High-speed signal acquisition board card

Abstract

The utility model provides a high-speed signal acquisition board card, which comprises a high-speed signal acquisition case, two sides of the high-speed signal acquisition case are fixedly connected with connecting jacks suitable for circuit connection, the surface of the high-speed signal acquisition case is fixedly connected with output jacks, and the output jacks are connected with the high-speed signal acquisition case. Damping grooves are formed in the two sides of the inner wall of a mounting groove, a first damping assembly supports a damping bottom plate through the structure of the first damping assembly, and when the high-speed signal acquisition case vibrates, the damping bottom plate is used for damping the bottom of the high-speed signal acquisition case in the first layer; meanwhile, vibration can be transmitted to the second damping assembly and the third damping assembly through the damping bottom plate, secondary damping is carried out through the structures of the second damping assembly and the third damping assembly, and the influence of vibration on the high-speed signal acquisition case is greatly relieved; and meanwhile, the high-speed signal acquisition case can be cooled through the vent holes when vibration occurs by utilizing the structure of the second damping assembly, so that the overall functionality and safety of the device are further improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to high -speed signal technical field, concretely relates to a high -speed signal acquisition board card. BACKGROUND

[0002] High -speed signal acquisition board card is a kind of hardware equipment for fast acquisition and processing analog or digital signal, usually through the expansion slot (such as PCI, PCIe) or external interface (such as USB, Ethernet) connection of computer.It can capture high frequency signal with extremely high sampling rate (up to millions or even billions of times sampling per second), and signal is converted into digital data by high-precision analog-digital converter (ADC), for subsequent analysis and processing.High-speed signal acquisition board card is widely used in communication test, scientific research, industrial detection, military and aerospace etc., for example 5G signal analysis, radar data processing, vibration detection, biomedical experiment etc.Its core advantage lies in high sampling rate, high resolution, multi-channel support and real-time processing capability, usually equipped with FPGA or DSP chip to realize efficient signal processing algorithm.

[0003] High-speed signal acquisition board card is usually used to capture high frequency, high precision signal, and vibration can cause signal distortion or noise increase, affect the accuracy of the overall acquisition information of device, and damping measure can reduce the influence of mechanical vibration on board card and sensor, ensure that the signal collected is real and reliable, for this purpose, we propose a kind of high-speed signal acquisition board card. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the insufficient of prior art, and provides a kind of high-speed signal acquisition board card, to solve the problems raised in the above background art.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of high-speed signal acquisition board card, including: high-speed signal acquisition machine case, the both sides of the high-speed signal acquisition machine case are fixedly connected with the connecting jack suitable for circuit connection, the surface of the high-speed signal acquisition machine case is fixedly connected with output jack, it is characterized by: the surface of the high-speed signal acquisition machine case is provided with shock attenuation installation box, the top of the shock attenuation installation box is provided with the installation slot of the size adaptation high-speed signal acquisition machine case, the surface of the shock attenuation installation box is provided with the recess of the adaptation connecting jack and output jack, the bottom of the high-speed signal acquisition machine case is fixedly connected with shock attenuation bottom plate, the top of the shock attenuation bottom plate four corners is fixedly connected with the second fixed nail for fixing between high-speed signal acquisition machine case and shock attenuation bottom plate, the back of the shock attenuation installation box is fixedly connected with reinforcing plate;

[0007] The top of the shock-absorbing bottom plate is provided with a plurality of air holes, the bottom of each air hole is fixedly connected with a second shock-absorbing assembly, and a third shock-absorbing assembly is arranged between the two second shock-absorbing assemblies.

[0008] Preferably, the second shock-absorbing assembly comprises a connecting fixed plate, the top of the connecting fixed plate is fixedly connected with third fixing nails for fixing the connecting fixed plate and the shock-absorbing bottom plate at four corners of the top of the connecting fixed plate, and the top of the connecting fixed plate is provided with an exhaust hole, the position of the exhaust hole is matched with the air hole.

