Display module

Abstract

The embodiment of the utility model provides a display module, relates to the technical field of display, and aims to solve the problem that the structural strength of the display module is reduced due to the fact that a backboard is subjected to hole breaking treatment in the related technology. The display module comprises a back plate, a printed circuit board and a bonding piece. The printed circuit board is arranged on one side of the back plate; the bonding piece is arranged between the side faces, facing each other, of the back plate and the printed circuit board so that the back plate and the printed circuit board can be bonded. The backboard and the printed circuit board are fixed in the mode, so that the backboard does not need to be subjected to hole breaking treatment, and the structural strength and stability of the display module can be effectively guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module. BACKGROUND

[0002] In the related art, when a printed circuit board (PCB) in a display module is fixed, a hole is usually punched on the lower side of a back plate, and then the material at the hole is folded to form a support to support the PCB, and then the PCB is fixed.

[0003] However, since the back plate is punched, the structural strength of the display module is reduced, affecting its stability and durability. CONTENT OF THE UTILITY MODEL

[0004] The embodiments of the present application provide a display module to at least solve the problem of reduced structural strength of the display module due to punching of the back plate.

[0005] In one aspect, the embodiments of the present application provide a display module, comprising: a back plate, a printed circuit board, and an adhesive member. The printed circuit board is arranged on one side of the back plate; the adhesive member is arranged between the side of the back plate and the side of the printed circuit board facing each other, so that the side of the back plate and the side of the printed circuit board are adhered.

[0006] In some embodiments, a groove is formed on the side of the printed circuit board facing the back plate, and at least part of the adhesive member is arranged in the groove.

[0007] In some embodiments, the groove has a groove bottom width greater than or equal to the opening width of the groove.

[0008] In some embodiments, the number of grooves is multiple, and the adhesive member comprises multiple adhesive portions spaced from each other, each adhesive portion corresponding to one groove and being at least partially arranged in the corresponding groove.

[0009] In some embodiments, the adhesive member comprises multiple adhesive portions spaced from each other, and the printed circuit board is provided with a connector interface, and the multiple adhesive portions include a target adhesive portion located between the connector interface and the back plate.

[0010] In some embodiments, among the multiple adhesive portions, the length of the target adhesive portion is greater than the length of other adhesive portions.

[0011] In some embodiments, the ratio of the length of the adhesive member to the length of the printed circuit board is greater than or equal to 1 / 3 and less than or equal to 1.

[0012] In some embodiments, the display module further comprises a buffer layer arranged between the printed circuit board and the back plate.

[0013] In some embodiments, the back plate comprises a first bearing part and a second bearing part arranged oppositely, and a connecting part connecting the first bearing part and the second bearing part, the first bearing part is used for bearing a backlight assembly, and the second bearing part is used for bearing a display assembly; the adhesive part is arranged on the connecting part.

[0014] In some embodiments, the adhesive extends to at least one side surface of the printed circuit board perpendicular to the thickness direction thereof.

[0015] For the display module provided by the embodiments of the present application, since the printed circuit board is arranged on one side of the back plate, one side surface of the printed circuit board and one side surface of the back plate face each other. By arranging the adhesive between the two side surfaces, the printed circuit board can be fixed on the back plate. Since the above-mentioned method does not need to make a hole in the back plate, the structural strength and stability of the display module can be effectively guaranteed. In addition, the printed circuit board is directly fixed on the side surface of the back plate by using the adhesive, so that the problem of light leakage caused by making a hole in the back plate can be avoided, thereby guaranteeing the display quality of the display module. Moreover, the side surfaces of the back plate and the printed circuit board only need to be aligned during the bonding process, so that the assembly process of the display module can also be optimized, and the production cost thereof can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative effort.

