a heat dissipation structure for a liquid crystal display module, including a fixed frame 1, an mounting frame 2 fixedly installed inside the fixed frame 1, a backlight plate 3 mounted on the upper surface of the mounting frame 2, and a display screen 4 fixedly installed on the upper surface of the backlight plate 3. A heat dissipation mechanism 5 is provided inside the fixed frame 1, and a cleaning mechanism 6 is provided outside the heat dissipation mechanism 5. A base plate 7 is provided at the bottom of the fixed frame 1, and a connecting mechanism 8 is provided between the base plate 7 and the fixed frame 1. The heat dissipation mechanism 5 includes a heat-conducting plate 501, which is disposed on the lower surface of the mounting frame 2. Thermally conductive silicone 502 is disposed inside the mounting frame 2 and between the backlight plate 3 and the heat-conducting plate 501. A plurality of heat dissipation fins 503 are fixedly installed on the lower surface of the heat-conducting plate 501.

[0038] In this embodiment: a mounting frame 2 is fixedly installed inside the fixed frame 1, and a backlight panel 3 is supported on the top of the mounting frame 2. The display screen 4 is tightly fixed on the backlight panel 3. In order to effectively manage the heat generated by the display screen 4 and the backlight panel 3, a heat dissipation mechanism 5 is provided inside the fixed frame 1. The heat dissipation mechanism 5 includes a heat-conducting plate 501, which is in close contact with the lower surface of the mounting frame 2. The two are connected by thermally conductive silicone 502 to achieve efficient heat conduction. The thermally conductive silicone 502 is evenly filled between the backlight panel 3 and the heat-conducting plate 501 to ensure that the heat can be quickly absorbed and transferred. Several heat dissipation fins 503 are densely distributed on the lower side of the heat-conducting plate 501. These fins greatly increase the heat dissipation area, thereby improving the heat dissipation efficiency. In addition, in order to keep the heat dissipation fins 503 clean to ensure continuous and efficient heat dissipation, a cleaning mechanism 6 is provided on the outside of the heat dissipation mechanism 5. The bottom of the fixed frame 1 and the base plate 7 are connected by a connecting mechanism 8.

[0039] refer to Figure 3 - Figure 5 Based on the above embodiments, in order to facilitate the installation of the heat-conducting plate 501, this embodiment provides the following design:

[0040] In a preferred embodiment, fixing rods 504 are fixedly installed on the lower surfaces of the four corners of the mounting frame 2, and first mounting holes 505 are opened on the four corner surfaces of the heat conduction plate 501, and the first mounting holes 505 are slidably connected to the fixing rods 504.

[0041] In this embodiment: by fixing the fixing rods 504 at the lower surface of the four corners of the mounting frame 2, correspondingly, the four corner surfaces of the heat-conducting plate 501 are provided with first mounting holes 505. The first mounting holes 505 and the fixing rods 504 are slidably connected, so that the heat-conducting plate 501 can be easily and accurately aligned and installed on the mounting frame 2, which greatly improves the flexibility and efficiency of the installation process.

[0042] refer to Figure 1 - Figure 5Based on the above embodiments, in order to improve the heat dissipation effect, this embodiment provides the following design:

[0043] In a preferred embodiment, mounting grooves 506 are provided on both sides of the bottom end of the fixed frame 1, and a cooling fan 507 is fixedly installed inside the mounting grooves 506.

[0044] In this embodiment, mounting slots 506 are provided on both sides of the bottom end of the fixed frame 1, and cooling fans 507 are installed inside these mounting slots 506. The cooling fans 507 can dissipate the heat absorbed by the heat conduction plate 501 and the heat dissipation fins 503 into the fixed frame 1, thereby significantly improving the heat dissipation rate. The operation of the cooling fans 507 will effectively accelerate the airflow and remove the heat accumulated on the heat dissipation fins 503, ensuring that the liquid crystal display module can maintain a stable operating state even in high temperature environments.

[0045] refer to Figure 3 - Figure 6 Based on the above embodiments, in order to facilitate the cleaning of the heat sink fins 503, this embodiment provides the following design:

[0046] In a preferred embodiment, the cleaning mechanism 6 includes a movable part 601, and a plurality of U-shaped cleaning strips 602 are fixedly installed on the surface of the movable part 601, and the U-shaped cleaning strips 602 are connected to the heat dissipation fins 503 by a snap-fit ​​connection.

[0047] In this embodiment, several U-shaped cleaning strips 602 are fixedly installed on the surface of the movable component 601. These U-shaped cleaning strips 602 are connected to the heat sink fins 503 by a snap-fit ​​connection, so that they can fit tightly against the surface of the heat sink fins 503. By simply moving the movable component 601, the U-shaped cleaning strips 602 can slide along the surface of the heat sink fins 503, effectively cleaning away the attached impurities, ensuring the cleanliness of the heat dissipation structure and the continuous performance of heat dissipation.

