Domain controller compatible with different heat dissipation modes and vehicle

Abstract

A domain controller compatible with different heat dissipation modes comprises a shell (100) and a printed circuit board assembly (200) arranged in the shell, and a first heat dissipation cavity (301) is formed in the outer top face (106) of the shell; a second heat dissipation cavity (303) is formed between the inner top face of the shell and the printed circuit board assembly, a third heat dissipation cavity (305) is formed between the inner bottom face of the shell and the printed circuit board assembly, and a fan containing cavity (307) is further formed in the shell. A first electromagnetic shielding retaining wall, a first electromagnetic shielding piece, a second electromagnetic shielding retaining wall and a second electromagnetic shielding piece (404) are arranged among the inner top surface, the inner bottom surface and the printed circuit board; wherein in the active heat dissipation mode, a fan (5) is arranged in the fan accommodating cavity; wherein in the active heat dissipation mode, a first heat dissipation cavity cover (103) covers the first heat dissipation cavity, and in the passive heat dissipation mode, the first heat dissipation cavity cover is removed from the first heat dissipation cavity.

Description

TECHNICAL FIELD

[0001] The utility model relates to a domain controller especially a domain controller with heat dissipation structure. BACKGROUND

[0002] With the continuous expansion of the use field of the domain controller, the demand of the domain controller becomes more diversified, and the update iteration speed is very fast, and at present, the low-order version domain controller develops more and more to the middle and high order, and the corresponding heat dissipation will also rise. Therefore, how to quickly and uniformly dissipate heat from the domain controller to meet the working temperature demand of the domain controller to ensure the stable operation of the domain controller becomes particularly important.

[0003] However, at present, there is still a lack of domain controller structure scheme which can well compatible active and passive heat dissipation. For example, when the domain controller with fan heat dissipation needs to cancel the fan to compatible low power consumption scheme, usually the fan cannot be simply removed, and the related structure needs to be greatly changed to meet the heat dissipation and electromagnetic compatibility (EMC) requirements, which leads to the rise of product cost. UTILITY MODEL CONTENT

[0004] One of the purposes of the utility model is to provide a domain controller compatible with different heat dissipation modes, which can switch to adopt active heat dissipation and passive heat dissipation according to the heat dissipation demand of the domain controller, thereby improving the compatibility of the heat dissipation structure, and at the same time, it can also meet the EMC requirements.

[0005] In order to realize the above purpose, the utility model provides a domain controller compatible with different heat dissipation modes, which includes a shell and a printed circuit board assembly arranged in the shell, the printed circuit board assembly includes a printed circuit board and electronic devices arranged on the printed circuit board, wherein:

[0006] The shell has an inner top surface facing the upper surface of the printed circuit board and an inner bottom surface facing the lower surface of the printed circuit board, a first heat dissipation cavity is arranged on the outer top surface of the shell opposite to the inner top surface, and a first heat dissipation cavity air inlet hole is arranged on the side wall of the shell corresponding to the position of the first heat dissipation cavity;

[0007] A second heat dissipation cavity is formed between the inner top surface of the shell and the printed circuit board assembly, and a second heat dissipation cavity air inlet hole is arranged on the side wall of the shell corresponding to the position of the second heat dissipation cavity;

[0008] A third heat dissipation cavity is formed between the inner bottom surface of the shell and the printed circuit board assembly, and a third heat dissipation cavity air inlet hole is arranged on the side wall of the shell corresponding to the position of the third heat dissipation cavity;

[0009] The fan accommodating cavity is arranged in the shell opposite to the first, second and third heat dissipation cavity air inlet holes.

[0010] The first electromagnetic shielding barrier is vertically arranged between the inner top surface and the upper surface of the printed circuit board, and the first electromagnetic shielding member is arranged between the first electromagnetic shielding barrier and the printed circuit board, and the first hole is formed in the first electromagnetic shielding barrier.

[0011] The second electromagnetic shielding barrier is vertically arranged between the inner bottom surface and the lower surface of the printed circuit board, and the second electromagnetic shielding member is arranged between the second electromagnetic shielding barrier and the printed circuit board, and the second hole is formed in the second electromagnetic shielding barrier.

[0012] In the active heat dissipation mode, the fan accommodating cavity is provided with a fan.

