Semiconductor ultrasonic cleaning machine

Abstract

The utility model relates to the technical field of semiconductor cleaning equipment, and discloses a semiconductor ultrasonic cleaning machine which comprises an ultrasonic cleaning machine body, a plurality of semiconductor pieces are arranged in the ultrasonic cleaning machine body, and a plurality of clamping assemblies capable of clamping and fixing the semiconductor pieces with different sizes are arranged on the two sides of each semiconductor piece. An adjusting assembly capable of adjusting the clamping height is arranged on one side of each clamping assembly. By arranging the clamping assembly and the adjusting assembly, a plurality of semiconductor chips are clamped and fixed by using the clamping assembly, so that the plurality of semiconductor chips can be unfolded, and then the height of each independent clamping assembly can be adjusted up and down by using the adjusting assembly, so that each semiconductor chip can be completely subjected to ultrasonic cleaning; through the arrangement, the semiconductor wafer can be cleaned, and ultrasonic waves can be prevented from being blocked by the semiconductor wafer with the same height.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning equipment technology, and in particular to a semiconductor ultrasonic cleaning machine. Background Technology

[0002] Currently, ultrasound propagates in liquids, causing the liquid and the cleaning tank to vibrate together at the ultrasonic frequency. The liquid and the cleaning tank have their own inherent frequency when they vibrate, which is the sound wave frequency, so people hear a buzzing sound. With the continuous development of the cleaning industry, more and more industries and enterprises are using ultrasonic cleaning machines. In the semiconductor industry, ultrasonic cleaning machines are used to clean semiconductors.

[0003] A semiconductor-specific ultrasonic cleaning machine is disclosed in Chinese utility model patent with publication number CN216262399U. Although the aforementioned prior art directly cleans silicon wafers by placing them in the cleaning tank, which damages the surface of the silicon wafers and affects their performance and lifespan, ultrasonic cleaning requires propagation. When multiple semiconductor wafers are on the same horizontal plane, the outer semiconductor wafers will affect the propagation and vibration of ultrasonic waves in the cleaning fluid, thus preventing the surrounding ultrasonic waves from being effectively transmitted to the inner semiconductor wafers. Therefore, it is necessary to design an ultrasonic cleaning machine that can effectively clean multiple semiconductor wafers. Utility Model Content

[0004] To address the technical problem that stacked semiconductor wafers can hinder the effective cleaning of ultrasonic cleaners, this invention provides a semiconductor ultrasonic cleaner.

[0005] This utility model is achieved by the following technical solution: a semiconductor ultrasonic cleaning machine, comprising an ultrasonic cleaning machine, wherein the ultrasonic cleaning machine has a plurality of semiconductor wafers inside, and each semiconductor wafer has a plurality of clamping components on both sides capable of clamping and fixing semiconductor wafers of different sizes. Each clamping component has an adjusting component on one side capable of adjusting the clamping height. The clamping component includes a support rod disposed on one side of the semiconductor wafer and a clamping block fixedly mounted on one side of the support rod. A first clamping groove adapted to the semiconductor wafer is opened on one side of the clamping block.

[0006] Through the above technical solution, when ultrasonically cleaning a large number of semiconductor wafers, a clamping assembly is used to clamp and fix semiconductor wafers of different sizes, and an adjustment assembly can adjust the fixed height of the fixed semiconductor wafers.

[0007] As a further improvement to the above solution, a base plate is fixedly installed at one end of each of the support rods, and a second clamping groove is provided on one side of each of the base plates.

[0008] Through the above technical solution, the base plate, together with the second clamping plate, will limit and fix the semiconductor wafer.

[0009] As a further improvement to the above solution, the adjustment assembly includes a fixing block disposed at one end of the support rod, an adjustment sleeve fixedly installed on one side of the fixing block, and a retaining plate disposed on one side of the adjustment sleeve, wherein one end of the support rod extends into the interior of the adjustment sleeve.

[0010] With the above technical solution, the support rod can slide up and down inside the adjustment sleeve, thus adjusting the cleaning height of the semiconductor wafer.

[0011] As a further improvement to the above solution, multiple fixing slots are provided on one side of both the support rod and the adjusting sleeve. The fixing slots of the support rod and the adjusting sleeve are connected and both are adapted to the clamping plate.

[0012] With the above technical solution, after the support rod slides inside the adjusting sleeve, the support rod can be fixed with a clamping plate.

[0013] As a further improvement to the above solution, the ultrasonic cleaner has multiple mounting slots on one side and a mounting rod on the top of the ultrasonic cleaner. Each of the fixing blocks has a fixing sleeve fixedly installed on one side of the mounting rod.

[0014] With the above technical solution, the fixing sleeve can slide on the mounting rod, which allows the fixing position of the semiconductor chip to be adjusted.

[0015] As a further improvement to the above solution, each of the fixing sleeves has a rubber sleeve fitted onto the mounting rod.

[0016] The above technical solution ensures that the rubber sleeve will prevent the fixed sleeve from moving easily.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] This invention uses a clamping component and an adjustment component to clamp and fix multiple semiconductor wafers, allowing them to be unfolded. Then, the height of each individual clamping component can be adjusted up and down using the adjustment component. This ensures that each semiconductor wafer can be completely cleaned by ultrasonic waves. This design not only cleans the semiconductor wafers but also prevents the ultrasonic waves from being blocked by semiconductor wafers of the same height. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2This is a schematic diagram of the structure of the present invention with the adjustment component;

[0021] Figure 3 This is a schematic diagram of the structure of the present invention with a clamping component.

