Semiconductor wafer fixing device

Abstract

The utility model relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer fixing device, which comprises a seat body, a bearing guide part, a suction plate, a communicating shell and a connector, the seat body comprises a seat shell, the left side of the seat shell is communicated with a connecting pipe, the upper side of the seat shell is communicated with a shunting shell, the outer side of the shunting shell is communicated with a group of four folding hoses, and the folding hoses are connected with the connecting pipe. The upper side of the seat shell is provided with a group of four bearing guide parts, each bearing guide part comprises a guide plate fixed to the seat shell, the inner side of a hole position of each guide plate is rotationally connected with a screw rod, the outer side of each screw rod is spirally connected with a screw sleeve, and the corresponding screw sleeve is connected with the corresponding folding hose. According to the semiconductor wafer fixing device provided by the utility model, through the arrangement of the seat body, the guide bearing part, the suction plate, the communication shell, the connector and other structures, the semiconductor wafer fixing device enables a worker to adaptively adjust the suction position according to the size of a wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer technology, specifically to a semiconductor wafer fixing device. Background Technology

[0002] Semiconductor wafers, or simply wafers, are thin sheets of semiconductor materials (such as crystalline silicon) used to manufacture integrated circuits. In wafer processing, multiple steps require fixing devices to hold the wafer in place to ensure stable and efficient processing.

[0003] Existing semiconductor wafer fixing devices mostly use chucks, which use suction to press the wafer tightly against the surface of the chuck to achieve fixing. However, since the suction hole positions of these chucks are usually fixed, they may not be flexible enough when adapting to wafers of different diameters, resulting in limited applicability. Therefore, a semiconductor wafer fixing device is proposed to address the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor wafer fixing device to solve the problem that the suction hole position and adsorption position of existing semiconductor wafer fixing devices are usually fixed, which may not be flexible enough when adapting to wafers of different diameters, resulting in limited applicability.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor wafer fixing device includes a base, a guide portion, a suction plate, a connecting shell, and a connector. The base includes a base shell, with a connecting pipe connected to the left side of the base shell and a shunt shell connected to the upper side of the base shell. A set of four folded flexible tubes are connected to the outer side of the shunt shell, and the folded flexible tubes are arranged at equal angles with the shunt shell as the center. A set of four guide portions are installed on the upper side of the base shell. Each guide portion includes a guide plate fixed on the base shell. A lead screw is rotatably connected to the inner side of a hole in the guide plate. A threaded sleeve is helically connected to the outer side of the lead screw. A linkage block is fixedly connected to the outer side of the threaded sleeve and slidably connected to the inner wall of the guide plate's groove. A knob is fixedly connected to the end of the lead screw away from the linkage block. A connecting shell connected to the other end of the folded flexible tube is slidably connected to the inner side of the lower groove of the guide plate. A suction plate that fits against the connecting shell is fixedly connected to the upper side of the guide plate.

[0007] Preferably, the suction plate has four suction hole groups arranged at equal angles, and the suction holes of the suction plate suction hole groups are arranged in double rows at equal intervals. The top of the upper convex shells on both sides of the connecting shell is provided with through holes, and the suction hole groups of the suction plate are all arranged on the upper side of the through holes of the connecting shell.

[0008] Preferably, a connector is installed inside the through hole of the communicating shell. The connector includes a tube shell that is fixedly connected to the inner wall of the through hole of the communicating shell. An arc-shaped connecting ring is slidably connected to the upper inner side of the tube shell, and a spring located inside the tube shell is fixedly connected to the lower side of the arc-shaped connecting ring.

[0009] Preferably, the upper end of the arc-connecting ring protrudes from the tube shell, the upper end diameter of the arc-connecting ring is smaller than the lower end diameter, the lower end diameter of the arc-connecting ring is larger than the inner diameter of the upper opening of the tube shell, and the diameter of the spring is larger than the inner diameter of the lower opening of the tube shell.

