Wafer carrier applied to 6-inch thick sheet

Abstract

The utility model discloses a wafer carrier applied to a 6-inch thick sheet. The wafer carrier comprises a bearing frame, a wafer accommodating cavity, side lugs and supporting legs, the wafer accommodating cavity comprises an accommodating section. The two containing sections form a containing groove, and the containing groove is arranged in a hollowed-out mode. The bearing frame comprises a bearing frame body. And the accommodating groove and the bearing frame main body form a wafer accommodating cavity. And the accommodating section is obliquely arranged. The accommodating section is bent towards the wafer accommodating cavity, and the joint of the wafer accommodating cavity and the supporting leg is tangent to the wafer. And a connecting strip is arranged on the outer side of the accommodating section. And the connecting strip is arranged at the tangent part of the wafer accommodating cavity and the 6-inch wafer. Positioning holes are formed in the sides, opposite to the side lugs, of the supporting legs, and guide sections inclined towards the positioning holes are arranged on the two sides of the positioning holes. The wafer carrier applied to the 6-inch thick wafer is provided with the accommodating section, the connecting strip and the positioning hole, so that the thick wafer is more convenient to install, and the wafer carrier can be accurately installed with a wafer bin.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, and in particular to a wafer carrier used in 6-inch thick wafers. Background Technology

[0002] In the semiconductor manufacturing industry, wafers are the core material used to manufacture integrated circuits. During wafer processing and transportation, the integrity and surface quality of the wafers are crucial. Therefore, wafer carriers are typically used to store and transport wafers, thus preventing damage caused by mechanical stress, particulate contamination, or chemical corrosion during handling and storage.

[0003] Traditional wafer carriers are primarily designed for wafers of conventional thickness (typically 200 to 300 micrometers). However, with the development of new materials technologies and the increasing demands of specific applications, such as power semiconductors, optoelectronic devices, and high-power laser manufacturing, a new class of thick wafers has emerged. These thicker wafers are significantly thicker than traditional wafers, typically reaching 1000 micrometers or even higher. These thick wafers place higher demands on the ease and accuracy of installation and the precise positioning of the wafer carrier within the wafer silo during processing and transportation. Utility Model Content

[0004] In view of this, the present invention provides a 6-inch thick wafer carrier to solve the above problems.

[0005] A 6-inch thick wafer carrier includes a support frame, a wafer receiving cavity disposed within the support frame, two side ears respectively disposed on both sides of the wafer receiving cavity, and a support foot disposed below the support frame and the wafer receiving cavity. The support frame includes a main body. The wafer receiving cavity includes multiple receiving segments with both ends connected to the main body of the support frame. Two spaced-apart receiving segments form receiving grooves, which are hollowed out. The multiple receiving grooves and the main body of the support frame form the wafer receiving cavity. The receiving grooves on both sides of the wafer receiving cavity are correspondingly arranged. The two receiving segments are inclined in a direction away from the wafer receiving cavity. The receiving segments are bent towards the wafer receiving cavity, and the connection between the wafer receiving cavity and the support foot is tangent to the wafer. Multiple connecting strips are provided laterally on the outer side of the multiple receiving segments away from the wafer receiving cavity, connecting to the main body of the support frame. The connecting strips are located on both sides of the wafer receiving cavity at a distance equal to the diameter of the 6-inch wafer and at tangent points. The support foot has a positioning hole on the side opposite to the side ear, and guide sections inclined toward the positioning hole are provided on both sides of the positioning hole.

[0006] Furthermore, the load-bearing frame also includes a load-bearing front plate disposed in the main body of the load-bearing frame, and a load-bearing rear plate disposed on the main body of the load-bearing frame opposite to the load-bearing front plate. The load-bearing front plate has two observation slots on opposite sides in the longitudinal direction, and a transversely arranged reinforcing rib is provided between the two observation slots.

[0007] Furthermore, the angle between the orientation of the receiving section and the central axis of the wafer receiving cavity is 5 degrees.

[0008] Furthermore, the spacing between the receiving grooves is set between 600 and 1500 micrometers.

[0009] Furthermore, the wafer receiving cavity is provided with 20 receiving slots.

[0010] Furthermore, the side ears are disposed on the side of the main body of the support frame away from the support foot, and are located at both ends of the outer side of the wafer receiving cavity.

[0011] Furthermore, the central angle of the positioning hole is set between 190 and 220 degrees.

