Die bond glue dispensing device for chip bonding

Abstract

The utility model provides a die bonding glue dispensing device for chip bonding. Relates to the technical field of solid crystal dispensing. The die bonding glue dispensing device for chip bonding comprises a supporting bottom frame and a glue dispensing machine, the glue dispensing machine comprises a machine base, the machine base is arranged at the top of the supporting bottom frame, a transverse supporting table is fixedly installed on the outer wall of one side of the supporting bottom frame, and a rotating shaft is rotatably installed on the transverse supporting table; a connecting plate is fixedly installed at the top end of the rotating shaft, two second n-shaped supports are fixedly installed at the top of the connecting plate, second transmission lead screws are rotatably installed in the two second n-shaped supports, and linkage plates are installed on the two second transmission lead screws in a threaded mode; and second servo motors are fixedly mounted on the outer walls of the sides, away from each other, of the two second [-shaped supports. The die bonding glue dispensing device for chip bonding has the advantages that the substrate replacement speed is high, and the downtime is shortened.

Description

Technical Field

[0001] This utility model relates to the field of die bonding dispensing technology, and in particular to a die bonding adhesive dispensing device for chip bonding. Background Technology

[0002] In the chip packaging process, a die bonder is used to bond the chip to the substrate to ensure that the chip can be fixed stably and reliably. Therefore, a die bonder is used to perform the dispensing work in the chip packaging process.

[0003] However, most dispensing machines have been found to have a long downtime during use. Because the substrate needs to be fixed at the dispensing station during dispensing, it takes a lot of time to remove the dispensed substrate after each substrate is dispensed before installing the next substrate to be dispensed. This significantly reduces dispensing efficiency for assembly line operations.

[0004] Therefore, it is necessary to provide a new die-attach adhesive dispensing device for chip bonding to solve the above-mentioned technical problems. Utility Model Content

[0005] The technical problem solved by this utility model is to provide a die-attach adhesive dispensing device for chip bonding that has a faster substrate replacement speed and reduces downtime.

[0006] To solve the above-mentioned technical problems, the present invention provides a die-bonding adhesive dispensing device for chip bonding, comprising: a support base and a dispensing machine. The dispensing machine includes a base, which is disposed on the top of the support base. A transverse support is fixedly installed on one outer wall of the support base. A rotating shaft is rotatably installed on the transverse support. A connecting plate is fixedly installed at the top of the rotating shaft. Two second C-shaped brackets are fixedly installed on the top of the connecting plate. A second transmission screw is rotatably installed inside each of the two second C-shaped brackets. A linkage plate is threaded onto each of the two second transmission screws. A second servo motor is fixedly installed on the outer wall of each of the two second C-shaped brackets on opposite sides. The output shafts of the two second servo motors are respectively fixedly connected to one end of each of the two second transmission screws. A bearing frame is fixedly installed on the top of each of the two linkage plates. The bottom end face of the bearing frame is flush with the top end face of the base. An electric slide rail is fixedly installed on the top of each of the two bearing frames. A workpiece fixing seat is slidably installed on each of the two electric slide rails, with one of the electric slide rails located above the base.

[0007] Preferably, the dispensing machine further includes two side support plates, a first C-shaped bracket, a first transmission screw, a transverse shift seat, a first rodless cylinder, and a dispensing unit. Both side support plates are fixedly mounted on the top of the machine base. The first C-shaped bracket is fixedly mounted on one side of the two side support plates that are close to each other. The first transmission screw is rotatably mounted inside the first C-shaped bracket. The transverse shift seat is threaded onto the first transmission screw. The first rodless cylinder is fixedly mounted on the transverse shift seat. The dispensing unit is fixedly mounted on the slider of the first rodless cylinder. A first servo motor is fixedly mounted on one outer wall of the first C-shaped bracket. The output shaft of the first servo motor is fixedly connected to one end of the first transmission screw. The first servo motor passes through the corresponding side support plate and is movably connected to it.

[0008] Preferably, a back plate is fixedly installed on the top of the transverse support, and three fans are fixedly installed on the side of the back plate near the second C-shaped bracket, and the three fans are all adapted to the workpiece fixing seat.

