Anti-oxidation electronic component high-temperature welding device

By filling the high-temperature welding device with inert gas and precisely controlling the position and temperature of the welding torch, the problem of oxidation at the welding point was solved, achieving high-quality and high-precision welding results.

CN223876249UActive Publication Date: 2026-02-06ASE (KUNSHAN) INC
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Patent Information

Application Number
CN202520450851.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-14
Publication Date
2026-02-06
Estimated Expiration
2035-03-14

AI Technical Summary

Technical Problem

During the welding process, the weld joint is prone to oxidation reaction with oxygen in the air, which reduces the purity and integrity of the weld joint and affects the performance and reliability of electronic components.

Method used

The high-temperature welding device for anti-oxidation electronic components is adopted. By filling the chamber with inert gas to isolate oxygen, and using electric push rods and threaded rods to control the position of the welding gun and circuit board, combined with heating tubes to control the temperature, high-temperature welding in an oxygen-free environment is ensured.

Benefits of technology

It effectively prevents oxidation reactions at the solder joints, maintains the purity and integrity of the solder joints, improves soldering quality and accuracy, simplifies the operation process, and protects electronic components from temperature fluctuations.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223876249U_ABST
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Abstract

The utility model relates to the technical field of electronic component welding, and discloses an anti-oxidation electronic component high-temperature welding device, which comprises a box body, a welding head, a welding head and a welding head, the box door is rotationally connected to the box body and used for opening and closing the box body; the fixing mechanism comprises a welding gun which is fixedly connected and arranged in the box body and is used for melting a welding wire on the circuit board; according to the utility model, the inert gas is filled into the box body to isolate oxygen, so that the oxidation reaction of a welding point is effectively prevented when the chip and the circuit board are welded, the generation of an oxide layer is reduced, the purity and the integrity of a welding joint are kept, the welding quality is also obviously improved, and the production efficiency is improved. Meanwhile, due to the reverse pulling design of the third spring and the first spring in the device, the clamping plate and the baffle can automatically reset, the operator can conveniently, rapidly and accurately place and fix the chip during welding, and the welding accuracy is further guaranteed.
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Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component welding technical field especially relates to a kind of high-temperature welding devices of anti-oxidation electronic component. BACKGROUND

[0002] In electronic manufacturing industry, high-temperature welding is one of the key steps to connect electronic components, however, the welding point is easy to react with oxygen in the air during welding, leading to the generation of oxide layer, which not only reduces the purity and integrity of welded joint, but also may affect the performance and reliability of electronic components.

[0003] The existing electronic component welding device is easy to oxidize with oxygen in the air during welding, which not only affects the appearance of welded joint, but also reduces the electrical performance of joint, resulting in poor welding quality. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcomings in prior art and provides a kind of high-temperature welding devices of anti-oxidation electronic component.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a kind of high-temperature welding devices of anti-oxidation electronic component, comprising:

[0006] Box, for accommodating electronic component during welding;

[0007] Box door, rotationally connected on the box, for opening and closing the box;

[0008] Fixing mechanism, including welding torch arranged in the box, for melting welding wire on circuit board;

[0009] Placement structure, including slide rod arranged on the box, for placing chip on circuit board.

[0010] As a further description of the above technical scheme: the fixing mechanism further comprises:

[0011] Electric push rod, fixedly arranged at the upper end of the box, for driving welding torch lifting;

[0012] Heating pipe, arranged in the box, for improving the temperature in the box;

[0013] Exhaust valve, arranged on one side of the box, for discharging gas in the box;

[0014] Air inlet pipe, arranged on one side of the box, for adding inert gas into the box, and one end of the air inlet pipe is connected to the inert gas storage tank through flange;

[0015] Clamp plate two, fixedly arranged at the bottom in the box, for fixing circuit board;

[0016] The clamping plate one is used for fixing the circuit board in cooperation with the clamping plate two;

[0017] The limiting groove is arranged on the bottom of the box body and is used for limiting the clamping plate one, and the clamping plate one is slidably connected to the limiting groove;

[0018] The threaded rod is threadedly connected to the box body and is used for driving the clamping plate one to move, and one end of the threaded rod is rotatably arranged in the T-shaped groove arranged on one side of the clamping plate one.

[0019] As a further description of the above technical solution: the exhaust valve penetrates the box body, and the air inlet pipe penetrates the box body.

[0020] As a further description of the above technical solution: the output end of the electric push rod penetrates the upper end of the box body, and the threaded rod penetrates the box body.