[0013] In the active heat dissipation mode, the first heat dissipation cavity cover is arranged on the first heat dissipation cavity, and in the passive heat dissipation mode, the first heat dissipation cavity cover is removed from the first heat dissipation cavity.

[0014] Further, in the domain controller, the first heat dissipation cavity is provided with a plurality of first heat dissipation fins.

[0015] Further, in the domain controller, the plurality of first heat dissipation fins extend between the first heat dissipation cavity air inlet hole and the fan air outlet opening to form a cooling air duct between the first heat dissipation cavity air inlet hole and the fan air outlet opening.

[0016] Further, in the domain controller, the side wall of the first heat dissipation cavity on the shell has an arc-shaped portion near the fan air outlet opening.

[0017] Further, in the domain controller, the shell is further provided with an air outlet hole beside the fan air outlet opening.

[0018] Further, in the domain controller, the shell is further provided with a second heat dissipation fin beside the first heat dissipation cavity on the outer top surface of the shell.

[0019] Further, in the domain controller, the inner top surface of the shell is provided with at least one first heat dissipation boss which is in heat exchange connection with at least one electronic device on the printed circuit board, and / or the inner bottom surface of the shell is provided with at least one second heat dissipation boss which is in heat exchange connection with at least one electronic device on the printed circuit board.

[0020] Further, the first heat dissipation boss and the corresponding electronic device are provided with a first heat conduction element, and / or the second heat dissipation boss and the corresponding electronic device are provided with a second heat conduction element.

[0021] Further, the first electromagnetic shielding member comprises conductive foam, and / or the second electromagnetic shielding member comprises conductive foam.

[0022] Further, the first electromagnetic shielding member comprises an electromagnetic shielding conductive adhesive layer, and / or the second electromagnetic shielding member comprises an electromagnetic shielding conductive adhesive layer.

[0023] Further, the shell comprises an upper cover and a lower cover connected with the upper cover, and an electromagnetic shielding conductive adhesive layer is arranged between the upper cover and the lower cover.

[0024] Another purpose of the utility model is to provide a vehicle with the domain controller as described above.

[0025] The domain controller can switch between active cooling and passive cooling according to the cooling requirements of the domain controller, thereby improving the compatibility of the cooling structure, and meeting the EMC requirements, so that the product cost can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The utility model discloses the domain controller in a kind of implementation under passive cooling state shows the schematic diagram of three-dimensional structure.

[0027] Figure 2 The utility model discloses the domain controller in a kind of implementation under passive cooling state shows the schematic diagram of split structure.

[0028] Figure 3 The utility model discloses the domain controller in a kind of implementation under active cooling state shows the schematic diagram of three-dimensional structure.

[0029] Figure 4 The utility model discloses the domain controller in a kind of implementation under active cooling state shows the schematic diagram of split structure.

[0030] Figure 5 The utility model discloses the domain controller in a kind of implementation shows the top view.

[0031] Figure 6 For Figure 5 Sectional view at A-A.

[0032] Figure 7 A side view of the domain controller according to the present application is shown in one embodiment.

[0033] Figure 8 A cross-sectional view at C-C is shown. Figure 7 A cross-sectional view at B-B is shown.

[0034] Figure 9 A cross-sectional view at B-B is shown. Figure 7 A cross-sectional view at B-B is shown.

[0035] Figure 10 An internal heat dissipation cavity of the domain controller according to the present application is shown in one embodiment.

[0036] Figure 11 An internal structure of the domain controller according to the present application is shown in one embodiment.

[0037] Figure 12 An internal structure of the domain controller according to the present application is shown in one embodiment.

[0038] Figure 13 An internal top surface of the domain controller according to the present application is shown in one embodiment.

[0039] Figure 14 A structure of an upper cover of the domain controller according to the present application is shown in one embodiment.

[0040] Figure 15 A split structure of the domain controller according to the present application is shown in another embodiment. DETAILED DESCRIPTION

[0041] The domain controller and vehicle according to the present application will be further explained and described below in conjunction with the accompanying drawings and specific embodiments, however, the explanation and description do not constitute undue limitations on the technical solutions of the present application.

[0042] The current domain controller either cannot realize compatibility with active and passive heat dissipation, or cannot simultaneously satisfy the requirements of heat dissipation and EMC, which leads to prolonged product development cost and development cycle.