[0048] refer to Figure 5 and Figure 6 Based on the above embodiments, in order to facilitate the movement of the movable component 601, this embodiment provides the following design:

[0049] In a preferred embodiment, a connecting block 603 is fixedly installed on one side surface of the movable member 601, and a push block 604 is fixedly installed on the other side surface of the connecting block 603. A sliding groove 605 is provided on one side surface of the fixed frame 1, and the connection between the connecting block 603 and the sliding groove 605 is a sliding connection.

[0050] In this embodiment, a connecting block 603 is fixedly installed on one side surface of the movable component 601, and a push block 604 is fixedly installed on the other side surface of the connecting block 603. When the movable component 601 needs to be moved to clean the heat dissipation fins 503, the push block 604 can be gently pushed, and the connecting block 603 can slide smoothly in the slide groove 605, easily driving the movable component 601 and its U-shaped cleaning strip 602 to move along the surface of the heat dissipation fins 503 to clean the dust on the surface of the heat dissipation fins 503, making the operation more convenient.

[0051] refer to Figure 2 - Figure 6 Based on the above embodiments, in order to facilitate the installation and disassembly of the base plate 7, this embodiment provides the following design:

[0052] In a preferred embodiment, the connecting mechanism 8 includes a fixed cylinder 801, which is fixedly installed on the upper surface of the four corners of the base plate 7. The fixed cylinder 801 is connected to the base plate 7. The connection between the fixed cylinder 801 and the fixed rod 504 is a sliding connection. The fixed rod 504 is internally threaded with a screw 802, which will block and tighten the base plate 7.

[0053] In this embodiment: the fixing cylinder 801 is installed on the upper surface of the four corners of the base plate 7 and is connected to the inside of the base plate 7. The fixing cylinder 801 and the fixing rod 504 adopt a sliding connection. During installation, it is convenient to limit the position of the base plate 7. At the same time, the fixing cylinder 801 can squeeze the heat-conducting plate 501 to improve the stability of the connection. The fixing rod 504 is designed with threads inside, which can be threaded to the screw 802. When the screw 802 is screwed into the fixing rod 504, the head of the screw 802 will tightly abut against the lower surface of the base plate 7, thereby blocking and fastening it, and also facilitating disassembly.

[0054] The above is the entire working process of the device, and all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0055] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, the present utility model is not limited to the specific embodiments described above. Therefore, any modifications or equivalent substitutions to the present utility model, and all technical solutions and improvements that do not depart from the spirit and scope of the utility model, are covered within the scope of the claims of the present utility model.

Claims

1. A heat dissipation structure for a liquid crystal display module, comprising a fixing frame (1), characterized in that: The fixed frame (1) is fixedly installed with a mounting frame (2), and a backlight panel (3) is installed on the upper surface of the mounting frame (2), and a display screen (4) is fixedly installed on the upper surface of the backlight panel (3). The fixed frame (1) is provided with a heat dissipation mechanism (5), and a cleaning mechanism (6) is provided on the outside of the heat dissipation mechanism (5). The bottom of the fixed frame (1) is provided with a base plate (7), and a connecting mechanism (8) is provided between the base plate (7) and the fixed frame (1). The heat dissipation mechanism (5) includes a heat-conducting plate (501), and the heat-conducting plate (501) is disposed on the lower surface of the mounting frame (2). The interior of the mounting frame (2) is provided with thermally conductive silicone (502), and the thermally conductive silicone (502) is disposed between the backlight plate (3) and the heat-conducting plate (501). A number of heat dissipation fins (503) are fixedly installed on the lower surface of the heat-conducting plate (501).

2. The heat dissipation structure for a liquid crystal display module according to claim 1, characterized in that: Fixing rods (504) are fixedly installed on the lower surface of the four corners of the mounting frame (2). The four corner surfaces of the heat-conducting plate (501) are provided with first mounting holes (505), and the first mounting holes (505) are slidably connected to the fixing rods (504).

3. The heat dissipation structure for a liquid crystal display module according to claim 1, characterized in that: The bottom two sides of the fixed frame (1) are provided with mounting grooves (506), and a cooling fan (507) is fixedly installed inside the mounting groove (506).

4. The heat dissipation structure for a liquid crystal display module according to claim 1, characterized in that: The cleaning mechanism (6) includes a movable part (601), and a number of U-shaped cleaning strips (602) are fixedly installed on the surface of the movable part (601), and the U-shaped cleaning strips (602) are connected to the heat dissipation fins (503) by a snap-fit ​​connection.

5. The heat dissipation structure for a liquid crystal display module according to claim 4, characterized in that: A connecting block (603) is fixedly installed on one side surface of the movable part (601), and a push block (604) is fixedly installed on the other side surface of the connecting block (603). A sliding groove (605) is provided on one side surface of the fixed frame (1), and the connection between the connecting block (603) and the sliding groove (605) is a sliding connection.

6. The heat dissipation structure for a liquid crystal display module according to claim 1, characterized in that: The connecting mechanism (8) includes a fixed cylinder (801), which is fixedly installed on the upper surface of the four corners of the base plate (7). The fixed cylinder (801) is connected to the base plate (7). The connection between the fixed cylinder (801) and the fixed rod (504) is a sliding connection. The fixed rod (504) has a screw (802) connected to its internal thread, and the screw (802) will block and tighten the base plate (7).

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