Semiconductor lead frame mold with cooling structure

Abstract

The utility model discloses a semiconductor lead frame mold with a cooling structure, belongs to the technical field of lead frames, and solves the problem that the mold is inconvenient to cool. Comprising a base, the outer surface of the base is fixedly connected with a cooling mechanism and an ejection mechanism, the cooling mechanism comprises a cooling frame fixedly connected to the upper surface of the base, the inner wall of the cooling frame is fixedly connected with a lower die block, and the inner wall of the base is fixedly connected with a plurality of sets of cooling fins. Through cooling liquid circulation and fan auxiliary heat dissipation, the mold temperature can be rapidly and effectively reduced, and the semiconductor lead frame forming defect caused by high temperature is avoided. The cooling liquid circularly flows among the cooling frame, the pressing shell and the base, fully absorbs heat of the mold, and is matched with the fan to accelerate heat dissipation, so that the mold is always kept at a proper temperature in the production process, the forming quality of the semiconductor lead frame is improved, and the defective rate is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of lead frame, especially relates to a semiconductor lead frame mold with cooling structure. BACKGROUND

[0002] The lead frame is a chip carrier of integrated circuit, is a kind of key structural member that the electrical connection of chip internal circuit lead-out end and external lead is realized by bonding material, forms electrical circuit, it plays the bridge role of connection with external wire, and the lead frame is needed in the majority of semiconductor integrated blocks, is important basic material in electronic information industry.

[0003] The utility model discloses a semiconductor lead frame mold discloses a semiconductor lead frame mold, including workbench and lower mould, the top of workbench is all fixedly connected with support rod, the top of support rod is fixedly connected with fixed plate, the inner chamber of fixed plate is fixedly connected with hydraulic rod, the bottom of hydraulic rod is fixedly connected with upper mould;The rear side of upper mould is provided with moving mechanism, and the moving mechanism includes toothed plate.The semiconductor lead frame mold, after material is placed on the surface of lower mould, the toothed plate can be driven to move down by the upper mould moving down, simultaneously drives lower mould to move to the bottom of upper mould along the right side of sliding groove and is pressed from both sides to solve the problem that upper and lower moulds are not movable, due to mechanical misoperation in production, cause the problem of human injury, and when manually taking out the mould, due to the heavy quality of mould, the problem of increasing labor intensity is increased by frequently taking out and putting in.

[0004] In actual production process, a large amount of heat is generated in the stamping process of the mold, the high temperature can change the physical properties of the mold material, reduce the hardness and strength of the mold, accelerate the wear rate of the mold, greatly shorten the service life of the mold, and the high temperature can affect the forming precision of the semiconductor lead frame, after the mold is heated and expanded, the size of the cavity in the mold changes, so that the size and shape of the lead frame stamped out are deviated, it is difficult to meet the increasingly strict product quality standards, resulting in the increase of product defective rate, therefore, the mold is not convenient to cool down. UTILITY MODEL CONTENTS

[0005] (I) technical problem solved

[0006] In view of the problems existing in the prior art, the utility model provides a semiconductor lead frame mold with cooling structure.

[0007] (II) technical scheme

[0008] In order to achieve the above object, the utility model discloses a semiconductor lead frame mold with cooling structure through the following technical scheme, a kind of semiconductor lead frame mold with cooling structure, including base, the outer surface of the base is fixedly connected with cooling mechanism and material pushing mechanism, the cooling mechanism includes cooling frame fixedly connected on the upper surface of the base, the inner wall of the cooling frame is fixedly connected with lower mould block, and the inner wall of the base is fixedly connected with multiple groups of cooling fins, and the outer surface of the cooling frame is fixedly connected with connecting hose, the other end of the connecting hose is fixedly connected with lower pressure shell, the lower surface of the lower pressure shell is fixedly connected with upper mould block, the material pushing mechanism includes first electric telescopic rod fixedly connected on the outer surface of the base, the output of the first electric telescopic rod is fixedly connected with lifting plate, the outer surface of the lifting plate is fixedly connected with multiple groups of ejector rod.