[0043] In order to solve the above problems, the present application provides a domain controller compatible with different heat dissipation modes in one embodiment.

[0044] Figure 1 A three-dimensional structure of the domain controller according to the present application is shown in one embodiment in a passive heat dissipation state.

[0045] Figure 2The utility model discloses the domain controller shows the split structure schematic diagram of passive heat dissipation state under one implementation way.

[0046] Figure 3 The utility model discloses the domain controller shows the three-dimensional structure schematic diagram of active heat dissipation state under one implementation way.

[0047] Figure 4 The utility model discloses the domain controller shows the split structure schematic diagram of active heat dissipation state under one implementation way.

[0048] As Figure 1 , Figure 2 , Figure 3 And Figure 4 Show, in some embodiments, the domain controller compatible with different heat dissipation mode includes: shell 100 and the printed circuit board assembly 200 that sets up in the shell 100 inside, wherein printed circuit board assembly 200 includes printed circuit board 201 and the electronic device 202 on it.

[0049] Figure 5 The utility model discloses the domain controller shows the plan view under one implementation way.

[0050] Figure 6 For Figure 5 The section view of A-A.

[0051] As Figure 5 And Figure 6 Show, the shell 100 has the inner top surface 104 to the printed circuit board upper surface and the inner bottom surface 105 to the printed circuit board lower surface, wherein the outer top surface 106 of the shell and the inner top surface opposite sets up and is equipped with the first heat dissipation cavity 301. Figure 1 And Figure 3 Show, the sidewall of shell 100 is equipped with the first heat dissipation cavity air inlet hole 302 in the position corresponding to the first heat dissipation cavity 301.

[0052] As Figure 5 And Figure 6 Show, the inner top surface 104 of shell 100 and the printed circuit board assembly 200 form the second heat dissipation cavity 303. Figure 1 And Figure 3 Show, the sidewall of shell 100 is equipped with the second heat dissipation cavity air inlet hole 304 in the position corresponding to the second heat dissipation cavity.

[0053] As Figure 5 And Figure 6 Show, the inner bottom surface 105 of shell 100 and the printed circuit board assembly 200 form the third heat dissipation cavity 305. Figure 1 And Figure 3As shown, the side wall of the shell 100 is provided with a third heat dissipation cavity air inlet hole 306 corresponding to the position of the third heat dissipation cavity.

[0054] In addition, as shown in the drawings, Figure 1 and Figure 2 The shell 100 is also provided with a fan accommodating cavity 307 arranged opposite to the first heat dissipation cavity air inlet hole 302, the second heat dissipation cavity air inlet hole 304 and the third heat dissipation cavity air inlet hole 306, and the side wall of the shell 100 is provided with a fan air outlet 308 corresponding to the position of the fan accommodating cavity 307.

[0055] Figure 11 The internal structure of the domain controller in one embodiment is shown from one perspective.

[0056] Figure 12 The internal structure of the domain controller in one embodiment is shown from another perspective.

[0057] As shown in the drawings, Figure 11 and Figure 12 The inner top surface of the shell and the upper surface of the printed circuit board have a first electromagnetic shielding baffle 401 arranged vertically therebetween, and a first electromagnetic shielding member 402 arranged between the first electromagnetic shielding baffle 401 and the printed circuit board 201, and the first electromagnetic shielding baffle 401 is provided with a first hole 4011, and the size and spacing thereof meet the EMC requirements. The inner bottom surface 105 of the shell and the lower surface of the printed circuit board 201 have a second electromagnetic shielding baffle 403 arranged vertically therebetween, and a second electromagnetic shielding member 404 arranged between the second electromagnetic shielding baffle and the printed circuit board 201, and the second electromagnetic shielding baffle 403 is provided with a second hole 4031, and the size and spacing thereof meet the EMC requirements.

[0058] As shown in the drawings, Figure 3 and Figure 4 In the active heat dissipation mode, the fan accommodating cavity 307 is provided with a fan 5, that is, the fan 5 is put into use in the active heat dissipation mode. In the passive heat dissipation mode, the fan 5 is not put into use, or as shown in the drawings, Figure 1 and Figure 2 The fan 5 is removed from the fan accommodating cavity 307.