[0009] Preferably, the bottom of the connecting fixed plate is fixedly connected with a rubber shock-absorbing column, and a plurality of air pressure buffer holes for air passage are formed in the surface of the rubber shock-absorbing column.

[0010] Preferably, the inner wall of the shock-absorbing mounting box is provided with shock-absorbing grooves at both sides, the horizontal height of the shock-absorbing grooves is lower than the height of the shock-absorbing bottom plate, the inner wall of the shock-absorbing groove is fixedly connected with a first shock-absorbing assembly, and the position of the first shock-absorbing assembly is matched with the bottom of the shock-absorbing bottom plate.

[0011] The first shock-absorbing assembly comprises a sponge shock-absorbing column, the sponge shock-absorbing column is arranged at the inner wall bottom of the shock-absorbing groove, the top of the sponge shock-absorbing column is fixedly connected with a connecting shock-absorbing plate, the position of the connecting shock-absorbing plate is matched with the bottom of the shock-absorbing bottom plate, and the top of the connecting shock-absorbing plate is fixedly connected with first fixing nails for connecting the shock-absorbing bottom plate and the connecting shock-absorbing plate.

[0012] Preferably, the plurality of third shock-absorbing assemblies comprise a fixed bottom plate, the fixed bottom plate is fixedly connected to the inner wall bottom of the shock-absorbing mounting box, and the top of the fixed bottom plate is fixedly connected with fourth fixing nails for fixing the fixed bottom plate and the inner wall bottom of the shock-absorbing mounting box.

[0013] Preferably, one end of the shock-absorbing spring is fixedly connected to the top of the fixed bottom plate, the top of the shock-absorbing spring is fixedly connected with a fixed insertion block, spring clamping blocks are arranged at both sides of the fixed insertion block, and the bottom of the shock-absorbing bottom plate is provided with a plurality of clamping grooves matched with the fixed insertion block and the spring clamping blocks.

[0014] Preferably, the inner wall bottom of the shock-absorbing mounting box is provided with a plurality of heat dissipation and ventilation holes, the positions of the heat dissipation and ventilation holes are matched with the second shock-absorbing assemblies, and the bottom of the shock-absorbing mounting box is fixedly connected with connecting pads at four corners.

[0015] Compared with the prior art, the shock-absorbing bottom plate has the advantages that:

[0016] 1、Through the damping groove opened on both sides of the mounting groove inner wall and the first damping assembly uses its structure to support the damping bottom plate, when the high-speed signal acquisition machine case produces vibration, the first level uses the damping bottom plate to dampen the bottom of the high-speed signal acquisition machine case, at the same time, the vibration is transmitted to the second damping assembly and the third damping assembly through the damping bottom plate, the structure of the second damping assembly and the third damping assembly is used to perform secondary damping, greatly slow down the influence of vibration on the high-speed signal acquisition machine case, and at the same time, the structure of the second damping assembly can perform heat dissipation on the high-speed signal acquisition machine case through the air vent when the vibration occurs, so as to further improve the functionality and safety of the device as a whole;

[0017] 2、Through the structure of the second damping assembly to help complete the damping, after the first damping assembly structure performs the first level damping on the device, the vibration is transmitted to the connecting fixed plate through the damping bottom plate, and the connecting fixed plate fixes the rubber damping column on the bottom of the damping bottom plate as a whole through the third fixing nail, when the damping bottom plate transmits the vibration, the rubber damping column uses its own elastic coefficient greater than that of the damping spring in the third damping assembly and the sponge damping column in the first damping assembly to help perform a larger degree of buffering, the deformation generated during the buffering will discharge the airflow due to the structure of the internal honeycomb air hole and the air pressure buffer hole, the discharged airflow can perform heat dissipation on the inside of the device through the exhaust hole and the air vent and the heat dissipation vent hole, further improve the overall buffering effect of the device while completing the heat dissipation function, and improve the functionality of the device. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, together with the embodiments of the present application, to explain the present application, and do not constitute a limitation on the present application.

