Wafer processing module and semiconductor process machine

Abstract

The utility model relates to a wafer processing module and a semiconductor process machine. The semiconductor process machine table is provided with a process chamber, and a wafer processing module is arranged in the process chamber; the wafer processing module comprises a support ring, a telescopic structure and a workbench. The supporting ring is arranged on the workbench through a telescopic structure. The top end of the telescopic structure is connected with the supporting ring, and the bottom end is connected with the workbench. The supporting ring is used for bearing and fixing a wafer; the workbench is provided with a boss, and the boss at least partially extends into the center cavity of the supporting ring. Through the configuration, the distance between the wafer and the boss can be adjusted through the telescopic structure, the front face of the thinned wafer is prevented from making contact with the boss, warping sizes of different degrees can be covered, particularly, limitation of a process machine table is broken through, and the wafer can be made thinner.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field, concretely relates to a wafer processing module and semiconductor process machine platform for processing and handling wafer on back surface. BACKGROUND

[0002] In prior art, in order to make more complex integrated circuit, need to thin the back surface of wafer, reduce wafer thickness. Wafer back surface is thinned, and then it is easy to warp in production process, influence subsequent manufacture. For example, when carrying out coating film processing and handling to wafer thinned back surface, once warping size exceeds the distance that is set in advance, the front surface of thinned wafer will contact the surface of lower workbench, and the front surface of thinned wafer is polluted or damaged. In addition, once the front surface of thinned wafer contacts the workbench, it will also affect electrical parameter, and make electrical parameter abnormal. Moreover, the distance that is set in advance cannot be adjusted according to the warping degree of different products, so as to frequently replace machine parts, not only high in use cost, but also seriously affect the working efficiency of machine. SUMMARY

[0003] In view of the technical problems in prior art, the utility model aims at providing a wafer processing module and semiconductor process machine platform, which aims at avoiding the front surface of thinned wafer from contacting the lower workbench, greatly improving wafer defect, covering different degrees of warping, expanding the application range, reducing the cost and improving the working efficiency of machine.

[0004] To achieve the above-mentioned purpose, the utility model provides a wafer processing module, which comprises: a support ring, a telescopic structure and a workbench; the support ring is arranged on the workbench through the telescopic structure; the top end of the telescopic structure is connected with the support ring, and the bottom end of the telescopic structure is connected with the workbench; the support ring is used for bearing and fixing a wafer; the workbench has a boss, and the boss at least partially extends into the central cavity of the support ring.

[0005] Optionally, the wafer processing module further comprises a protective ring arranged above the support ring.

[0006] Optionally, the wafer processing module further comprises a motor arranged in the workbench, and the motor is connected with the telescopic structure to drive the telescopic structure to extend and retract.

[0007] Optionally, the telescopic structure comprises at least three telescopic rods, and the at least three telescopic rods are arranged between the support ring and the bottom end of the boss and are arranged along the circumference of the support ring.

[0008] Optionally, the maximum height of the telescopic structure is less than or equal to the height of the boss.

[0009] Optionally, the maximum height of the telescopic structure is less than or equal to 3mm.

[0010] Optionally, the distance between the top surface of the boss and the center position of the front surface of the wafer facing the boss is greater than 2mm, or the distance between the top surface of the boss and the center position of the front surface of the wafer facing the boss is 3mm to 5mm.

[0011] Optionally, the workbench comprises a cooling device.

[0012] Based on the same inventive concept, the utility model also provides a semiconductor process machine table, has process chamber, be provided with wafer processing module of preceding described any one in process chamber.

[0013] Optionally, the semiconductor process machine table further comprises a control system, the control system is connected with the motor in wafer processing module, the motor is arranged in the workbench and is connected with the telescopic structure, and the motor is used for driving the telescopic structure to stretch out and draw back under the control of the control system.

[0014] Compared with the prior art, the technical scheme provided by the utility model has at least the following beneficial effects:

[0015] The wafer processing module and the semiconductor process machine table can adjust the height of the supporting ring, thereby indirectly adjusting the distance between the wafer and the boss of the workbench, preventing the front surface of the thinned wafer from contacting the boss, and covering different degrees of warping size, thereby meeting the processing requirements of products with different degrees of warping, and especially breaking through the limitation of the process machine table, providing a good solution for thinning the wafer, even to thinner. BRIEF DESCRIPTION OF DRAWINGS

[0016] Those skilled in the art will understand that the provided drawings are used to better understand the utility model, and do not constitute any limitation on the scope of the utility model.