[0009] Preferably, a gear is fixedly installed at the bottom end of the rotating shaft, a second rodless cylinder is fixedly installed at the bottom of the transverse support, a connecting plate is fixedly installed on the slider of the second rodless cylinder, and a toothed rack is fixedly installed on the side of the connecting plate away from the second rodless cylinder, the toothed rack meshing with the gear.

[0010] Preferably, two locking pieces are fixedly installed at the bottom of the transverse support, and the same limiting slide rod is fixedly installed on the side of the two locking pieces that are close to each other. The limiting slide rod passes through the connecting piece and is slidably connected to the connecting piece. The connecting piece is in contact with one of the locking pieces.

[0011] Preferably, two first guide rods are fixedly installed inside the first C-shaped bracket, and both first guide rods pass through the transverse sliding seat and are slidably connected to the transverse sliding seat.

[0012] Preferably, two second guide rods are fixedly installed inside each of the two second C-shaped brackets, and the corresponding two second guide rods pass through the corresponding linkage plate and are slidably connected to it.

[0013] Compared with related technologies, the die bond adhesive dispensing device for chip bonding provided by this utility model has the following advantages:

[0014] This invention provides a die-attach adhesive dispensing device for chip bonding. By setting two workpiece holders that can exchange positions with each other, the substrate can be quickly changed by the reciprocating rotation of the rotating shaft, thereby greatly reducing the intermediate downtime and improving dispensing efficiency. Furthermore, the use of a fan can accelerate the drying and solidification speed of the adhesive, thereby further improving work efficiency. Attached Figure Description

[0015] Figure 1 A schematic diagram of a preferred embodiment of the die bond adhesive dispensing device for chip bonding provided by this utility model;

[0016] Figure 2 This is a schematic diagram of the oblique upward view structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the upward-viewing planar structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the connection structure between the load-bearing frame and the electric slide rail in this utility model;

[0019] Figure 5 This is a schematic diagram of the dispensing machine in this utility model;

[0020] Figure 6 This is a schematic diagram of the connection structure between the rotating shaft and the connecting plate in this utility model;

[0021] Figure 7 This is a schematic diagram of the oblique upward view connecting the linkage plate and the load-bearing frame in this utility model;

[0022] The following are the labeling elements in the diagram: 1. Support base; 2. Dispensing machine; 201. Machine base; 202. Side support plate; 203. First C-shaped bracket; 204. First transmission screw; 205. Transverse sliding seat; 206. First rodless cylinder; 207. Dispensing unit; 208. Electric slide rail; 209. Workpiece fixing seat; 3. Transverse support; 4. Rotating shaft; 5. Connecting plate; 6. Second C-shaped bracket; 7. Second transmission screw; 8. Linkage plate; 9. Bearing frame; 10. Back connection plate; 11. Fan; 12. Gear; 13. Second rodless cylinder; 14. Connecting piece; 15. Gear rack; 16. Positioning piece; 17. Limiting slide rod. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Please refer to the following: Figure 1-7The die-bonding adhesive dispensing device for chip bonding includes: a support base 1 and a dispensing machine 2, model SEC-E380. This dispensing machine 2 is a common dispensing machine on the market, and includes components such as a base 201, two side support plates 202, a first I-shaped bracket 203, a first transmission screw 204, a transverse support 205, a first rodless cylinder 206, and a dispensing unit 207. These will not be described in detail here. The base 201 is located on top of the support base 1, and both side support plates 202 are fixedly installed on top of the base 201. The first I-shaped bracket 203 is fixedly installed on both side support plates 201. On the side closest to each other, the first transmission screw 204 is rotatably mounted inside the first C-shaped bracket 203, the transverse shift seat 205 is threaded onto the first transmission screw 204, the first rodless cylinder 206 is fixedly mounted on the transverse shift seat 205, and the dispensing unit 207 is fixedly mounted on the slider of the first rodless cylinder 206. A first servo motor is fixedly mounted on the outer wall of one side of the first C-shaped bracket 203, and its output shaft is fixedly connected to one end of the first transmission screw 204. The first servo motor passes through and is movably connected to the corresponding side support plate 202. Two first guide rods are fixedly mounted inside the first C-shaped bracket 203. Each first guide rod passes through the transverse sliding seat 205 and is slidably connected to the transverse sliding seat 205. A transverse support 3 is fixedly installed on one side of the outer wall of the support base 1, and a rotating shaft 4 is rotatably installed on it. A connecting plate 5 is fixedly installed at the top of the rotating shaft 4. Two second C-shaped brackets 6 are fixedly installed on the top of the connecting plate 5. A second transmission screw 7 is rotatably installed inside each of the two second C-shaped brackets 6. A linkage plate 8 is threaded onto each of the two second transmission screws 7. A second servo motor is fixedly installed on the outer wall of the two second C-shaped brackets 6 on the side away from each other. The output shafts of the two second servo motors are respectively connected to the two second transmission screws. One end of 7 is fixedly connected, and the top of the two linkage plates 8 are fixedly installed with a bearing frame 9. The bottom end face of the bearing frame 9 is flush with the top end face of the base 201. Electric slide rails 208 are fixedly installed on the top of the two bearing frames 9. Workpiece fixing seats 209 are slidably installed on the two electric slide rails 208. During use, one of the electric slide rails 208 is located above the base 201 to adapt to the dispensing unit 207. In addition, two second guide rods are fixedly installed in the two second C-shaped brackets 6. The two corresponding second guide rods pass through the corresponding linkage plates 8 and are slidably connected to them.

