Quantum chip magnetic shielding device

Abstract

The utility model relates to the technical field of chip packaging, in particular to a quantum chip magnetic shielding device. Comprising a shielding bottom plate and an auxiliary assembly, the auxiliary assembly comprises a mounting table, an electromagnetic shielding packaging box, an inner magnetostatic shielding cover and an outer magnetostatic shielding cover, a quantum chip is packaged in the electromagnetic shielding packaging box, and the inner magnetostatic shielding cover and the outer magnetostatic shielding cover are arranged to work in a matched mode to form a three-layer shielding structure. The electromagnetic shielding packaging box and the inner static magnetic shielding cover are arranged on the outer layer, magnetic field shielding of different types of magnetic fields and different intensities is achieved, the working environment of the quantum chip to be packaged in the electromagnetic shielding packaging box is jointly guaranteed, meanwhile, during arrangement, the electromagnetic shielding packaging box is arranged on the inner layer, the inner static magnetic shielding cover is arranged on the outer layer, and the electromagnetic shielding packaging box can directly make contact with the quantum chip to be packaged; when the electromagnetic shielding effect is carried out, the attachment effect of the surface of the electromagnetic shielding packaging box is good, the electromagnetic shielding effect can be effectively ensured, and the problem that the shielding effect on a static magnetic field in an existing chip packaging structure is poor can be solved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a quantum chip magnetic shielding device. Background Technology

[0002] Superconducting quantum chips are placed in extremely low-temperature environments, but these environments are still very noisy. While extremely low temperatures are a fundamental condition for quantum chip operation, they cannot eliminate all environmental noise. Environmental noise refers to any form of light, sound, and electricity fluctuations, including thermal noise, electrical noise, infrared radiation noise, magnetic field noise, and mechanical vibration noise. It can cause valuable information to be submerged in ineffective information generated by these fluctuations. The vast majority of environmental noise exists primarily in the form of infrared and magnetic field radiation, and it randomly interferes with the quantum information stored in the quantum chip. Therefore, more shielding measures are needed to reduce the impact of noise on the qubits.

[0003] In the prior art, Chinese patent application number 201721872396.4, application date: 2017.12.28, patent title "A Noise Reduction Device for Quantum Chips" discloses a noise shielding device for quantum chips, which mainly targets magnetic field radiation noise and infrared radiation noise for shielding and noise reduction.

[0004] In this prior art, only a shielding barrel structure made of aluminum alloy 6061 is used as the encapsulation box structure for magnetic field radiation noise. When in use, this structure can only achieve shielding of electromagnetic radiation noise, but cannot achieve shielding of static magnetic fields, and the shielding effect is poor. Utility Model Content

[0005] The purpose of this invention is to provide a magnetic shielding device for quantum chips to solve the problem of poor shielding effect against static magnetic fields in existing chip packaging structures.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: This utility model provides a quantum chip magnetic shielding device, including a shielding base plate and auxiliary components;

[0007] The auxiliary components include a mounting platform, an electromagnetic shielding encapsulation box, an inner magnetic shielding cover, and an outer magnetic shielding cover. The mounting platform is integrally formed with the shielding base plate and has a threaded mounting cavity inside. The bottom of the shielding base plate has an integrated support platform with flared cable holes on both sides. The electromagnetic shielding encapsulation box is fixed to the shielding base plate and has cable holes on its side walls. It encapsulates a quantum chip inside. The inner magnetic shielding cover is threadedly connected to the mounting platform and is located outside the electromagnetic shielding encapsulation box. The outer magnetic shielding cover is detachably connected to the mounting platform and is located outside the inner magnetic shielding cover.

[0008] The inner cavity surface of the inner static magnetic shield is provided with a coating that absorbs infrared radiation noise.

[0009] Both the inner and outer static magnetic shields are cylindrical structures.

[0010] The top of the inner static magnetic shield is provided with a hexagonal boss.

[0011] The auxiliary component further includes a heat sink, which is annularly welded to the outer magnetic shield and penetrates the inner magnetic shield and the coating, and cooperates with the auxiliary heat sink provided on the electromagnetic shielding encapsulation box.

