Photoelectric packaging structure and electronic device

Abstract

The utility model discloses an electronic device. The electronic device comprises a light-transmitting cover body and a photoelectric packaging structure, the photoelectric packaging structure comprises a substrate, and a sensing assembly, a light-emitting assembly, a first dam structure and a packaging structure which are arranged on the substrate. The sensing component and the light-emitting component are arranged along a first direction. The first dam structure is located between the light-emitting assembly and the sensing assembly. The packaging structure wraps the sensing component, the light-emitting component and the first dam structure. The top surface of the packaging structure is provided with a first optical channel opening and a second optical channel opening which are respectively corresponding to the light-emitting component and the sensing component. A first groove structure is formed in the position, corresponding to the first light channel opening, of the top surface of the packaging structure, the first groove structure has a first width in the first direction, a first horizontal distance is formed between the edge of the first light channel opening and the edge of the light-emitting assembly, and the first horizontal distance is not larger than 25% of the first width. Therefore, according to the photoelectric packaging structure, crosstalk can be effectively reduced, and the light receiving efficiency of the sensing assembly is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to an optoelectronic packaging structure and an electronic device, in particular to an optoelectronic packaging structure and an electronic device with small size and improved signal-to-noise ratio. BACKGROUND

[0002] Optical physiological sensors generally include two sensing components, i.e., light emitting units and sensing units. The light emitted by the light emitting units as positive light sources is reflected by the object to be sensed (e.g., a human body) and then received by the sensing units to sense the physiological characteristics of the human body by comparing the differences in the detection signals. Generally, a light-tight barrier or housing is provided between the light emitting units and the sensing units to prevent the light emitted by the light emitting units from being directly received by the sensing units to cause early sensing, thereby affecting the accuracy of the sensing results of the sensor.

[0003] However, for small wearable electronic devices such as TWS Bluetooth earphones or smartwatches, an optical physiological sensor is equipped with a glass inside, which is attached to the top surface of the optical physiological sensor under the limited space requirement. Due to the configuration of the glass, the travel path of the light is changed due to diffraction, causing unnecessary light (i.e., so-called stray light) to enter the inside of the sensor, thereby generating cross talk and affecting the yield of the product. CONTENT OF THE INVENTION

[0004] The technical problem to be solved by the present application is to provide an optoelectronic packaging structure and an electronic device with small size and improved signal-to-noise ratio to overcome the deficiencies of the prior art.

[0005] To solve the above technical problems, one of the technical solutions adopted by the present application is to provide an optoelectronic packaging structure, which includes a substrate and a sensing component, a light emitting component, a first dam structure, and a packaging structure arranged on the substrate. The sensing component and the light emitting component are arranged along a first direction. The first dam structure is located between the light emitting component and the sensing component. The packaging structure covers the sensing component, the light emitting component, and the first dam structure. The top surface of the packaging structure has a first light passage opening and a second light passage opening corresponding to the light emitting component and the sensing component, respectively. The top surface of the packaging structure is a non-flat surface. The top surface of the packaging structure has a first groove structure corresponding to the first light passage opening. The first groove structure has a first width along the first direction. The edge of the first light passage opening and the edge of the light emitting component have a first horizontal distance, and the first horizontal distance is not greater than 25% of the first width.

[0006] Optionally, the package structure comprises a first encapsulation and a second encapsulation, the first encapsulation encapsulating the sensing component and the light emitting component, and a portion of the second encapsulation forming a wall to surround the first encapsulation, the sensing component, the light emitting component and the first dam structure, and another portion of the second encapsulation forming a second dam structure stacked above the first dam structure.

[0007] Optionally, the first encapsulation is divided by the first dam structure and the second dam structure into a first portion and a second portion separated from each other and not in contact with each other, the first portion encapsulating the light emitting component, and the second portion encapsulating the sensing component.

[0008] Optionally, a top surface of the package structure is jointly formed by a top surface of the second encapsulation and a bare surface of the first encapsulation exposed from the second encapsulation.

[0009] Optionally, a vertical distance is present between a bottom surface of the first recess structure and a top surface of the second encapsulation, and a maximum predetermined height is present between the top surface of the second encapsulation and a bottom surface of the substrate, and the vertical distance accounts for 5% to 40% of the maximum predetermined height.

[0010] Optionally, the first recess structure extends along a second direction and penetrates through opposite side walls of the wall, and the second direction is perpendicular to the first direction.

[0011] Optionally, an inner edge of the first recess structure is cut flush with a side edge of the second dam structure.

[0012] Optionally, a second recess structure is present on the top surface of the package structure at the second light passage opening, and the second recess structure corresponds to the sensing component.

[0013] Optionally, in the first direction, the second recess structure has a second width, and a second horizontal distance is present between an inner edge of the second recess structure and an edge of the sensing component, and the second horizontal distance is not greater than 25% of the second width.

[0014] Optionally, the second recess structure extends along a second direction and penetrates through opposite side walls of the wall, and the second direction is perpendicular to the first direction, and the first recess structure and the second recess structure are arranged in parallel.

[0015] Optionally, in the first direction, a width of the second dam structure is greater than a width of the first dam structure.

[0016] Optionally, the first encapsulation and the second encapsulation of the package structure jointly form a dual encapsulation molding structure.