[0059] In addition, as shown in the drawings, Figure 3 and Figure 4 In the active heat dissipation mode, the first heat dissipation cavity 301 is provided with a first heat dissipation cavity cover 103. In the passive heat dissipation mode, as shown in the drawings, Figure 1 and Figure 2 The first heat dissipation cavity cover is removed from the first heat dissipation cavity 301.

[0060] Through the above setting mode, the domain controller can be compatible with the active heat dissipation mode and the passive heat dissipation mode according to different heat dissipation requirements, and can also meet the EMC requirements of the electronic device.

[0061] When the heat dissipation requirement is high, the active heat dissipation mode can be adopted, at this time, the fan 5 is put into work, as shown in the figure, the cold air enters the first heat dissipation cavity 301, the second heat dissipation cavity 303 and the third heat dissipation cavity 305 inside the domain controller from the first heat dissipation cavity air inlet hole 302, the second heat dissipation cavity air inlet hole 304 and the third heat dissipation cavity air inlet hole 306 under the suction of the fan 5. Figure 6 As can be seen, the cold air with different air volumes flows through the three cavities, and the hot air after heat exchange flows out to the cavity outside through the fan air outlet 308, so that the heat dissipation function of the whole machine is achieved. Figure 6

[0062] The cold air enters the first heat dissipation cavity 301 from the first heat dissipation cavity air inlet hole 302, so that the main heat generated by the electronic device of the printed circuit board assembly, such as the SOC main chip, is taken out of the cavity. At the same time, the cold air can also enter the second heat dissipation cavity from the second heat dissipation cavity air inlet hole 304, then pass through the first hole 4011 on the first electromagnetic shielding baffle wall 401, and finally flow out to the cavity outside through the fan air outlet 308. The second heat dissipation cavity 303 is used to reduce the temperature in the gap cavity between the printed circuit board assembly 200 and the inner top surface 104 of the shell, which is mainly used for directly dissipating heat of the upper surface of the printed circuit board 201 and the electronic device thereon. In addition, the cold air also enters the third heat dissipation cavity 305 from the third heat dissipation cavity air inlet hole 306, then passes through the second hole 4031 on the second electromagnetic shielding baffle wall 403, and finally flows out to the cavity outside through the fan air outlet 308. The third heat dissipation cavity 305 is mainly used for directly dissipating heat of the lower surface of the printed circuit board and the electronic device thereon, such as low-power electronic devices.

[0063] In addition, the first heat dissipation cavity cover 103 can ensure that the first heat dissipation cavity forms a reliable air duct, thereby greatly improving the heat dissipation effect of the main chip.

[0064] Figure 7 The side view of the domain controller in one embodiment is shown.

[0065] Figure 8 For Figure 7 The cross-sectional view at C-C in the figure.

[0066] Figure 9 For Figure 7 The cross-sectional view at B-B in the figure.

[0067] Figure 10 ​The internal heat dissipation cavity of the domain controller in the utility model is shown from a three-dimensional perspective.

[0068] As Figure 7 , Figure 8 , Figure 9 and Figure 10 indicated, in some more specific embodiments, due to the structural arrangement of the printed circuit board assembly itself, the second heat dissipation cavity 303 can be divided into a first heat dissipation sub-cavity 3031 and a second heat dissipation sub-cavity 3032, cold air can flow through the first heat dissipation sub-cavity 3031 and the second heat dissipation sub-cavity 3032 at the same time, and most of the air in the second heat dissipation sub-cavity 3032 will flow into the first heat dissipation sub-cavity 3031, and the two parts of air flow will flow out through the first hole 4011 described later, and finally be taken out of the shell by the fan air outlet 308.

[0069] When the heat dissipation requirement is relatively low, the domain controller of the utility model can adopt a passive heat dissipation mode as shown in Figure 1 and Figure 2 , at this time the fan 5 and the first heat dissipation cavity cover 103 can be removed. Since the passive heat dissipation removes the first heat dissipation cavity cover 103, the first heat dissipation cavity 301 forms maximum natural air convection and heat radiation with external air, avoiding the heat being trapped inside the shell to affect the use performance of the whole machine, thus having good heat dissipation performance.

