Wax supply device for polishing equipment
By designing a wax supply device, the problem of needing to shut down the polishing equipment's wax supply system for debugging was solved, enabling independent debugging and testing of the wax, thereby improving production efficiency and reducing costs.
Patent Information
- Application Number
- CN202520276334.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing polishing equipment requires shutdown during wax supply system debugging, leading to production stoppages, affecting output and utilization rate. Furthermore, the wax supply system is inconvenient to adjust and costly.
Design a wax supply device that includes a wax tank, compressed air supply pipeline, vacuum pipeline and wax supply pipeline, equipped with control valve and filter, to achieve independent debugging and testing of wax and avoid downtime of the entire equipment.
It enables flexible adjustment and testing of wax, avoids overall downtime of polishing equipment, increases wafer production, reduces costs, and improves uptime.
Smart Images
Figure CN223889753U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor production, concretely relates to a wax supply device for polishing equipment. BACKGROUND
[0002] In the process of processing and manufacturing of semiconductor wafers, polishing the wafer surface is a very important link, because the precision of polishing directly affects the performance parameters of the final product. The commonly used wafer polishing method is chemical mechanical polishing, and the main process of the normal operation of the polishing equipment is: taking a wafer, applying wax, attaching, polishing and the like. Among them, the wax is mainly applied to the surface of the ceramic disc to form a uniform wax layer, and then the wafer is attached to the ceramic disc through the wax, and finally the wafer is polished. Because the uniformity, flatness and integrity of the wax applied to the ceramic disc are directly related to the quality of the wafer after polishing, problems in wax application will cause abnormality such as flatness, thickness and depression of the wafer after polishing, and the type, ratio, pressure and flow of the wax are important factors affecting the wax application effect.
[0003] In the process of applying wax to the ceramic disc in the polishing equipment, the wax supply mode is generally centralized supply, which is simply a wax supply system that divides multiple supply pipelines to supply multiple polishing equipment for wax application at the same time. Since the wax supply system is configured with a batching barrel and a supply barrel, it can ensure continuous supply of the polishing equipment. However, in the polishing production process, the wax needs to be adjusted for various reasons such as product demand, quality improvement and cost adjustment, including introduction test of new type wax, wax ratio adjustment, wax pressure adjustment and wax abnormality confirmation. The shutdown of the supply system will cause all the polishing equipment to be unable to produce due to lack of wax supply, resulting in loss of production. Therefore, a device for adjusting and testing the wax is needed. When the wax is adjusted and verified, it can be adjusted in the device, and after the adjustment is completed, it can be connected to a polishing equipment for testing, which can facilitate the adjustment of the wax and avoid the risk of overall shutdown of the polishing equipment.
[0004] Therefore, the wax supply system in the polishing production process needs to be further improved, and a new type of wax supply device for polishing equipment is provided, which can more conveniently adjust and test the wax, and can effectively avoid the risk of overall shutdown of the polishing machine. It has important technical value for improving the yield of wafers, improving the utilization rate of polishing equipment and reducing costs. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a wax supply device for polishing equipment to solve the problems in the prior art.
[0006] The utility model aims at providing a wax supply device for polishing equipment to solve the problems in the prior art.
[0007] A wax supply device for polishing equipment, comprising a wax bucket, a compressed air supply pipeline, a vacuum pipeline and a wax supply pipeline; a control valve is arranged on each of the compressed air supply pipeline, the vacuum pipeline and the wax supply pipeline, respectively, for controlling the opening and closing of the respective pipeline;
[0008] The wax bucket is used for containing wax; the compressed air supply pipeline and the vacuum pipeline are communicated with the upper part of the wax bucket, respectively, for supplying compressed air into the wax bucket and vacuumizing; the wax supply pipeline is communicated with the bottom of the wax bucket, for supplying wax to the polishing equipment; a filter is arranged on the wax supply pipeline.
[0009] Preferably, a ring-shaped handle is arranged on the top of the wax bucket, and a plurality of hand-holding holes are arranged on the ring-shaped handle in the circumferential direction.
[0010] Preferably, a bucket cover that can be opened and closed is arranged on the top of the wax bucket.
[0011] Preferably, a handle is arranged on the bucket cover.
[0012] Preferably, a drip pan is arranged on the bottom of the wax bucket.
[0013] Preferably, a transparent liquid level tube that communicates the upper and lower parts of the interior of the wax bucket is arranged on the outer side of the wax bucket.
[0014] Preferably, a pressure regulating valve is further arranged on the compressed air supply pipeline.
[0015] Preferably, the wax supply pipeline comprises a fifth pipeline located in the wax bucket and a second pipeline located outside the wax bucket.
[0016] The filter and the control valve on the wax supply pipeline are located on the second pipeline.
[0017] Preferably, the compressed air supply pipeline and the vacuum pipeline comprise a tee joint, and a fourth pipeline, a first pipeline and a third pipeline are respectively connected to the three connectors of the tee joint.