[0017] To solve the above technical problems, another technical solution adopted by the present application is to provide an optoelectronic packaging structure, which comprises a substrate, a sensing component, a light-emitting component, a first dam structure, and a packaging structure. The sensing component, the light-emitting component, the first dam structure, and the packaging structure are arranged on the substrate. The sensing component and the light-emitting component are arranged along a first direction, and the first dam structure is located between the light-emitting component and the sensing component. The packaging structure comprises a first encapsulation body and a second encapsulation body. The first encapsulation body encapsulates the sensing component and the light-emitting component. A part of the second encapsulation body forms a wall body to surround the first encapsulation body, the sensing component, the light-emitting component, and the first dam structure, and another part of the second encapsulation body forms a second dam structure stacked above the first dam structure. A part of a top surface of the first encapsulation body is not covered by the second encapsulation body and forms a first light passage opening and a second light passage opening corresponding to the light-emitting component and the sensing component, respectively. The top surface of the first encapsulation body has a vertical distance from a top surface of the second encapsulation body along a direction perpendicular to a surface of the substrate. The top surface of the second encapsulation body and a bottom surface of the substrate have a maximum predetermined height, and the vertical distance accounts for 5% to 40% of the maximum predetermined height.

[0018] To solve the above technical problems, another technical solution adopted by the present application is to provide an optoelectronic packaging structure, which comprises a substrate, a sensing component, a light-emitting component, a first dam structure, and a packaging structure. The sensing component, the light-emitting component, the first dam structure, and the packaging structure are arranged on the substrate. The sensing component and the light-emitting component are arranged along a first direction, and the first dam structure is located between the light-emitting component and the sensing component. The packaging structure comprises a first encapsulation body and a second encapsulation body. The first encapsulation body encapsulates the sensing component and the light-emitting component, and a part of the second encapsulation body forms a wall body to surround the first encapsulation body, the sensing component, the light-emitting component, and the first dam structure. Another part of the second encapsulation body forms a second dam structure stacked above the first dam structure. A part of a top surface of the wall body and the second dam structure of the second encapsulation body extends to cover a top surface of the first encapsulation body. A top surface of the packaging structure forms a non-flat surface, and a part of the top surface of the first encapsulation body not covered by the second encapsulation body forms a first light passage opening and a second light passage opening corresponding to the light-emitting component and the sensing component, respectively. In the first direction, a width of the second dam structure is greater than a width of the first dam structure.

[0019] Optionally, the top surface of the packaging structure has a first groove structure formed corresponding to the first light passage opening, and a second groove structure formed corresponding to the second light passage opening. The first groove structure and the second groove structure extend along the same direction and penetrate through opposite sidewalls of the wall body.

[0020] To solve the above technical problems, another technical solution of the present application is to provide an electronic device, which comprises a light-transmitting cover and the above-mentioned optoelectronic packaging structure. The optoelectronic packaging structure is spaced apart from the light-transmitting cover by a gap.

[0021] One of the beneficial effects of the present application is that the optoelectronic packaging structure of the present application forms a non-planar structure, i.e. a groove structure, on the top surface of the packaging structure. The air gap formed by the groove structure lengthens the path of the light, expands the distance between the light-emitting component and the sensing unit and the external light-transmitting cover (e.g. a glass component), thereby reducing the probability of stray light entering the interior of the sensor, reducing the occurrence of crosstalk, and thus improving the yield of the product. In addition, the present application can control the distance between the light-emitting component and the edge of the light passage opening by designing the first horizontal distance, so that the light-emitting component is not too far from the barrier wall structure, preventing the light source emitted by the light-emitting component from the first light passage opening from touching the sensing object before contacting the light-transmitting cover (e.g. a glass component), causing part of the light to be emitted into the second light passage opening and received by the sensing component, affecting the accuracy of the sensing result.

[0022] For a further understanding of the features and technical contents of the present application, please refer to the following detailed description of the present application and the accompanying drawings. However, the accompanying drawings provided are only for reference and illustration, and are not intended to limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 FIG. 1 is a perspective view of an optoelectronic packaging structure according to a first embodiment of the present application.

[0024] Figure 2 FIG. 2 is a partially exploded view of the optoelectronic packaging structure according to the first embodiment of the present application.

[0025] Figure 3 FIG. 3 is a top view of the optoelectronic packaging structure according to the first embodiment of the present application.

[0026] Figure 4 FIG. 4 is a cross-sectional view of the optoelectronic packaging structure according to the first embodiment of the present application. Figure 3

[0027] Figure 5 FIG. 5 is a cross-sectional view of another implementation state of the optoelectronic packaging structure according to the first embodiment of the present application.

[0028] Figure 6 FIG. 6 is a cross-sectional view of another implementation state of the optoelectronic packaging structure according to the first embodiment of the present application.

[0029] Figure 7 FIG. 7 is a top view of an optoelectronic packaging structure according to a second embodiment of the present application.

[0030] Figure 8 FIG. 8 is a cross-sectional view of the optoelectronic packaging structure according to the second embodiment of the present application.​Figure 7 A schematic diagram of the cross-section of section VIII-VIII.

[0031] Figure 9 This is a graph showing the test results of the optoelectronic packaging structure of this application. Detailed Implementation

[0032] The following specific embodiments illustrate the implementation of the "optoelectronic packaging structure and electronic device" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0033] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components, these components should not be limited by these terms. These terms are primarily used to distinguish one component from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more related listed items.