[0017] Figure 1 is a bottom view of a display module provided by some embodiments of the present application;

[0018] Figure 2 is a top view of a display module provided by some embodiments of the present application;

[0019] Figure 3 is a sectional view of a display module provided by some embodiments of the present application;

[0020] Figure 4A is a structural schematic view of a printed circuit board according to some embodiments of the present application;

[0021] Figure 4B is a structural schematic view of a printed circuit board according to some other embodiments of the present application;

[0022] Figure 5 is a bottom view of a display module provided by some embodiments of the present application;

[0023] Figure 6 is a sectional view of a display module provided by some embodiments of the present application;

[0024] Figure 7 is a sectional view of a display module provided by some embodiments of the present application;

[0025] Figure 8 is a structural schematic diagram of a display device provided by some embodiments of the present application. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. The described technical solutions are only used to explain and describe the ideas of the present application, and should not be regarded as a limitation on the protection scope of the present application.

[0027] In the description of the present application, it should be understood that the terms “first”, “second” and similar words do not represent any order, number or importance, but are only used to distinguish different technical features.

[0028] “A and / or B” includes the following three combinations: only A, only B, and the combination of A and B.

[0029] In the present application, the word “exemplary” is used to mean “serving as an example, instance, or illustration.” Any implementation described as “exemplary” in the present application is not necessarily to be construed as preferred or advantageous over other implementations. The following description is presented to enable any person skilled in the art to make and use the present application.

[0030] The various embodiments of the present application are similar, and the features in different embodiments and / or different examples can be combined with each other.

[0031] Some embodiments of the present application provide a display module, as shown in Figures 1 to 3 , Figures 5 to 7 The display module 100 includes a back plate 10, a printed circuit board 20, and an adhesive 30. The printed circuit board 20 is arranged on one side of the back plate 10. The adhesive 30 is arranged between the side of the back plate 10 and the side of the printed circuit board 20 facing each other, so that the side of the back plate 10 and the side of the printed circuit board 20 are bonded. The extension direction of the side of the printed circuit board 20 is consistent with the thickness direction of the printed circuit board 20.

[0032] Since the printed circuit board 20 is arranged on one side of the back plate 10, one side of the printed circuit board 20 and one side of the back plate 10 face each other. By arranging the adhesive between the two sides, the printed circuit board 20 can be fixed on the back plate 10. Since the above-mentioned method does not need to make a hole in the back plate, the structural strength and stability of the display module can be effectively guaranteed.

[0033] In addition, the back plate is usually provided with a backlight assembly, and if the back plate is processed with a hole, it is easy to cause light leakage, which reduces the display quality of the display module. The embodiments of the present application can avoid the problem of light leakage by directly fixing the printed circuit board 20 on the side of the back plate 10 by the adhesive 30, thereby guaranteeing the display quality of the display module. Moreover, the back plate 10 and the printed circuit board 20 only need to be aligned during the bonding process, which can also optimize the assembly process of the display module and reduce the production cost.

[0034] In some examples, as shown in Figure 1 and Figure 2 , the adhesive 30 extends to at least one side surface of the printed circuit board 20 perpendicular to the thickness direction of the printed circuit board 20. That is, the adhesive 30 covers at least one surface of the printed circuit board 20 perpendicular to the thickness direction of the printed circuit board 20 on the basis of being arranged on the side of the printed circuit board 20. The extension direction of the surface is perpendicular to the thickness direction of the printed circuit board 20, and the at least one surface of the printed circuit board 20 perpendicular to the thickness direction of the printed circuit board 20 may, for example, be at least one of the upper surface and the lower surface of the printed circuit board 20. In this way, the contact area between the adhesive 30 and the printed circuit board 20 can be increased, thereby improving the bonding strength and guaranteeing the stability of the relative position of the printed circuit board 20 and the back plate 10.

[0035] As an example, as shown in Figure 1 , part of the adhesive 30 is arranged on the side of the printed circuit board 20, and the other part covers part of the upper surface of the printed circuit board 20. Alternatively, as shown in Figure 2 , part of the adhesive 30 is arranged on the side of the printed circuit board 20, and the other part is attached to the lower surface of the printed circuit board 20. Alternatively, part of the adhesive 30 is arranged on the side of the printed circuit board 20, another part covers part of the upper surface of the printed circuit board 20, and the other part is attached to the lower surface of the printed circuit board 20. In this case, the adhesive 30 is arranged on the side of the printed circuit board 20 and covers part of the printed circuit board 20.