[0012] This invention discloses a quantum chip magnetic shielding device. The quantum chip is directly electromagnetically shielded within an electromagnetic shielding enclosure. Furthermore, by setting an inner and an outer static magnetic shielding cover to work together, a three-layer shielding structure is formed, which respectively shields different types and intensities of magnetic fields, jointly ensuring the working environment of the quantum chip to be packaged within the electromagnetic shielding enclosure. During setup, the electromagnetic shielding enclosure is placed in the inner layer, while the inner static magnetic shielding cover is placed in the outer layer. The electromagnetic shielding enclosure can directly contact the quantum chip to be packaged. During electromagnetic shielding, the surface of the electromagnetic shielding enclosure exhibits a good adhesion effect, effectively ensuring the electromagnetic shielding effect. This solves the problem of poor shielding effect against static magnetic fields in existing chip packaging structures. Attached Figure Description

[0013] This utility model can be further illustrated by the non-limiting embodiments given in the accompanying drawings.

[0014] Figure 1 This is a schematic diagram of the overall structure of the quantum chip magnetic shielding device according to the first embodiment of this utility model.

[0015] Figure 2 This is a cross-sectional view of the inner static magnetic shielding cover of the first embodiment of this utility model.

[0016] Figure 3 This is a schematic diagram of the overall structure of the quantum chip magnetic shielding device according to the second embodiment of this utility model.

[0017] Figure 4 This is a schematic diagram of the heat sink structure of the second embodiment of the present invention.

[0018] In the diagram: 101-Shielding base plate, 102-Mounting platform, 103-Electromagnetic shielding encapsulation box, 104-Quantum chip, 105-Inner static magnetic shielding cover, 106-Outer static magnetic shielding cover, 107-Coating, 108-Hexagonal boss, 201-Heat sink. Detailed Implementation

[0019] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0020] Example 1:

[0021] like Figure 1 and Figure 2 As shown, where Figure 1 This is a schematic diagram of the overall structure of a quantum chip magnetic shielding device. Figure 2 This is a cross-sectional view of the inner magnetic shielding cover 105. This invention provides a magnetic shielding device for a quantum chip, comprising a shielding base plate 101 and auxiliary components. The auxiliary components include a mounting platform 102, an electromagnetic shielding encapsulation box 103, an inner magnetic shielding cover 105, and an outer magnetic shielding cover 106. The aforementioned solution solves the problem of poor shielding effect for static magnetic fields in existing chip packaging structures. It is understood that the aforementioned solution can achieve good static magnetic field shielding for the chip.

[0022] In this embodiment, the shielding base plate 101 is made of magnetic shielding material and is provided with mounting holes for easy fixing.

[0023] The mounting platform 102 is integrally formed with the shielding base plate 101 and has a threaded mounting cavity inside. The bottom of the shielding base plate 101 is provided with an integrated support platform and cable holes with flared sides. The electromagnetic shielding encapsulation box 103 is fixed on the shielding base plate 101 and has cable holes on its side wall. The quantum chip 104 is encapsulated inside. The inner static magnetic shielding cover 105 is threadedly connected to the mounting platform 102 and is located outside the electromagnetic shielding encapsulation box 103. The outer static magnetic shielding cover 106 is detachably connected to the mounting platform 102 and is located outside the inner static magnetic shielding cover 105. The mounting platform 102 is made of magnetic shielding material and is integrally formed with the shielding base plate 101. It has an internal threaded mounting cavity to facilitate the installation of the threaded end of the inner static magnetic shielding cover 105. The electromagnetic shielding encapsulation box 103 is fixed to the shielding base plate 101 by bolts and encapsulates a quantum chip 104 inside. When working, the electromagnetic shielding encapsulation box 103 directly contacts the quantum chip 104 to be encapsulated. During electromagnetic shielding, the surface of the electromagnetic shielding encapsulation box 103 exhibits good adhesion effect, effectively ensuring the electromagnetic shielding effect. Furthermore, a signal... The cable hole through which the signal line passes is provided with an integrated support platform at the bottom of the shielding base plate 101. The support platforms are evenly spaced in a ring to elevate the bottom when it is fixed, so that the signal line can pass through the horn-shaped cable holes on both sides of the bottom. The inner magnetic shielding cover 105 and the outer magnetic shielding cover 106 are both made of permalloy, which is an iron-nickel alloy with high magnetic permeability under weak magnetic fields. It has a good magnetic shielding effect against weak magnetic fields. The outer magnetic shielding cover 106 has a ring of perforated fixing ears on the outer side for easy fixing with bolts.

[0024] Secondly, the inner cavity surface of the inner static magnetic shield 105 is provided with a coating 107 for absorbing infrared radiation noise. The coating 107 is a cylindrical structure made of epoxy resin.