[0034] First Embodiment

[0035] See Figure 1 and Figure 2 As shown, Figure 1 This is a three-dimensional schematic diagram of the optoelectronic packaging structure according to the first embodiment of this application. Figure 2 This is a partially exploded view of the optoelectronic packaging structure according to the first embodiment of this application. The first embodiment of this application provides an optoelectronic packaging structure M, which includes: a substrate 1, a sensing component 2, a light-emitting component, a first dam structure 4, and a packaging structure 5.

[0036] For example, the optoelectronic packaging structure M of this application is a photoelectric sensor used to sense human physiological characteristics. The substrate 1 can be a circuit board with conductive lines, and the sensing component 2, the light-emitting component, the first dam structure 4, and the packaging structure 5 are disposed on the substrate 1. The optoelectronic packaging structure M can be applied to wearable devices, such as true wireless stereo (TWS) headphones, augmented reality (AR), virtual reality (VR), and mixed reality (MR) devices, etc., but this application is not limited thereto.

[0037] Please also refer to Figure 4As shown, the substrate 1 includes an upper surface and a lower surface opposite to the upper surface. The substrate 1 further includes a plurality of first metal pads 11 disposed on the upper surface of the substrate 1 and a plurality of second metal pads 12 disposed on the lower surface of the substrate 1. The plurality of first metal pads 11 can be electrically connected to the plurality of second metal pads 12 through conductive vias VH. The substrate 1 further includes a first solder mask layer SM1 disposed on the upper surface of the substrate 1, and a second solder mask layer SM2 disposed on the lower surface of the substrate 1, but not limited thereto. In the present embodiment, the sensing component 2 and the light emitting component can be electrically connected to the plurality of second metal pads 12 through the soldering areas of the first metal pads 11.

[0038] The light emitting component can be one or more combinations of light emitting diodes (LEDs) and laser diodes, which can emit light of different wavelengths, such as infrared light, ultraviolet light, or visible light, for detection by the sensing component 2. In the present embodiment, the light emitting component includes two light emitting units 3 arranged along a second direction (Z-axis direction) for emitting near-infrared light with a wavelength of 700 nm to 1500 nm, but the present application is not limited to the color, wavelength, or number of the light emitting component. The light emitting component and the sensing component 2 are arranged along a first direction (X-axis direction), and the first dam structure 4 is located between the light emitting component and the sensing component 2.

[0039] The light emitting component (e.g., the two light emitting units 3) can emit light to the surface of an external object (e.g., the surface of human skin), which is reflected back to be received by the sensing component 2 and converted into an electrical signal to detect changes in the state of the object (e.g., the physiological characteristic state of the human body).

[0040] The sensing component 2 may include a sensing unit 21 and a carrier plate 22. The carrier plate 22 is bonded to the substrate 1 with die-attach adhesive 7. The carrier plate 22 can electrically connect the sensing unit 21 and the exposed first metal pad 11 (soldering area) on the substrate 1 through its internal circuitry or internal structure to achieve signal transmission. The carrier plate 22 serves as a carrier to support the sensing unit 21, and the carrier plate 22 may be a controller, processor, memory, application-specific integrated circuit (ASIC), analog front end (AFE) IC component, etc. The sensing unit 21 may be a photodetector, phototransistor (PTR), photodiode, or photosensitive IC. The sensing unit 21 and the carrier plate 22, as well as the carrier plate 22 and the exposed first metal pad 11 (soldering area) on the substrate 1, can be electrically connected via multiple metal leads 6. In addition, the light-emitting unit 3 and the substrate 1 can also be electrically connected via metal leads 6, but this is not a limitation. In other implementations, the light-emitting unit 3 can be flip-chip mounted on the substrate 1.

[0041] See Figure 1 , Figure 3 and Figure 4 As shown, Figure 3 This is a top view of the optoelectronic packaging structure according to the first embodiment of this application. Figure 4 for Figure 3 A cross-sectional view of section IV-IV is shown. In the embodiments of this application, the encapsulation structure 5 includes a first encapsulation body 51 and a second encapsulation body 52, that is, the encapsulation structure 5 is a double-molding structure composed of the first encapsulation body 51 and the second encapsulation body 52. ​​The first encapsulation body 51 covers the sensing component 2 and the light-emitting component. The first encapsulation body 51 is divided by the first dam structure 4 into a first part 511 and a second part 512 that are separate from each other and do not contact each other. The first part 511 covers the light-emitting component (e.g., two light-emitting units 3), and the second part 512 covers the sensing component 2.

[0042] Furthermore, one portion of the second package 52 forms a hollow wall 521, and the other portion forms a second dam structure 522 (the wall 521 and the second dam structure 522 can be integrally formed). The two ends of the second dam structure 522 are connected to both sides of the wall 521 and are located between the light-emitting component and the sensing component 2. Moreover, the first package 51 is also divided by the second dam structure 522 into a first part 511 and a second part 512 that are separate from each other and do not contact each other. Figure 2As shown, the wall 521 and the second dam structure 522 jointly define a first cavity and a second cavity. The first cavity has a first opening P1 and the second cavity has a second opening P2. The light emitting assembly (e.g. two light emitting units 3) and the first portion 511 are located in the first cavity, and the sensing assembly 2 and the second portion 512 are located in the second cavity. Further, the wall 521 is disposed on the substrate 1 and surrounds the first package 51, the light emitting assembly, the sensing assembly 2 and the first dam structure 4. The second dam structure 522 is stacked above the first dam structure 4 and is located between the light emitting assembly and the sensing assembly 2. In other words, the first dam structure 4 and the second dam structure 522 jointly form a dam structure to separate the light emitting assembly and the sensing assembly 2.

