Wafer cleaning device

Abstract

The utility model provides a wafer cleaning device, which comprises a support piece, a wafer cleaning device, a wafer cleaning device and a wafer cleaning device, and is characterized in that the support piece is used for supporting a wafer; the spraying head and the supporting piece are oppositely arranged, the spraying head comprises a connecting part and a spraying part which are arranged in a connected mode, the connecting part is connected with a cleaning fluid supply device, and the spraying part is bent towards the edge position close to the wafer relative to the connecting part and used for spraying cleaning fluid to the edge position of the wafer. The spraying part is bent towards the edge position close to the wafer relative to the connecting part, so that the direct impact strength of the cleaning liquid on the edge of the wafer can be effectively relieved, the phenomenon of splashing of the cleaning liquid in the cleaning process is improved, more cleaning liquid can be enabled to be in uniform and sufficient contact with the surface of the wafer, and the cleaning efficiency is improved. And the contact area between the cleaning liquid and the wafer is obviously increased, so that the cleaning efficiency of the edge of the wafer is improved, and the production yield is also obviously optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field, concretely relates to a wafer cleaning device. BACKGROUND

[0002] In the process of the general photoetching technology coating, the redundant glue can be pushed to the wafer edge by centrifugal force, a small amount of which remains in the wafer edge, and flows to the wafer back under the action of surface tension, therefore, it is needed to remove immediately after the rotary coating is finished, and this process is called EBR.

[0003] At present, the EBR conical needle head used by the core source machine table splashes due to the contact of EBR liquid to the wafer, which influences the process surface and causes yield loss. UTILITY MODEL CONTENTS

[0004] The utility model solves the problem that the existing EBR conical needle head causes the contact of EBR liquid to the wafer to splash.

[0005] In order to solve the above problems, the utility model provides a wafer cleaning device, which comprises:

[0006] A support piece is used for supporting the wafer.

[0007] A spray head is oppositely arranged with the support piece, and the spray head comprises a connecting part and a spraying part which are connected, the connecting part is connected with a cleaning liquid supply device, and the spraying part is bent towards the edge position close to the wafer relative to the connecting part and is used for spraying the cleaning liquid to the edge position of the wafer.

[0008] Optionally, the intersection angle between the spraying direction of the spraying part and the line connecting the center of the upper surface of the wafer to the edge direction is an acute angle.

[0009] Technical effect: the acute angle spraying direction can avoid the splashing of flowing liquid, reduce the accumulation or lack of cleaning liquid caused by improper spraying direction, and the cleaning liquid can be more accurately sprayed to the surface of the edge area of the wafer, thereby enhancing the ability to remove the pollutants on the surface of the wafer.

[0010] Optionally, the range of the acute angle is between 15 DEG and 35 DEG.

[0011] Optionally, in the direction perpendicular to the wafer, the distance from one end of the spraying part close to the wafer to the wafer is less than or equal to 0.4 cm.

[0012] Technical effect: setting the distance can make the cleaning liquid reach the edge position of the wafer at a consistent flow rate and concentration, ensure that the cleaning liquid contacts the wafer more effectively, reduce unnecessary overflow and waste of the cleaning liquid, and reduce the impact force of the liquid.

[0013] Optionally, the length of the spraying part is greater than the length of the connecting part.

[0014] Technical effect: It can ensure that the cleaning liquid can be more stable and evenly distributed in the edge area of the wafer.

[0015] Optionally, the angle between the connecting part and the spraying part is adjustable.

[0016] Technical effect: It can be adaptively adjusted according to the size and shape of the wafer, and improve the spraying effect.

[0017] Optionally, the connecting part and the spraying part are needle-shaped structures.

[0018] Technical effect: The needle-shaped structure has a small contact area but high strength, which makes the connecting part stable during rotation. By setting the spraying part as a needle-shaped structure, the sprayed cleaning liquid can be more concentrated, so that the spraying range and precision can be more easily controlled.

[0019] Optionally, the connecting part and the spraying part are integrally formed.

[0020] Technical effect: The design of integrally forming reduces the joints and gaps between the connecting part and the spraying part, thereby reducing the leakage and resistance of the cleaning liquid during transmission, and improving the transmission efficiency of the cleaning liquid.

[0021] Optionally, the wafer cleaning device further comprises:

[0022] A fixed block, one end of the fixed block is connected with the connecting part, and the other end of the fixed block is connected with the cleaning liquid supply device;

[0023] An adjusting block, the adjusting block clamps the fixed block, and is used for adjusting the included angle between the connecting part and the center line of the support according to the size of the wafer.