[0019] In the drawings:

[0020] Figure 1 It is a whole structure schematic diagram of the present application;

[0021] Figure 2 It is a whole structure back schematic diagram of the present application;

[0022] Figure 3 It is a whole internal disassembly schematic diagram of the mounting groove of the present application;

[0023] Figure 4 It is a schematic diagram of the second damping assembly in the structure of the present application;

[0024] Figure 5 It is a schematic diagram of the first damping assembly in the structure of the present application;

[0025] Figure 6The utility model discloses a third damping assembly's schematic view in the structure.

[0026] In the drawing: 1, high -speed signal acquisition machine case;2, connecting jack;3, output jack;4, damping installation box;5, installation slot;6, damping bottom plate;7, damping groove;8, first damping assembly;801, sponge damping column;802, connecting damping plate;803, first fixed nail;9, air hole;10, second fixed nail;11, second damping assembly;1101, connecting fixed plate;1102, third fixed nail;1103, exhaust hole;1104, rubber damping column;1105, air pressure buffer hole;12, third damping assembly;1201, fixed bottom plate;1202, fourth fixed nail;1203, damping spring;1204, fixed plug -in block;1205, spring card block;13, heat dissipation vent;14, connecting batten;15, reinforcing plate. DETAILED DESCRIPTION

[0027] The utility model discloses an embodiment of the utility model will combine the drawing in the embodiment of the utility model, the technical scheme in the embodiment of the utility model is clearly and completely described, obviously, the described embodiment is only a part of embodiment of the utility model, but is not all the embodiment. Based on the embodiment in the utility model, all other embodiments that the ordinary skill in the art obtains without making the creative labor are all in the range of the utility model protection. EMBODIMENT

[0028] Please refer to Figures 1-6 The technical scheme provided by the embodiment is as follows:

[0029] A high-speed signal acquisition board card, comprising: a high-speed signal acquisition machine case 1, both sides of the high-speed signal acquisition machine case 1 are fixedly connected with connecting jacks 2 suitable for circuit connection, and the surface of the high-speed signal acquisition machine case 1 is fixedly connected with an output jack 3, characterized in that: the surface of the high-speed signal acquisition machine case 1 is provided with a damping installation box 4, the top of the damping installation box 4 is provided with an installation slot 5 suitable in size for the high-speed signal acquisition machine case 1, the surface of the damping installation box 4 is provided with grooves suitable for the connecting jacks 2 and the output jack 3, the bottom of the high-speed signal acquisition machine case 1 is fixedly connected with a damping bottom plate 6, the top of the damping bottom plate 6 is fixedly connected with second fixed nails 10 for fixing the high-speed signal acquisition machine case 1 and the damping bottom plate 6, and the back of the damping installation box 4 is fixedly connected with a reinforcing plate 15.

[0030] The top of the damping bottom plate 6 is provided with a plurality of air holes 9, the bottom of the air hole 9 is fixedly connected with a second damping assembly 11, and the second damping assembly 11 and a third damping assembly 12 are arranged between the two second damping assemblies 11, so that when the high-speed signal acquisition machine case 1 vibrates, the second damping assembly 11 and the third damping assembly 12 can buffer the vibration generated by the high-speed signal acquisition machine case 1 by using their own structures.

[0031] In the embodiment, the high-speed signal acquisition case 1 and the connection jack 2 and the output jack 3 can help collect information data, the shockproof mounting box 4 and the mounting groove 5 can help accommodate the high-speed signal acquisition case 1, the shockproof bottom plate 6 can fix the high-speed signal acquisition case 1 on the top of the shockproof bottom plate 6 through the second fixing nails 10, so as to improve the stability of the device, the reinforcing plate 15 can reinforce the whole device from the back, so as to further improve the stability of the device, the air hole 9 can be linked with the second shockproof component 11, and the second shockproof component 11 can help heat dissipation while shockproof, so as to further improve the functionality of the device, and the third shockproof component 12 can further increase the shockproof effect of the whole device.