[0043] Referring to Figure 5 As shown, Figure 5 is a cross-sectional view of another implementation state of the optoelectronic package structure of the first embodiment. In an embodiment, the second dam structure 522 can be a T-shaped structure with an extension 5221, and the first dam structure 4 has a concave portion 40 formed on the surface facing the substrate 1. Therefore, the stacking manner of the first dam structure 4 and the second dam structure 522 can be that the extension 5221 of the second dam structure 522 and the concave portion 40 of the first dam structure 4 are combined with each other. In detail, the package structure 5 covers the sensing assembly 2 (the sensing unit 21 and the carrier 22), the light emitting assembly (two light emitting units 3) and the first dam structure 4. Among them, the width of the second dam structure 522 in a first direction (X-axis direction) can be greater than the width of the first dam structure 4. By increasing the width of the second dam structure 522, it can greatly reduce the opportunity of crosstalk between the emitted light beam and the received light beam during measurement, thereby avoiding the stray light from the emission end penetrating the second dam structure 522 and entering the sensing end. In the embodiments of the present application, the first package 51 is made of a light-transmitting material, and the second package 52 (the outer wall 521 and the second dam structure 522) is made of a light-blocking material. Therefore, the first package 51 is a light-transmitting structure, and the second package 52 is a light-blocking structure. Further, the second dam structure 522 is made of a light-blocking material like the first dam structure 4. The materials of the two can be the same or different, which is not limited in the present application.

[0044] As Figure 1 With Figure 4 As shown, the top surface 5S of the package structure 5 has a first light channel opening C1 and a second light channel opening C2, which correspond to the light emitting assembly and the sensing assembly 2, respectively. As Figure 2 With Figure 3As shown, the second package 52 has a first opening P1 and a second opening P2, which correspond to the first part 511 and the second part 512 of the first package 51, respectively. Therefore, when the first package 51 and the second package 52 form a dual-package molding structure, that is, the package structure 5, the first part 511 and the second part 512 fill the first cavity and the second cavity, respectively, and seal the first opening P1 and the second opening P2. The top surface 5S of the package structure 5 is formed by the top surface 52S of the second package 52 and the top surface 51S of the first package 51 exposed in the second package 52.

[0045] like Figure 1 and Figure 4 As shown, in the embodiments of this application, the top surface 5S of the encapsulation structure 5 is a non-flat surface. For example, a groove structure is formed on the top surface 51S of the first portion 511 and the top surface 51S of the second portion 512 of the first encapsulation body 51, namely, a first groove structure V1 and a second groove structure V2, which are arranged in parallel. Figure 4 As shown, the exposed surface of the first package 51 on the second package 52 includes the top surface 51S, the bottom surface B1 and sidewall E1 of the first recess structure V1, and the bottom surface B2 and sidewalls E2 of the second recess structure V2. More specifically, the bottom surface B1, sidewall E1, and sidewall S1 of the second dam structure 522 together constitute the first recess structure V1. The bottom surface B2 and sidewalls E2 together constitute the second recess structure V2. The first recess structure V1 is located within the area of ​​the first light channel opening C1, and the second recess structure V2 is located within the area of ​​the second light channel opening C2. The first recess structure V1 and the second recess structure V2 correspond to the light-emitting component (e.g., two light-emitting units 3) and the sensing component 2, respectively. Furthermore, the first optical channel opening C1 is the top region of the first part 511 of the first package 51 (including the top surface 51S, the bottom surface B1 of the first groove structure V1 and the side wall E1), while the second optical channel opening C2 is the top region of the second part 512 of the first package 51 (including the top surface 51S, the bottom surface B2 of the second groove structure V2 and the two side walls E2).

[0046] The outline shape of the first groove structure V1 and the second groove structure V2 is not limited in this application. For example, in the embodiments of this application, both the first groove structure V1 and the second groove structure V2 are rectangular and extend along a second direction (Z-axis direction) and penetrate the opposite side walls of the first encapsulation body 51 and the wall 521 (see...). Figure 1 ),like Figure 3As shown, the second direction is perpendicular to the first direction. However, in other embodiments, the groove structure can be a circular hole, a semi-circular hole, an elliptical hole, or any other shape structure, or can be a rectangular structure not extending through both side walls of the first package 51. Similarly, the shapes of the first light passage opening C1 and the second light passage opening C2 can be rectangular, circular, or any other shape, without being limited thereto.