[0009] For a preferred scheme of the semiconductor lead frame mold with cooling structure of the utility model, wherein the lower surface of the cooling frame is fixedly connected with connecting pipeline, and the other end of the connecting pipeline is fixedly connected to the inner wall of the base.

[0010] By adopting the above technical scheme, the cooling liquid in the cooling frame is conveniently introduced into the base through the connecting pipeline.

[0011] As a preferred scheme of the semiconductor lead frame mold with cooling structure of the utility model, wherein the inner wall of the lower pressure shell is fixedly connected with temperature sensor, and the outer surface of the temperature sensor is electrically connected with control panel through wire, and the outer surface of the control panel is fixedly connected to the upper surface of the base.

[0012] By adopting the above technical scheme, the cooling liquid in the lower pressure shell is conveniently detected through the temperature sensor.

[0013] As a preferred scheme of the semiconductor lead frame mold with cooling structure of the utility model, wherein the outer surface of the base is fixedly connected with multiple groups of fan, and the upper surface of the base is fixedly connected with second electric telescopic rod, and the output of the second electric telescopic rod is fixedly connected with the upper surface of the lower pressure shell.

[0014] By adopting the above technical scheme, the lower pressure shell is conveniently moved downward by starting the second electric telescopic rod, so that the outer surfaces of the upper mould block and the lower mould block can be attached.

[0015] As a preferred scheme of the semiconductor lead frame mold with cooling structure of the utility model, wherein the upper surface of the base is fixedly connected with water pump, the water inlet of the water pump is fixedly connected to the inner wall of the base, and the water outlet of the water pump is fixedly connected with first hose, and the first hose is fixedly connected to the inner wall of the lower pressure shell.

[0016] By adopting the technical scheme, the cooling liquid in the base and the cooling frame can be conveniently pumped into the lower pressing shell by starting the water pump, and then the cooling liquid in the base can be conveniently circulated.

[0017] As a preferred scheme of the semiconductor lead frame mold with the cooling structure, the material ejecting mechanism further comprises a plurality of support sleeves fixedly connected to the inner wall of the base, the inner wall of the support sleeve is in sliding connection with the outer surface of the first electric telescopic rod, and the upper surface of the first electric telescopic rod is in sliding connection with the inner wall of the lower mold block.

[0018] By adopting the technical scheme, the lower surface of the lower mold block can be conveniently prevented from being supported by the support sleeves, and the formed semiconductor lead frame can be conveniently ejected by the first electric telescopic rod.

[0019] (Three) beneficial effects

[0020] The utility model provides a semiconductor lead frame mold with cooling structure. Have the following beneficial effects:

[0021] 1. By cooling liquid circulation and fan auxiliary heat dissipation, can fast and effective reduce the mold temperature, avoid because high temperature leads to semiconductor lead frame forming defect. Cooling liquid circulates between cooling frame, lower pressing shell and base, absorbs the heat of the mold sufficiently, cooperates the fan to accelerate heat dissipation, ensure that the mold always keeps proper temperature in the production process, improved the forming quality of semiconductor lead frame, reduced the rate of defective products.

[0022] 2. By the first electric telescopic rod of material ejecting mechanism and support sleeve cooperation, realized the automatic ejection of forming product, need not manual manual piece, saved the operation time, improved production efficiency. The second electric telescopic rod controls the lifting of lower pressing shell, realizes the automatic opening and closing of mold, reduces manual intervention, makes the whole production process more coherent and smooth, further improves production efficiency, reduces the labor cost. DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the following will be needed to use the drawings in the embodiment description briefly introduced, obviously, the following description in the drawings is only some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, can also obtain other drawings according to these drawings.

[0024] Figure 1 It is the overall structure schematic diagram of the utility model;

[0025] Figure 2 It is the front cross-sectional structure schematic diagram of the utility model.

[0026] Figure 3 It is the whole side cross-sectional structure schematic diagram of the utility model;

[0027] Figure 4 It is the whole planar cross-sectional structure schematic diagram of the utility model.