[0025] In the above method, in order to accelerate the drying and solidification of the adhesive, a back plate 10 is fixedly installed on the top of the horizontal support 3. Three fans 11 are fixedly installed on the side of the back plate 10 near the second U-shaped bracket 6. The three fans 11 are all adapted to the workpiece fixing seat 209. By blowing air, the moisture in the adhesive can be removed quickly, thereby achieving the effect of rapid drying and solidification.

[0026] In this method, in order to drive the connecting plate 5 to rotate, and each rotation can only be 180°, a gear 12 is fixedly installed at the bottom of the rotating shaft 4, a second rodless cylinder 13 is fixedly installed at the bottom of the transverse support 3, and a connecting piece 14 is fixedly installed on its slider. A toothed rack 15 is fixedly installed on the side of the connecting piece 14 away from the second rodless cylinder 13. The toothed rack 15 meshes with the gear 12. Two locking pieces 16 are fixedly installed at the bottom of the transverse support 3. The same limiting slide rod 17 is fixedly installed on the side of the two locking pieces 16 that are close to each other. The limiting slide rod 17 passes through the connecting piece 14 and slides through the connecting piece 14. The connecting piece 14 contacts one of the locking pieces 16. Whenever the connecting piece 14 contacts one of the locking pieces 16, it means that the rotating shaft 4 has rotated the connecting plate 5 by 180°, thereby achieving the limiting effect.

[0027] The working principle of the die bond adhesive dispensing device for chip bonding provided by this utility model is as follows:

[0028] When in use, first fix the two substrates on the two workpiece fixing seats 209 respectively, and then use the dispensing machine 2 to dispense glue to one of the substrates.

[0029] After the dispensing is completed, in order to quickly perform the next dispensing operation, the second servo motor near the base 201 can be started. Its output shaft drives the corresponding second transmission screw 7 to rotate, and the corresponding linkage plate 8 moves horizontally with the support frame 9. At this time, the electric slide rail 208 on the base 201 gradually moves away, and finally brings it and the substrate on it that has been dispensed to the top of the corresponding second C-shaped bracket 6. At this time, there is no electric slide rail 208 on the base 201.

[0030] Then, the second rodless cylinder 13 is activated, and the slider on it moves longitudinally with the connecting piece 14, so that the toothed rack 15 and the gear 12 are meshed. This drives the rotating shaft 4 and the connecting plate 5 to rotate until the connecting piece 14 moves to contact another locking piece 16. At this time, the second rodless cylinder 13 stops running. At this time, the connecting plate 5 rotates 180°, so that the two second U-shaped brackets 6 exchange positions with each other. Then, the second servo motor near the base 201 is activated. Driven by the corresponding second transmission screw 7 and linkage plate 8, the substrate that has not yet been glued will gradually enter the upper part of the base 201 and finally move to the designated glued position. Then, the glued position can be continued.

[0031] On the other side, three fans 11 are activated to blow air onto the substrate after the adhesive has been applied, thereby accelerating the drying and solidification of the adhesive. After solidification, the substrate is removed and replaced with the next substrate that has not yet been applied with adhesive. The process continues until the previous substrate has been applied with adhesive. Once the previous substrate has been applied with adhesive, it is removed from the base 201. Then, the second rodless cylinder 13 is activated to rotate the rotating shaft 4 180°, which allows the two second I-shaped supports 6 to exchange positions once more. This process is repeated until the entire adhesive application process is completed.