[0047] As shown, the first groove structure V1 has a bottom surface B1, and the second groove structure V2 has a bottom surface B2. The bottom surface B1 of the first groove structure V1 and the top surface 52S of the second package 52 are vertically spaced apart by a vertical distance VL. Similarly, the bottom surface B2 of the second groove structure V2 and the top surface 52S of the second package 52 are also vertically spaced apart by the vertical distance VL. The vertical distance VL is the depth of the first groove structure V1 and the second groove structure V2. Figure 4 As shown, the first groove structure V1 has a bottom surface B1, and the second groove structure V2 has a bottom surface B2. The bottom surface B1 of the first groove structure V1 and the top surface 52S of the second package 52 are vertically spaced apart by a vertical distance VL. Similarly, the bottom surface B2 of the second groove structure V2 and the top surface 52S of the second package 52 are also vertically spaced apart by the vertical distance VL. The vertical distance VL is the depth of the first groove structure V1 and the second groove structure V2.

[0048] The optoelectronic package structure M of the present application forms a non-planar structure on the top surface 5S thereof, i.e., forms the first groove structure V1 and the second groove structure V2. The air gaps formed by the first groove structure V1 and the second groove structure V2 lengthen the path of the light rays (because of the additional vertical distance VL), and increase the distance between the light emitting component and the sensing unit 2 and the external light transmissive cover (e.g., the glass component G) as shown, thereby reducing the probability of stray light entering the interior of the sensor, reducing the occurrence of crosstalk, and thus improving the yield of the product. Figure 8 As shown, the first groove structure V1 has a bottom surface B1, and the second groove structure V2 has a bottom surface B2. The bottom surface B1 of the first groove structure V1 and the top surface 52S of the second package 52 are vertically spaced apart by a vertical distance VL. Similarly, the bottom surface B2 of the second groove structure V2 and the top surface 52S of the second package 52 are also vertically spaced apart by the vertical distance VL. The vertical distance VL is the depth of the first groove structure V1 and the second groove structure V2.

[0049] To further prevent the sensing component 2 from being affected by light crosstalk caused by ambient light or stray light, a light shielding layer 8, such as a black ink coating, can be applied to the area of the top surface 51S of the first package 51 outside the first groove structure V1 and the second groove structure V2, as shown. In other embodiments, the light shielding layer 8 can also extend to cover the top surface 52S of the second package 52. Figure 6 As shown, the first groove structure V1 has a bottom surface B1, and the second groove structure V2 has a bottom surface B2. The bottom surface B1 of the first groove structure V1 and the top surface 52S of the second package 52 are vertically spaced apart by a vertical distance VL. Similarly, the bottom surface B2 of the second groove structure V2 and the top surface 52S of the second package 52 are also vertically spaced apart by the vertical distance VL. The vertical distance VL is the depth of the first groove structure V1 and the second groove structure V2.

[0050] Continuing to refer to Figure 4The first groove structure V1 has a first width W1. The inner edge of the first groove structure V1 facing the second dam structure 522 is flush with the side edge (side wall S1) of the second dam structure 522. Viewed from the X-axis, the edge 3E of the light-emitting unit 3 does not extend beyond the side wall S1 (which is also the edge of the first light channel opening). That is, the side wall S1 and the edge 3E of the light-emitting unit 3 can be approximately flush or have a predetermined distance between them. Specifically, there is a first horizontal distance HL1 between the side wall S1 and the edge 3E of the light-emitting unit 3. The first horizontal distance HL1 is not greater than 25% of the first width W1, or in other words, the first horizontal distance HL1 accounts for 0~25% of the first width W1 (when the first horizontal distance HL1 is 0, that is, the side wall S1 is flush with the edge 3E of the light-emitting unit 3).

[0051] In addition, the second groove structure V2 has a second width W2, and there is a second horizontal distance HL2 between the edge 21E of the sensing unit 21 of the sensing component 2 and the other side edge (i.e., side wall S2) of the second dam structure 522. The second horizontal distance HL2 is not greater than 25% of the second width W2.

[0052] This application controls the distance between the light-emitting component and the sensing unit 2 and the edges of the first and second light channel openings (C1, C2) by designing a first horizontal distance HL1 and a second horizontal distance HL2. This ensures that the light-emitting unit 3 and the sensing unit 2 are not too far from the barrier structure, preventing the light source emitted by the light-emitting unit 3 from the first light channel opening C1 from contacting the light-transmitting cover (e.g., before it even touches the object to be sensed) due to contact with the light-transmitting cover. Figure 8 The glass component G shown generates diffraction, causing some light to enter the second optical channel opening C2 prematurely and be received by the sensing component 2, affecting the accuracy of the sensing results.

[0053] Second Embodiment

[0054] See Figure 7 and Figure 8 As shown, Figure 7 This is a top view schematic diagram of the optoelectronic packaging structure according to the second embodiment of this application. Figure 8 for Figure 7 A cross-sectional schematic diagram of section VIII-VIII. The second embodiment of this application provides an optoelectronic packaging structure M', which includes: a substrate 1, a sensing component 2, a light-emitting component, a first dam structure 4, and a packaging structure 5.