[0032] The second shockproof component 11 comprises a connecting fixed plate 1101, the top of the connecting fixed plate 1101 is fixedly connected with third fixing nails 1102 for fixing the connecting fixed plate 1101 and the shockproof bottom plate 6, and the top of the connecting fixed plate 1101 is provided with an exhaust hole 1103.

[0033] In the embodiment, the second shockproof component 11 is fixed on the bottom of the shockproof bottom plate 6 through the connecting fixed plate 1101 and the third fixing nails 1102, so as to improve the stability of the second shockproof component 11, and the exhaust hole 1103 is opposite to the air hole 9, so that the air discharged by the second shockproof component 11 can be effectively sprayed to the bottom of the high-speed signal acquisition case 1, so as to improve the heat dissipation effect of the whole device.

[0034] The bottom of the connecting fixed plate 1101 is fixedly connected with a rubber shock column 1104, and the surface of the rubber shock column 1104 is provided with a plurality of air pressure buffer holes 1105 for air ventilation.

[0035] In the embodiment, the rubber shock column 1104 at the bottom of the connecting fixed plate 1101 can be shock-absorbed by itself, and the internal honeycomb type air hole and the air pressure buffer hole 1105 can effectively release air pressure in the shock-absorbing process, so as to heat the high-speed signal acquisition case 1 by air pressure, and further improve the functionality of the device.

[0036] The inner walls of the shockproof mounting box 4 are provided with shockproof grooves 7 on both sides, the horizontal height of the shockproof grooves 7 is lower than the height of the shockproof bottom plate 6, the inner walls of the shockproof grooves 7 are fixedly connected with first shockproof components 8, and the positions of the first shockproof components 8 are matched with the two sides of the bottom of the shockproof bottom plate 6.

[0037] The first damping assembly 8 comprises a sponge damping column 801 arranged at the bottom of the inner wall of the damping groove 7, the top of the sponge damping column 801 is fixedly connected with a connecting damping plate 802, the position of the connecting damping plate 802 matches the bottom of the two sides of the damping bottom plate 6, and the top of the connecting damping plate 802 is fixedly connected with a first fixing nail 803 for connecting the damping bottom plate 6 and the connecting damping plate 802.

[0038] In the embodiment, the first damping assembly 8 is fixed in the damping groove 7, the damping groove 7 provides a damping space, and the connecting damping plate 802 is connected to the two sides of the damping bottom plate 6 by the first fixing nail 803, so that the stability of the device is further improved, and when the damping bottom plate 6 is subjected to a vibration impact, the sponge damping column 801 can preliminarily buffer by the material itself, so that the overall buffering effect of the device is improved.

[0039] The plurality of third damping assemblies 12 comprise a fixed bottom plate 1201 fixedly connected to the bottom of the inner wall of the damping mounting box 4, and the top of the fixed bottom plate 1201 is fixedly connected with a fourth fixing nail 1202 for fixing the fixed bottom plate 1201 and the bottom of the inner wall of the damping mounting box 4.

[0040] In the embodiment, the third damping assembly 12 is fixed to the bottom of the inner wall of the damping mounting box 4 by the fixed bottom plate 1201 and the fourth fixing nail 1202, so that the stability of the device is further improved.

[0041] One end of the damping spring 1203 is fixedly connected to the top of the fixed bottom plate 1201, the top of the damping spring 1203 is fixedly connected with a fixed plug 1204, both sides of the fixed plug 1204 are provided with spring clamping blocks 1205, and the bottom of the damping bottom plate 6 is provided with a plurality of clamping grooves matched with the fixed plug 1204 and the spring clamping blocks 1205.