[0070] In addition, the domain controller of the utility model still has high EMC shielding performance when passively dissipating heat. The printed circuit board is provided with a first electromagnetic shielding barrier wall 401 and a first electromagnetic shielding member 402 arranged between the first electromagnetic shielding barrier wall 401 and the printed circuit board 201 on both sides of the printed circuit board, a second electromagnetic shielding barrier wall 403 and a second electromagnetic shielding member 404 arranged between the second electromagnetic shielding barrier wall and the printed circuit board 201, wherein the first electromagnetic shielding barrier wall 401 presses the first electromagnetic shielding member 402 on the upper surface of the printed circuit board 201, and the second electromagnetic shielding barrier wall 403 presses the second electromagnetic shielding member 404 on the lower surface of the printed circuit board 201. According to this arrangement, even if the fan 5 and the first heat dissipation cavity cover 103 are removed, the EMC shielding performance of the corresponding position can still be guaranteed. That is, the entire printed circuit board assembly is enclosed inside the metal shell, and electromagnetic signals can be prevented from leaking from the air inlet side and the air outlet side without the fan 5 and the first heat dissipation cavity cover 103, so that the domain controller of the utility model can still solve the EMC shielding problem of the whole machine in the passive heat dissipation mode, thereby greatly improving the reliability of the entire domain controller.

[0071] In some more specific embodiments, as Figure 2 and Figure 4As shown, in order to facilitate installation, the housing 100 of the domain controller can include an upper cover 101 and a lower cover 102 connected with the upper cover 101, and the lower cover 102 can be connected with the upper cover by screws 108.

[0072] In addition, in order to ensure the EMC performance of the domain controller, as shown in Figure 2 and Figure 4 An electromagnetic shielding conductive adhesive layer 107 can be arranged between the upper cover 101 and the lower cover 102, which is in a liquid state initially, is applied to the corresponding structures of the upper cover and the lower cover, and is fixed with the upper cover and the lower cover through a curing process. After curing, it is elastic and can realize the interference compression fit of the upper cover and the lower cover.

[0073] In the embodiment with the upper cover and the lower cover, the inner top surface 104 of the housing 100 is the inner surface of the upper cover, the inner bottom surface 105 of the housing is the inner surface of the lower cover, and the outer top surface 106 of the housing is the outer surface of the upper cover.

[0074] In some more specific embodiments, as shown in Figure 2 and Figure 4 The first heat dissipation cavity air inlet hole 302, the second heat dissipation cavity air inlet hole 304, the third heat dissipation cavity air inlet hole 306, and the fan air outlet 308 are all arranged on the upper cover 101.

[0075] In order to further improve the heat dissipation effect, in some more specific embodiments, as shown in Figure 1 A plurality of first heat dissipation fins 61 are arranged in the first heat dissipation cavity 301. In this embodiment, the heat of the inner top surface 104 can be quickly transferred to the surface of the first heat dissipation fin 61, thereby increasing the heat dissipation surface area of the first heat dissipation cavity.

[0076] In order to further improve the heat dissipation effect, in some embodiments, as shown in Figure 1 The first heat dissipation fins 61 extend between the first heat dissipation cavity air inlet hole 302 and the fan air outlet 308, thereby forming a cooling air duct between the first heat dissipation cavity air inlet hole 302 and the fan air outlet 308.

[0077] As shown in Figure 14 In some more specific embodiments, the side wall of the first heat dissipation cavity formed on the upper cover 101 of the housing has an arc-shaped portion 63 near the fan air outlet 308.

[0078] Since the first heat dissipation cavity is the main air duct for heat dissipation of the entire domain controller, the arc-shaped portion 63 is designed near the fan of the air duct, which can have the effect of gathering and aggregating air.

[0079] As shown in Figure 11As shown, in some more specific embodiments, an air outlet 309 may also be provided on the side of the fan outlet 308 on the housing to further improve the heat dissipation effect.

[0080] like Figure 1 As shown, in some more specific embodiments, a second heat dissipation fin 62 can also be provided on the side of the first heat dissipation cavity on the outer top surface of the housing 100. The second heat dissipation fin 62 is used to further improve the heat dissipation effect, especially in passive heat dissipation mode, it can passively dissipate heat for some low-power electronic devices.

[0081] like Figure 13 As shown, in some embodiments, the inner top surface 104 of the housing, such as the inner surface of the top cover 101, may have at least one first heat dissipation protrusion 1041, which is thermally connected to at least one electronic device on the printed circuit board.