[0036] In some embodiments, as shown in Figure 1 , Figure 4A and Figure 4B , a groove K is formed on the side of the printed circuit board 20 facing the back plate 10, and at least part of the adhesive 30 is arranged in the groove K.

[0037] In the process of bonding the printed circuit board 20 and the back plate 10, a gap is usually left between the two. When the bonding member 30 is arranged, the recess K is provided in the printed circuit board 20, so that a part of the bonding member 30 is accommodated in the recess K and contacts the part of the printed circuit board 20 at the position of the recess K, and another part of the bonding member 30 is located outside the recess K and contacts the back plate 10, thereby ensuring the stable connection between the printed circuit board 20 and the back plate 10.

[0038] In addition, since the recess K is provided in the printed circuit board 20, the contact area between the bonding member 30 and the printed circuit board 20 is increased, thereby improving the fixing ability of the bonding member 30 to the printed circuit board 20 and the back plate 10, and improving the structural stability of the display module 100.

[0039] In some examples, as shown in Figure 4A , the bottom width D1 of the recess K is equal to the opening width D2 of the recess K. For example, the cross section of the recess K along the direction perpendicular to the thickness of the printed circuit board 20 can be rectangular.

[0040] In other examples, as shown in Figure 4B , the bottom width D1 of the recess K is greater than the opening width D2 of the recess K. For example, the cross section of the recess K along the direction perpendicular to the thickness of the printed circuit board 20 can be dovetail-shaped.

[0041] Since the bottom width D1 of the recess K is greater than or equal to the opening width D2 of the recess K, it means that the space in the recess K for accommodating the bonding member 30 is larger, so that the volume of the bonding member 30 is relatively larger, thereby facilitating the improvement of the fixing ability of the bonding member 30 to the printed circuit board 20 and the back plate 10; and the contact area between the bonding member 30 and the printed circuit board 20 is also relatively larger, which is also conducive to further improving the fixing ability of the bonding member 30 to the printed circuit board 20 and the back plate 10.

[0042] In some embodiments, please continue to refer to Figure 1 , Figure 4A and 4B , the number of recesses K is multiple, and the bonding member 30 includes multiple bonding portions 31 spaced from each other, each bonding portion 31 corresponds to a recess K and is at least partially arranged in the corresponding recess K.

[0043] By arranging a plurality of grooves K, and making each bonding portion 31 correspond to one groove K and at least partially arranged in the corresponding groove K, the contact area and connection points between the back plate 10 and the printed circuit board 20 can be effectively increased. When the display module 100 is subjected to external forces in different directions, the plurality of bonding portions 31 can disperse stress from different positions, thereby effectively preventing relative displacement or falling between the printed circuit board 20 and the back plate 10, and further ensuring the structural stability of the display module 100.

[0044] In addition, the mutually spaced bonding portions 31 can effectively save the material used by the bonding member 30 while ensuring sufficient bonding strength, thereby reducing material costs. When the display module 100 needs to be repaired, due to the spaced arrangement of the bonding portions 31, it is convenient for maintenance personnel to process individual bonding portions 31, for example, by heating or using a special solvent, a specific bonding portion 31 can be separated more easily without affecting the connection of other parts. Thus, the convenience and feasibility of repair can be effectively improved, thereby reducing repair costs and time.

[0045] In addition, the spaced distribution of the plurality of bonding portions 31 can also make the heat dissipation channel between the printed circuit board 20 and the back plate 10 more uniform, which can effectively avoid the problem of local overheating of the printed circuit board 20. This helps to further improve the working stability and reliability of the printed circuit board 20, prolong its service life, and also improves the display effect of the entire display module, reduces display abnormalities caused by uneven temperature.

[0046] In some examples, each bonding portion 31 can be completely embedded in the groove K, or can be partially embedded, as long as there is sufficient contact area between the bonding portion 31 and the groove K to achieve effective bonding. This not only improves the stability of the bonding member 30, but also increases the bonding strength between the bonding member 30 and the groove K.

[0047] In some examples, the length of each bonding portion 31 can be greater than or equal to 2 millimeters and less than or equal to 10 millimeters.

