High-speed high-precision intelligent chip mounter

Abstract

The utility model discloses a high-speed high-precision intelligent chip mounter, which comprises a working platform, and a conveying line assembly for conveying a substrate along the X direction is arranged in the middle of the working platform; automatic feeding, adjusting and pasting devices are symmetrically arranged on the two sides of the working platform, and elements are pasted on the base plates on the conveying line assembly from the two sides through the automatic feeding, adjusting and pasting devices; the single-side automatic feeding, adjusting and pasting device comprises a material box feeding mechanism, a first transfer table, a material taking and transferring mechanism, a second transfer table and a pasting mechanism, an external sheet taking mechanism transfers elements to the first transfer table from the material box feeding mechanism, the first transfer table conducts fine adjustment in the horizontal plane, the material taking and transferring mechanism transfers the elements to the second transfer table from the first transfer table, and the pasting mechanism conducts pasting on the elements. A plurality of elements are orderly arranged on the double-station transfer table II, and the surface mounting mechanism transfers and attaches the plurality of elements on the transfer table II to the substrate, so that the elements are accurately and efficiently attached to the substrate at a high speed, and the surface mounting device is particularly suitable for attaching the elements with multiple specifications and shapes.

Description

Technical Field

[0001] This utility model relates to the field of chip placement equipment technology, and in particular to a high-speed, high-precision intelligent chip placement machine. Background Technology

[0002] With the rapid development of electronic technology, especially the surge in demand for high-performance circuit boards in emerging fields such as artificial intelligence, 5G, autonomous driving, AR / VR, high-performance computing (HPC), and the Internet of Things, traditional surface mount technology (SMT) is no longer able to meet the efficiency and precision requirements of modern production.

[0003] While existing pick-and-place machines have achieved automation to some extent, there is still room for improvement in terms of bonding accuracy, production efficiency, and equipment stability during high-speed operation.

[0004] Therefore, it is particularly important to develop a fully automatic high-speed pick and place machine that can maintain high bonding accuracy during high-speed operation and has multiple placement modes to accommodate components of various sizes and shapes. Utility Model Content

[0005] To address the aforementioned issues, this invention provides a high-speed, high-precision intelligent chip mounter with a reasonable structure, enabling precise, efficient, and high-speed mounting of components onto a substrate, particularly suitable for mounting components of various specifications and shapes.

[0006] The technical solution adopted in this utility model is as follows:

[0007] A high-speed, high-precision intelligent chip mounter includes a working platform. A conveyor line assembly is arranged through the middle of the working platform along the X direction, and the conveyor line assembly conveys a substrate along the X direction. Automatic feeding and adjusting mounting devices are symmetrically arranged on the working platform on both sides of the conveyor line assembly, and the automatic feeding and adjusting mounting devices mount components onto the substrate on the conveyor line assembly from both sides.

[0008] The structure of the single-sided automatic feeding and adjustment mounting device includes a material box feeding mechanism, a transfer station 1, a material picking and transfer mechanism, a transfer station 2, and a mounting mechanism. The external material picking mechanism transfers components from the material box feeding mechanism to the transfer station 1, where the transfer station 1 performs fine adjustments in the horizontal plane. The material picking and transfer mechanism then transfers the components from the transfer station 1 to the transfer station 2. Multiple components are arranged in an orderly manner on the dual-station transfer station 2, and the mounting mechanism transfers and mounts the multiple components on the transfer station 2 onto the substrate.

[0009] As a further improvement to the above technical solution:

[0010] The conveyor assembly has a base plate platform in the middle, which is mounted on a lifting mechanism. The lifting mechanism lifts the base plate located on the conveyor assembly upwards via the base plate platform.

[0011] The feeding mechanism of the material box includes a feeding platform installed on the lifting mechanism. Multiple material pieces are stacked on the top surface of the feeding platform. An external material picking mechanism transfers the material pieces to the transfer platform in an orderly manner.

