Light emitting device

Abstract

The embodiment of the utility model provides a light-emitting device. The light-emitting device comprises a support, a light-emitting element, a packaging adhesive layer and a diffusion layer, a first groove is formed in the support, and the light-emitting element is arranged at the bottom of the first groove and connected with the support; the packaging adhesive layer is arranged in the first groove and covers the light-emitting element; the diffusion layer is arranged in the first groove and located on the side, away from the light-emitting element, of the packaging adhesive layer. According to the light-emitting device provided by the embodiment of the invention, the diffusion layer is arranged above the packaging adhesive layer, the chromaticity uniformity of the emergent light spot of the light-emitting device can be improved by utilizing the scattering and refraction effects of the diffusion layer, and thus the emergent light chromaticity uniformity of the light-emitting device is improved; besides, the diffusion layer covers the packaging adhesive layer, so that the path of water vapor permeating into the packaging adhesive layer from the light-emitting surface can be prolonged, the influence of moisture on the packaging adhesive layer is reduced, and the service life of the light-emitting device is further prolonged.

Description

Technical Field

[0001] This application relates to the field of displays, and in particular to a light-emitting device. Background Technology

[0002] LEDs (light-emitting diodes) have many advantages such as small size, high luminous efficiency, and long lifespan, and are therefore widely used. White LEDs currently generally use blue light chips to excite phosphors to convert them into white light. However, the uneven distribution of phosphor particles in the encapsulating glue leads to uneven color of the light spot, which in turn affects the color uniformity index of the LCD backlight. Utility Model Content

[0003] Based on this, embodiments of this application provide a light-emitting device.

[0004] This application provides a light-emitting device, including:

[0005] The bracket has a first groove.

[0006] A light-emitting element is disposed at the bottom of the first groove and connected to the bracket;

[0007] An encapsulating adhesive layer is disposed within the first groove and covers the light-emitting element;

[0008] A diffusion layer is disposed within the first groove and located on the side of the encapsulating adhesive layer opposite to the light-emitting element.

[0009] In some embodiments, the diffusion layer includes a light-transmitting film and diffusing particles dispersed in the light-transmitting film; and / or,

[0010] The encapsulating adhesive layer is fluorescent adhesive; and / or,

[0011] The light-emitting element is an LED chip.

[0012] In some embodiments, the refractive index of the diffused particles is 1.4 to 1.55; and / or,

[0013] The particle size of the diffused particles is 1 μm to 5 μm; and / or,

[0014] The content of the diffused particles in the light-transmitting film is 1 wt% to 10 wt%.

[0015] In some embodiments, the light-emitting device further includes a lens connected to the bracket and covering the opening of the first groove.

[0016] In some embodiments, the lens and the bracket are connected by adhesive or snap-fit ​​connection; and / or,

[0017] The lens is provided with a second groove, the opening of the second groove is oriented toward the opening of the first groove, and the groove wall of the second groove is an arc surface.

[0018] In some embodiments, the top surface of the bracket is provided with a first engaging portion, and the bottom surface of the lens is provided with a second engaging portion. The first engaging portion and the second engaging portion are connected to achieve positioning between the bracket and the lens.

[0019] In some embodiments, the first engaging portion is a protruding structure surrounding the opening of the first groove, and the second engaging portion is a protruding structure surrounding the opening of the second groove. The first engaging portion enters the second engaging portion to achieve connection and positioning between the first engaging portion and the second engaging portion; or...

[0020] The first engaging portion is a protruding structure surrounding the opening of the first groove, and the second engaging portion is a protruding structure surrounding the opening of the second groove. The second engaging portion enters the first engaging portion to achieve connection and positioning between the first engaging portion and the second engaging portion.

[0021] In some embodiments, the support includes a connected bowl and a base, the bowl being cylindrical, one end of the bowl being connected to the base, such that the bowl and the base together enclose the first groove, and the light-emitting element is disposed on the first base and connected to the first base.

[0022] In some embodiments, the substrate includes a first conductive substrate, a second conductive substrate, and an insulating layer. The insulating layer is disposed between the first conductive substrate and the second conductive substrate to separate the first conductive substrate and the second conductive substrate. Both the first conductive substrate and the second conductive substrate are connected to the insulating layer, and both ends of the insulating layer are connected to the bowl / cup.

[0023] One of the positive and negative electrodes of the light-emitting element is connected to the first conductive substrate via a first bonding wire, and the other is connected to the second conductive substrate via a second bonding wire.

[0024] In some embodiments, the light-emitting element is connected to the substrate via an insulating adhesive; and / or,

[0025] The bowl and the insulating layer are both made of insulating plastic; and / or,

[0026] The bowl / cup is integrally molded using an injection molding process; and / or,

[0027] The first conductive substrate is metal, the first bonding wire is made of metal, and the first bonding wire is connected to the first conductive substrate by soldering; and / or,

[0028] The second conductive substrate is metal, the second bonding wire is made of metal, and the second bonding wire is connected to the second conductive substrate by welding.