[0028] In the figure, 1, base; 2, cooling mechanism;201, connecting hose;202, fan;203, temperature sensor;204, cooling frame;205, connecting pipeline;206, press-down shell;207, water pump;208, cooling fin;209, first hose;3, top material mechanism;301, lifting plate;302, first electric telescopic rod;303, ejector rod;304, support sleeve;4, second electric telescopic rod;5, control panel;6, lower mold block;7, upper mold block. DETAILED DESCRIPTION

[0029] The technical scheme in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model.

[0030] Embodiment 1

[0031] Referring to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , it is the first embodiment of the utility model, and the embodiment provides a semiconductor lead frame mold with a cooling structure, which comprises a base 1, the outer surface of the base 1 is fixedly connected with a cooling mechanism 2 and a top material mechanism 3, the cooling mechanism 2 comprises a cooling frame 204 fixedly connected to the upper surface of the base 1, the inner wall of the cooling frame 204 is fixedly connected with a lower mold block 6, and the inner wall of the base 1 is fixedly connected with a plurality of cooling fins 208, and the outer surface of the cooling frame 204 is fixedly connected with a connecting hose 201, the other end of the connecting hose 201 is fixedly connected with a press-down shell 206, and the lower surface of the press-down shell 206 is fixedly connected with an upper mold block 7.

[0032] Specifically, the lower surface of the cooling frame 204 is fixedly connected with a connecting pipe 205, the other end of the connecting pipe 205 is fixedly connected to the inner wall of the base 1, the inner wall of the lower pressing shell 206 is fixedly connected with a temperature sensor 203, the outer surface of the temperature sensor 203 is electrically connected with a control panel 5 through a wire, the outer surface of the control panel 5 is fixedly connected to the upper surface of the base 1, the outer surface of the base 1 is fixedly connected with a plurality of fans 202, and the upper surface of the base 1 is fixedly connected with a second electric telescopic rod 4, the output end of the second electric telescopic rod 4 is fixedly connected with the upper surface of the lower pressing shell 206, the upper surface of the base 1 is fixedly connected with a water pump 207, the water inlet of the water pump 207 is fixedly connected to the inner wall of the base 1, and the water outlet of the water pump 207 is fixedly connected with a first hose 209, and the first hose 209 is fixedly connected to the inner wall of the lower pressing shell 206.

[0033] Further through the circulation of the cooling liquid and the fan 202, the mold temperature can be quickly and effectively reduced, and the forming defects of the semiconductor lead frame caused by high temperature are avoided. The cooling liquid circulates between the cooling frame 204, the lower pressing shell 206 and the base 1, fully absorbs the heat of the mold, cooperates with the fan 202 to accelerate heat dissipation, ensures that the mold always maintains a suitable temperature during the production process, improves the forming quality of the semiconductor lead frame, and reduces the rate of defective products.

[0034] Embodiment 2

[0035] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 , it is a second embodiment of the utility model, which is based on the previous embodiment, and the material pushing mechanism 3 comprises a first electric telescopic rod 302 fixedly connected to the outer surface of the base 1, an output end of the first electric telescopic rod 302 is fixedly connected with a lifting plate 301, and the outer surface of the lifting plate 301 is fixedly connected with a plurality of ejector rods 303.

[0036] Specifically, the material pushing mechanism 3 further comprises a plurality of support sleeves 304 fixedly connected to the inner wall of the base 1, the inner wall of the support sleeve 304 is slidably connected with the outer surface of the first electric telescopic rod 302, and the upper surface of the first electric telescopic rod 302 is slidably connected with the inner wall of the lower mold block 6 through the base 1.

[0037] Further, the first electric telescopic rod 302 cooperates with the support sleeve 304 to realize automatic ejection of the formed product, without manual taking, saving operation time and improving production efficiency. The second electric telescopic rod 4 controls the lifting of the lower pressing shell 206 to realize automatic opening and closing of the mold, reduces manual intervention, makes the whole production process more coherent and smooth, further improves the production efficiency, and reduces the labor cost.