[0048] In some embodiments, please continue to refer to Figure 1 , Figure 4A and 4B , the bonding member 30 includes a plurality of mutually spaced bonding portions 31, the printed circuit board 20 is provided with a connector interface 21, and the plurality of bonding portions 31 includes a target bonding portion 310 located between the connector interface 21 and the back plate 10.

[0049] By arranging the target bonding portion 310 between the connector interface 21 and the back plate 10, the connection strength between the printed circuit board 20 and the back plate 10 in the area where the connector interface 21 is located can be effectively enhanced. The connector interface 21 usually needs to be frequently plugged with the connector of an external device, which can cause certain stress to the connection between the printed circuit board 20 and the back plate 10. The target bonding portion 310 can effectively disperse the stress and prevent the printed circuit board 20 from loosening in the area where the connector interface 21 is located, thereby ensuring the structural stability of the entire display module 100.

[0050] In some examples, the target bonding portion 310 can be located in the groove K, which can further enhance the connection strength between the printed circuit board 20 and the back plate 10 in the area where the connector interface 21 is located.

[0051] In other examples, the target bonding portion 310 can be located outside the groove K. In this way, the structural strength of the printed circuit board 20 in the area where the connector interface 21 is located can be effectively guaranteed, thereby relieving the influence on the structure of the printed circuit board 20 when the connector is plugged.

[0052] In some embodiments, the printed circuit board 20 can further be provided with components 22. The bonding portion 31 can be arranged between the components 22 and the back plate 10, or can be arranged at other positions, which are not limited in the embodiments of the present application.

[0053] In some examples, the components 22 and the connector interface 21 can be arranged on the same side surface of the printed circuit board 20 perpendicular to the thickness direction of the printed circuit board 20, for example, the upper surface.

[0054] In some embodiments, as shown in Figure 1 Among the plurality of bonding portions 31, the length of the target bonding portion 310 is greater than the length of the other bonding portions 31.

[0055] In this way, the connection strength between the printed circuit board 20 and the back plate 10 in the area where the connector interface 21 is located can be further enhanced.

[0056] In some examples, a flexible circuit board 40 is arranged between the printed circuit board 20 and the back plate 10, and the flexible circuit board 40 is used to connect the display assembly 50 in the printed circuit board 20 and the back plate 10. The plurality of bonding portions 31 are located on both sides of the flexible circuit board 40 and avoid the area where the connector interface 21 is located. The length of the target bonding portion 310 can be greater than or equal to the length of the connector interface 21, and the length of the other bonding portions 31 is less than the length of the connector interface 21.

[0057] In some embodiments, as shown in Figure 5 and Figure 6As shown, the ratio of the length of the adhesive 30 to the length of the printed circuit board 20 is greater than or equal to 1 / 3 and less than or equal to 1.

[0058] The adhesive 30 is in a continuous and uninterrupted structure. By setting the ratio of the length of the adhesive 30 to the length of the printed circuit board 20 to be greater than or equal to 1 / 3 and less than or equal to 1, the adhesion stability between the printed circuit board 20 and the back plate 10 can be ensured, thereby ensuring the structural stability of the display module 100.

[0059] It is worth noting that, Figure 6 and Figure 3 The main difference between the two is that Figure 3 the printed circuit board 20 in the first embodiment is provided with a groove K, while Figure 6 the printed circuit board 20 in the second embodiment is not provided with a groove.

[0060] As an example, the length of the printed circuit board 20 can be 150 mm. In this case, the length of the adhesive 30 is greater than or equal to 50 mm and less than or equal to 150 mm.

[0061] In some examples, the ratio of the length of the adhesive 30 to the length of the printed circuit board 20 is less than 1. For example, the distance between one end of the adhesive 30 and the same end of the printed circuit board 20 is greater than or equal to 10 mm. That is, one end of the adhesive 30 is recessed compared to the same end of the printed circuit board 20, and the distance is controlled to be greater than or equal to 10 mm.

[0062] In this way, the material of the adhesive 30 can be effectively prevented from overflowing to the non-adhesion area of the printed circuit board 20 and the back plate 10 during the coating and curing process, which is caused by excessive coating or pressure, thereby easily contaminating the surrounding electronic components or lines, causing short circuit and other failures.