[0029] The light-emitting device provided in this application embodiment can improve the color uniformity of the emitted light spot by providing a diffusion layer above the encapsulating adhesive layer, thereby enhancing the color uniformity of the emitted light. In addition, the diffusion layer covering the encapsulating adhesive layer can extend the path of moisture penetration from the light-emitting surface into the encapsulating adhesive layer, reduce the impact of moisture on the encapsulating adhesive layer, and thus extend the service life of the light-emitting device. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0031] Figure 1 This is a schematic diagram of the structure of the light-emitting device provided in the embodiments of this application.

[0032] Component symbol explanation:

[0033] 100, Light-emitting device; 20, Support; 21, Bowl / cup; 22, Substrate; 221, First conductive substrate; 222, Second conductive substrate; 223, Insulating layer; 215, First engaging portion; 23, First groove; 30, Light-emitting element; 40, Encapsulating adhesive layer; 50, Diffusion layer; 60, Lens; 61, Second groove; 62, Second engaging portion; 71, First bonding wire; 72, Second bonding wire; 80, Insulating adhesive. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0035] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0039] Please see Figure 1This application provides a light-emitting device 100, including a bracket 20, a light-emitting element 30, an encapsulating adhesive layer 40, and a diffusion layer 50. The bracket 20 has a first groove 23, the light-emitting element 30 is disposed at the bottom of the first groove 23 and connected to the bracket 20; the encapsulating adhesive layer 40 is disposed in the first groove 23 and covers the light-emitting element 30; the diffusion layer 50 is disposed in the first groove 23 and is located on the side of the encapsulating adhesive layer 40 away from the light-emitting element 30.

[0040] The light-emitting device 100 provided in this application embodiment can improve the color uniformity of the emitted light spot by providing a diffusion layer 50 above the encapsulating adhesive layer 40, thereby enhancing the color uniformity of the emitted light of the light-emitting device 100. In addition, the diffusion layer 50 covering the encapsulating adhesive layer 40 can extend the path of moisture penetrating from the light-emitting surface into the encapsulating adhesive layer 40, reducing the impact of moisture on the encapsulating adhesive layer 40, and thus extending the service life of the light-emitting device 100.

[0041] For example, the diffusion layer 50 includes a light-transmitting film and diffusion particles dispersed in the light-transmitting film.

[0042] For example, the material of the light-transmitting film is a resin material, such as polycarbonate, polyethylene terephthalate, etc.

[0043] For example, the material of the diffused particles is silicon dioxide or titanium dioxide, etc.

[0044] For example, the refractive index of the diffused particles is 1.4 to 1.55, such as 1.4, 1.42, 1.45, 1.47, 1.5, 1.52, 1.55, etc.

[0045] For example, the particle size of the diffused particles is 1μm to 5μm, such as 1μm, 2μm, 3μm, 4μm, 5μm, etc.

[0046] For example, the content of the diffused particles in the light-transmitting film is 1wt% to 10wt%, such as 1wt%, 2wt%, 3wt%, 4wt%, 5wt%, 6wt%, 7wt%, 8wt%, 9wt%, 10wt%, etc.

[0047] For example, the encapsulating adhesive layer 40 is a fluorescent adhesive. For example, the fluorescent adhesive is composed of a mixture of phosphor and adhesive. The phosphor can be YAG, silicate-based, nitride-based, KSF-based, or β-Syron-based materials, and the adhesive can be silicone rubber, silicone resin, or other materials.

[0048] It is understood that when the encapsulating adhesive layer 40 is a fluorescent adhesive, the emitted light of the light-emitting element 30 can excite the phosphor to emit light of different colors after entering the encapsulating adhesive layer 40, thereby realizing the conversion of light color. In some embodiments, the emitted light of the light-emitting element 30 is blue light, which is converted into white light after passing through the encapsulating adhesive layer 40.

[0049] For example, the light-emitting element 30 is an LED chip.

[0050] Please see Figure 1 In some embodiments, the light-emitting device 100 further includes a lens 60, which is connected to the bracket 20 and covers the opening of the first groove 23.

[0051] It is understandable that the lens 60 has the function of diffusing light. By placing the lens 60 above the bracket 20, the light emission uniformity of the light-emitting device 100 can be improved.

[0052] For example, the lens 60 and the bracket 20 are connected by adhesive or snap-fit ​​connection.

[0053] Please see Figure 1 The lens 60 is provided with a second groove 61, the opening of the second groove 61 is oriented toward the opening of the first groove 23, and the groove wall of the second groove 61 is an arc surface.