[0012] The transfer station is mounted on the working platform via X-axis moving module 1 and Y-axis moving module 1. The transfer station 1 rotates in the horizontal plane around its own axis as the center via a rotary motor, and the components are supported on the top surface of the transfer station 1.

[0013] Multiple components are attached to the cutting film and supported on a transfer platform; the transfer platform is equipped with clamping devices that flatten and fix the circumferential edges of the cutting film.

[0014] It also includes a vision component 1 installed on one side of the turntable facing outward. The vision component 1 performs image acquisition and judgment on the elements on the turntable 1, driving the turntable 1 to adjust the elements in the horizontal plane.

[0015] The material handling and transfer mechanism is located above the space between the first transfer platform and the second transfer platform. The material handling and transfer mechanism is a turret structure. Multiple suction nozzles are installed circumferentially on the bottom surface of the material handling and transfer mechanism. As the turret structure rotates, each suction nozzle picks up the components from the first transfer platform in turn and arranges them in an orderly manner on the second transfer platform according to a preset number.

[0016] The transfer station is mounted on the working platform via an X-axis moving module 3, and the transfer station rotates in the horizontal plane around its own axis via a rotary motor.

[0017] The placement mechanism is installed on the working platform via the X-axis moving module 2 and the Y-axis moving module 2, forming a gantry structure mounted above the transfer station 2. Each placement mechanism includes multiple placement units arranged along the length of the X-axis moving module 2. The multiple placement units are independently driven by corresponding driving units, and the multiple placement units jointly pick up components from the transfer station 2 and attach them to the substrate.

[0018] A vision component three facing upwards is installed on the working platform located between the transfer station two and the conveyor assembly, and a vision component two facing downwards is installed on the outside of the placement mechanism; after the placement unit picks up the component, it undergoes pre-placement inspection by the vision component three, and the vision component two performs post-placement inspection on the component on the substrate.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] This invention utilizes the symmetrical arrangement of automatic feeding and placement devices on both sides of the working platform to form a symmetrical feeding mode, effectively improving the placement speed. Through the arrangement and coordinated use of transfer station one, transfer station two, and material handling and transfer mechanism, precise positioning of components can be achieved, and multiple components can be simultaneously and independently placed by the placement mechanism. This enables precise, efficient, and high-speed placement of components onto the substrate, making it particularly suitable for the placement of components of various specifications and shapes. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of this utility model.

[0022] Figure 2 This is a schematic diagram showing the arrangement of the material box feeding mechanism of this utility model on the lifting mechanism.

[0023] Figure 3 This is a schematic diagram of the layout of the transfer station of this utility model.

[0024] Figure 4 This is a schematic diagram showing the layout of the material handling and transfer mechanisms above the transfer platform 1 and transfer platform 2 of this utility model.

[0025] Figure 5 This is a schematic diagram of the layout of the patch mechanism of this utility model.

[0026] Figure 6 This is a schematic diagram showing the layout of the substrate platform at the conveyor line assembly of this utility model.

[0027] The components include: 1. Working platform; 2. Material box loading mechanism; 3. Transfer station one; 4. Material handling and transfer mechanism; 5. Patch assembly mechanism; 6. Transfer station two; 7. Substrate platform;

[0028] 21. Lifting mechanism;

[0029] 31. Y-axis motion module one; 32. Vision component one; 33. X-axis motion module one;

[0030] 51. Y-axis motion module two; 52. X-axis motion module two; 53. Vision component two; 54. Vision component three;

[0031] 61. X-axis movement module three;

[0032] 71. Conveyor line assembly. Detailed Implementation

[0033] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0034] like Figure 1As shown, the high-speed, high-precision intelligent chip mounter of this embodiment includes a working platform 1. A conveyor line assembly 71 is arranged through the middle of the working platform 1 along the X direction. The conveyor line assembly 71 conveys the substrate along the X direction. Automatic feeding and adjustment mounting devices are symmetrically arranged on the working platform 1 on both sides of the conveyor line assembly 71. The automatic feeding and adjustment mounting devices mount the components onto the substrate on the conveyor line assembly 71 from both sides.