[0024] The wafer cleaning device provided by the embodiment of the present application can effectively reduce the direct impact strength of the cleaning liquid on the edge of the wafer by bending the spraying part relative to the connecting part towards the edge position close to the wafer, improve the phenomenon of splashing of the cleaning liquid during cleaning, and further promote more cleaning liquid to uniformly and fully contact the wafer surface, thereby significantly increasing the contact area between the cleaning liquid and the wafer. In this way, not only the cleaning efficiency of the wafer edge is improved, but also the production yield is significantly optimized. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 The structure diagram of the wafer cleaning device provided by the embodiment of the present application is shown;

[0026] Figure 2 isFigure 1 Side view of the wafer cleaning apparatus shown.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Wafer cleaning device; 11. Support component; 12. Nozzle; 13. Fixing block; 14. Adjusting block; 15. Cleaning fluid pipeline; 121. Connecting part; 122. Spraying part; 2. Wafer. Detailed Implementation

[0029] To make the above-mentioned objectives, features and superior structure of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below.

[0030] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the wafer cleaning apparatus provided in the embodiments of this application. Figure 2 for Figure 1 The image shows a side view of a wafer cleaning apparatus. This application provides a wafer cleaning apparatus 1, which includes a support member 11 and a nozzle 12. The support member 11 supports a wafer 2. The nozzle 12 is disposed opposite to the support member 11 and includes a connecting portion 121 and a spraying portion 122 connected together. The connecting portion 121 is connected to a cleaning fluid supply device. The spraying portion 122 bends relative to the connecting portion 121 towards the edge of the wafer 2 to spray cleaning fluid onto the edge of the wafer 2. By bending the spraying portion 122 relative to the connecting portion 121 towards the edge of the wafer 2, the direct impact intensity of the cleaning fluid on the edge of the wafer 2 can be effectively reduced, improving the phenomenon of cleaning fluid splashing during the cleaning process. This allows more cleaning fluid to uniformly and fully contact the surface of the wafer 2, significantly increasing the contact area between the cleaning fluid and the wafer 2. This not only improves the cleaning efficiency of the wafer 2 edge but also significantly optimizes the production yield.

[0031] In some embodiments, during the cleaning process, the support member 11 drives the wafer 2 to rotate, and the nozzle 12 reciprocates along the edge of the wafer 2, spraying cleaning fluid. In some embodiments, the support member 11 is stationary, and the nozzle 12 is rotating, reciprocating and circumferentially moving along the edge of the wafer 2 while spraying cleaning fluid. In other embodiments, both the support member 11 and the nozzle 12 are rotating, but at different speeds. Specific settings can be made according to actual conditions, and no specific limitations are imposed here.

[0032] The cleaning solution can be deionized water or other chemical solutions, such as ammonia solution or hydrofluoric acid solution, depending on the type of contaminants to be removed from the surface of wafer 2.

[0033] The flow rate of the spray cleaning liquid is also different according to the difficulty of removing the contaminants on the upper surface of the wafer 2. When the contaminants are difficult to remove, a larger flow rate of the spray is required to enhance the ability to remove the contaminants. When the contaminants are easy to remove, the flow rate of the spray is reduced to save the cleaning liquid.

[0034] The intersection angle between the spray direction of the spray part 122 and the line connecting the center of the upper surface of the wafer 2 to the edge of the wafer 2 is an acute angle. The spray direction of the acute angle can avoid the splashing of the flowing liquid and reduce the accumulation or lack of the cleaning liquid caused by the improper spray direction. The cleaning liquid can be more accurately sprayed to the surface of the edge area of the wafer 2, thereby enhancing the ability to remove the contaminants on the surface of the wafer 2. It should be noted that the spray direction of the spray part 122 does not change in the reciprocating movement of the spray head 12 during the cleaning process. However, the spray direction of the spray part 122 can be adjusted according to the size and thickness of the wafer 2 to be cleaned before the cleaning, as long as the intersection angle between the spray direction of the spray part 122 and the line connecting the center of the upper surface of the wafer 2 to the edge of the wafer 2 is an acute angle.

[0035] In some embodiments, the range of the acute angle is between 15° and 35°, for example, 20°, 25°.

[0036] In the direction perpendicular to the wafer 2, the distance from the end of the spray part 122 close to the wafer 2 to the wafer 2 is less than or equal to 0.4 cm. The distance can make the cleaning liquid reach the edge position of the wafer 2 at a consistent flow rate and concentration, ensure that the cleaning liquid contacts the wafer 2 more effectively, and reduce unnecessary overflow and waste of the cleaning liquid, while reducing the impact force of the liquid. It should be noted that the distance between the spray head 12 and the wafer 2 remains unchanged in the reciprocating movement of the spray head 12. However, the distance between the spray head 12 and the wafer 2 can be adjusted according to the size and thickness of the wafer 2 to be cleaned before the cleaning. By improving the distance between the spray part 122 and the wafer 2, the impact force of the cleaning liquid on the edge of the wafer 2 can be reduced, thereby improving the splashing of the cleaning liquid.