[0021] As a further description of the above technical solution: the placing structure further comprises:

[0022] The accommodating groove is arranged on one side of the box body and is used for accommodating the sliding rod;

[0023] The baffle is slidably connected to the accommodating groove and is used for closing the accommodating groove, and the sliding rod is slidably connected to the baffle;

[0024] The spring one has one end fixedly arranged on the baffle and the other end fixedly arranged on the baffle, and is used for keeping the baffle always moving upward through the pulling action of the spring one;

[0025] The spring two has one end fixedly arranged on the baffle and the other end fixedly arranged on one end of the sliding rod, and is used for keeping the sliding rod always moving to one side through the rebounding action of the spring two;

[0026] The clamping plate is used for fixing the chip in cooperation with one end of the sliding rod;

[0027] The sliding groove is arranged on one end of the sliding rod and is used for limiting the clamping plate, and the clamping plate is slidably connected to the sliding groove;

[0028] The push rod is slidably connected to the sliding rod and is used for driving the clamping plate to move, and the clamping plate is fixedly arranged on one end of the push rod;

[0029] The spring three has one end fixedly arranged on one end of the push rod and the other end fixedly arranged on one end of the sliding rod, and is used for keeping the push rod always moving to one side through the pulling action of the spring three.

[0030] As a further description of the above technical solution: the accommodating groove penetrates the box body, and the sliding rod penetrates the baffle.

[0031] As a further description of the above technical solutions: the push rod penetrates the slide rod.

[0032] The utility model has the advantages of:

[0033] 1. In the utility model, inert gas is filled into the box to isolate oxygen, effectively preventing oxidation reaction of the welding point when the chip and the circuit board are welded, reducing the generation of oxide layer, maintaining the purity and integrity of the welding joint, significantly improving the welding quality, and the reverse pulling design of spring three and spring one enables the clamping plate and the baffle to be automatically reset, facilitating the operator to quickly and accurately place and fix the chip during welding, and further ensuring the accuracy of welding.

[0034] 2. In the utility model, the movement of the welding gun and the fixation of the circuit board can be easily controlled by the operator through the adjustment of the electric push rod and the threaded rod, greatly simplifying the operation process, in addition, the introduction of the heating pipe and the inert gas enables the temperature in the box to be accurately controlled within the required welding temperature range, ensuring the smooth progress of the welding process and avoiding damage to the components due to temperature fluctuations, and the closed design and bolt fixation of the box door ensure the oxygen-free environment in the box, further improving the welding quality and the protection effect of the components. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 A cross-sectional view of the anti-oxidation electronic component high-temperature welding device is provided for the utility model;

[0036] Figure 2 A structure diagram of the anti-oxidation electronic component high-temperature welding device is provided for the utility model Figure 1 ;

[0037] Figure 3 A structure diagram of the anti-oxidation electronic component high-temperature welding device is provided for the utility model Figure 2 ;

[0038] Figure 4 A partial structure diagram of the anti-oxidation electronic component high-temperature welding device is provided for the utility model;

[0039] Figure 5 is Figure 4 An enlarged view of A in the utility model.

[0040] LEGEND:

[0041] 1, box; 2, box door; 301, threaded rod; 302, limit groove; 303, clamping plate one; 304, clamping plate two; 305, electric push rod; 306, heating pipe; 307, exhaust valve; 308, air inlet pipe; 309, welding gun; 401, containing groove; 402, baffle; 403, spring one; 404, sliding rod; 405, spring two; 406, push rod; 407, spring three; 408, sliding groove; 409, clamping plate. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0043] Embodiment 1:

[0044] Referring to the drawings as Figures 1 to 5 The utility model provides a kind of high-temperature welding device of anti-oxidation electronic component, including the box 1 for containing electronic component when welding and rotating connection in box 1, for opening and closing box door 2 of box 1, box 1 includes fixed mechanism, including the welding gun 309 of fixedly connected arrangement in box 1, for melting welding wire on circuit board;

[0045] It needs to be explained that box door 2 is away from the side of rotating in box 1 by bolt fixed in box 1, box door 2 is equipped with transparent panel, to facilitate staff observation welding condition in box 1;

[0046] As a kind of preferable implementation, fixed mechanism further includes: electric push rod 305, fixedly connected arrangement is in the upper end of box 1, for driving welding gun 309 to lift and fall;Heating pipe 306 is arranged in box 1, for improving the temperature in box 1;Exhaust valve 307 is arranged in one side of box 1, for discharging gas in box 1;Air inlet pipe 308 is arranged in one side of box 1, for adding inert gas to box 1, and one end of air inlet pipe 308 is connected on inert gas storage tank by flange;Clamping plate two 304 is fixedly connected arrangement in the bottom of box 1, for fixing circuit board;Clamping plate one 303 is used for fixing circuit board in cooperation with clamping plate two 304;Limit groove 302 is arranged in the bottom of box 1, for limiting clamping plate one 303, and clamping plate one 303 is slidably connected in limit groove 302;Threaded rod 301 is threadedly connected in box 1, for driving clamping plate one 303 to move, and one end of threaded rod 301 is rotationally arranged in T-shaped slot opened in one side of clamping plate one 303;