[0054] It is understood that the groove wall of the second groove 61 is the light incident surface of the lens 60. Therefore, when the groove wall of the second groove 61 is an arc surface, the light will be refracted into outgoing light at different angles when it is incident on different areas of the groove wall of the second groove 61, thereby diverging the light and improving the light emission uniformity of the light-emitting device 100.

[0055] Please see Figure 1 For example, the second groove 61 is hemispherical.

[0056] Please see Figure 1 For example, the opening area of ​​the second groove 61 is slightly larger than the opening area of ​​the first groove 23, so that all the light emitted from the opening of the first groove 23 can enter the second groove 61, thereby improving the light utilization rate.

[0057] Please see Figure 1 The top surface of the bracket 20 is provided with a first engaging part 215, and the bottom surface of the lens 60 is provided with a second engaging part 62. The first engaging part 215 and the second engaging part 62 are connected to realize the positioning between the bracket 20 and the lens 60.

[0058] It is understandable that by providing a first engaging part 215 on the top surface of the bracket 20 and a second engaging part 62 on the bottom surface of the lens 60, the bracket 20 and the lens 60 can be positioned by connecting the first engaging part 215 and the second engaging part 62 during assembly, thereby enabling quick installation.

[0059] Please see Figure 1 In some embodiments, the first engaging portion 215 is a protruding structure surrounding the opening of the first groove 23, and the second engaging portion 62 is a protruding structure surrounding the opening of the second groove 61. The first engaging portion 215 enters the second engaging portion 62 to achieve connection and positioning between the first engaging portion 215 and the second engaging portion 62.

[0060] In some other embodiments, the first engaging portion 215 is a protruding structure surrounding the opening of the first groove 23, and the second engaging portion 62 is a protruding structure surrounding the opening of the second groove 61. The second engaging portion 62 enters the first engaging portion 215 to achieve connection and positioning between the first engaging portion 215 and the second engaging portion 62.

[0061] For example, the lens 60 is made of silicone rubber or polymethyl methacrylate (PMMA).

[0062] Please see Figure 1 The support 20 includes a bowl 21 and a base 22 connected together. The bowl 21 is cylindrical and one end of the bowl 21 is connected to the base 22 so that the bowl 21 and the base 22 together form the first groove 23. The light-emitting element 30 is disposed on the first base 22 and connected to the first base 22.

[0063] Please see Figure 1 For example, from the end of the bowl 21 near the base 22 to the end away from the base 22, the cross-sectional area enclosed by the inner side of the bowl 21 gradually increases. In some embodiments, the inner wall surface of the bowl 21 is an arc surface.

[0064] Please see Figure 1 The substrate 22 includes a first conductive substrate 221, a second conductive substrate 222, and an insulating layer 223. The insulating layer 223 is disposed between the first conductive substrate 221 and the second conductive substrate 222 to separate the first conductive substrate 221 and the second conductive substrate 222. Both the first conductive substrate 221 and the second conductive substrate 222 are connected to the insulating layer 223. Both ends of the insulating layer 223 are connected to the bowl 21.

[0065] One of the positive and negative electrodes of the light-emitting element 30 is connected to the first conductive substrate 221 via a first bonding line 71, and the other is connected to the second conductive substrate 222 via a second bonding line 72.

[0066] Please see Figure 1 The light-emitting element 30 is connected to the substrate 22 by an insulating adhesive 80. For example, the insulating adhesive 80 can be a die-bonding adhesive.

[0067] For example, both the bowl / cup 21 and the insulating layer 223 are made of insulating plastic.

[0068] For example, the bowl cup 21 is integrally formed by injection molding.

[0069] For example, the first conductive substrate 221 is metal, the first bonding wire 71 is made of metal (e.g., gold or silver), and the first bonding wire 71 is connected to the first conductive substrate 221 by welding.

[0070] For example, the second conductive substrate 222 is metal, the material of the second bonding wire 72 is metal (e.g., gold or silver), and the second bonding wire 72 is connected to the second conductive substrate 222 by welding.

[0071] It is understood that the first conductive substrate 221 and the second conductive substrate 222 have dual functions. First, they can serve as substrates to support the cup 21 and the light-emitting element 30, encapsulating adhesive layer 40 and diffusion layer 50 inside the cup 21. Second, they can serve as metal pads to connect the positive and negative terminals of the light-emitting element 30, thereby supplying power to the light-emitting element 30 to control the light-emitting element 30 to light up or turn off.

[0072] The method for fabricating the light-emitting device provided in this application includes:

[0073] S1. Provide a support assembly, which includes multiple supports 20. The multiple supports 20 are connected by metal ribs or metal segments to form the support assembly. The multiple supports 20 can be arranged in an array. The number of supports 20 can be two or more, such as two, four, eight, etc.