[0012] Compared with existing technologies, this utility model provides a wafer carrier for 6-inch thick wafers, which includes a wafer receiving cavity and supporting feet to facilitate the installation of 6-inch thick wafers and make it easier to install the wafer carrier in a wafer cadmium. The receiving section in the wafer receiving cavity is inclined away from the wafer receiving cavity to facilitate placing the wafer into the receiving slot. Because the receiving section is bent towards the wafer receiving cavity, the connection between the wafer receiving cavity and the supporting feet is tangent to the wafer. A connecting strip located on the outer side of multiple receiving sections is positioned at a point where the distance between the two sides of the wafer receiving cavity is equal to and tangent to the diameter of the 6-inch wafer, thus determining the installation position of the 6-inch wafer. The supporting feet have positioning holes on the side opposite the side ears, and guide sections inclined towards the positioning holes on both sides of the positioning holes, making the installation of the positioning holes and the wafer cadmium more convenient. Attached Figure Description

[0013] Figure 1 This utility model provides a structural schematic diagram of a wafer carrier used in 6-inch thick wafers.

[0014] Figure 2 A schematic diagram of the structure of the wafer carrier used for loading wafers in a 6-inch thick wafer.

[0015] Figure 3 Another structural schematic diagram of the wafer carrier used for loading 6-inch thick wafers.

[0016] Figure 4 for Figure 3The enlarged structural diagram of point A of the wafer carrier used for loading 6-inch thick wafers. Detailed Implementation

[0017] The specific embodiments of this utility model are described in further detail below. It should be understood that the description of the embodiments of this utility model herein is not intended to limit the scope of protection of this utility model.

[0018] The terminology used herein is intended to explain the embodiments and is not intended to limit and / or restrict the present invention. It should be understood that the terms "front," "rear," "left," "right," "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are used only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0019] Please see Figures 1 to 4 This is a schematic diagram of a wafer carrier for a 6-inch thick wafer, provided by this utility model. The wafer carrier for a 6-inch thick wafer includes a support frame 10, a wafer receiving cavity 20 disposed within the support frame 10, two side ears 30 respectively disposed on both sides of the wafer receiving cavity 20, and a support foot 40 disposed below the support frame 10 and the wafer receiving cavity 20. It is conceivable that the wafer carrier for a 6-inch thick wafer also includes other functional modules, such as identification numbers disposed on the side ears, which are techniques well known to those skilled in the art and will not be described in detail here.

[0020] A wafer is a silicon wafer used in the fabrication of semiconductor integrated circuits. Various circuit element structures can be fabricated on silicon wafers. Wafers are transported, processed, and cleaned within the factory using open cassette-type wafer carriers.

[0021] The support frame 10 supports various functional components. The support frame 10 includes a support frame body 11, a front support plate 12 disposed on the support frame body 11, and a rear support plate 13 disposed opposite to the front support plate 12. The front support plate 12 has two observation slots 121 on opposite sides in the longitudinal direction to facilitate observation of the wafer in the wafer receiving cavity 20. A transversely arranged reinforcing rib 122 is provided between the two observation slots 121 to enhance the structural strength of the support frame body 11 and the front support plate 12. The rear support plate 13 is plate-shaped and prevents the wafer from falling off.

[0022] The wafer receiving cavity 20 includes multiple receiving segments 21 connected at both ends to the support frame body 11. Two spaced-apart receiving segments 21 form receiving grooves 22. The receiving grooves 22 are hollowed out. The multiple receiving grooves 22 and the support frame body 11 form the wafer receiving cavity 20. The receiving grooves 22 on both sides of the wafer receiving cavity 20 are correspondingly arranged. The two receiving segments 21 are inclined in a direction away from the wafer receiving cavity 20 to facilitate placing the wafer into the receiving groove. In this embodiment, the angle between the direction of the receiving segment 21 and the central axis of the wafer receiving cavity 20 is 5 degrees. Since the receiving segment 21 is bent toward the wafer receiving cavity 20, the distance between the two sides of the wafer receiving cavity 20 gradually decreases from the bending point to the direction near the support foot 40. The connection between the wafer receiving cavity 20 and the support foot 40 is tangential to the wafer and provides support. Multiple receiving sections 21 are provided with multiple connecting strips 23 laterally connected to the supporting frame body 11 on the outer side away from the wafer receiving cavity 20. The connecting strips 23 are located on both sides of the wafer receiving cavity 20 at a distance equal to the diameter of the 6-inch wafer and at a tangent position, serving to fix the wafer and thus determine its mounting position. Because the slot pitch of standard 6-inch wafer carriers on the market is around 650 micrometers, there are relatively few wafer carriers suitable for transporting 6-inch thick wafers. Therefore, the slot pitch of the receiving slots 22 is set between 600-1500 micrometers to accommodate wafers with a diameter of 6 inches and a thickness greater than the standard 650 micrometers. In this embodiment, the slot pitch of the receiving slots 22 is set to 1500 micrometers. In this embodiment, the wafer receiving cavity 20 has 20 receiving slots 22 to accommodate the slot width of the receiving slots 22.