[0022] Explanation of key symbols:

[0023] 1. Ultrasonic cleaning machine; 2. Semiconductor wafer; 301. Support rod; 302. Clamping block; 401. Fixing block; 402. Adjusting sleeve; 403. Clamping plate; 5. Base plate; 6. Mounting rod; 7. Fixing sleeve; 8. Rubber sleeve. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0025] Please combine Figures 1-3 This embodiment of a semiconductor ultrasonic cleaning machine includes an ultrasonic cleaning machine 1. The ultrasonic cleaning machine 1 has multiple semiconductor wafers 2 inside. Each semiconductor wafer 2 has multiple clamping components on both sides that can clamp and fix semiconductor wafers 2 of different sizes. Each clamping component has an adjustment component on one side that can adjust the clamping height. The clamping component includes a support rod 301 disposed on one side of the semiconductor wafer 2 and a clamping block 302 fixedly installed on one side of the support rod 301. A first clamping groove adapted to the semiconductor wafer 2 is opened on one side of the clamping block 302. A base plate 5 is fixedly installed at one end of each support rod 301. A second clamping groove is opened on one side of each base plate 5. When ultrasonically cleaning a large number of semiconductor wafers 2, the clamping components are used to clamp and fix semiconductor wafers 2 of different sizes. The adjustment component can adjust the fixed height of the fixed semiconductor wafers 2.

[0026] Combination Figure 2 and Figure 3 The adjustment assembly includes a fixing block 401 at one end of the support rod 301, an adjustment sleeve 402 fixedly installed on one side of the fixing block 401, and a retaining plate 403 on one side of the adjustment sleeve 402. One end of the support rod 301 extends into the interior of the adjustment sleeve 402. Multiple fixing slots are provided on one side of both the support rod 301 and the adjustment sleeve 402. The fixing slots of the support rod 301 and the adjustment sleeve 402 are connected. Both the fixing slots of the support rod 301 and the adjustment sleeve 402 are adapted to the retaining plate 403. When the support rod 301 slides inside the adjustment sleeve 402, the retaining plate 403 can be used to fix the support rod 301.

[0027] Combination Figure 1 and Figure 2The ultrasonic cleaner 1 has multiple mounting slots on one side and a mounting rod 6 on the top. Each fixing block 401 has a fixing sleeve 7 fixedly installed on one side of the mounting rod 6. Each fixing sleeve 7 has a rubber sleeve 8 fixedly installed inside the mounting rod 6. The fixing sleeve 7 can slide on the mounting rod 6, so that the fixed position of the semiconductor chip 2 can be adjusted.

[0028] The implementation principle of a semiconductor ultrasonic cleaner in this embodiment is as follows: When multiple semiconductor wafers 2 need ultrasonic cleaning, the fixing sleeve 7 is placed on the mounting rod 6, and then each semiconductor wafer 2 is clamped between two clamping blocks 302. Then, the clamping plate 403 is pulled out from the inside of the fixing groove, so that the support rod 301 can slide up and down inside the adjusting sleeve 402, thereby adjusting the height of each row of semiconductor wafers 2. After the adjustment is completed, the clamping plate 403 is inserted into the fixing groove of the support rod 301 and the adjusting sleeve 402 to fix the support rod 301. Then, the mounting rod 6 is placed into the mounting groove of the ultrasonic cleaner 1, so that the ultrasonic waves can perform ultrasonic cleaning on each semiconductor wafer 2. This setting can clean the semiconductor wafers 2 and avoid the ultrasonic waves being blocked by semiconductor wafers 2 of the same height.

[0029] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A semiconductor ultrasonic cleaning machine, comprising an ultrasonic cleaning machine (1), wherein the ultrasonic cleaning machine (1) is internally provided with a plurality of semiconductor wafers (2), characterized in that, Each of the semiconductor wafers (2) has multiple clamping components on both sides that can clamp and fix semiconductor wafers (2) of different sizes. Each clamping component has an adjustment component on one side that can adjust the clamping height. The clamping component includes a support rod (301) on one side of the semiconductor wafer (2) and a clamping block (302) fixedly installed on one side of the support rod (301). The clamping block (302) has a first clamping groove on one side that is adapted to the semiconductor wafer (2).

2. The semiconductor ultrasonic cleaning machine as described in claim 1, characterized in that, Each of the support rods (301) has a base plate (5) fixedly installed at one end, and each base plate (5) has a second clamping groove on one side.

3. The semiconductor ultrasonic cleaning machine as described in claim 1, characterized in that, The adjustment assembly includes a fixing block (401) disposed at one end of the support rod (301), an adjustment sleeve (402) fixedly installed on one side of the fixing block (401), and a retaining plate (403) disposed on one side of the adjustment sleeve (402), with one end of the support rod (301) extending into the interior of the adjustment sleeve (402).

4. A semiconductor ultrasonic cleaning machine as described in claim 3, characterized in that, Multiple fixing slots are provided on one side of both the support rod (301) and the adjusting sleeve (402). The fixing slots of the support rod (301) and the adjusting sleeve (402) are connected. The fixing slots of the support rod (301) and the adjusting sleeve (402) are both adapted to the card plate (403).

5. A semiconductor ultrasonic cleaning machine as described in claim 3, characterized in that, The ultrasonic cleaner (1) has multiple mounting slots on one side and a mounting rod (6) on the top of the ultrasonic cleaner (1). Each of the fixing blocks (401) has a fixing sleeve (7) fixedly installed on one side of the mounting rod (6).

6. A semiconductor ultrasonic cleaning machine as described in claim 5, characterized in that, Each of the fixing sleeves (7) has a rubber sleeve (8) fixedly installed inside, which is fitted onto the mounting rod (6).

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