[0063] As an example, the midpoint of the adhesive 30 in the length direction coincides with the midpoint of the printed circuit board 20 in the length direction. The two ends of the adhesive 30 are recessed by 10 mm compared to the printed circuit board 20, respectively. In this way, while ensuring the adhesion stability of the printed circuit board 20 and the back plate 10, the electronic components or lines around the printed circuit board 20 can also be effectively prevented from being affected by the adhesive 30.

[0064] In some examples, the material of the adhesive 30 can be ultraviolet curing glue.

[0065] In some embodiments, as shown in Figure 7 the display module 100 further includes a buffer layer 60 arranged between the printed circuit board 20 and the back plate 10.

[0066] In this way, when the display module 100 is twisted and opened or closed in the display device, the printed circuit board 20 and the back plate 10 can effectively avoid scratching and generating a large scratching sound. Therefore, the printed circuit board 20 and the back plate 10 will not be pulled relative to each other, thereby effectively avoiding the risk of abnormal sound.

[0067] In some examples, the buffer layer 60 can be foam. The foam has a certain elasticity and is light in weight, thereby having a good buffering effect. In addition, the foam has good shielding effect, good durability and reliability, thereby being conducive to protecting the stability of the display module 100 as a whole.

[0068] In some embodiments, as shown in Figs. 1 to 3, the back plate 10 includes a first bearing part 11 and a second bearing part 12 arranged opposite to each other, and a connecting part 13 connecting the first bearing part 11 and the second bearing part 12. The first bearing part 11 is used to bear the backlight assembly, and the second bearing part 12 is used to bear the display assembly 50. That is, the backlight assembly and the display assembly 50 can be borne by the back plate 10, thereby ensuring that the display module 100 has good structural stability. Figure 3 、 Figure 6 and Figure 7 In some embodiments, as shown in Figs. 1 to 3, the back plate 10 includes a first bearing part 11 and a second bearing part 12 arranged opposite to each other, and a connecting part 13 connecting the first bearing part 11 and the second bearing part 12. The first bearing part 11 is used to bear the backlight assembly, and the second bearing part 12 is used to bear the display assembly 50. That is, the backlight assembly and the display assembly 50 can be borne by the back plate 10, thereby ensuring that the display module 100 has good structural stability.

[0069] The display assembly 50 is located on the light-emitting side of the backlight assembly. The backlight assembly can provide a light source for the display assembly 50, thereby cooperating with the display assembly 50 to realize the display of a picture. The display assembly 50 can include a color film substrate 52, an array substrate 53, and a liquid crystal layer between the color film substrate 52 and the array substrate 53. By controlling the deflection of the liquid crystal molecules in the liquid crystal layer, the transmission of the light from the backlight assembly by the display assembly 50 can be changed, thereby realizing the picture display of the display assembly 50.

[0070] In some examples, the display assembly 50 further includes a first polarizer 51 located on the side of the color film substrate 52 away from the array substrate 53, and a second polarizer 54 located on the side of the array substrate 53 away from the color film substrate 52. The second polarizer 54 can convert the light beam generated by the backlight assembly into polarized light, and the first polarizer 51 is used to analyze the polarized light modulated by the liquid crystal molecules to generate bright and dark contrasts, thereby achieving a good picture display effect.

[0071] In addition, the printed circuit board 20 can be connected to the array substrate 53 through the flexible circuit board 40. One end of the array substrate 53 connected to the flexible circuit board 40 can be adhesively fixed on the second bearing part 12.

[0072] In some examples, the backlight assembly includes the light source 61 and a light guide plate 62 located on the light emitting side of the light source 61, and the light guide plate 62 can emit light from the light source 61 towards the display assembly 50. The light source 61 can be disposed on a circuit board 611 to control the light emission of the light source 61 through the circuit board 611. The circuit board 611 can be fixed on the first bearing portion 11.

[0073] As an example, the backlight assembly can further include a first diffusion sheet, a first prism sheet, a second prism sheet and a second diffusion sheet which are sequentially disposed on the light emitting side of the light guide plate 62. The light is modulated by the above-mentioned diffusion sheets and prism sheets, so that a more excellent light emitting effect can be presented, thereby improving the display taste of the display module.