[0042] In the embodiment, the damping spring 1203 can connect the fixed bottom plate 1201, the fixed plug 1204 and the spring clamping blocks 1205 by the structure itself, after the third damping assembly 12 is fixed to the bottom of the damping bottom plate 6 by the fixed plug 1204 and the spring clamping blocks 1205, the vibration transmitted by the damping bottom plate 6 is slowed down by the damping spring 1203 by the structure itself, and the overall elastic coefficient of the damping spring 1203 is smaller than that of the rubber damping column 1104 in the first damping assembly 8, so that the damping spring 1203 starts to dampen after the second damping assembly 11 is overall damped, so that the progressive damping effect of the device as a whole is further improved.

[0043] The inner wall bottom of the shock-absorbing mounting box 4 is provided with a plurality of heat dissipation vents 13, the heat dissipation vents 13 are matched with the second shock-absorbing assembly 11, and the bottom of the shock-absorbing mounting box 4 is fixedly connected with a connecting pad plate 14 at four corners.

[0044] In the embodiment, the plurality of heat dissipation vents 13 provided at the bottom of the shock-absorbing mounting box 4 can dissipate the air discharged by the second shock-absorbing assembly 11, so as to ensure the shock-absorbing effect of the second shock-absorbing assembly 11 as a whole, and the connecting pad plate 14 can lift the shock-absorbing mounting box 4 by using the structure thereof, so as to provide a space for heat dissipation of the heat dissipation vents 13, thereby further improving the heat dissipation effect of the device as a whole.

[0045] Working principle: the user can help connect the device to collect information through the connecting jack 2 and the output jack 3 in the high-speed signal acquisition case 1, the shock-absorbing mounting box 4 and the mounting groove 5 can be mounted in the mounting groove 5 with the shock-absorbing bottom plate 6 and the second fixing nail 10, and the top of the shock-absorbing bottom plate 6, so as to improve the stability of the high-speed signal acquisition case 1, and the shock-absorbing groove 7 and the first shock-absorbing assembly 8 provided on the inner wall of the mounting groove 5 can support the shock-absorbing bottom plate 6 by using the structure thereof, when the high-speed signal acquisition case 1 vibrates, the shock-absorbing bottom plate 6 is used to absorb the vibration at the bottom of the high-speed signal acquisition case 1 at the first level, at the same time, the vibration is transmitted to the second shock-absorbing assembly 11 and the third shock-absorbing assembly 12 through the shock-absorbing bottom plate 6, and the second shock-absorbing assembly 11 and the third shock-absorbing assembly 12 are used to absorb the vibration again, so as to greatly reduce the influence of the vibration on the high-speed signal acquisition case 1, and the structure of the second shock-absorbing assembly 11 can dissipate heat through the air vent 9 when the vibration occurs, so as to further improve the functionality and safety of the device as a whole, the heat dissipation vents 13 can provide a ventilation channel from the bottom when the second shock-absorbing assembly 11 discharges air pressure, the connecting pad plate 14 can help to lift the shock-absorbing mounting box 4, so as to avoid that the heat dissipation vents 13 cannot ventilate from the bottom, and the reinforcing plate 15 can further reinforce the back of the shock-absorbing mounting box 4, so as to improve the stability of the device as a whole.