[0018] The other end of the fourth pipeline is communicated to the upper part of the wax bucket.
[0019] The other end of the first pipeline is used for connecting a compressed air supply device, for supplying compressed air into the wax bucket.
[0020] The other end of the third pipeline is used for connecting a vacuumizing device, for extracting air in the wax bucket.
[0021] Preferably, the pressure regulating valve is located on the fourth pipeline.
[0022] The application provides a wax supply device for a polishing equipment through further improvement of a wax supply system in a polishing production process. BRIEF DESCRIPTION OF DRAWINGS
[0023] Fig. 1 is a front view of the wax supply device;
[0024] Fig. 2 is a rear view of the wax supply device;
[0025] Fig. 3 is a right view of the wax supply device;
[0026] Fig. 4 is a left view of the wax supply device;
[0027] Fig. 5 is a top view of the wax supply device;
[0028] Fig. 6 is a partial sectional view of the wax supply device.
[0029] BRIEF DESCRIPTION OF DRAWINGS
[0030] 1 - first pipeline; 2 - second pipeline; 3 - filter; 4 - first valve; 5 - tee; 6 - second valve; 7 - third pipeline; 8 - wax barrel; 9 - drip tray; 10 - third valve; 11 - annular handle; 12 - pressure regulating valve; 13 - liquid level pipe; 14 - barrel cover; 15 - fourth pipeline; 16 - fifth pipeline. DETAILED DESCRIPTION
[0031] The preferred embodiment of the application provides a wax supply device for a polishing equipment, as shown in the figure, comprising a wax barrel 8, a compressed air supply pipeline, a vacuum pipeline and a wax supply pipeline; the compressed air supply pipeline, the vacuum pipeline and the wax supply pipeline are each provided with a control valve for controlling the on-off of the respective pipeline. Figs. 1-6
[0032] The wax barrel 8 is preferably cylindrical in shape and is internally used for containing wax.
[0033] The compressed air supply pipeline and the vacuum pipeline are communicated with the upper part of the wax bucket 8, and are respectively used for introducing compressed air into the wax bucket 8 and vacuumizing. The introduction of compressed air into the wax bucket 8 can increase the pressure in the wax bucket, facilitating the wax supply. The vacuumization of the wax bucket 8 can extract the air in the wax bucket, reduce the adverse effects of oxygen and other gases on the oxidation and deterioration of the wax, and also help to remove some possible impurities or moisture. Since the compressed air supply pipeline and the vacuum pipeline are the pipelines for air intake and vacuumization, they cannot be introduced into the wax, and are communicated to the upper part of the wax bucket.
[0034] The wax supply pipeline is communicated with the bottom of the wax bucket 8, and is used for supplying wax to the polishing equipment. Through the wax supply pipeline, the wax can be supplied to the wax coating device of the polishing equipment, and the wax supply pipeline is directly communicated to the bottom of the wax bucket 8, so that the wax in the wax bucket 8 can be completely discharged. The wax supply pipeline is provided with a filter 3 for filtering impurities and particles in the wax, preventing the impurities and particles from entering the wax coating device and causing poor wax coating.
[0035] Preferably, the top of the wax bucket 8 is provided with an annular handle 11, and a plurality of long strip-shaped hand holding holes are arranged on the annular handle in the circumferential direction, facilitating the movement of the wax supply device by personnel with hands.
[0036] Preferably, the top of the wax bucket 8 is provided with a closable bucket cover 14. The bucket cover 14 is circular and is used for sealing the wax bucket 8, which can prevent air leakage and the entry of foreign matter into the bucket, and a handle is arranged on the bucket cover, facilitating the installation or removal of the bucket cover 14. When it is necessary to add wax to the wax supply device, the bucket cover 14 is removed, the wax is poured in, and then the bucket cover 14 is installed back after completion.
[0037] Preferably, the bottom of the wax bucket 8 is provided with a leakage receiving disc 9, which is square and can store the overflowed residual wax when the wax is added or the joint leaks.
[0038] Preferably, the outer side of the wax bucket 8 is provided with a transparent liquid level tube 13 which is communicated with the upper and lower parts of the inside of the wax bucket. Since the wax bucket 8 is preferably made of metal, the liquid level thereof cannot be directly observed from the outside. The liquid level tube 13 is a transparent tube, and the liquid level of the wax in the inside of the wax bucket 8 can be observed in real time through the liquid level tube 13, facilitating the advance preparation and addition of wax.
[0039] Preferably, the compressed air supply pipeline is further provided with a pressure regulating valve 12. The pressure regulating valve 12 is provided with a pressure gauge and an adjusting knob. The pressure gauge can display the current pressure in the bucket, and the adjusting knob can adjust the pressure in the bucket according to the needs of the wax coating of the polishing equipment.