[0082] like Figure 15 As shown, in some embodiments, the inner bottom surface 105 of the housing, such as the inner surface of the lower cover 102, has at least one second heat dissipation protrusion 1051, which is thermally connected to at least one electronic device on the printed circuit board.

[0083] This configuration allows for the simultaneous cooling of various electronic components 202 on the printed circuit board, improving cooling efficiency and ensuring uniform cooling.

[0084] In some more specific implementations, such as Figure 2 and Figure 4 As shown, a first thermally conductive element 71 may be provided between the first heat dissipation protrusion and the corresponding electronic device; and / or a second thermally conductive element 72 may be provided between the second heat dissipation protrusion and the corresponding electronic device. The first and second thermally conductive elements can reduce thermal resistance, thereby further improving the heat conduction effect.

[0085] In some more specific embodiments, the first and second thermally conductive elements may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive layer may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet, or similar thermally conductive elements.

[0086] like Figure 11 and Figure 12 As shown, in some embodiments, the first electromagnetic shield 402 may include conductive foam; and / or the second electromagnetic shield 404 may also include conductive foam, thereby achieving EMC sealing of the printed circuit board assembly.

[0087] As Figure 15 shown, in some other embodiments, the first electromagnetic shielding member 402 can include an electromagnetic shielding conductive adhesive layer; and / or the second electromagnetic shielding member 404 can also include an electromagnetic shielding conductive adhesive layer. The electromagnetic shielding conductive adhesive layer can be in the form of a point, avoiding the first hole 4011 and the second hole 4031, and being applied on the corresponding first electromagnetic shielding barrier 401 and the second electromagnetic shielding barrier 403, and clamping the printed circuit board from the front and back sides, so as to realize the EMC sealing of the printed circuit board.

[0088] In some more specific embodiments, the electromagnetic shielding conductive adhesive layer herein is made of the same material as the electromagnetic shielding conductive adhesive layer 107 between the upper cover 101 and the lower cover 102.

[0089] In the present application, the printed circuit board (PCB board) of the domain controller can be a printed circuit board integrated with various electronic devices. Moreover, the number of the printed circuit board in the present application is not limited to one, and it can be provided with multiple printed circuit boards in the shell.

[0090] In the present application, the electronic device on the printed circuit board can be a system on chip (SOC), or can also be other electronic components generating heat and having power consumption, such as resistors, capacitors, inductors, or diodes, transistors.

[0091] In the present application, the domain controller can be a vehicle domain controller, which is used for form state control and state monitoring of the vehicle, including but not limited to a vehicle mobile data center, a hardware monitor (HMI) realizing the function of a man-machine interaction controller, an in-vehicle entertainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU).

[0092] The domain controller described in the present application can be used in a vehicle, for example, can be applied in automated driving of an intelligent vehicle. Among them, the intelligent vehicle can include an electric vehicle or a gasoline-driven vehicle supporting unmanned driving, driver assistance (ADAS), intelligent driving, connected driving, intelligent network driving, and car sharing.

[0093] Therefore, the utility model provides a kind of vehicle in another implementation mode further, it has the domain controller as described above. Since the utility model has no improvement for other components of vehicle, therefore, other components of vehicle are not described in detail here.

[0094] It should be noted that the prior art part in the protection scope of the utility model is not limited to the embodiments given in the utility model document, all prior art not contradictory to the scheme of the utility model, including but not limited to prior patent literature, prior publication, prior public use, etc., can be included in the protection scope of the utility model.

[0095] In addition, the combination mode of each technical feature in the case is not limited to the combination mode recorded in the claims of the case or the combination mode recorded in the specific embodiment, all technical features recorded in the case can be freely combined or combined in any mode, unless contradictory to each other.

[0096] It should be noted that the above-mentioned embodiments are only specific embodiments of the utility model. Obviously, the utility model is not limited to the above embodiments, and similar changes or modifications that can be directly derived or easily conceived by those skilled in the art from the disclosed content of the utility model are all within the protection scope of the utility model.