[0017] Figure 1 is a structural schematic view of the wafer processing module provided by the utility model according to an embodiment, the wafer back is upward, and the wafer front is downward.

[0018] In the drawings: 1-wafer, 11-protective ring, 12-supporting ring, 121-center cavity, 13-telescopic structure, 14-workbench, 15-boss, 16-cooling device, d-distance from the center position of the wafer front to the top surface of the boss. DETAILED DESCRIPTION

[0019] The utility model makes further detailed instructions to the utility model in combination with drawings. The advantages and features of the utility model will be more clear according to the following description. It should be noted that all drawings adopt very simplified form and all use non-precise proportion, only to facilitate, clear and assist the purpose of explaining the utility model embodiment. It should be recognized that the relative terms such as "upper", "lower", "top", "bottom", "upper" and "lower" shown in the drawings can be used to describe the relationship between various elements. These relative terms are intended to cover different orientations of the elements in addition to the orientation depicted in the drawings. For example, if the device is inverted relative to the view in the drawing, the element described as "above" another element will now be below the element.

[0020] One of the purposes of the utility model is to provide a wafer processing module, which mainly processes the thinned wafer, and the processing mode can be film plating (i.e. wafer back metallization process, which uses various common metal materials such as titanium, nickel, silver, gold and other metal films), of course, it can also be other back processing technology, and the present application is not limited to this.

[0021] The wafer processing module provided by the utility model aims to solve the problem that in the prior art, when the thinned wafer back surface is processed, the front surface of the thinned wafer is contaminated or damaged due to the warping contact of the front surface of the thinned wafer to the workbench.

[0022] The second purpose of the utility model is to provide a semiconductor process machine, which is provided with a process chamber, and a wafer processing module is arranged in the process chamber.

[0023] For the convenience of description, the film plating of the thinned wafer back surface is taken as an example for description in this paper. Those skilled in the art can modify the description of the embodiments of the present application to adapt to other processing of the thinned wafer. The wafer processing module and the semiconductor process machine will be further described in the following.

[0024] As shown in Figure 1 The utility model embodiment provides a wafer processing module, which needs to be arranged in a process chamber (not shown), specifically, the wafer processing module comprises a support ring 12, a telescopic structure 13 and a workbench 14.

[0025] Optionally, the wafer processing module further comprises a protective ring 11, which is arranged above the support ring 12 and is used for protecting the wafer 1, so that the target material in the process will not be sputtered on the inner wall of the process chamber, but only fall on the back surface of the wafer 1. Figure 1 In the embodiment, the bottom of the protective ring 11 contacts the top of the support ring 12, achieving the protection effect.

[0026] The support ring 12 is arranged on the workbench 14 through the telescopic structure 13, specifically, the top end of the telescopic structure 13 is connected with the support ring 12, and the bottom end of the telescopic structure 13 is connected with the workbench 14. The connection mode between the telescopic structure 13 and the support ring 12 and the workbench 14 is detachable connection or non-detachable connection. The support ring 12 is used for carrying and fixing the wafer 1. The wafer 1 is a back-thinning wafer, and the thickness and diameter of the wafer 1 are not limited.

[0027] The support ring 12 also has the effect of protecting the front surface of the workbench 14 and the wafer 1, so that the target material in the process cannot be sputtered onto the front surface of the workbench 14 and the wafer 1. For this purpose, the workbench 14 is arranged in a stepped structure and forms a boss 15. The boss 15 at least partially extends into the central cavity 121 of the support ring 12. That is, the inner diameter of the support ring 12 is slightly larger than the outer diameter of the boss 15. In addition, in some application scenarios, the workbench 14 also has a cooling function, as shown in the figure, the workbench 14 can include a cooling device 16 for heat dissipation and cooling of the wafer 1. Since the present application does not involve improvement of the cooling device 16, the specific structure and cooling mode of the cooling device 16 are not limited, for example, a cooling disc, a cooling pipeline or the like can be used as the cooling device 16.

[0028] Further, since the telescopic structure 13 itself has the telescopic function, the telescopic structure 13 can adjust the height of the support ring 12 by changing the length (or height) of the telescopic structure 13, thereby indirectly adjusting the distance d from the wafer 1 to the boss 15, so that the distance d can be large or small, which not only adapts to wafers of different thicknesses, but also meets the processing needs of wafers with different degrees of warping.