[0035] The structure of the single-sided automatic feeding and adjustment mounting device includes a material box feeding mechanism 2, a transfer platform 1 3, a material picking and transfer mechanism 4, a transfer platform 2 6, and a mounting mechanism 5. The external material picking mechanism transfers components from the material box feeding mechanism 2 to the transfer platform 1 3, where the transfer platform 1 3 performs fine adjustments in the horizontal plane. The material picking and transfer mechanism 4 transfers components from the transfer platform 1 3 to the transfer platform 2 6. Multiple components are arranged in an orderly manner on the dual-station transfer platform 2 6, and the mounting mechanism 5 transfers and mounts multiple components from the transfer platform 2 6 onto the substrate.

[0036] In this embodiment, the symmetrical arrangement of the automatic feeding and placement devices on both sides of the working platform 1 forms a symmetrical feeding mode, which effectively improves the placement speed. Through the arrangement and coordinated use of the transfer station 1 3, the transfer station 2 6 and the material handling and transfer mechanism 4, the precise position adjustment of the components can be achieved, and the placement mechanism 5 can simultaneously and independently attach multiple components, thereby achieving precise, efficient and high-speed bonding of components to the substrate.

[0037] like Figure 2 As shown, the material box feeding mechanism 2 includes a feeding platform installed on the lifting mechanism 21. Multiple material pieces are stacked on the top surface of the feeding platform. The external material picking mechanism transfers the material pieces to the transfer platform 3 in an orderly manner.

[0038] In this embodiment, the external component-grabbing mechanism can be a robotic arm, robot, truss, or other gripping mechanism, as long as it can achieve component transfer.

[0039] In this embodiment, multiple components can be attached to a single sheet. The components are transferred from the material box loading mechanism 2 to the transfer station 3 in units of the sheet.

[0040] like Figure 3 As shown, the transfer platform 3 is installed on the working platform 1 via the X-axis moving module 33 and the Y-axis moving module 31. The transfer platform 3 rotates in the horizontal plane with its own axis as the center via a rotary motor, and the components are supported on the top surface of the transfer platform 3.

[0041] In this embodiment, the transfer platform 3 can rotate circumferentially via the action of a rotary motor, move in the X direction via the action of an X-axis moving module 33, and move in the Y direction via the action of a Y-axis moving module 31, thereby realizing the movement and adjustment of the components on it in the horizontal plane, especially the circumferential adjustment.

[0042] Multiple components are attached to the cutting film to form a sheet, which is supported on the transfer table 3 by the cutting film; the transfer table 3 is equipped with clamping devices that flatten and fix the circumferential edge of the cutting film.

[0043] In this embodiment, the cutting film of the material sheet is flattened and clamped by the clamping device on the transfer table 3, thereby effectively ensuring the accuracy of the adjustment of each component in the horizontal plane and the accuracy of the material picking and transfer mechanism 4 when picking up each component.

[0044] In this embodiment, the clamping element can adopt an existing conventional structure, such as a clamping element arranged circumferentially.

[0045] It also includes a vision component 32 installed on the outside of the turntable 3. The vision component 32 captures and judges the image of the component on the turntable 3, and drives the turntable 3 to adjust the component in the horizontal plane, effectively ensuring the angle of the component in the horizontal plane.

[0046] like Figure 4 As shown, the material handling and transfer mechanism 4 is located above the space between the transfer platform 3 and the transfer platform 6. The material handling and transfer mechanism 4 is a turret structure. Multiple suction nozzles are installed on the bottom surface of the material handling and transfer mechanism 4 in the circumferential direction. As the turret structure rotates, each suction nozzle picks up the components from the transfer platform 3 in turn and arranges them in an orderly manner on the transfer platform 6 according to a preset number.