[0055] The optoelectronic packaging structure M' of the second embodiment is similar in structure to the optoelectronic packaging structure M of the first embodiment, and the similarities will not be elaborated further. The main difference lies in the packaging structure 5 of the optoelectronic packaging structure M' of the second embodiment, as well as the size of the first and second optical channel openings C1 and C2, which are different from those of the optoelectronic packaging structure M of the first embodiment. In detail, in the second embodiment, the wall 521 of the second package 52 and the top surface 52S of the second dam structure 522 partially extend to cover the top surface 51S of the first package 51, while the portion of the top surface of the first package 51 not covered by the second package 52 forms the first and second optical channel openings C1 and C2, which also jointly define the first groove structure V1 and the second groove structure V2. The bottom surface of the first groove structure V1 is the top surface 51S of the first package 51, and the two side walls S1 and S3 of the first groove structure V1 are respectively one side wall of the second dam structure 522 and the inner side wall of the wall 521. The bottom surface of the second groove structure V2 is the other part of the top surface 51S of the first encapsulation body 51. The two side walls S2 and S4 of the second groove structure V2 are the other side wall of the second dam structure 522 and the other inner side wall of the wall 521, respectively.

[0056] A vertical distance VL exists between the bottom surface of the first recessed structure V1 (the top surface 51S of the first package 51) and the top surface 52S of the second package 52, and between the bottom surface of the second recessed structure V2 (another part of the top surface 51S of the first package 51) and the top surface 52S of the second package 52. The vertical distance VL is the depth of the first recessed structure V1 and the second recessed structure V2. Furthermore, the overall height of the package structure M' is defined as the maximum predetermined height T between the top surface 52S of the second package 52 and the bottom surface 1B of the substrate 1. The vertical distance VL (the depth of the first recessed structure V1 and the second recessed structure V2) is 5% to 40% of the maximum predetermined height T.

[0057] The first groove structure V1 has a first width W1. Viewed from the X-axis, the edge 3E of the light-emitting unit 3 does not extend beyond the edge (sidewall S1) of one side of the second dam structure 522. That is, the sidewall S1 and the edge 3E of the light-emitting unit 3 can be approximately flush or have a predetermined distance between them. Specifically, there is a first horizontal distance HL1 between the edge (sidewall S1) of the first groove structure V1 facing the second dam structure 522 and the edge 3E of the light-emitting unit 3. The first horizontal distance HL1 is not greater than 25% of the first width W1, or in other words, the first horizontal distance HL1 accounts for 0~25% of the first width W1 (when the first horizontal distance HL1 is 0, that is, the sidewall S1 and the edge 3E of the light-emitting unit 3 are flush).

[0058] Similarly, the second recess structure V2 has a second width W2, and a second horizontal distance HL2 between the edge 21E of the sensing unit 21 of the sensing component 2 and the other side edge (i.e. the side wall S2) of the second dam structure 522, the second horizontal distance HL2 being not greater than 25% of the second width W2.

[0059] Further, in this embodiment, the first light passage opening C1 is completely located in the first recess structure V1, and the second light passage opening C2 is completely located in the second recess structure V2. In other words, the area of the first light passage opening C1 is the bottom surface B1 of the first recess structure V1, and the area of the second light passage opening C2 is the bottom surface B2 of the second recess structure V2. The profile shape of the first recess structure V1 and the second recess structure V2 is not limited in the present application. For example, in the embodiment of the present application, the first recess structure V1 and the second recess structure V2 are both rectangular, and extend along a second direction (Z-axis direction) and penetrate through the opposite side walls of the wall body 521 (see FIG. 2). However, in other embodiments, the recess structure can be a circular hole, a semicircular hole, an elliptical hole, or any other shape structure, and can also be a rectangular structure that does not extend and penetrate through the opposite side walls of the wall body 521. Similarly, the shape of the first light passage opening C1 and the second light passage opening C2 can be rectangular, circular, semicircular, elliptical, or any other shape, which is not limited in the present application. Figure 7 )。But in other embodiments, the recess structure can be a circular hole, a semicircular hole, an elliptical hole or any shape structure, and can also be a rectangular structure that does not extend and penetrate through the opposite side walls of the wall body 521. Similarly, the shape of the first light passage opening C1 and the second light passage opening C2 can be rectangular, circular, semicircular, elliptical, or any other shape, which is not limited in the present application.

[0060] In the manufacturing process of the optoelectronic packaging structure M', first, the sensing component 2 and the light emitting component (e.g. two light emitting units 3) are placed on the substrate 1. Then, a first light-blocking adhesive is disposed between the light emitting component and the sensing component 2 by means of dispensing to form the first dam structure 4. Then, a light-transmitting adhesive, i.e. the first encapsulant 51, is disposed on the substrate 1 by means of molding to cover the sensing component 2, the light emitting component, and the first dam structure 4. After that, the outer peripheral portion of the first encapsulant 51 and the portion above the first dam structure 4 are removed to form some accommodation spaces.

[0061] In other implementation states, in the step of removing part of the first encapsulant 51, in addition to cutting off the outer peripheral portion of the first encapsulant 51, the corresponding portion of the upper surface of the substrate can also be cut off to form a first groove 10 at the outer edge of the upper surface of the substrate 1, for example, the substrate 1 can form a stepped structure; and in the step of removing part of the first encapsulant 51, in addition to cutting off the portion above the first dam structure 4, the upper half of the first dam structure 4 can also be further removed to form a second groove 40 to increase the volume of the accommodation space (as shown in FIG. 6). Figure 5The second encapsulation 52 is formed by filling a second non-transparent adhesive material into the cavities of the first encapsulation 51 and covering the first encapsulation 51. The second non-transparent adhesive material filled around the first encapsulation 51 forms the peripheral structure of the second encapsulation 52, i.e. the wall 521, and the second non-transparent adhesive material filled above the first dam structure 4 forms the second dam structure 522. Then, the first and second recess structures V1 and V2 are formed by removing the second non-transparent adhesive material above the sensing component 2 and the light emitting component. The first recess structure V1 is located corresponding to the first light passage opening C1, and the second recess structure V2 is located corresponding to the second light passage opening C2.