[0029] As can be seen, the wafer processing module can adjust the height of the support ring 12 through the telescopic structure 13, thereby indirectly adjusting the distance d from the wafer 1 to the boss 15 of the workbench 14, which not only prevents the front surface of the thinned wafer 1 from contacting the boss 15, but also covers different degrees of warping size, thereby meeting the processing needs of products with different degrees of warping, especially breaking through the limitation of the process machine, providing a good solution for wafer thinning, even thinner.

[0030] That is, the wafer processing module provided by the embodiment can be applied to the processing of wafers with smaller thickness, and can effectively prevent the front surface of the wafer 1 from contacting the boss 15. For example, the original machine can only cope with a warping size of 2mm, while the present application can cope with a warping size of more than 2mm (such as 3mm, 4.5mm, etc.), even if the wafer 1 has a larger warping degree, the front surface of the wafer 1 can also be prevented from contacting the boss 15.

[0031] In practice, there are many ways to realize the telescopic structure 13, and one skilled in the art can choose at least one of them to implement. For example, it can be realized by driving a motor, or by telescoping a telescopic rod, which is realized by nesting multiple rods, and in other cases, the telescopic structure 13 can also be realized by inflating and deflating a bag, etc.

[0032] In this embodiment, the wafer processing module further includes a motor (not shown) disposed in the workbench 14. The motor here is connected to the telescopic structure 13 to drive the telescopic structure 13 to telescope. The motor can be a rotary motor or a linear motor.

[0033] Further, in view of the actual situation, considering that the distance d between the wafer 1 and the boss 15 needs to be adjusted, which is usually a few millimeters, and the installation space is limited, therefore, a telescopic rod which is easier to realize and has a simpler structure is adopted.

[0034] Therefore, in a preferred embodiment, the telescopic structure 13 adopts a telescopic rod (or movable pin), which is composed of at least two rods, and the adjacent rods are movably connected to facilitate telescopic adjustment. Generally, the telescopic adjustment can be achieved by screw adjustment or by different locking positions. Different locking positions mean that adjacent rods can be locked at different positions.

[0035] For example, the telescopic rod includes a first rod and a second rod; the diameter of the second rod is smaller than that of the first rod, so that the second rod is nested in the first rod. In addition, the length of the second rod is longer than that of the first rod, so that the second rod can be extended from the first rod. Through this structure, the height of the support ring 12 is increased or decreased, thereby increasing the distance from the front surface of the wafer 1 to the top surface of the boss 15, so that the semiconductor process machine can cover a larger wafer warpage.

[0036] The telescopic structure 13 can be one, for example, directly setting the telescopic structure 13 as a ring structure. In this embodiment, the telescopic structure 13 includes at least three telescopic rods, which are disposed between the support ring 12 and the bottom end of the boss 15, and are spaced apart along the circumference of the support ring 12, thereby stably supporting the support ring 12. The at least three telescopic rods are preferably uniformly distributed along the circumference. More preferably, the telescopic structure 13 includes four telescopic rods, which are more stable and reliable in support. Then, the motor can drive multiple telescopic rods to telescope synchronously.

[0037] As a variant, the telescopic structure 13 can also be manually adjusted to telescope, or a combination of manual and electric use. When used in combination of manual and electric, the telescopic structure 13 can be controlled to telescope by the motor, or the telescopic structure 13 can be adjusted by manual mode, which is more convenient to use.

[0038] In addition, the height of the telescopic structure 13 is less than or equal to the height of the boss 15. For example, in some application scenarios, the height of the boss 15 is 3 mm, and the maximum height of the telescopic structure 13 is less than or equal to 3 mm. In summary, the maximum height or adjustable distance of the telescopic structure 13 can be set according to the size of the boss 15 and the center cavity 121 of the support ring 12, as long as the center cavity 121 of the support ring 12 does not deviate from the boss 15.

[0039] Preferably, the distance d between the center position of the front surface of the wafer 1 and the top surface of the boss 15 is greater than 2 mm, and more preferably, d is 3 mm to 5 mm, such as 3 mm, 3.5 mm, 4 mm, 4.5 mm or 5 mm. The center position of the front surface of the wafer 1 is the position with the largest warping size.