[0047] It should be noted that the inert gas can be argon or nitrogen;

[0048] As a preferred embodiment, the exhaust valve 307 penetrates the box 1, and the air inlet pipe 308 penetrates the box 1.

[0049] As a preferred embodiment, the output end of the electric push rod 305 penetrates the upper end of the box 1, and the threaded rod 301 penetrates the box 1.

[0050] Embodiment 2:

[0051] On the basis of embodiment 1, in order to further improve the convenience of chip welding, a placing structure is arranged on the box 1.

[0052] As a preferred embodiment, the placing structure comprises a sliding rod 404 arranged on the box 1, which is used to place the chip on the circuit board.

[0053] It should be noted that the sliding rod 404 is provided with a clamping strip, and the baffle 402 is provided with a clamping groove for preventing the sliding rod 404 from rotating on the baffle 402.

[0054] As a preferred embodiment, the placing structure further comprises: a containing groove 401 arranged on one side of the box 1, used to contain the sliding rod 404; a baffle 402 slidingly connected to the containing groove 401, used to close the containing groove 401, and the sliding rod 404 is slidingly connected to the baffle 402; a spring one 403, one end of which is fixedly arranged on the baffle 402, and the other end is fixedly arranged on the baffle on one side of the box 1, used to keep the baffle 402 always moving upward by the pulling action of the spring one 403; a spring two 405, one end of which is fixedly arranged on the baffle 402, and the other end is fixedly arranged on one end of the sliding rod 404, used to keep the sliding rod 404 always moving to one side by the rebounding action of the spring two 405; a clamping plate 409, used to fix the chip in cooperation with one end of the sliding rod 404; a sliding groove 408, arranged on one end of the sliding rod 404, used to limit the clamping plate 409, and the clamping plate 409 is slidingly connected to the sliding groove 408; a push rod 406, slidingly connected to the sliding rod 404, used to drive the clamping plate 409 to move, and the clamping plate 409 is fixedly arranged on one end of the push rod 406; a spring three 407, one end of which is fixedly arranged on one end of the push rod 406, and the other end is fixedly arranged on one end of the sliding rod 404, used to keep the push rod 406 always moving to one side by the pulling action of the spring three 407.

[0055] As a preferred embodiment, the containing groove 401 penetrates the box 1, and the sliding rod 404 penetrates the baffle 402.

[0056] As a preferred embodiment, the push rod 406 penetrates the sliding rod 404.

[0057] Working principle: in use, first pull the push rod 406 on the slide rod 404 and pull the spring three 407, the push rod 406 drives the clamping plate 409 to slide on the slide groove 408, after the clamping plate 409 moves to a certain position, place the chip between the clamping plate 409 and one end of the slide rod 404, then release the push rod 406, the clamping plate 409 moves to one side through the reverse pulling of the spring three 407 to fix the chip, then place the circuit board between the clamping plate two 304 and the clamping plate one 303, then twist the threaded rod 301 to rotate on one side of the clamping plate one 303, the threaded rod 301 drives the clamping plate one 303 to slide on the limiting groove 302 through the threaded connection on the box body 1, when the clamping plate two 304 and the clamping plate one 303 are attached to both sides of the circuit board, the fixing is completed, then rotate the box door 2 to close the box body 1 and fix the box door 2 through the bolt, then connect the flange at one end of the air inlet pipe 308 to the storage tank of inert gas, then open the heating pipe 306 to heat the box body 1 to the required welding temperature, then add inert gas into the box body 1 through the air inlet pipe 308, which prevents the oxidation reaction of the welding point when the chip and the circuit board are welded by adding inert gas into the box body 1 to isolate oxygen in the air, which helps to reduce the generation of oxide layer and maintain the purity and integrity of the welding joint, then open the electric push rod 305 to push the welding gun 309 to move downward, when the solder wire on the circuit board is melted by the welding gun 309, reverse open the electric push rod 305 to drive the welding gun 309 to move upward for resetting, then push the slide rod 404 to slide on the baffle 402, when the chip at one end of the slide rod 404 is above the circuit board, pull the slide rod 404 downward, the slide rod 404 drives the baffle 402 to move and pull the spring one 403, when the chip at one end of the slide rod 404 is above the melted solder wire, the welding is completed, then pull the push rod 406 on the slide rod 404 and pull the spring three 407 to release the fixation of the chip, then release the slide rod 404 and the push rod 406, the baffle 402 and the clamping plate 409 are reset through the reverse pulling of the spring one 403 and the reverse pulling of the spring three 407, so as to facilitate the operator to place the chip during welding, which not only ensures the temperature in the box body 1, but also ensures that no oxygen enters the box body 1, thereby improving the welding precision of electronic components.