Claims

1. A domain controller compatible with different heat dissipation modes, comprising a shell (100) and a printed circuit board assembly (200) arranged in the shell, the printed circuit board assembly comprising a printed circuit board (201) and electronic devices (202) arranged on the printed circuit board; characterized in that: the shell has an inner top surface (104) facing the upper surface of the printed circuit board and an inner bottom surface (105) facing the lower surface of the printed circuit board, a first heat dissipation cavity (301) is arranged on the outer top surface (106) of the shell opposite to the inner top surface, and the side wall of the shell is provided with a first heat dissipation cavity air inlet hole (302) corresponding to the position of the first heat dissipation cavity; a second heat dissipation cavity (303) is formed between the inner top surface of the shell and the printed circuit board assembly, and the side wall of the shell is provided with a second heat dissipation cavity air inlet hole (304) corresponding to the position of the second heat dissipation cavity; a third heat dissipation cavity (305) is formed between the inner bottom surface of the shell and the printed circuit board assembly, and the side wall of the shell is provided with a third heat dissipation cavity air inlet hole (306) corresponding to the position of the third heat dissipation cavity; a fan accommodating cavity (307) is arranged in the shell opposite to the first heat dissipation cavity air inlet hole, the second heat dissipation cavity air inlet hole and the third heat dissipation cavity air inlet hole; the side wall of the shell is provided with a fan air outlet (308) corresponding to the position of the fan accommodating cavity; a first electromagnetic shielding barrier (401) is vertically arranged between the inner top surface and the upper surface of the printed circuit board, and a first electromagnetic shielding member (402) is arranged between the first electromagnetic shielding barrier and the printed circuit board, and the first electromagnetic shielding barrier is provided with a first hole (4011); a second electromagnetic shielding barrier (403) is vertically arranged between the inner bottom surface and the lower surface of the printed circuit board, and a second electromagnetic shielding member (404) is arranged between the second electromagnetic shielding barrier and the printed circuit board, and the second electromagnetic shielding barrier is provided with a second hole (4031); wherein in the active heat dissipation mode, a fan (5) is arranged in the fan accommodating cavity; wherein in the active heat dissipation mode, a first heat dissipation cavity cover (103) is arranged on the first heat dissipation cavity, and in the passive heat dissipation mode, the first heat dissipation cavity cover is removed from the first heat dissipation cavity. A plurality of first heat dissipation fins (61) are arranged in the first heat dissipation cavity. The plurality of first heat dissipation fins extend between the first heat dissipation cavity air inlet hole and the fan air outlet to form a cooling air duct between the first heat dissipation cavity air inlet hole and the fan air outlet. The side wall of the shell forming the first heat dissipation cavity has an arc-shaped portion (63) near the fan air outlet. The shell is further provided with an air outlet hole (309) beside the fan air outlet. The shell is further provided with a second heat dissipation fin (62) beside the first heat dissipation cavity on the outer top surface of the shell. ​ ​ ​ 2. The domain controller of claim 1, wherein, ​ 3. The domain controller of claim 2, wherein, ​ 4. The domain controller of claim 1, wherein, ​ 5. The domain controller of claim 1, wherein, ​ 6. The domain controller of claim 1, wherein, ​ 7. The domain controller of claim 1, wherein, The inner top surface of the shell has at least one first heat dissipation boss (1041) which is in heat exchange connection with at least one electronic device on the printed circuit board; and / or the inner bottom surface of the shell has at least one second heat dissipation boss (1051) which is in heat exchange connection with at least one electronic device on the printed circuit board.

8. The domain controller of claim 7, wherein, A first heat conduction element (71) is arranged between the first heat dissipation boss and the corresponding electronic device; and / or a second heat conduction element (72) is arranged between the second heat dissipation boss and the corresponding electronic device.

9. The domain controller of claim 1, wherein, The first electromagnetic shielding member comprises conductive foam; and / or the second electromagnetic shielding member comprises conductive foam.

10. The domain controller of claim 1, wherein, The first electromagnetic shielding member comprises an electromagnetic shielding conductive adhesive layer; and / or the second electromagnetic shielding member comprises an electromagnetic shielding conductive adhesive layer.

11. The domain controller of claim 1, wherein, The shell comprises an upper cover (101) and a lower cover (102) connected with the upper cover, and an electromagnetic shielding conductive adhesive layer (107) is arranged between the upper cover and the lower cover.

12. A vehicle characterized by comprising: It has the domain controller as claimed in any one of claims 1-11.

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