[0032] Compared with related technologies, the die bond adhesive dispensing device for chip bonding provided by this utility model has the following advantages:

[0033] This utility model provides a die-attach adhesive dispensing device for chip bonding. By setting two workpiece fixing seats 209 that can exchange positions with each other, the substrate can be quickly changed by the reciprocating rotation of the rotating shaft 4, thereby greatly reducing the intermediate downtime and improving the dispensing efficiency. Furthermore, the air blowing by the fan 11 can accelerate the drying and solidification speed of the adhesive, thereby further improving the work efficiency.

[0034] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A die-bonding adhesive dispensing device for chip bonding, comprising a support frame and a dispensing machine, wherein the dispensing machine includes a base, characterized in that, The machine base is mounted on top of the support frame. A transverse support is fixedly installed on one outer wall of the support frame. A rotating shaft is rotatably mounted on the transverse support. A connecting plate is fixedly mounted on the top of the rotating shaft. Two second C-shaped brackets are fixedly mounted on the top of the connecting plate. A second transmission screw is rotatably mounted inside each of the two second C-shaped brackets. A linkage plate is threaded onto each of the two second transmission screws. A second servo motor is fixedly mounted on the outer wall of each of the two second C-shaped brackets on opposite sides. The output shafts of the two second servo motors are fixedly connected to one end of each of the two second transmission screws. A bearing frame is fixedly mounted on the top of each of the two linkage plates. The bottom end face of the bearing frame is flush with the top end face of the machine base. An electric slide rail is fixedly mounted on the top of each of the two bearing frames. A workpiece fixing seat is slidably mounted on each of the two electric slide rails. One of the electric slide rails is located above the machine base.

2. The die-bonding adhesive dispensing device for chip bonding according to claim 1, characterized in that, The dispensing machine further includes two side support plates, a first C-shaped bracket, a first transmission screw, a transverse shift seat, a first rodless cylinder, and a dispensing unit. Both side support plates are fixedly mounted on the top of the machine base. The first C-shaped bracket is fixedly mounted on one side of the two side support plates that are close to each other. The first transmission screw is rotatably mounted inside the first C-shaped bracket. The transverse shift seat is threaded onto the first transmission screw. The first rodless cylinder is fixedly mounted on the transverse shift seat. The dispensing unit is fixedly mounted on the slider of the first rodless cylinder. A first servo motor is fixedly mounted on one outer wall of the first C-shaped bracket. The output shaft of the first servo motor is fixedly connected to one end of the first transmission screw. The first servo motor passes through the corresponding side support plate and is movably connected to it.

3. The die bonding adhesive dispensing device for chip bonding according to claim 1, characterized in that, A back plate is fixedly installed on the top of the transverse support. Three fans are fixedly installed on the side of the back plate near the second C-shaped bracket. All three fans are adapted to the workpiece fixing seat.

4. The die bonding adhesive dispensing device for chip bonding according to claim 1, characterized in that, A gear is fixedly installed at the bottom of the rotating shaft, and a second rodless cylinder is fixedly installed at the bottom of the transverse support. A connecting plate is fixedly installed on the slider of the second rodless cylinder, and a toothed rack is fixedly installed on the side of the connecting plate away from the second rodless cylinder. The toothed rack meshes with the gear.

5. The die bonding adhesive dispensing device for chip bonding according to claim 4, characterized in that, Two locking pieces are fixedly installed at the bottom of the transverse support. The same limiting slide rod is fixedly installed on the side of the two locking pieces that are close to each other. The limiting slide rod passes through the connecting piece and is slidably connected to the connecting piece. The connecting piece is in contact with one of the locking pieces.

6. The die bonding adhesive dispensing device for chip bonding according to claim 2, characterized in that, Two first guide rods are fixedly installed inside the first C-shaped bracket. Both first guide rods pass through the transverse sliding seat and are slidably connected to the transverse sliding seat.

7. The die bonding adhesive dispensing device for chip bonding according to claim 1, characterized in that, Two second guide rods are fixedly installed inside each of the two second C-shaped brackets, and the corresponding two second guide rods pass through the corresponding linkage plate and are slidably connected to it.

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