[0038] Working principle: when the semiconductor lead frame production, first start the second electric telescopic rod 4, its output end drive down the shell 206 to move down, so that the upper die block 7 and the lower die block 6 closely, form a complete mold cavity, for the formation of semiconductor lead frame to create conditions, mold closed, start the fan 202 and water pump 207. Water pump 207 starts to work, the base 1 and the cooling frame 204 in the cooling liquid pump into the down shell 206, realize the circulation of cooling liquid. Cooling liquid in the circulation process, constantly absorb the heat generated by the mold work, play a cooling effect. At the same time, the fan 202 starts, to the upper surface of the down shell 206 blowing airflow, accelerate the cooling liquid flowing through the down shell 206 heat dissipation, enhance the cooling effect. When the cooling liquid flows between the fins 208, can effectively take away the heat of the lower die block 6, thus cooling the semiconductor lead frame forming in the lower die block 6, ensure that it is in the appropriate temperature environment forming, improve product quality.

[0039] In this process, the temperature sensor 203 of the inner wall of the down shell 206 real-time monitoring of the temperature of the cooling liquid, and the data transmission to the control panel 5. The operator can adjust the equipment operation parameters according to the temperature information displayed on the control panel 5, to ensure the stability of the cooling effect, when the semiconductor lead frame forming is completed, start the first electric telescopic rod 302. The output end of the first electric telescopic rod 302 drive lift plate 301 upward, and then make a group of ejector rod 303 synchronous rising. Ejector rod 303 will be shaped semiconductor lead frame from the lower die block 6, facilitate the operator to take pieces, complete the whole production process.

[0040] It should be noted that in this article, such as first and second relationship terms such as only to distinguish one entity or operation with another entity or operation, and does not necessarily require or imply any such actual relationship or order between the entities or operations.

Claims

1. A semiconductor lead frame mold having a cooling structure, comprising a base (1), characterized in that: The outer surface of the base (1) is fixedly connected with a cooling mechanism (2) and a material feeding mechanism (3); The cooling mechanism (2) comprises a cooling frame (204) fixedly connected to the upper surface of the base (1), the inner wall of the cooling frame (204) is fixedly connected with a lower mold block (6), the inner wall of the base (1) is fixedly connected with a plurality of heat dissipation fins (208), the outer surface of the cooling frame (204) is fixedly connected with a connecting hose (201), the other end of the connecting hose (201) is fixedly connected with a lower pressing shell (206), the lower surface of the lower pressing shell (206) is fixedly connected with an upper mold block (7); The material feeding mechanism (3) comprises a first electric telescopic rod (302) fixedly connected to the outer surface of the base (1), the output end of the first electric telescopic rod (302) is fixedly connected with a lifting plate (301), the outer surface of the lifting plate (301) is fixedly connected with a plurality of ejector rods (303).

2. The semiconductor lead frame mold with a cooling structure according to claim 1, wherein: The lower surface of the cooling frame (204) is fixedly connected with a connecting pipeline (205), the other end of the connecting pipeline (205) is fixedly connected to the inner wall of the base (1).

3. The semiconductor lead frame mold with a cooling structure according to claim 2, wherein: The inner wall of the lower pressing shell (206) is fixedly connected with a temperature sensor (203), the outer surface of the temperature sensor (203) is electrically connected with a control panel (5) through a wire, the outer surface of the control panel (5) is fixedly connected to the upper surface of the base (1).

4. The semiconductor lead frame mold with a cooling structure according to claim 3, wherein: The outer surface of the base (1) is fixedly connected with a plurality of fans (202), and the upper surface of the base (1) is fixedly connected with a second electric telescopic rod (4), the output end of the second electric telescopic rod (4) is fixedly connected with the upper surface of the lower pressing shell (206).

5. The semiconductor lead frame mold with a cooling structure according to claim 4, wherein: The upper surface of the base (1) is fixedly connected with a water pump (207), the water inlet of the water pump (207) is fixedly connected to the inner wall of the base (1), and the water outlet of the water pump (207) is fixedly connected with a first hose (209), the first hose (209) is fixedly connected to the inner wall of the lower pressing shell (206).

6. The semiconductor lead frame mold with a cooling structure according to claim 1, wherein: The material feeding mechanism (3) further comprises a plurality of support sleeves (304) fixedly connected to the inner wall of the base (1), the inner wall of the support sleeve (304) is slidably connected with the outer surface of the first electric telescopic rod (302), and the upper surface of the first electric telescopic rod (302) is slidably connected with the inner wall of the lower mold block (6).

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