[0010] Preferably, the linkage block has notches on both sides, the upper convex shells on both sides of the connecting shell are all disposed in the notches of the linkage block, and the lower end face of the connecting shell is in contact with the upper end face of the base shell.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] In this invention, the structure consisting of a base, a guide, a suction plate, a connecting shell, and a connector allows the base to support these components. Simultaneously, it connects to an external air pump via a connecting pipe, enabling the base to draw air through the connecting shell and connector. The guide allows adjustment of the position of the connecting shell and connector, connecting them to suction holes at different locations on the suction plate. Adjusting the suction plate's position accommodates wafers of different diameters, enabling operators to adapt the suction position to the wafer's dimensions. This solves the problem of existing semiconductor wafer fixing devices, where the suction hole and suction positions are typically fixed, limiting their applicability when adapting to wafers of different diameters. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the suction plate of this utility model;

[0015] Figure 3 This utility model Figure 1 A schematic diagram of the suction plate structure;

[0016] Figure 4 This is a schematic diagram of the structure of the base of this utility model;

[0017] Figure 5 This is a schematic diagram of the structure of the guide section of this utility model;

[0018] Figure 6 This is a cross-sectional view of the connecting shell of this utility model;

[0019] Figure 7 This is a cross-sectional view of the connector of this utility model.

[0020] In the diagram: 1. Base; 11. Base housing; 12. Connecting pipe; 13. Diverter housing; 14. Folded flexible hose; 2. Guide section; 21. Guide plate; 22. Lead screw; 23. Lead sleeve; 24. Linking block; 25. Knob; 3. Suction plate; 4. Connecting housing; 5. Connector; 51. Pipe housing; 52. Arc joint ring; 53. Spring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0023] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0024] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0025] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0026] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0027] Please see Figure 1-7 This utility model provides a technical solution:

[0028] A semiconductor wafer fixing device includes a base 1, a guide portion 2, a suction plate 3, a connecting shell 4, and a connector 5. The base 1 includes a base housing 11, a connecting pipe 12 connected to the left side of the base housing 11, a shunt shell 13 connected to the upper side of the base housing 11, and a set of four folded flexible tubes 14 connected to the outer side of the shunt shell 13, the folded flexible tubes 14 being arranged at equal angles with the shunt shell 13 as the center. A set of four guide portions 2 are installed on the upper side of the base housing 11, the guide portions 2 including those fixed to the base housing 11. The guide plate 21 has a lead screw 22 rotatably connected to the inner side of the hole of the guide plate 21. The lead screw 22 is screwed to the outer side of the lead screw 23. The outer side of the lead screw 23 is fixedly connected to a linkage block 24 that slides with the inner wall of the guide plate 21. The end of the lead screw 22 away from the linkage block 24 is fixedly connected to a knob 25. The lower groove of the guide plate 21 is slidably connected to a connecting shell 4 that communicates with the other end of the folded hose 14. The upper side of the guide plate 21 is fixedly connected to a suction plate 3 that fits against the connecting shell 4.

[0029] The suction plate 3 has four suction hole groups arranged at equal angles, and the suction holes of the suction plate 3 are arranged in double rows at equal intervals. Through holes are opened on the top of the convex shells on both sides of the connecting shell 4. The suction hole groups of the suction plate 3 are all located above the through holes of the connecting shell 4. This arrangement allows each connecting shell 4 to align with each suction hole of the suction plate 3 by movement. Connecting heads 5 are installed inside the through holes of the connecting shell 4. Each connecting head 5 includes a tube shell 51 fixedly connected to the inner wall of the through hole of the connecting shell 4. An arc-shaped connecting ring 52 is slidably connected to the upper inner side of the tube shell 51. A spring 53 located inside the tube shell 51 is fixedly connected to the lower side of the arc-shaped connecting ring 52. This arrangement allows the connecting shell 4 to connect and communicate with the suction holes of the suction plate 3 through the connecting head 5. The upper end of the arc-shaped connecting ring 52 protrudes from the tube shell 51. This arrangement allows the upper end of the arc-shaped connecting ring 52 to... The upper diameter of the arc-shaped connecting ring 52 is smaller than that of the lower diameter, while the lower diameter of the arc-shaped connecting ring 52 is larger than the inner diameter of the upper opening of the tube shell 51. This design allows the tube shell 51 to limit the arc-shaped connecting ring 52, preventing it from detaching from the tube shell 51. The diameter of the spring 53 is larger than the inner diameter of the lower opening of the tube shell 51. This design ensures that the spring 53 remains within the tube shell 51, pushing the arc-shaped connecting ring 52 upwards without detaching from the lower opening of the tube shell 51. The connecting block 24 has notches on both sides, and the upper convex shells on both sides of the connecting shell 4 are located within the notches of the connecting block 24. This design allows the displacement of the connecting block 24 to move the connecting shell 4. The lower end face of the connecting shell 4 is in contact with the upper end face of the seat shell 11. This design ensures that the connecting shell 4 remains stable during displacement.