[0074] S2. Provide multiple light-emitting elements 30 (LED chips) and fix each light-emitting element 30 on a bracket 20. The multiple brackets 20 correspond one-to-one with the multiple light-emitting elements 30. The light-emitting elements 30 can be glued to the brackets 20 with die bond adhesive.

[0075] S3. Wire bonding process: The positive and negative terminals of the light-emitting element 30 (LED chip) are connected to the positive and negative terminals (first conductive substrate 221 and second conductive substrate 222) of the support 20 through metal bonding wires to form electrical conductivity.

[0076] S4. Dispensing process: Apply an appropriate amount of fluorescent adhesive into the cup 21 of the bracket 20 using a dispensing machine;

[0077] S5, fluorescent adhesive baking process, which uses heat to bake the fluorescent adhesive to cure it and form an encapsulation adhesive layer;

[0078] S6, Diffusion layer adhesive dispensing process: The adhesive mixed with diffusion particles is quantitatively injected into the cup 21 of the support 20 through a dispensing machine.

[0079] S7. Diffusion layer adhesive baking process: The diffusion layer adhesive is cured by heating and baking.

[0080] S8. Connect multiple lenses 60 to multiple brackets 20 respectively. The lenses 60 and brackets 20 can be connected by glue or snap-fit.

[0081] S9. The lead frame assembly is punched to separate the multiple brackets 20 connected in sequence. Specifically, this step is also called the punching and blanking process. The metal connecting ribs or metal segments between the brackets 20 are punched and cut apart by the punching die to form a single light-emitting device 100.

[0082] The light-emitting devices provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A light-emitting device, characterized in that, include: The bracket has a first groove. A light-emitting element is disposed at the bottom of the first groove and connected to the bracket; An encapsulating adhesive layer is disposed within the first groove and covers the light-emitting element; A diffusion layer is disposed within the first groove and located on the side of the encapsulating adhesive layer opposite to the light-emitting element; A lens is connected to the bracket and covers the opening of the first groove. The lens has a second groove with the opening facing the opening of the first groove. The groove wall of the second groove is an arc surface.

2. The light-emitting device according to claim 1, characterized in that, The diffusion layer includes a light-transmitting film and diffusing particles dispersed in the light-transmitting film; and / or, The encapsulating adhesive layer is fluorescent adhesive; and / or, The light-emitting element is an LED chip.

3. The light-emitting device according to claim 2, characterized in that, The refractive index of the diffused particles is 1.4 to 1.55; and / or, The particle size of the diffused particles is 1 μm to 5 μm.

4. The light-emitting device according to claim 1, characterized in that, The lens and the bracket are connected by glue or clips.

5. The light-emitting device according to any one of claims 1-4, characterized in that, The top surface of the bracket is provided with a first engaging part, and the bottom surface of the lens is provided with a second engaging part. The first engaging part and the second engaging part are connected to achieve positioning between the bracket and the lens.

6. The light-emitting device according to claim 5, characterized in that, The first engaging portion is a protruding structure surrounding the opening of the first groove, and the second engaging portion is a protruding structure surrounding the opening of the second groove. The first engaging portion enters the second engaging portion to achieve connection and positioning between the first engaging portion and the second engaging portion; or... The first engaging portion is a protruding structure surrounding the opening of the first groove, and the second engaging portion is a protruding structure surrounding the opening of the second groove. The second engaging portion enters the first engaging portion to achieve connection and positioning between the first engaging portion and the second engaging portion.

7. The light-emitting device according to claim 1, characterized in that, The support includes a connected bowl and a base. The bowl is cylindrical and one end is connected to the base so that the bowl and the base together form the first groove. The light-emitting element is disposed on the base and connected to the base.

8. The light-emitting device according to claim 7, characterized in that, The substrate includes a first conductive substrate, a second conductive substrate, and an insulating layer. The insulating layer is disposed between the first conductive substrate and the second conductive substrate to separate the first conductive substrate and the second conductive substrate. Both the first conductive substrate and the second conductive substrate are connected to the insulating layer. Both ends of the insulating layer are connected to the bowl. One of the positive and negative electrodes of the light-emitting element is connected to the first conductive substrate via a first bonding wire, and the other is connected to the second conductive substrate via a second bonding wire.

9. The light-emitting device according to claim 8, characterized in that, The light-emitting element is connected to the substrate by an insulating adhesive; and / or, The bowl and the insulating layer are both made of insulating plastic; and / or, The bowl / cup is integrally molded using an injection molding process; and / or, The first conductive substrate is metal, the first bonding wire is made of metal, and the first bonding wire is connected to the first conductive substrate by soldering; and / or, The second conductive substrate is metal, the second bonding wire is metal, and the second bonding wire is connected to the second conductive substrate by welding.

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