[0040] Correspondingly, the utility model embodiment further provides a semiconductor process machine, which has a process chamber, and the process chamber is provided with the wafer processing module of any of the foregoing embodiments.

[0041] Moreover, the semiconductor process machine usually further includes a control system, which is arranged outside the process chamber and is convenient for an operator to operate and monitor. The control system can adopt any existing device with a control function, such as an original automatic control center, console, control terminal or the like of the semiconductor process machine. In summary, those skilled in the art can know how to select based on the disclosure of the present application and common knowledge in the art. The control system has an operation panel, such as a man-machine interface, which is convenient for the operator to adjust parameters, programs and the like as needed.

[0042] Preferably, the control system is in communication connection with the motor, so that the motor drives the telescopic structure 13 to extend or retract according to the instruction of the control system, and controls the height of the telescopic structure 13, thereby solving the problem of different warping.

[0043] It should be noted that the control system can control the speed, direction and displacement of the motor, and indirectly control the lifting direction and lifting height of the telescopic structure 13, so as to realize high-precision positioning. In actual use, a program for controlling the telescopic structure 13 by the motor can be added to the control system of the original semiconductor process machine. The height (absolute height or relative height) of the telescopic structure 13 can be input into the control system by the operator through a communication interface (such as a man-machine interface), and the height of the telescopic structure 13 can be adjusted and set at any time as needed, so as to cover products with different warping.

[0044] Finally, it should be noted that the innovation of the present application is derived from the field of back surface film coating technology for wafer thinning, but those skilled in the art can understand that the present application can also be applied to other process treatment technologies for wafer thinning. At this time, the warping problem existing during the post-thinning processing of the wafer can also be solved using the above-mentioned technology. In short, as long as there is a field of wafer thinning warping problem, the technical concept of the present application can be applied to achieve basically the same or similar effect.

[0045] It should be understood that the above embodiments specifically disclose the features of the preferred embodiments of the present application, so that those skilled in the art can better understand the present application. Those skilled in the art should understand that, on the basis of the disclosure content of the present application, the present application can be appropriately modified to achieve the same purpose and / or achieve the same advantages as the disclosed embodiments of the present application. Those skilled in the art should also realize that such similar structures do not deviate from the scope disclosed by the present application, and they can be variously changed, replaced and changed without deviating from the scope disclosed by the present application.

Claims

1. A wafer processing module, characterized in that, The application relates to a wafer processing module, comprising: a support ring, a telescopic structure and a workbench; the support ring is arranged on the workbench through the telescopic structure; the top end of the telescopic structure is connected with the support ring, and the bottom end of the telescopic structure is connected with the workbench; the support ring is used for bearing and fixing a wafer; the workbench is provided with a boss which is at least partially inserted into a central cavity of the support ring.

2. The wafer processing module of claim 1, wherein, Further comprising: a protection ring arranged above the support ring.

3. The wafer processing module of claim 1 or 2, wherein, Further comprising a motor arranged in the workbench, the motor being connected with the telescopic structure to drive the telescopic structure to perform telescopic operation.

4. The wafer processing module of claim 1 or 2, wherein, The telescopic structure comprises at least three telescopic rods, the at least three telescopic rods being arranged between the support ring and the bottom end of the boss and being arranged in a circumferential direction of the support ring.

5. The wafer processing module of claim 1 or 2, wherein, The maximum height of the telescopic structure is less than or equal to the height of the boss.

6. The wafer processing module of claim 5, wherein, The maximum height of the telescopic structure is less than or equal to 3mm.

7. The wafer processing module of claim 1 or 2, wherein, The distance between the top surface of the boss and the central position of the front surface of the wafer facing the boss is greater than 2mm, or the distance between the top surface of the boss and the central position of the front surface of the wafer facing the boss is 3mm-5mm.

8. The wafer processing module of claim 1 or 2, wherein, The workbench comprises a cooling device.

9. A semiconductor processing tool having a process chamber, wherein: The process chamber is provided with the wafer processing module as claimed in any one of claims 1-8.

10. The semiconductor processing tool of claim 9, wherein, Further comprising a control system, the control system being in communication connection with the motor in the wafer processing module; the motor is arranged in the workbench and is connected with the telescopic structure; the motor is used for driving the telescopic structure to perform telescopic operation under the control of the control system.

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