[0030] Workflow: The semiconductor wafer fixing device fixes the wafer as follows: First, connect the connector 12 of the base 1 to an external air pump. Then, by starting the external air pump, the base 1 evacuates air from the connecting shell 4 through the various folded hoses 14, the shunt shell 13, and the base shell 11. The connecting shell 4 can then be evacuated through the connector 5 of the arc-connected ring 52 inserted into the suction hole of the suction plate 3, allowing the suction plate 3 to adsorb and fix the wafer placed on it. When the size of the wafer does not match the current adsorption position of the suction plate 3, the screw 22 can be rotated by turning the knob 25 as needed. Since the sleeve 23 cannot rotate due to the restriction of the linkage block 24, the rotation of the screw 22 can drive the sleeve 23 to move. The displacement of the sleeve 23 will then drive the linkage block 24 to move, thereby driving the connected... The movable connecting shell 4 is displaced, and the displacement of the connecting shell 4 will drive the connector 5 to move, so that the arc-shaped connecting ring 52 located in any suction hole of the suction plate 3 is pressed into the tube shell 51 (the spring 53 is compressed). When the connecting shell 4 and the connector 5 are displaced to the appropriate suction hole position of the suction plate 3, the connector 5 will be aligned with the suction hole of the suction plate 3. At this time, the spring 53 will elastically reset and push the arc-shaped connecting ring 52 upward, so that the arc-shaped connecting ring 52 is locked into the suction hole of the suction plate 3. Through the above operation, it is possible to connect with the suction holes at different positions on the suction plate 3 to adjust the suction position of the suction plate 3. By adjusting the suction position of the suction plate 3, it can be adapted to wafers of different diameters. The semiconductor wafer fixing device allows the operator to adapt the suction position according to the size of the wafer to stably fix wafers of different sizes.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer fixing device, comprising a base (1), a guide portion (2), a suction plate (3), a connecting shell (4), and a connector (5), characterized in that: The base (1) includes a base shell (11), with a connecting pipe (12) connected to the left side of the base shell (11), and a diversion shell (13) connected to the upper side of the base shell (11). A set of four folded flexible hoses (14) are connected to the outer side of the diversion shell (13), and the folded flexible hoses (14) are arranged at equal angles with the diversion shell (13) as the center. A set of four guide parts (2) are installed on the upper side of the base shell (11), and the guide part (2) includes a guide plate (21) fixed on the base shell (11). The guide plate (21) has holes on the inner side of the holes. A lead screw (22) is dynamically connected, and a threaded sleeve (23) is spirally connected to the outside of the lead screw (22). A connecting block (24) that is slidably connected to the inner wall of the guide plate (21) is fixedly connected to the outside of the threaded sleeve (23). A knob (25) is fixedly connected to the end of the lead screw (22) away from the connecting block (24). A connecting shell (4) that communicates with the other end of the folded hose (14) is slidably connected to the inner side of the lower groove of the guide plate (21). A suction plate (3) that fits against the connecting shell (4) is fixedly connected to the upper side of the guide plate (21).

2. The semiconductor wafer fixing device according to claim 1, characterized in that: The suction plate (3) is provided with four suction hole groups arranged at equal angles, and the suction holes of the suction plate (3) are arranged in double rows at equal intervals. The top of the upper convex shells on both sides of the connecting shell (4) are provided with through holes, and the suction hole groups of the suction plate (3) are all arranged on the upper side of the through holes of the connecting shell (4).

3. The semiconductor wafer fixing device according to claim 2, characterized in that: Connectors (5) are installed inside the through holes of the connecting shell (4). Each connector (5) includes a tube shell (51) fixedly connected to the inner wall of the through hole of the connecting shell (4). An arc ring (52) is slidably connected to the upper inner side of the tube shell (51). A spring (53) located inside the tube shell (51) is fixedly connected to the lower side of the arc ring (52).

4. A semiconductor wafer fixing device according to claim 3, characterized in that: The upper end of the arc ring (52) protrudes from the tube shell (51), the upper diameter of the arc ring (52) is smaller than the lower diameter, the lower diameter of the arc ring (52) is larger than the inner diameter of the upper opening of the tube shell (51), and the diameter of the spring (53) is larger than the inner diameter of the lower opening of the tube shell (51).

5. A semiconductor wafer fixing device according to claim 3, characterized in that: The linkage block (24) has notches on both sides, and the upper convex shells on both sides of the connecting shell (4) are all set in the notches of the linkage block (24). The lower end face of the connecting shell (4) is in contact with the upper end face of the base shell (11).

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