[0046] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-speed signal acquisition board, comprising a high-speed signal acquisition chassis (1), wherein both sides of the high-speed signal acquisition chassis (1) are fixedly connected to connection sockets (2) suitable for circuit connection, and the surface of the high-speed signal acquisition chassis (1) is fixedly connected to an output socket (3), characterized in that: The surface of the high-speed signal acquisition case (1) is provided with a shock-absorbing mounting box (4), the top of the shock-absorbing mounting box (4) is provided with a mounting groove (5) with a size suitable for the high-speed signal acquisition case (1), the surface of the shock-absorbing mounting box (4) is provided with a groove suitable for the connection jack (2) and the output jack (3), the bottom of the high-speed signal acquisition case (1) is fixedly connected with a shock-absorbing bottom plate (6), the top of the shock-absorbing bottom plate (6) is fixedly connected with a second fixing nail (10) for fixing the high-speed signal acquisition case (1) and the shock-absorbing bottom plate (6), and the back of the shock-absorbing mounting box (4) is fixedly connected with a reinforcing plate (15). A plurality of air holes (9) are formed in the top of the shock-absorbing bottom plate (6), and a second shock-absorbing assembly (11) is fixedly connected to the bottom of the air hole (9), and a third shock-absorbing assembly (12) is arranged between the two second shock-absorbing assemblies (11), so that when the high-speed signal acquisition case (1) vibrates, the second shock-absorbing assembly (11) and the third shock-absorbing assembly (12) can buffer the vibration of the high-speed signal acquisition case (1) by using their own structures.

2. The high-speed signal acquisition board card of claim 1, wherein: The second shock-absorbing assembly (11) comprises a connecting fixed plate (1101), the top of the connecting fixed plate (1101) is fixedly connected with a third fixing nail (1102) for fixing the connecting fixed plate (1101) and the shock-absorbing bottom plate (6), and an air exhaust hole (1103) is formed in the top of the connecting fixed plate (1101).

3. The high-speed signal acquisition board card of claim 2, wherein: The bottom of the connecting fixed plate (1101) is fixedly connected with a rubber shock-absorbing column (1104), and a plurality of air pressure buffer holes (1105) for air passage are formed in the surface of the rubber shock-absorbing column (1104).

4. The high-speed signal acquisition board card of claim 1, wherein: The inner walls of the shock-absorbing mounting box (4) are provided with shock-absorbing grooves (7) on both sides, the horizontal height of the shock-absorbing groove (7) is lower than the height of the shock-absorbing bottom plate (6), and a first shock-absorbing assembly (8) is fixedly connected to the inner wall of the shock-absorbing groove (7), and the position of the first shock-absorbing assembly (8) matches the bottom of the shock-absorbing bottom plate (6) on both sides. The first shock-absorbing assembly (8) comprises a sponge shock-absorbing column (801), the sponge shock-absorbing column (801) is arranged at the inner wall bottom of the shock-absorbing groove (7), the top of the sponge shock-absorbing column (801) is fixedly connected with a connecting shock-absorbing plate (802), the position of the connecting shock-absorbing plate (802) matches the bottom of the shock-absorbing bottom plate (6) on both sides, and the top of the connecting shock-absorbing plate (802) is fixedly connected with a first fixing nail (803) for connecting the shock-absorbing bottom plate (6) and the connecting shock-absorbing plate (802).

5. The high-speed signal acquisition board card of claim 4, wherein: A plurality of third damping components (12) include a fixed bottom plate (1201) fixedly connected to the inner wall bottom of the damping mounting box (4), and the top of the fixed bottom plate (1201) is fixedly connected with a fourth fixing nail (1202) for fixing the fixed bottom plate (1201) and the inner wall bottom of the damping mounting box (4).

6. The high-speed signal acquisition board card of claim 5, wherein: One end of the damping spring (1203) is fixedly connected to the top of the fixed bottom plate (1201), and the top of the damping spring (1203) is fixedly connected with a fixed insertion block (1204), both sides of the fixed insertion block (1204) are provided with spring clamping blocks (1205), and the bottom of the damping bottom plate (6) is provided with a plurality of clamping grooves matched with the fixed insertion block (1204) and the spring clamping block (1205).

7. The high-speed signal acquisition board card of claim 1, wherein: The inner wall bottom of the damping mounting box (4) is provided with a plurality of heat dissipation ventilation holes (13) matched with the second damping component (11), and the bottom corners of the damping mounting box (4) are fixedly connected with connecting pads (14).

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