[0037] The length of the spray part 122 is greater than the length of the connecting part 121. By such a setting, it can be ensured that the cleaning liquid can be more stably and uniformly distributed in the edge area of the wafer 2.

[0038] In some embodiments, the length of the spray part 122 is twice the length of the connecting part 121.

[0039] In some embodiments, the angle between the connecting part 121 and the spray part 122 is adjustable. In this way, the spray effect can be adaptively adjusted according to the size and shape of the wafer 2. In addition, by adjusting the angle between the connecting part 121 and the spray part 122, the direction and range of the cleaning liquid can be accurately controlled, and the flexibility and adaptability of the wafer cleaning device 1 are also improved.

[0040] The connecting part 121 and the spraying part 122 are both needle-shaped structures, the needle-shaped structure has a small contact area but a high strength, which makes the connecting part 121 stable during rotation. By setting the spraying part 122 as a needle-shaped structure, the sprayed cleaning liquid can be more concentrated, so that the spraying range and accuracy can be more easily controlled.

[0041] In some embodiments, the connecting part 121 and the spraying part 122 are integrally formed, the design of integrally forming reduces the joints and gaps between the connecting part 121 and the spraying part 122, thereby reducing the leakage and resistance of the cleaning liquid during transmission, and improving the transmission efficiency of the cleaning liquid.

[0042] In some embodiments, the inner diameter of the connecting part 121 and the spraying part 122 is 0.5 millimeters.

[0043] In some embodiments, the angle between the extension line of the connecting part 121 and the center line of the support 11 can be 0°, that is, the connecting part 121 can be perpendicular to the support 11, so that the angle between the connecting part 121 and the support 11 is not too large, which can cause the angle between the spraying part 122 and the wafer 2 to be too large, thereby causing the cleaning liquid to splash. It can be understood that the specific value of the angle between the extension line of the connecting part 121 and the center line of the support 11 can be adjusted and set according to the size and thickness of the wafer 2, such as 0° to 45°, 45° to 90°, greater than 90°, and the like, which is not specifically limited here.

[0044] The wafer cleaning device 1 further comprises a fixing block 13, one end of the fixing block 13 is connected with the connecting part 121, and the other end of the fixing block 13 is connected with the cleaning liquid supply device, and the fixing block 13 is used to connect the cleaning liquid supply device and the connecting part 121.

[0045] The wafer cleaning device 1 further comprises an adjusting block 14, the adjusting block 14 clamps the fixing block 13, and is used to adjust the angle between the connecting part 121 and the center line of the support 11 according to the size of the wafer 2 before cleaning.

[0046] The wafer cleaning device 1 further comprises a cleaning liquid pipeline 15, one end of the cleaning liquid pipeline 15 is connected with the fixing block 13, and the other end of the cleaning liquid pipeline 15 is connected with the cleaning liquid supply device, and the cleaning liquid pipeline 15 is used to circulate the cleaning liquid.

[0047] Although the utility model discloses as above, the utility model is not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be the range limited by the claims.

Claims

1. A wafer cleaning apparatus, characterized in that, The wafer cleaning apparatus includes: Support member, the support member being used to support the wafer; The nozzle is disposed opposite to the support member. The nozzle includes a connecting part and a spraying part connected together. The connecting part is connected to a cleaning fluid supply device. The spraying part is bent relative to the connecting part towards the edge of the wafer for spraying cleaning fluid onto the edge of the wafer. Wherein, the angle between the spraying direction of the spraying part and the line connecting the center to the edge of the upper surface of the wafer is an acute angle; and in the direction perpendicular to the wafer, the distance from the end of the spraying part closest to the wafer to the wafer is less than or equal to 0.4 cm.

2. The wafer cleaning apparatus according to claim 1, characterized in that, The acute angle is between 15° and 35°.

3. The wafer cleaning apparatus according to any one of claims 1 to 2, characterized in that, The length of the spraying part is greater than the length of the connecting part.

4. The wafer cleaning apparatus according to any one of claims 1 to 2, characterized in that, The angle between the connecting part and the spraying part is adjustable.

5. The wafer cleaning apparatus according to any one of claims 1 to 2, characterized in that, Both the connecting part and the spraying part are needle-shaped structures.

6. The wafer cleaning apparatus according to any one of claims 1 to 2, characterized in that, The connecting part and the spraying part are integrally formed.

7. The wafer cleaning apparatus according to any one of claims 1 to 2, characterized in that, The wafer cleaning apparatus further includes: A fixing block, one end of which is connected to the connecting part, and the other end of which is connected to the cleaning fluid supply device; An adjusting block, which clamps the fixing block, is used to adjust the angle between the centerline of the connecting part and the support member according to the size of the wafer.

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