[0023] The side ears 30 are disposed on the side of the main body 11 away from the support feet 40 and are located at both ends of the outer side of the wafer receiving cavity 20.

[0024] The support foot 40 supports the carrier frame 10, preventing the wafer from contacting other objects at the end facing the support foot 40, thus ensuring the cleanliness of the wafer. The support foot 40 has a positioning hole 41 on the side opposite the side ear 30 to facilitate determining the installation position of the wafer carrier in the wafer cadmium. The central angle of the positioning hole 41 is set between 190 and 220 degrees. Guide sections 42 inclined towards the positioning hole 41 are provided on both sides of the positioning hole 41, making installation of the positioning hole 41 with the wafer cadmium more convenient.

[0025] Compared with the prior art, the present invention provides a wafer carrier for 6-inch thick wafers, which includes a wafer receiving cavity 20 and a support foot 40 to facilitate the installation of 6-inch thick wafers and make it easier to install the wafer carrier in a wafer hopper. The receiving section 21 in the wafer receiving cavity 20 is inclined away from the wafer receiving cavity 20 to facilitate placing the wafer into the receiving slot 22. Because the receiving section 21 is bent towards the wafer receiving cavity 20, the connection between the wafer receiving cavity 20 and the support foot 40 is tangent to the wafer. A connecting strip 23, located on the outer side of the plurality of receiving sections 21, is positioned at a distance equal to and tangent to the diameter of the 6-inch wafer from both sides of the wafer receiving cavity 20, thereby determining the installation position of the 6-inch wafer. The support foot 40 has a positioning hole 41 on the side opposite to the side ear 30. The positioning hole 41 has guide sections 42 on both sides that are inclined toward the positioning hole 41, making it easier to install the positioning hole 41 with the wafer hopper.

[0026] The above are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Any modifications, equivalent substitutions or improvements within the spirit of the present utility model are covered within the scope of the claims of the present utility model.

Claims

1. A wafer carrier for use on 6-inch thick wafers, characterized in that: The 6-inch thick wafer carrier includes a support frame, a wafer receiving cavity disposed within the support frame, two side ears respectively disposed on both sides of the wafer receiving cavity, and a support leg disposed below the support frame and the wafer receiving cavity. The support frame includes a main body, and the wafer receiving cavity includes multiple receiving segments with both ends connected to the main body of the support frame. Two spaced-apart receiving segments form receiving grooves, which are hollowed out. The multiple receiving grooves and the main body of the support frame form the wafer receiving cavity. The side ears on both sides of the wafer receiving cavity... The receiving slots are correspondingly arranged, and the two receiving sections are inclined in the direction away from the wafer receiving cavity. The receiving sections are bent towards the wafer receiving cavity. The connection between the wafer receiving cavity and the support foot is tangent to the wafer. Multiple receiving sections are provided with multiple connecting strips that are laterally connected to the main body of the support frame on the outer side away from the wafer receiving cavity. The connecting strips are located at the distance between the two sides of the wafer receiving cavity and the diameter of the 6-inch wafer and are tangent to each other. The support foot is provided with a positioning hole on the side opposite to the side ear. Guide sections inclined towards the positioning hole are provided on both sides of the positioning hole.

2. The wafer carrier for a 6-inch thick wafer as described in claim 1, characterized in that: The load-bearing frame also includes a load-bearing front plate disposed in the main body of the load-bearing frame, and a load-bearing rear plate disposed on the main body of the load-bearing frame opposite to the load-bearing front plate. The load-bearing front plate has two observation slots on opposite sides in the longitudinal direction, and a transversely arranged reinforcing rib is provided between the two observation slots.

3. The wafer carrier for a 6-inch thick wafer as described in claim 1, characterized in that: The angle between the orientation of the receiving section and the central axis of the wafer receiving cavity is 5 degrees.

4. The wafer carrier for 6-inch thick wafers as described in claim 1, characterized in that: The spacing between the receiving grooves is set between 600 and 1500 micrometers.

5. The wafer carrier for a 6-inch thick wafer as described in claim 1, characterized in that: The wafer receiving cavity is provided with 20 receiving slots.

6. The wafer carrier for a 6-inch thick wafer as described in claim 1, characterized in that: The side ears are located on the side of the main body of the support frame away from the support feet, and at both ends of the outer side of the wafer receiving cavity.

7. The wafer carrier for a 6-inch thick wafer as described in claim 1, characterized in that: The central angle of the positioning hole is set between 190 and 220 degrees.

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