[0025] Then, both the inner magnetic shield 105 and the outer magnetic shield 106 are cylindrical structures. Cylindrical magnetic shielding structures reflect magnetic flux lines more easily than rectangular magnetic shielding structures, maximizing the low-resistance path of magnetic flux and thus resulting in better magnetic shielding.

[0026] Finally, a hexagonal boss 108 is provided on the top of the inner static magnetic shield 105. The purpose of this structure is to facilitate the quick installation or disassembly of the inner static magnetic shield 105 with the mounting platform 102.

[0027] When using this invention to solve the problem of poor shielding effect of static magnetic fields in existing chip packaging structures, the quantum chip 104 is directly electromagnetically shielded within the electromagnetic shielding packaging box 103. Furthermore, by setting the inner static magnetic shielding cover 105 and the outer static magnetic shielding cover 106 to work together, a three-layer shielding structure is formed, which respectively achieves shielding of different types and intensities of magnetic fields, jointly ensuring the working environment of the quantum chip 104 to be packaged within the electromagnetic shielding packaging box 103. At the same time, during the setup, the electromagnetic shielding packaging box 103 is placed in the inner layer, and the inner static magnetic shielding cover 105 is placed in the outer layer. The electromagnetic shielding packaging box 103 can directly contact the quantum chip 104 to be packaged. When performing electromagnetic shielding, the surface of the electromagnetic shielding packaging box 103 has a good adhesion effect, which can effectively ensure the electromagnetic shielding effect, thereby solving the problem of poor shielding effect of static magnetic fields in existing chip packaging structures.

[0028] Example 2:

[0029] like Figure 3 and Figure 4 As shown, where Figure 3 This is a schematic diagram of the overall structure of a quantum chip magnetic shielding device. Figure 4 This is a schematic diagram of the structure of the heat sink 201. Based on the first embodiment, this utility model provides a quantum chip magnetic shielding device. The auxiliary component also includes a heat sink 201. The heat sink 201 is annularly welded to the outer static magnetic shielding cover 106 and passes through the inner static magnetic shielding cover 105 and the coating 107 respectively, and cooperates with the auxiliary heat sink provided on the electromagnetic shielding encapsulation box 103.

[0030] In this embodiment, when the quantum chip 104 operates within the electromagnetic shielding enclosure 103, the large number of signals input to the quantum chip 104 for processing causes localized temperature rise, potentially exceeding 20 mK. This generates significant thermal noise, which may directly damage the information stored in the quantum chip 104, rendering it unable to function properly. Therefore, an auxiliary heat sink arranged in a row is provided on one side wall of the electromagnetic shielding enclosure 103. The high thermal conductivity oxygen-free copper of the auxiliary heat sink dissipates heat from the internal cavity to the cavity between the mounting platform 102 and the inner static magnetic shield 105. Then, the heat is further conducted away by the heat sink 201, which can also be made of high thermal conductivity oxygen-free copper. This effectively dissipates the working heat inside the electromagnetic shielding enclosure 103.

[0031] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A magnetic shielding device for a quantum chip, comprising a shielding base plate, characterized in that: It also includes auxiliary components; The auxiliary components include a mounting platform, an electromagnetic shielding encapsulation box, an inner magnetic shielding cover, and an outer magnetic shielding cover. The mounting platform is integrally formed with the shielding base plate and has a threaded mounting cavity inside. The bottom of the shielding base plate has an integrated support platform with flared cable holes on both sides. The electromagnetic shielding encapsulation box is fixed to the shielding base plate and has cable holes on its side walls. It encapsulates a quantum chip inside. The inner magnetic shielding cover is threadedly connected to the mounting platform and is located outside the electromagnetic shielding encapsulation box. The outer magnetic shielding cover is detachably connected to the mounting platform and is located outside the inner magnetic shielding cover.

2. The quantum chip magnetic shielding device as described in claim 1, characterized in that: The inner cavity surface of the inner static magnetic shield is coated with a coating that absorbs infrared radiation noise.

3. The quantum chip magnetic shielding device as described in claim 1, characterized in that: Both the inner and outer magnetic shields are cylindrical structures.

4. The quantum chip magnetic shielding device as described in claim 1, characterized in that: The top of the inner static magnetic shield is provided with a hexagonal boss.

5. The quantum chip magnetic shielding device as described in claim 2, characterized in that: The auxiliary component also includes a heat sink, which is annularly welded to the outer static magnetic shield and penetrates the inner static magnetic shield and the coating, and cooperates with the auxiliary heat sink provided on the electromagnetic shielding encapsulation box.

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