[0047] In this embodiment, the material handling mechanism 4 picks up each component sequentially from the transfer platform 3 and arranges them in an orderly manner on the transfer platform 6. For example, the components are arranged in a predetermined number along the X direction on the transfer platform 6 to facilitate the picking and attaching by the patching mechanism 5.

[0048] The transfer platform 26 is installed on the work platform 1 via the X-axis moving module 3 61. The transfer platform 26 rotates in the horizontal plane with its own axis as the center via a rotary motor.

[0049] In this embodiment, the transfer platform 2 6 can move in the X direction via the action of the X-direction moving module 3 61, so as to facilitate the arrangement of multiple components in the X direction on the transfer platform 2 6 in conjunction with the rotation of the material handling and transfer mechanism 4.

[0050] In this embodiment, the second transfer station 6 can rotate and switch between two workstations via the action of a rotary motor, corresponding to the first transfer station 3 on both sides and the conveyor assembly 71.

[0051] like Figure 5As shown, the placement mechanism 5 is mounted on the work platform 1 via the X-axis moving module 2 52 and the Y-axis moving module 2 51, forming a gantry structure mounted above the transfer station 2 6. Each placement mechanism 5 includes multiple placement units arranged along the length of the X-axis moving module 2 52. The multiple placement units are independently driven by corresponding drive units, and the multiple placement units jointly pick up components from the transfer station 2 6 and attach them to the substrate.

[0052] In this embodiment, a single patch unit may include lifting power, circumferential rotation power, and an adsorption component located below, so that after the single patch unit adsorbs the component from the transfer stage 2 6, it can independently attach the component to a preset position on the substrate.

[0053] In this embodiment, each mounting unit can operate independently, which is convenient and meets the needs of mounting small batches and various types of components on the substrate.

[0054] A vision component 3 54 facing upwards is installed on the work platform 1 located between the transfer station 2 6 and the conveyor assembly 71, and a vision component 2 53 facing downwards is installed on the outside of the placement mechanism 5; after the placement unit picks up the component, it is inspected by the vision component 3 54 before placement, and the vision component 2 53 inspects the component on the substrate after placement, thereby effectively ensuring the placement accuracy and precision of the component on the substrate.

[0055] like Figure 6 As shown, a substrate platform 7 is provided in the middle of the conveyor assembly 71. The substrate platform 7 is mounted on the lifting mechanism. The action of the lifting mechanism lifts the substrate located in the conveyor assembly 71 upward through the substrate platform 7.

[0056] In practical use, the substrate is transported in the X direction via the conveyor assembly 71. When the substrate reaches the substrate platform 7, the lifting mechanism lifts the substrate upwards via the substrate platform 7, which facilitates the component attachment by the two side mounting mechanisms 5.

[0057] In this embodiment, the principle of simultaneous multi-head pickup and simultaneous patch placement, high-definition camera, and precise motion control is adopted, and its theoretical accuracy can reach ±5um@3σ and UPH can reach 45K.

[0058] This invention enables precise, efficient, and high-speed bonding of components onto a substrate, and is particularly suitable for bonding components of various specifications and shapes.

[0059] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0060] The above description is an explanation of the present utility model and not a limitation thereof. The scope of the present utility model is defined by the claims. Within the protection scope of the present utility model, any form of modification may be made.