[0074] In addition, the backlight assembly can further include a reflective sheet 63 located on one side of the light guide plate 62, and the reflective sheet 63 can reflect the light in the light guide plate 62, so that the light of the light source 61 is finally emitted towards the display assembly 50.

[0075] In some embodiments, as shown in Figure 3 and Figure 6 The adhesive 30 is partially disposed on the connecting portion 13. That is, a part of the adhesive 30 is disposed on the side of the back plate 10 facing the printed circuit board 20.

[0076] As an example, another part of the adhesive 30 is further disposed on the second bearing portion 12. In this way, the contact area between the adhesive 30 and the back plate 10 can be increased. Thus, the fixing ability of the adhesive 30 to the printed circuit board 20 and the back plate 10 is improved, so as to improve the structural stability of the display module 100.

[0077] In some embodiments, as shown in Figure 7 The display module 100 further includes a border adhesive 71, which extends along the direction surrounding the printed circuit board 20 from the first bearing portion 11 and is cut off at the position of the color film substrate 52. In this way, on the one hand, the display module 100 can be prevented from leaking light, and on the other hand, the structures of the display module 100 can be protected to a certain extent to prevent them from being physically impacted.

[0078] In some examples, the copper leakage portion of the printed circuit board 20 can be bonded with the conductive cloth on the border adhesive 71, so as to realize the grounding requirement of the display module 100, so as to isolate the external electromagnetic interference from the display module 100.

[0079] Some embodiments of the present application provide a display device, as shown in Figure 8 The display device 200 includes the display module 100 according to any of the above-mentioned embodiments.

[0080] Since the display device 200 comprises the display module 100, the display device 200 has the technical effects of the display module 100 described above, which will not be repeated here.

[0081] In some examples, the display device 200 further comprises a frame, and the display module 100 is fixed in the frame to realize protection of the display module 100.

[0082] As an example, the display device 200 further comprises a support 201, and the support 201 is connected with the display module 100 to support the display module 100, thereby facilitating the placement of the display module 100 and facilitating the use of the user.

[0083] The above describes the embodiments of the present application in detail, and the principles and implementation manners of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range will be changed, and the above description of the present application should not be understood as a limitation.

Claims

1. A display module, characterized by The display module comprises: a back plate; a printed circuit board arranged on one side of the back plate; and an adhesive member arranged between the side of the back plate and the side of the printed circuit board facing each other, so that the side of the back plate and the side of the printed circuit board are bonded. The printed circuit board is provided with a groove on the side facing the back plate, and at least part of the adhesive member is arranged in the groove.

2. The display module of claim 1, wherein, The groove has a bottom width greater than or equal to the opening width of the groove.

3. The display module of claim 2, wherein, The number of grooves is multiple, and the adhesive member comprises multiple adhesive parts spaced from each other, each adhesive part corresponding to one groove and being at least partially arranged in the corresponding groove.

4. The display module of claim 2, wherein, The adhesive member comprises multiple adhesive parts spaced from each other, and the printed circuit board is provided with a connector interface, and the multiple adhesive parts include a target adhesive part located between the connector interface and the back plate.

5. The display module of claim 2, wherein, Among the multiple adhesive parts, the length of the target adhesive part is greater than that of the other adhesive parts.

6. The display module of claim 5, wherein, The ratio of the length of the adhesive member to the length of the printed circuit board is greater than or equal to 1 / 3 and less than or equal to 1.

7. The display module of claim 1, wherein, The display module further comprises a buffer layer arranged between the printed circuit board and the back plate. 8.The display module of any one of claims 1-7, wherein, The back plate comprises a first bearing part and a second bearing part arranged oppositely, and a connecting part connecting the first bearing part and the second bearing part, the first bearing part is used to bear the backlight assembly, and the second bearing part is used to bear the display assembly; the adhesive member is partially arranged on the connecting part.

9. The display module of any one of claims 1-7, wherein, The adhesive member extends to at least one side surface of the printed circuit board perpendicular to the thickness direction thereof.

10. The display module of any one of claims 1-7, wherein, ​

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