[0062] Advantages of the embodiments

[0063] As shown in FIG. 1, the optoelectronic package structure M of the first embodiment includes a sensing component 2, a light emitting component 3, a first encapsulation 51, a second encapsulation 52, a first dam structure 4, and a second dam structure 522. Figure 8 With Figure 9 As shown in FIG. 2, the optoelectronic package structure M’ of the second embodiment includes a sensing component 2, a light emitting component 3, a first encapsulation 51, a second encapsulation 52, a first dam structure 4, a second dam structure 522, a first recess structure V1, and a second recess structure V2. Figure 9 The graph of the test results of the optoelectronic package structure of the present application. Figure 8 The graph mainly shows the relative position between a light-transmitting cover (e.g. a glass component G) of an electronic device (not shown) and the optoelectronic package structure M’ installed inside the electronic device. For example, the electronic device can be an optical sensor. The glass component G is located above the optoelectronic package structure M’ with a gap H. Figure 9 Curve one in FIG. 3 represents the prior art optoelectronic package structure without the recess structure (without air gap), which is equivalent to the optoelectronic package structure M of the first embodiment. Figure 8 The vertical distance VL in FIG. 3 is 0 (i.e. the top surface 51S of the first encapsulation 51 is completely flush with the top surface 52S of the second encapsulation 52); curve two represents the optoelectronic package structure M’ of the present application, which has the first and second recess structures with a depth (i.e. the vertical distance VL), i.e. the first and second recess structures form an air gap. In addition, it should be noted that, Figure 9 The horizontal axis in FIG. 4 represents the gap (in mm), and the vertical axis represents the digital count of the electronic device (e.g. optical sensor). The digital count usually refers to the number of times of the digital signal change measured by the sensor within a certain period of time. This count value can reflect the changes of events, objects or light intensity sensed by the sensor, and is usually related to the resolution or accuracy of the sensor.

[0064] By measuring the crosstalk condition of the glass component G at different distances (gap H gradually increases from 0.1 mm to 1.5 mm) above the optoelectronic packaging structure, it can be found that the crosstalk condition of the optoelectronic packaging structure M' of the present application is significantly improved. This is because the optoelectronic packaging structure M' of the present application forms a non-planar structure, that is, has a first recess structure V1 and a second recess structure V2, on its top surface, and the air gap formed by the first recess structure V1 and the second recess structure V2 lengthens the travel path of the light (because the vertical distance VL is increased) and expands the distance between the light-emitting component and the sensing unit 2 and the external light-transmitting cover (such as the glass component G shown in Figure 8 Therefore, the probability of stray light entering the inside of the sensor is reduced (as shown by the comparison of curve two and curve one, the digital count measured by the sensor of the present application is reduced compared to the existing optoelectronic packaging structure), crosstalk is reduced, and product yield is improved. Figure 9

[0065] In addition, the present application can also control the distance between the light-emitting component and the sensing unit 2 and the edges of the first and second light channels openings (C1, C2) by designing the first horizontal distance HL1 and the second horizontal distance HL2, so that the light-emitting component (such as two light-emitting units 3) and the sensing unit 2 are not too far from the barrier structure, preventing the light source emitted by the light-emitting unit 3 from the first light channel opening C1 from contacting the sensing object and causing diffraction due to contact with the glass component G, causing part of the light to be received by the sensing component 2 early, affecting the accuracy of the sensing result.

[0066] The above disclosure is only the preferred feasible embodiments of the present application, and does not limit the protection scope of the claims of the present application, so any equivalent technical changes made according to the content of the specification and drawings of the present application are included in the protection scope of the claims of the present application.​

Claims

1. An optoelectronic package structure, comprising: The optoelectronic package structure comprises: a substrate; a sensing component disposed on the substrate; a light emitting component disposed on the substrate, the sensing component and the light emitting component being arranged along a first direction; a first dam structure disposed on the substrate and located between the light emitting component and the sensing component; and a package structure disposed on the substrate and covering the sensing component, the light emitting component and the first dam structure; wherein a top surface of the package structure has a first light passage opening and a second light passage opening corresponding to the light emitting component and the sensing component respectively, the top surface of the package structure being a non-flat surface; wherein the top surface of the package structure has a first groove structure corresponding to the first light passage opening, the first groove structure having a first width along the first direction, a first horizontal distance between an edge of the first light passage opening and an edge of the light emitting component being not greater than 25% of the first width.

2. The optoelectronic package structure of claim 1, wherein, The package structure comprises a first package and a second package, the first package covering the sensing component and the light emitting component, one part of the second package forming a wall to surround the first package, the sensing component, the light emitting component and the first dam structure, another part of the second package forming a second dam structure stacked above the first dam structure.

3. The optoelectronic package structure of claim 2, wherein, The first package is divided by the first dam structure and the second dam structure into a first part and a second part which are separated from each other and do not contact each other, the first part covering the light emitting component and the second part covering the sensing component.

4. The optoelectronic package structure of claim 2, wherein, The top surface of the package structure is composed of a top surface of the second package and a bare surface of the first package exposed to the second package.