Claims

1. A high-speed, high-precision intelligent chip mounter, comprising a working platform (1), characterized in that: The work platform (1) is provided with a conveyor line assembly (71) running through the X direction in the middle, and the conveyor line assembly (71) conveys the substrate along the X direction; automatic feeding adjustment and attaching devices are symmetrically arranged on the work platform (1) on both sides of the conveyor line assembly (71), and the automatic feeding adjustment and attaching devices attach the components to the substrate on the conveyor line assembly (71) from both sides. The structure of the single-sided automatic feeding and adjustment mounting device is as follows: it includes a material box feeding mechanism (2), a transfer station one (3), a material picking and transfer mechanism (4), a transfer station two (6), and a mounting mechanism (5). The external picking mechanism transfers the components from the material box feeding mechanism (2) to the transfer station one (3). The transfer station one (3) makes fine adjustments in the horizontal plane. The material picking and transfer mechanism (4) transfers the components from the transfer station one (3) to the transfer station two (6). Multiple components are arranged in an orderly manner on the dual-station transfer station two (6). The mounting mechanism (5) transfers multiple components on the transfer station two (6) to the substrate.

2. The high-speed, high-precision intelligent placement machine as described in claim 1, characterized in that: The conveyor assembly (71) has a base plate platform (7) in the middle. The base plate platform (7) is mounted on the lifting mechanism. The action of the lifting mechanism lifts the base plate located in the conveyor assembly (71) upward through the base plate platform (7).

3. The high-speed, high-precision intelligent placement machine as described in claim 1, characterized in that: The feeding mechanism (2) includes a feeding platform installed on the lifting mechanism (21). Multiple pieces of material are stacked on the top surface of the feeding platform. The external picking mechanism transfers the pieces of material to the transfer platform (3) in an orderly manner.

4. The high-speed, high-precision intelligent placement machine as described in claim 1, characterized in that: The transfer station (3) is installed on the working platform (1) via the X-axis moving module (33) and the Y-axis moving module (31). The transfer station (3) rotates in the horizontal plane with its own axis as the center via a rotary motor. The components are supported on the top surface of the transfer station (3).

5. The high-speed, high-precision intelligent placement machine as described in claim 1, characterized in that: Multiple components are attached to the cutting film and supported on the transfer platform (3) by the cutting film; the transfer platform (3) is equipped with clamping components that flatten and fix the circumferential edge of the cutting film.

6. The high-speed, high-precision intelligent placement machine as described in claim 1, characterized in that: It also includes a vision component 1 (32) installed on the outside of the turntable 1 (3), which performs image acquisition and judgment on the components on the turntable 1 (3) and drives the turntable 1 (3) to adjust the components in the horizontal plane.

7. The high-speed, high-precision intelligent placement machine as described in claim 1, characterized in that: The material handling and transfer mechanism (4) is located above the space between the transfer platform one (3) and the transfer platform two (6). The material handling and transfer mechanism (4) is a turret structure. Multiple suction nozzles are installed on the bottom surface of the material handling and transfer mechanism (4) along the circumferential direction. As the turret structure rotates, each suction nozzle picks up the components from the transfer platform one (3) in turn and arranges them in an orderly manner on the transfer platform two (6) according to a preset number.

8. The high-speed, high-precision intelligent placement machine as described in claim 1, characterized in that: The transfer station 2 (6) is installed on the working platform (1) via the X-axis moving module 3 (61). The transfer station 2 (6) rotates in the horizontal plane with its own axis as the center via a rotary motor.

9. The high-speed, high-precision intelligent placement machine as described in claim 1, characterized in that: The patching mechanism (5) is installed on the work platform (1) via the X-axis moving module two (52) and the Y-axis moving module two (51) to form a gantry structure mounted above the transfer station two (6). The single patching mechanism (5) includes multiple patching units arranged along the length of the X-axis moving module two (52). The multiple patching units are driven independently by the corresponding driving unit. The multiple patching units jointly pick up components from the transfer station two (6) and attach them to the substrate.

10. The high-speed, high-precision intelligent placement machine as described in claim 9, characterized in that: A vision component three (54) facing upwards is installed on the work platform (1) located between the transfer station two (6) and the conveyor assembly (71), and a vision component two (53) facing downwards is installed on the outside of the placement mechanism (5); after the placement unit picks up the component, it is inspected by the vision component three (54) before placement, and the vision component two (53) inspects the component on the substrate after placement.

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