[0058] Finally, it should be noted that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features, as long as they are within the spirit and principles of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An apparatus for high temperature soldering of an electronic component against oxidation, characterized by: The utility model relates to a welding box, which comprises a box body (1) for containing electronic components during welding, a box door (2) rotatably connected to the box body (1) for opening and closing the box body (1), a fixing mechanism comprising a welding gun (309) fixedly arranged in the box body (1) for melting welding wire on a circuit board, and a placing structure comprising a sliding rod (404) arranged on the box body (1) for placing a chip on the circuit board. The fixing mechanism further comprises an electric push rod (305) fixedly arranged at the upper end of the box body (1) for driving the welding gun (309) to move up and down, a heating pipe (306) arranged in the box body (1) for increasing the temperature in the box body (1), an exhaust valve (307) arranged on one side of the box body (1) for discharging gas in the box body (1), and an air inlet pipe (308) arranged on one side of the box body (1) for adding inert gas into the box body (1), wherein one end of the air inlet pipe (308) is connected to an inert gas storage tank through a flange. The fixing mechanism further comprises a clamping plate II (304) fixedly arranged at the bottom of the box body (1) for fixing the circuit board, a clamping plate I (303) for fixing the circuit board in cooperation with the clamping plate II (304), a limiting groove (302) arranged at the bottom of the box body (1) for limiting the clamping plate I (303), wherein the clamping plate I (303) is slidably connected to the limiting groove (302), and a threaded rod (301) threadedly connected to the box body (1) for driving the clamping plate I (303) to move, wherein one end of the threaded rod (301) is rotatably arranged in a T-shaped groove arranged on one side of the clamping plate I (303). The exhaust valve (307) penetrates the box body (1), and the air inlet pipe (308) penetrates the box body (1). The output end of the electric push rod (305) penetrates the upper end of the box body (1), and the threaded rod (301) penetrates the box body (1).

2. The apparatus according to claim 1, wherein: The placing structure further comprises a containing groove (401) arranged on one side of the box body (1) for containing the sliding rod (404), a baffle (402) slidably connected to the containing groove (401) for closing the containing groove (401), wherein the sliding rod (404) is slidably connected to the baffle (402), a spring I (403) having one end fixedly arranged on the baffle (402) and the other end fixedly arranged on a ledge arranged on one side of the box body (1) for always keeping the baffle (402) moving upward by the pulling action of the spring I (403), a spring II (405) having one end fixedly arranged on the baffle (402) and the other end fixedly arranged on one end of the sliding rod (404) for always keeping the sliding rod (404) moving to one side by the rebounding action of the spring II (405), a clamping plate (409) for fixing a chip in cooperation with one end of the sliding rod (404), a sliding groove (408) arranged on one end of the sliding rod (404) for limiting the clamping plate (409), wherein the clamping plate (409) is slidably connected to the sliding groove (408). ​ ​ ​ ​ ​ ​ ​ ​ 3. The high-temperature welding device for anti-oxidation electronic components according to claim 2, characterized in that: ​ 4. The high-temperature welding device for anti-oxidation electronic components according to claim 3, characterized in that: ​ 5. The high-temperature welding device for anti-oxidation electronic components according to claim 4, characterized in that: ​ ​ ​ ​ ​ ​ ​ A push rod (406) is slidingly connected to the slide rod (404) to drive the card (409) to move, and the card (409) is fixedly arranged at one end of the push rod (406); A spring three (407) is fixedly arranged at one end of the push rod (406) and the other end of the slide rod (404), so that the push rod (406) is always moved to one side by the action of the spring three (407) pulling.

6. The high-temperature welding apparatus for anti-oxidation electronic components according to claim 5, characterized in that: The accommodating groove (401) penetrates the box (1), and the slide rod (404) penetrates the baffle (402).

7. The high-temperature welding apparatus for anti-oxidation electronic components according to claim 6, characterized in that: The push rod (406) penetrates the slide rod (404).