5. The optoelectronic package structure of claim 4, wherein, A vertical distance between a bottom surface of the first groove structure and the top surface of the second package is 5% to 40% of a maximum predetermined height between the top surface of the second package and a bottom surface of the substrate.

6. The optoelectronic package structure of claim 5, wherein, The first groove structure extends along a second direction and penetrates through opposite side walls of the wall, the second direction being perpendicular to the first direction.

7. The optoelectronic package structure of claim 6, wherein, An inner edge of the first groove structure is flush with a side edge of the second dam structure.

8. The optoelectronic package structure of claim 2, wherein, The top surface of the package structure has a second groove structure corresponding to the sensing component at the second light passage opening.

9. The optoelectronic package structure of claim 8, wherein, In the first direction, the second groove structure has a second width, a second horizontal distance between an inner edge of the second groove structure and an edge of the sensing component being not greater than 25% of the second width.

10. The optoelectronic package structure of claim 9, wherein, The second groove structure extends along a second direction and penetrates through opposite side walls of the wall, the second direction being perpendicular to the first direction, the first groove structure and the second groove structure being arranged in parallel.

11. The optoelectronic package structure of claim 2, wherein, In the first direction, a width of the second dam structure is greater than a width of the first dam structure.

12. The optoelectronic package structure of claim 2, wherein, The first encapsulation body and the second encapsulation body of the encapsulation structure jointly form a dual-encapsulation molding structure.

13. An optoelectronic package structure, comprising: The optoelectronic packaging structure comprises: a substrate; a sensing component disposed on the substrate; a light-emitting component disposed on the substrate, the sensing component and the light-emitting component being arranged along a first direction; a first dam structure disposed on the substrate and located between the light-emitting component and the sensing component; and an encapsulation structure disposed on the substrate, the encapsulation structure comprising a first encapsulation body and a second encapsulation body, the first encapsulation body encapsulating the sensing component and the light-emitting component, one part of the second encapsulation body forming a wall body to surround the first encapsulation body, the sensing component, the light-emitting component, and the first dam structure, another part of the second encapsulation body forming a second dam structure stacked above the first dam structure; wherein a part of a top surface of the first encapsulation body is not covered by the second encapsulation body and forms a first light passage opening and a second light passage opening corresponding to the light-emitting component and the sensing component respectively; wherein the top surface of the first encapsulation body has a vertical distance from a top surface of the second encapsulation body along a direction perpendicular to a surface of the substrate, the top surface of the second encapsulation body and a bottom surface of the substrate have a maximum predetermined height, and the vertical distance accounts for 5% to 40% of the maximum predetermined height.

14. An optoelectronic package structure, comprising: The optoelectronic packaging structure comprises: a substrate; a sensing component disposed on the substrate; a light-emitting component disposed on the substrate, the sensing component and the light-emitting component being arranged along a first direction; a first dam structure disposed on the substrate and located between the light-emitting component and the sensing component; and an encapsulation structure disposed on the substrate, the encapsulation structure comprising a first encapsulation body and a second encapsulation body, the first encapsulation body encapsulating the sensing component and the light-emitting component, one part of the second encapsulation body forming a wall body to surround the first encapsulation body, the sensing component, the light-emitting component, and the first dam structure, another part of the second encapsulation body forming a second dam structure stacked above the first dam structure; wherein a part of a top surface of the first encapsulation body is not covered by the second encapsulation body and forms a first light passage opening and a second light passage opening corresponding to the light-emitting component and the sensing component respectively; wherein, in the first direction, a width of the second dam structure is greater than a width of the first dam structure.

15. The optoelectronic package structure of claim 14, wherein, The top surface of the encapsulation structure has a first groove structure corresponding to the first light passage opening and a second groove structure corresponding to the second light passage opening, the first groove structure and the second groove structure extending along the same direction and penetrating through opposite sidewalls of the wall body. The optoelectronic packaging structure comprises: a substrate; a sensing component disposed on the substrate; a light-emitting component disposed on the substrate, the sensing component and the light-emitting component being arranged along a first direction; a first dam structure disposed on the substrate and located between the light-emitting component and the sensing component; and an encapsulation structure disposed on the substrate, the encapsulation structure comprising a first encapsulation body and a second encapsulation body, the first encapsulation body encapsulating the sensing component and the light-emitting component, one part of the second encapsulation body forming a wall body to surround the first encapsulation body, the sensing component, the light-emitting component, and the first dam structure, another part of the second encapsulation body forming a second dam structure stacked above the first dam structure; wherein a part of a top surface of the first encapsulation body is not covered by the second encapsulation body and forms a first light passage opening and a second light passage opening corresponding to the light-emitting component and the sensing component respectively; wherein, in the first direction, a width of the second dam structure is greater than a width of the first dam structure. The top surface of the encapsulation structure has a first groove structure corresponding to the first light passage opening and a second groove structure corresponding to the second light passage opening, the first groove structure and the second groove structure extending along the same direction and penetrating through opposite sidewalls of the wall body.

16. An electronic device, comprising: The electronic device comprises: a light-transmitting cover; and The optoelectronic packaging structure according to any one of claims 1 to 12, wherein the optoelectronic packaging structure is spaced apart from the light-transmitting cover by a gap.

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