[0040] Preferably, the wax supply pipeline includes a fifth pipeline 16 located in the wax bucket 8 and a second pipeline 2 located outside the wax bucket; the filter 3 and the control valve, i.e. the third valve 10, on the wax supply pipeline are located on the second pipeline 2, facilitating the control.
[0041] Preferably, the compressed air supply pipeline and the vacuum pipeline comprise a tee joint 5 and a fourth pipeline 15, a first pipeline 1 and a third pipeline 7 connected with the three joints of the tee joint 5 respectively; the other end of the fourth pipeline 15 is communicated to the upper part of the wax bucket 8; the other end of the first pipeline 1 is used for connecting with the compressed air supply device, for supplying compressed air into the wax bucket 8 through the first pipeline 1 and the fourth pipeline 15; the other end of the third pipeline 7 is used for connecting with the vacuum device, for extracting air in the wax bucket through the third pipeline 7 and the fourth pipeline 15. The first valve 4 is arranged on the first pipeline 1, and the second valve 6 is arranged on the third pipeline 7.
[0042] Since the compressed air supply pipeline and the vacuum pipeline are both gas flow pipelines, the common fourth pipeline 15 can be arranged to reduce the number of pipelines and reduce the cost.
[0043] Further preferably, the pressure regulating valve 12 is arranged on the common fourth pipeline 15, which can regulate the pressure of the compressed air supply and the vacuum.
[0044] In use, first, wax is added, then the second valve 6 is opened to perform vacuumizing, then the second valve 6 is closed and the first valve 4 is opened to supply compressed air to pressurize, at the same time, the pressure is adjusted through the pressure regulating valve 12, finally, the third valve 10 is opened, and the wax in the bucket starts to supply the wax coating device of the polishing equipment to coat wax.
[0045] The application provides a wax supply device for a polishing equipment through further improvement of the wax supply system in the polishing production process. The device can conveniently adjust and test the wax, and can perform wax coating debugging for one polishing equipment without affecting the normal production of other polishing equipments, thereby effectively avoiding the risk of overall shutdown of the polishing equipment, achieving the purposes of improving the yield of wafers, reducing shutdown, improving the utilization rate, reducing the cost and the like. Therefore, the wax supply device for the polishing equipment has good practical value and technical improvement significance in the semiconductor wafer processing and manufacturing process.
[0046] Although the preferred embodiments of the application have been described, those skilled in the art can make further changes and modifications to the embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including all changes and modifications falling within the scope of the application. Obviously, those skilled in the art can make various changes and modifications to the application without departing from the spirit and scope of the application. Thus, if these modifications and changes of the application fall within the scope of the claims of the application and their equivalents, the application also intends to include these changes and modifications.
Claims
1. A wax supply device for polishing equipment, characterized in that, It includes a wax tank, a compressed air supply line, a vacuum line, and a wax supply line; each of the compressed air supply line, the vacuum line, and the wax supply line is equipped with a control valve, which is used to control the on / off state of their respective lines. The wax barrel is used to hold wax; the compressed air supply line and the vacuum line are connected to the upper part of the wax barrel and are used to introduce compressed air into the wax barrel and to create a vacuum, respectively; the wax supply line is connected to the bottom of the wax barrel and is used to supply wax to the polishing equipment; the wax supply line is equipped with a filter.
2. The wax supply device for polishing equipment as described in claim 1, characterized in that, The top of the wax barrel is provided with a ring handle, and the ring handle has multiple hand-held holes along the circumference.
3. The wax supply device for polishing equipment as described in claim 1, characterized in that, The top of the wax barrel is equipped with an openable and closable lid.
4. The wax supply device for polishing equipment as described in claim 3, characterized in that, The bucket lid is equipped with a handle.
5. The wax supply device for polishing equipment as described in claim 1, characterized in that, The bottom of the wax barrel is equipped with a drip tray.
6. The wax supply device for polishing equipment as described in claim 1, characterized in that, The outside of the wax barrel is provided with a transparent liquid level pipe that connects the upper and lower parts of the inside of the wax barrel.
7. The wax supply device for polishing equipment as described in any one of claims 1 to 6, characterized in that, The compressed air supply pipeline is also equipped with a pressure regulating valve.
8. The wax supply device for polishing equipment as described in claim 1, characterized in that, The wax supply pipeline includes a fifth pipeline located inside the wax barrel and a second pipeline located outside the wax barrel; The filter and the control valve on the wax supply line are located on the second line.
9. The wax supply device for polishing equipment as described in claim 7, characterized in that, The compressed air supply pipeline and the vacuum pipeline include a tee and a fourth pipeline, a first pipeline and a third pipeline respectively connected to three joints of the tee; The other end of the fourth pipeline is connected to the upper part of the wax barrel; The other end of the first pipeline is connected to a compressed air supply device for introducing compressed air into the wax barrel; The other end of the third pipeline is used to connect to a vacuum pumping device to extract air from the wax barrel.
10. The wax supply device for polishing equipment as described in claim 9, characterized in that, The pressure regulating valve is located on the fourth pipeline.